DATASHEET MMCS6CS. 6-channel Multiple Color Sensor LCC10 INTRODUCTION

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DATASHEET MMCS6CS 6-channel Multiple Color Sensor LCC10 Order No.: 090400-283-26AEZ00 Status: certified INTRODUCTION The Multiple Color Sensors are made of 3 x 6 photo diodes and one center and dark photo diode (special PIN silicon technology with extended sensibility) integrated on chip. The diodes are carried out as segments of a circle structure with the diameter of 2 mm. The design as Si-PIN photo diodes allows signal frequencies up to MHz-range. In order to achieve a small cross talk between the photodiodes the individual sectors were separated from each other by additional structures. Design supported by MAZeT starting from the initial specification over entire life cycle Utilizing interference filters - long-term stabile without aging, compact and robust, flexible for customized applications, extremely temperature-stable High transmission, high blocking, high filter slopes Based on minimized silicon sensors suitable for mass volumes - small in size, reduced thickness, lead free, robust surface Small LCC10 package (SMD) MAZeT GmbH db07228e - 2016-01-08 Each of these photodiodes is sensitized with dielectric spectral filter for its spectral range (see figure 2). The aim of the sensor is to measure colors or other spectral sensitive states precise based on principle of spectral estimating. For more details of the sensor, principle measurement, evaluation board and software library please contact our sales offices. FEATURES Spectral selective sensors for fast and precise control and measurement tasks Simultaneous measurement of six spectral ranges plus monitor diode 1 With pre-designed key-components in hardware and software, e.g. alternative MAZeT signal amplifiers I/U-, I/C-converter (12 bit 16 bit), analog and digital output APPLICATIONS General color measurement Measurement of natural spectra Detection of metameric colors Portable color reader and measurement (Multi-wavelength readers) Biometric measurement Substance analysisin liquids Multispectral eye & vascular imaging Portable fluorescence detection Wearable monitors Forensics Capsule endoscopy Cancer screening OEM components & assemblies 1 User specific sensing: use this diode in combination with a small-banded special LED as illumination to realize an add-one spectral function Production data information is current as of publication date. Products conform to specifications per the terms of MAZeT GmbH. The information in this document is subject of change without notice, please confirm that this is the latest version. Please check with a MAZeT sales representative for availability and further information. Full legal notices can be found on the final page.

INTRODUCTION... 1 FEATURES... 1 APPLICATIONS... 1 SPECTRAL CHARACTERISTIC... 3 ELECTRICAL AND SENSOR CHARACTERISTICS... 3 PIN CONFIGURATION... 4 PACKAGE & OUTLINE DIMENSIONS... 5 SOLDERING PROFILE... 6 HANDLING... 6 PACKING INFORMATION... 6 APPLICATION NOTE... 6 8.1 Narrowband Luminous Sources... 6 8.2 Angle of Incidence... 6 8.3 Effects of Temperature... 7 8.4 Connection to amplifiers... 7 8.5 Notes for PCB Layout... 8 8.6 Notes for Manufacturing... 8 ORDERING INFORMATION... 9 LEGAL NOTES AND WARNINGS... 10 mazet.de db07228e certified_2016-01-08 Page 2 of 11

SPECTRAL CHARACTERISTIC Figure 1: Typical relative sensitivity of MMCS6CS scanned with broadband light and limited angle of incidence <10 0,4 spectral sensitvity 0,35 0,3 0,25 0,2 0,15 0,1 S_BP425 S_BP475 S_BP525 S_BP575 S_BP625 S_BP675 S_Center 0,05 0 350 400 450 500 550 600 650 700 750 800 850 ELECTRICAL AND SENSOR CHARACTERISTICS Table 1: Operating conditions (TA = 25 C; per single diode) DESCRIPTION SYMB CONDITION MIN TYP MAX UNIT Diameter of light sensitivity area D 2 mm Light sensitivity area per channel (6 channels) of center diode A 0.31 0.07 mm² Typical photo sensitivity of diodes at peak wavelength S max pw = 590 nm p 425 = 425 nm p 475 = 475 nm p 525 = 525 nm p 575 = 575 nm p 625 = 625 nm p 675 = 675 nm 0.2 0.4 A/W Spectral tolerance of filter curve ( ) < ±1%* nm Reverse voltage V R 0 2.5 10 V Dark current I R 50 pa Terminal capacitance C An C AC C AD V R = 2.6 V E = 0 lx f = 100 khz Rise and fall time of photo-current t r, t f 2 µs Angle of incidence (Filter) < 1%* 10 degree Operating temperature range T op 0 +80 C Storage temperature range T st RH < 70% -20 +80 C Moisture Sensitive Level MSL JEDEC J-STD-020 4 31 47 72 pf mazet.de db07228e certified_2016-01-08 Page 3 of 11

