Features and Applications of New Type Inductors 2011.4
Contents 1 Main Product Categories 2 Development Roadmap 3 4 High Q Factor Multilayer Chip Ceramic Inductor Multilayer Chip Power Inductor
Main Product Categories Passive Components Material Design Application Manufacturing Measurement EMC Components RF Components Coils Sensitive Components Tantalum Capacitor Multilayer Chip Ferrite Bead Chip 3-Terminal Emi Filter Multilayer Chip CMC Wire Wound CMC Multilayer Chip LC Filter Multilayer Antenna Module(New) ASM(New) Multilayer Chip Ceramic Multilayer Chip Varistor Inductor Chip NTC Termistor Multilayer Chip Ferrite Inductor Wire Wound Ceramic Inductor Wire Wound Power Inductor Solid Tantalum Chip Capacitor
Requirements of Components in Electronic Equipments Electronic Equipments Components High Frequency Portability Multifunction Low Power Consumption Large Current Large Capacity Long Runtime Slim & Thin High Reliability Stable Supply
's Strategy Wire Wound Technology The Advantage of Multilayer Technology Multilayer Technology Feasible to produce small and slim type components Suitable for mass production Ensure supplying stability and short delivery period. Full automatic process to ensure high reliability and quality.
High Frequency Inductor of Wire Wound Ceramic Inductor High Q, Tight Inductance tolerance SDWL1005C SDWL1608C SDWL2012C SDWL2520C SDWL3216C SDWL3225C SDWL4532C Chip high Frequency Inductor Multilayer Chip Ceramic Inductor High reliable, Low cost SDCL0603C SDCL1005C SDCL1608C SDHL1005C SDHL1608C
Requirements of Inductors in RF Circuits RF filter Resonant Circuit RF filter Impedance Matching Parameters Matching Requirements Resonance RF Choke L Precision High High Low Q Factor High High Low RDC Low Low High
The Effect of Q Value Lower insertion loss and power saving will be acquired by using inductors with high Q factor
High Q Multilayer Chip Inductor Improved Material Optimization of Coil Structure HQ Series Multilayer Chip Ceramic Inductor High-precision automated production technology Higher Performance
High Q Multilayer Chip Inductor 100 80 HQ1005C6N8JT Wire Wounder Inductor SDWL1005C6N8JSTF Common Multilayer Inductor SDCL1005C6N8JTDF RDC compared 255 Q Factor 60 40 91 130 128 20 60 55 0 0 200 400 600 800 1000 1200 1400 1600 1800 2000 Frequency [MHz] 3.9nH HQ1005 10nH SDWL11005 SDCL1005 Product compared Q Factor @MHz 100 250 500 900 1800 RDC (mω) HQ1005-6N8 19 29 40 55 72 90 Wire Wound Inductor SDWL1005-6N8 19 31 41 54 70 85 Multilayer Chip Inductor SDCL1005-6N8 9 14 20 27 37 160
High Q Multilayer Chip Inductor Copper wire exposed outside which can be damaged easily. Wire wound Inductor Silver inside to avoid damage based on LTCC technology Monolithic structure to realize strong mechanical strength Multilayer Inductor
High Q Multilayer Chip Inductor Dimension:1.0mm x 0.6mm x 0.5mm; Inductance range:1.0~15 nh ; Rated current range:430ma~1.0a; Part Number L (nh) Q Min. L, Q Test. Freq (MHz) Q (Typ.) Freq. (MHz) 100 250 900 1800 S.R.F (MHz) Min DCR (Ω) Max. Ir (ma) Max. HQ1005C1N0 TF 1.0 16 250 13 20 50 70 6000 0.05 1000 HQ1005C2N2 TF 2.2 16 250 13 20 45 65 6000 0.07 800 HQ1005C6N8 TF 6.8 20 250 18 25 50 75 5000 0.15 550 HQ1005C10N TF 10 22 250 18 26 53 75 4500 0.18 500 HQ1005C15N TF 15 22 250 18 28 53 68 4000 0.22 430
Three Types Power Inductors Power Inductors Wire wound Type Ⅰ Multilayer Type Wire wound type Ⅱ P/N:SWPA P/N: MPL
Comparison Results Items Wire-wound Ⅰ Wire-wound Ⅱ Multilayer Downsizing Thin Inductance Range Temperature Rise Current Saturation Current Price
Multilayer Power Inductor High Saturation Current High Performance magnetic material Br B Conventional New Hc H
Performance Comparison Low AC Loss Vin=3.6V/Vout=1.8V (TPS62300 3MHz) Low AC Resistance Conversion efficiency under low loading
Performance Comparison Low DC Consumption Vin=3.6V/Vout=1.8V (TPS62300 3MHz) Low DC Resistance Conversion efficiency under high loading
MPL Series Power Inductors Main Advantages Low profile High reliability Low DCR and ACR Space saving Typical Application New generation smart phone MID WLAN DSC, DVC MPL Family Dimension (mm) Thickness Inductance Range (µh) Main Electrical Performance DC-Resistance Range (m Ohms ) Rated Current Range (ma) MPL2012 0.5/0.9 0.47-4.7 90-340 600-1200 MPL2016 0.9 0.47-4.7 60-140 1100-1600 MPL2520 0.9/1.1 0.47-4.7 40-140 900-1800
Future Development Directions Future Directions Small-Size 1.6x0.8 mm 1.0x0.5 mm Thin Type 0.55 mm 0.35 mm Improve Saturation Current Optimize Structure, Improve Ferrite Material