Datasheet AH3535LC-1LEIX 1W/3W 3535 IR LED Lambertian
Features 1W/3W 3535 Al2O3 Ag-plating Ceramic Package Half Angle (2θ1/2) : 125 Silicone Compression Molding Lens Vertical Chips Main Applications Plant Lighting Industrial Lighting Medical Lighting Special Lighting Description This LED is one of the smallest high power LED footprint available by All Brite, has offered extended solid-state lighting design possibilities. It is designed with All Brite own Patents and using copper lead frame, the best thermal material of the world. It matches the JEDEC Level 1 MSL sensitivity level and suitable for SMD process, Pb free reflow soldering capability, and full compliance with EU Reduction of Hazardous Substances (RoHS) legislation.
Emitter Mechanical Dimensions Anode Cathode Bottom Layout Anode Dimension Recommended Solder Pad Adobe Cathode Slug Circuit Diagram Notes: 1. All dimensions are in millimeters. 2. Tolerance is ±0.25mm.
Electrical/Optical Characteristics (Ta=25 ) Parameter Symbol Typ. Unit Condition Forward Voltage VF 1-4 V Dominant Wavelength WLP 630-870 nm Viewing Angle [1] 2θ1/2 120 125 130 deg Luminous Flux Φe 135-760 mw IF=700 ma Thermal resistance (junction to solder point) Temperature coefficient of Voltage Rth(j-s) - 8 - /W VF/ T - -3 - mv/ Reverse leakage Current IR - - 10 μa VR=5 V Absolute Maximum Ratings (Ta=25 ) Parameter Symbol Ratings Unit Power Dissipation Pd 1-3 mw DC Forward Current IF 350 ma Max DC Forward Current IF(Max DC) 700 ma Max Pulsed Forward Current[2] IF(Max Pulsed) 1000 ma/ LED Junction Temperature TJ 120 Reverse Voltage VR 5 V Operating Temp. Topr 30 ~ +80 Storage Temp. Tstg 40 ~ +100 Note: [1] Tolerance Θ:10 [2] 1/10 Duty Cycle 0.1ms Pulse Width
Flux Characteristics Radiation Pattern Lambertian Part Number Radiant Flux (mw) Emitter Infrared 660 AH3535LC-1LEI6 180 1400 Infrared 740 AH3535LC-1LEI7 180 1400 Infrared 850 AH3535LC-1LEI8 180 1400 Electrical Characteristics Forward Voltage VF (V) Typ. Infrared 660 1.6-5 Infrared 740 1.6-5 Infrared 850 1.6-5 Optical Characteristics P/N Peak Wavelength (nm) Viewing Angle (degrees) 2 θ1/2 AH3535LC-1LEI6 Infrared 660 640 680 125 AH3535LC-1LEI7 Infrared 740 700 800 125 AH3535LC-1LEI8 Infrared 850 800 900 125
Peak Wavelength Bin Structure Bin Code Peak Wavelength (nm) DQ 640 645 DS 645 650 SA 650 655 Infrared 660 SC 655 660 SW 660 665 SG 665 670 SI 670 675 SK 675 680 Radiant Flux Bin Structure Bin Code Radiant Flux (mw) AM 180 210 AN 210 240 AO 240 285 AP 285 325 AQ 325 380 AR 380 440 AS 440 520 Infrared 660 AT 520 600 AU 600 700 AV 700 800 AW 800 900 AX 900 1000 AY 1000 1100 AZ 1100 1200 BA 1200 1300 BB 1300 1400
Forward Voltage Bin Structure Bin Code Forward Voltage (V) 2 1.6 1.8 3 1.8 2.0 4 2.0 2.2 5 2.2 2.4 6 2.4 2.6 7 2.6 2.8 8 2.8 3.0 9 3.0 3.2 Infrared 660 A 3.2 3.4 B 3.4 3.6 C 3.6 3.8 D 3.8 4.0 E 4.0 4.2 F 4.2 4.4 G 4.4 4.6 H 4.6 4.8 I 4.8 5.0
Peak Wavelength Bin Structure Bin Code Peak Wavelength (nm) JA 700 705 JC 705 710 JE 710 715 JG 715 720 JI 720 725 JJ 725 730 JM 730 735 JO 735 740 JQ 740 745 Infrared 740 JS 745 750 KA 750 755 KC 755 760 KE 760 765 KG 765 770 KI 770 775 KJ 775 780 KM 780 785 KO 785 790 KQ 790 795 KS 795 800
Radiant Flux Bin Structure Bin Code Radiant Flux (mw) AM 180 210 AN 210 240 AO 240 285 AP 285 325 AQ 325 380 AR 380 440 AS 440 520 Infrared 740 AT 520 600 AU 600 700 AV 700 800 AW 800 900 AX 900 1000 AY 1000 1100 AZ 1100 1200 BA 1200 1300 BB 1300 1400
Forward Voltage Bin Structure Bin Code Forward Voltage (V) 2 1.6 1.8 3 1.8 2.0 4 2.0 2.2 5 2.2 2.4 6 2.4 2.6 7 2.6 2.8 8 2.8 3.0 9 3.0 3.2 Infrared 740 A 3.2 3.4 B 3.4 3.6 C 3.6 3.8 D 3.8 4.0 E 4.0 4.2 F 4.2 4.4 G 4.4 4.6 H 4.6 4.8 I 4.8 5.0