Figure 2: Typical Characteristics (TA = 25 C); Terminal capacitance vs. Reverse voltage E = 0lx f = 100kHz All data are results from tests and qualifications we did under conditions of laboratory. Ensure yourself by tests or ask us if your application deviates from the conditions here, before you start development or mass production. PIN CONFIGURATION Table 2: Pin configuration Figure 3: Bottom view PIN NAME DESCRIPTION 1 Kat Common cathode 2 P425 Anode 425 3 P675 Anode 675 4 PD Dark diode 5 P475 Anode 475 6 P525 Anode 525 7 PW Centre diode 8 P625 Anode 625 9 P575 Anode 575 10 nc Not connected mazet.de db07228e certified_2016-01-08 Page 4 of 11

PACKAGE & OUTLINE DIMENSIONS 2 Figure 4: Sizes of MMCS6CS in 10 Pin LCC package Figure 5: Technical drawings (dimensions in millimeter) 2 Please, protect the sensible surface (glass) of the sensor against scratch and similar mechanical injuries. It will have negative effects for the perfect function of the sensor. mazet.de db07228e certified_2016-01-08 Page 5 of 11

SOLDERING PROFILE Figure 6: Recommended reflow SOLDERING PROFILE; Reflow profile for Pb-Free Assembly HANDLING Care should be taken to keep the sensor surface clean. Dust, scratches will adversely affect the sensor parameters. Sensors should be handled as optical device. It is important to use normal ESD handling and precautions for ESD sensitive devices. Each sensor element is baked prior packing for shipment (24 hours at 125 C). Devices are packed in a sealed aluminized envelope with humidity indicator card and desiccant. Keep the opening and handling time of bag as short as possible and note the specified MSL (see chapter 2). PACKING INFORMATION Standard packing type for the sensor elements are tube or box. Otherwise has to be cleared with our sales team. APPLICATION NOTE 8.1 Narrowband Luminous Sources The spectral filters of the color sensors are specialized for applications with broadband source of lighting >10 nm. Please ask our sales team before utilizing our sensor in combination with narrowband luminous sources. 8.2 Angle of Incidence The packaging of the sensor IC has an aperture angle (beam width) of nearly 90. Traditional interference filter work depending on angle of incidence. Using a <10 angle of incidence will allow the best results with no filter shifts. This can be ensured by using lenses or optical holes that limit the angle of incidence to the sensor device <10. An angle of incidence of more than 10 will result in a filter shift. The filter response and accuracy will be distorted the greater the angle deviation is. Please note a filter deviation resulting mazet.de db07228e certified_2016-01-08 Page 6 of 11

from this fact can differ from standard observer function and/or from the filter functions specified in this document. Please ask our sales team for support. 8.3 Effects of Temperature The functionality of the filters do not depend on any temperature changes. The temperature coefficient of the photo sensitivity and the dark current of the photodiodes need to be considered, since these have an influence on the sensor response in case of changing temperature. Common signal converters do not implement temperature compensation. MAZeT offers various signal ASICs including temperature compensation. Please ask our sales team about the application-specific solution to prevent negative influence caused by temperature shifts. 8.4 Connection to amplifiers Opposite figure shows a circuit for the conversion of photo current to an equivalent voltage. These voltage can be processed e.g. with an ADC. By the selection of suitable resistors the output voltage range can be adjusted to the photo current value (for example two pin-programmable transimpedance amplifier MTI04, MCDC04EQ, MDDC04AQ or alternatives e.g. MTI08CQ. Figure 7: Circuit for the conversion of photo current to an equivalent voltage +V R = V DD R V 1 REF 1 R 2 R 3 R 4 MAZeT MTI04 R 5 R 6. R 7 R 8 MAZeT MTI04 mazet.de db07228e certified_2016-01-08 Page 7 of 11

8.5 Notes for PCB Layout The connections between sensor outputs and converter inputs have to be protected against any kind of electromagnetic coupling and have to be guarded with the potential of reference voltage 3 to avoid leakage currents. Disturbing leakage currents with equivalent values like the sensor currents can occur, without guarding layers at the inputs of the PCB isolation resistance! Digital signals and circuit lines with high current loads should not be used directly beneath or next to the color sensor as well as the converter. Often the converter operates internally with minimal currents (pamps). Therefore, protection measures need to be performed to shield the converter and sensor against EMC stress or external interferences. When measuring very small photocurrents a separate shielding (metal cover) of the sensor and of the wires between sensor and converter is recommended. This shield is connected to Vref or VSS. If the sensor is exposed to strong alternating magnetic fields, then a magnetic absorber prevents the induction of additional currents into the wires from the sensor to the converter. The connections between the color sensor (anode and cathode) and the converter should be also as short as possible (<10 mm) and without interlayer connections. The signal for cathode(s) or anode(s) should have the same cross-section on the PCB. Color Sensor, converter and its external components for references and/or power supply (e.g. R ext in case of MCDC04EQ) should be placed on the same PCB side. Around the sensor signal lines a conductor connected with the potential of reference voltage should be created. One level below the signals a reference voltage potential area should be used that extends only to the analog inputs and the signal lines. 8.6 Notes for Manufacturing JENCOLOR sensors are optoelectronic components operating at high precision, resolution and smallest currents of na in operation and pa in standby. This must be considered in the development and manufacturing. So mechanical stress, EMC, dirt and moisture must be avoided. For manufacturing purposes we recommend completely removing the moisture on the boards with JENCOLOR sensors. This refers to residual moisture on / below the sensor and converter. In sensor operations residual moisture can lead to leakage currents and result in increased offset values. Offset means a lower resolution, lower accuracy and measuring inaccuracies in sensor mode. These have particular impact on small measurement signals from the sensor. If cleaning of a PCB with water is necessary then make sure to fully dry the board later on with suitable processes and technologies (e.g. baking). This avoids residual moisture as reason for leakage currents and noise. 3 VRT/VPD see data sheets of MCDC04EQ and MDDC04EQ mazet.de db07228e certified_2016-01-08 Page 8 of 11

