EU Research project proposals (call for Finnish companies) 11th EEMELI Workshop 29 th August 2012 Jukka Hast Research Professor VTT Technical Research Centre of Finland
04/10/2012 2 General ICT theme work programme Objective ICT-2013.3.3 Heterogeneous Integration and take-up of Key Enabling Technologies for Components and Systems (page 42) a) Integrating heterogeneous technologies i) Miniaturised smart systems ii) Hybrid integration of organic electronics and micro/nano electronics iii) Further development and validation in real settings of micro-nano-bio and bio-photonics systems DL: 15. January 2013 and other proposals in NMP, ENERGY themes
IML-UI In-mould-Labelling for novel 2.5/3D User- Interfaces Tentative Proposal Kari Rönkä VTT Technical Research Centre of Finland
04/10/2012 4 Hybrid In-mould Integration pilot factory A unique pilot line for hybrid in-mould integration to enable seamless integration of novel optical, electrical, and mechanical features into 3D plastic products. The capability of the line will include component assembly and bonding of various types of components on flexible substrates in continuous WEB Stop & Go process as well as over-moulding of the assembled foils. Key features: Optics-electronics-mechanics combined Continuous 200 mm WEB substrate Printed flex, silicon, and conventional components 3D plastic in-mould integration Capacity from hundreds to tens-of thousands Automated chip & component bonder Datacon EVO 2200 with R2R transport system 2K injection moulding machine Engel Victory 120-tons
04/10/2012 5 Project Concept Idea & Objectives Creation of novel integrated user-interfaces with advanced In-Mould-Labelling process based on flexible OLAE components for display and sensing as well as indicator lights/back-lighting ILEDs and traditional control electronics Integration of printed electronics mature flexible components on product structures in selected applications Link innovative SME technology providers to new integrated smart systems user cases Over-moulding with selected plastics (PC, PMMA, elastomers + 2K combinations) Enhance the full process maturity to pre-production level (including interconnection steps) Manufacturability data, robust, standardly defined, interconnection technology: foil-to-foil, chip-to-foil (pick & place), Compatibility with thermal, mechanical and chemical constraints for printed electronics devices, ptimising of design and manufacturing variations (integration level, data collection (yield, tack-times, cost analysis) Objective ICT-2013.3.3 Heterogeneous Integration and take-up of Key Enabling Technologies for Components and Systems or TEKES industrial group project
04/10/2012 6 Value proposition & impact Less mechanical parts Systems on single substrate Design freedom Reduced complexity Less sub-systems Simplified value chain Less suppliers Cost 2D formation 3D formation Reduction Seamless integration Reduced volume System size System weight Optics-electronicsmechanics combined Elimination of holes and interconnects Tentative Consortium 1. VTT (FIN, RTD): coordination, hybrid pilot environment, flex-to-flex interconnections, over-moulding integration 2. End user 1-3 (IND): End user (e.g automotive, healthcare/ environmental monitoring) case demonstrator requirements and design of demonstrators, exploitation 3. Component supplier 1-3 (IND/SME): Innovative component company 1, design and supply 4. System integrator (IND/SME): Product concept design and verification (if different than end-user) 5. Manufacturing chain 1-3 (SME): Printing, assembly, In-Mould-Labelling, testing, technology transfer 6. RTD: testing, life cycle analysis, environmental issues, industrial design Contact person: Kari Rönkä (kari.ronka@vtt.fi)
PIHI Printed Integrated Hybrids for Interactivity Tentative Proposal Henrik Sandberg VTT Technical Research Centre of Finland
04/10/2012 8 Some demo concepts of flexible printed hybrid systems already demostrated Printed electronic voting card - utilizing printed battery, keyboard, memory and OLED components. User test (500 people) at Printed Electronics Europe 2011 NFC smart poster A2 size with printed user interface + software for Android phones DEMO at Prinse12 seminar Printed OLED display integrated to a smart card Powered via a standard Mifare RFID reader Active LT with S-o-A emitters > 4kHrs OLED survives card lamination process