Peak Wavelength Bin Structure Bin Code Peak Wavelength (nm) IA 800 805 IC 805 810 IE 810 815 IG 815 820 II 820 825 IJ 825 830 IM 830 835 IO 835 840 IQ 840 845 Infrared 850 IS 840 850 FA 850 855 FC 855 860 FE 860 865 FG 865 870 FI 870 875 FJ 875 880 FM 880 885 FO 885 890 FQ 890 895 FS 895 900
Radiant Flux Bin Structure Bin Code Radiant Flux (mw) AM 180 210 AN 210 240 AO 240 285 AP 285 325 AQ 325 380 AR 380 440 AS 440 520 Infrared 850 AT 520 600 AU 600 700 AV 700 800 AW 800 900 AX 900 1000 AY 1000 1100 AZ 1100 1200 BA 1200 1300 BB 1300 1400
Forward Voltage Bin Structure Bin Code Forward Voltage (V) 2 1.6 1.8 3 1.8 2.0 4 2.0 2.2 5 2.2 2.4 6 2.4 2.6 7 2.6 2.8 8 2.8 3.0 9 3.0 3.2 Infrared 850 A 3.2 3.4 B 3.4 3.6 C 3.6 3.8 D 3.8 4.0 E 4.0 4.2 F 4.2 4.4 G 4.4 4.6 H 4.6 4.8 I 4.8 5.0
Relative intensity (350mA normalize to 1) Current (ma) Relative intensity AH3535LC-1LEIX Spectrum distribution Wavelength (nm) Characteristic curves Current (ma) Forward Voltage (VF) Fig.1 Radiant flux (Φe) vs Current (ma) Fig.2 Current (IF) vs Voltage (VF)
Relative intensity AH3535LC-1LEIX Typical radiation pattern View angle (degrees) Relative intensity
Carrier Tape Dimensions Cathode Anode Notes: All dimensions are in millimeters.
Emitter Reel Packaging Notes: All dimensions are in millimeters. Label Form Specification All Brite International P/N: XXXX CAT: U HUE: B1 VF: 51 Quantity: 1000 PCS Lot No: ACO201239 Date: 2012/09/28 ROHS QC P/N : Part Number CAT: Brightness Rank HUE: Rank Vf: Forward Voltage Rank Quantity: Packing Quantity Lot No: Lot Number Date: Date Note: Above specification may be changed without notice. We will reserve authority on material change for above specification.
Typical Reflow Soldering Profile Reflow Soldering Temperature Profile Profile Feature Average Ramp-Up Rate (Tsmax to TP) Preheat Temperature Min (TSmin) Temperature Max (TSmax) Time (Tsmin to TSmax) Typical parameters 3 C / second max. 150 C 200 C 60-180 seconds Time maintained above Temperature (TL) Time (TL) 217 C 60-150 seconds Peak/Classification Temperature (Tp) 240 C Time within 5 C of Actual Peak Temperature (Tp) Ramp-Down Rate Time 25 C to Peak Temperature 5 seconds 6 C/second max. 8 minutes max.
Precaution for Use In order to avoid absorption of moisture, it is recommended that the products are stored in the dry box (or desiccators ) with a desiccants. Alternatively the following environment is recommended: Storage temperature : 5 C~30 C Humidity:60% HR max. If the storage conditions are of high humidity the product should be dried before use. Recommended drying conditions: 12 hours at 60 C±5 C. Any mechanical force or any excess vibration should be avoid during the cooling process after soldering. Reflow rapidly cooling should be avoided. Components should not be mounted on distorted Printed Circuit Boards. Devices should not contact with any types of fluid, such as water, oil, organic solvents. etc. The maximum ambient temperature should be taken into consideration when determining the operating current. Devices should be soldered within 7 days after opening the moisture-proof packing. Repack unused product in anti-moisture packing, fold to close any opening and store in a dry place. The appearance and specifications of devices may be modified for improvement without notice. ESD Precautions Static Electricity and surge damages LEDs. It is recommended that wrist bands or anti-electrostatic gloves be used when handing the LEDs. All devices, equipment and machinery should be properly grounded. This product must be driven by constant power supplier.