ORDERING INFORMATION NAME Status PACKAGE Article MMCS6CS Series LCC10 090400-283-26AEZ00

LEGAL NOTES AND WARNINGS Failure to comply with these instructions could result in death or serious injury. Misuse of documentation The information contained in this document is the property of MAZeT. Photocopying or otherwise reproducing any part of the catalog, whether electronically or mechanically is prohibited, except where the express permission of MAZeT GmbH has been obtained. In general, all company and brand names, as well as the names of individual products, are protected by brand, patent or product law. State of document - The information provided in this document is for reference only. Do not use this document as product installation guide since products can be under development to improve performance or any other purpose. Before you start any development or place an order please contact your supplier or MAZeT for the latest version of this document. MAZeT explicitly reserves the right to make technical changes to information described in the document. Information and Disclaimer The information provided in this document is based on the knowledge of the MAZeT GmbH as of the date of publication. The MAZeT GmbH cannot give warranty regarding the accuracy of information provided by third parties. MAZeT may not have conducted testing or chemical analysis on all incoming material or chemicals. MAZeT GmbH performs and continues to perform reasonable measures to provide the most accurate data at the given time. Additional efforts to integrate information provided by third parties are performed and continue to be performed. Certain supplier information may be proprietary or limited and not available at release. Personal Injury: All products are conform to the specifications in accordance with the terms and conditions of MAZeTs standard warranty. Production processing does not necessarily include testing of all parameters. RoHS Directive 2011/65/EU /REACH INFORMATION - RoHS compliance and PB free: The products of MAZeT fully comply with the current RoHS-directives. Our semiconductor products do not contain any of the six substance chemical categories, for example including the restriction on lead usage (lead weight may not exceed 0.1% in homogeneous materials). RoHS compliant products are suitable for the usage in lead-free specified processes, when designed to be soldered at high temperatures. REACH information: MAZeT products do not contain any of the latest REACH Substances of Very High Concern (SVHC) regarding the Europe Union (EU) Regulation 1907/2006. The latest 155 substances restricted per the REACH Regulation were last updated on June 16, 2014. Please refer to the following for the most current candidate list of substances: http://echa.europa.eu/candidate-list-table. MAZeT solutions are not designed or intended for use in critical applications, in which the failures or malfunctions of the product may result in personal injury or death. Use of MAZeT products in life support systems is expressly unauthorized and any use by customer is completely at their own risk. In the case of a restricted use of the product described here, an application of the product outside of this limitation is at your own risk. mazet.de db07228e certified_2016-01-08 Page 10 of 11

Warranty disclaimer The warranty expressed herein shall be in lieu of any other warranties, expressed or implied, including, without limitation, any implied warranties or conditions of merchantability and fitness for a particular purpose., which are expressly disclaimed, and is in lieu of any and all other obligations or liability on supplier s part- For the avoidance of doubt, supplier shall not be liable for any special, incidental, indirect or consequential loss or damage, including loss pf revenue or profit, of any kind of nature, arising at any time, from any cause whatsoever resulting from the use or operation of the products or any breach of this limited warranty. Legal liability - MAZeT assumes no responsibility for the use of any foreign products or circuits described in this document or customer product design, conveys no license, either expressed or implied, under any patent or other right, and makes no representation that the foreign circuits are free of patent infringement. MAZeT further makes no claim as to the suitability of its products for any particular purpose, nor does MAZeT assume any liability arising out of the use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. ESD Warning: Sensor handling precautions should be observed to avoid static discharge. WEEE Disposal: - The product should be disposed in to according the Directive 2002/96 / EC of the European Council on Waste Electrical and Electronic Equipment [WEEE] and the German electoral law [ElektroG] of 16 March 2005. Please contact our technical support if you need more details. mazet.de db07228e certified_2016-01-08 Page 11 of 11