04/10/2012 9 -- PIHI -- Printed Integrated Hybrids for Interactivity The motivation for the project is that the manufacturing technology has reached a level that allows to produce a multifunctional smart sheet at a cost level that opens up entirely new application areas. The various technologies must be proven as an integrated unit in order to demonstrate the business case and its potential. Markets are available in areas such as advertising and retail, transportation (maps, tickets and pay cards), secure official documents, etc. Tentative demonstrators based on market analysis (2 will be chosen for the final proposal): Smart NFC interactive poster (Menu, directory, map, advertisement etc.) Smart secure document (Smart card or official document with button input, memory, display, encryption, and NFC interaction) Data logging (tag or document with on board power source, multiple sensing features and NFC programming and readout) Remarkable market potential in future! Business growth from tens of million s to over billion business by 2020. Estimated by IdTechEx, 2011
04/10/2012 10 Tentative consortium partners and roles, volume of the activity Thinned silicon chips photo printing (chip application) Integration, up-scaling, R2R processing, chip bonding, printed battery, printed OFET, OLED display front panel, NFC integration (e.g. antenna), project coordiation: Production, integration: Circuit design, NFC programming, etc.: Substrates and substrate conditioning: EC Display elements, drivers: Nn: nn??? Negotiations are on-going with the potential partners Volume approx. 6 M EC contribution, IP Contact: Henrik Sandberg, henrik.sandberg@vtt.fi
Integrated biosensor ICT-2013.3.3 Heterogeneous Integration and take-up of Key Enabling Technologies for Components and Systems ii) Hybrid integration of organic electronics and micro/nano electronics on flexible, large area and/or stretchable substrates, combining different materials, components and subsystems, creating opportunities for application driven integrated systems. Focus is on interfacing different types of material, different types of components and subsystems, different design styles or production processes and dealing with process variations, multi-layers, packaging and encapsulation. 5.7.2012 Maria Smolander, Raimo Korhonen VTT Raeann Gifford, Göran Gustafsson, Acreo
Schematic structure of the platform for Integrated Biosensor Printed Transistors For Display control Biosensor Sample Deposition Printed Battery Printed Display Silicon chip Acreo Life Science 12 10/4/2012
Integrated biosensor Background several solutions exist for electrochemical biosensors typical state-of-the-art solutions contain screen-printed electrodes with detection chemistry AND portable reader for data handling & result output In this proposed project new technology platform for low-cost, stand-alone biosensors will be developed and demonstrated for two selected applications with ascending complexity level primarily state-of-the-art components will be integrated to achieve the final sensor system Fluidic channels Printed sensors Printed electrodes Power source Chip Display
Consortium VTT and Acreo have agreed about proposal preparation for this call coordinator to be agreed between VTT & Acreo Other possible research partners: Linköping University ITENE (disposal/ recyclability) Contact information: Maria Smolander (VTT) maria.smolander@vtt.fi
All-Carbon Electronics Preleminary plan for TEKES project 2013 Henrik Sandberg (henrik.sandberg@vtt.fi)
Plan We demonstrate complimentary transistors using only carbon-based materials as active and passive components. Substrate: Specially coated paper developed at FUNMAT; Nano-fibrillar cellulose (NFC) films developed in VTT. Electrodes: Reduced Graphene oxide ink; Carbon (graphite) ink Semiconductors: Carbon nanotubes; conjugated polymers In some cases the substrate (thin NFC films) can also double as the dielectric and the transistors fabricated around it.
Collaboration VTT NFC films Printed Graphene electrodes Device develpment FUNMAT, ÅA & Uni Turku Special paper substrates Graphenoxide ink development Device characterization Industrial partners (e.g., Canatu) Carbon nanotube development
04/10/2012 18 VTT - 70 years of technology for business and society