TLPA TOSHIBA PHOTOCOUPLER GaAlAs LED & PHOTO-IC TLPA Plasma Display Panels (PDPs) High-Speed Interface Factory Automation (FA) Unit: mm The Toshiba TLPA mini-flat coupler is a small-outline coupler suitable for surface-mount assembly. The TLPA consists of a GaAlAs light-emitting diode and an integrated high-gain, high-speed photodetector. This unit is housed in the -pin SO package and guarantees a creepage distance of.0mm, a clearance of.0mm and an insulation thickness of 0.mm. Therefore, the TLPA meets the reinforced insulation class requirements of international safety standards. Inverter logic (totem-pole output) SO package Guaranteed performance over: -0 to 00 C Power supply voltage:. to.v Input thresholds current: IFHL = ma (max). ± 0..7 ± 0. 7.0 ± 0. 0..27 2. 0. 2. ± 0. 0. 0. min TOSHIBA -L Weight: 0.08 g (typ.) Propagation delay time (tphl / tplh): 0 ns (max) Switching speed: 20 MBd (typ.) Common-mode transient immunity: ±0 kv/us Isolation voltage: 70 Vrms UL approval: UL77, File No.E79 Under application Truth Table Input LED Tr Tr2 Output H ON OFF ON L L OFF ON OFF H Construction Mechanical Rating Creepage Distance:.0mm (min) Clearance:.0mm (min) Insulation Thickness: 0.mm (min) Pin Configuration (Top View) Schematic + I F VF - Tr2 : ANODE : CATHODE : : V O (Output) : Tr I CC I O V O A bypass capacitor of 0.μF must be connected between pins and.
TLPA Absolute Maximum Ratings (Ta=2 C) LED DETECTOR Characteristic Symbol Rating Unit Forward current IF 20 ma Forward current derating (Ta 8 C) ΔI F / ΔTa -0. ma/ C Peak transient forward current (Note ) IFPT A Reverse voltage VR V Output current IO 0 ma Output voltage VO V Supply voltage V Output power dissipation PO 0 mw Operating temperature range Topr -0 to 00 C Storage temperature range Tstg - to 2 C Lead solder temperature(0 s) Tsol 20 C Isolation voltage (AC, min.,r.h. 0%,Ta=2 C) (Note 2) BVs 70 Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ( Handling Precautions / Derating Concept and Methods ) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Recommended Operating Conditions Characteristic Symbol Min Typ. Max Unit Input current, ON IF(ON) 8 8 ma Input voltage, OFF VF(OFF) 0 0.8 V Supply voltage (Note )..0. V Operating temperature Topr -0 00 C Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. Correlation between Input current, switching speed and drive circuit (reference information). Input current (IF) 2mA 8mA 8mA Test Circuit (Page ) (Page ) 2 (Page, With Speed up capacitor) Note : Pulse width PW μs, 00 pps. Typical switching speed 2 2 MBd 8 20 MBd 2 27 MBd Note 2 : This device is regarded as a two terminal device : pins and are shorted together, as are pins, and. Note : The detector of this product requires a power supply voltage ( ) of. V or higher for stable operation. If the is lower than this value, an I CC may increase, or an output may be unstable. Be sure to use the product after checking the supply current, and the operation of a power-on/-off. 2
Electrical Characteristics (Unless otherwise specified, Ta=-0 to 00 C, =. to. V ) Characteristic Symbol Test Circuit TLPA Conditions Min Typ. Max Unit Input forward voltage VF IF = 0 ma,ta = 2 C..8.8 V Temperature coefficient of forward voltage ΔVF /ΔTa IF = 0 ma -2.0 mv/ C Input reverse current IR VR= V, Ta = 2 C 0 μa Input capacitance CT V = 0, f= MHz, Ta = 2 C 0 pf Logic low output voltage VOL Logic high output voltage VOH 2 IOL =. ma, IF = 2 ma, = V IOH = -0.02 ma, VF =.0 V, = V 0. V.0 V Logic low supply current ICCL IF = 2 ma.0 ma Logic high supply current ICCH VF = 0 V.0 ma Input current logic low output Input voltage logic high output IFHL IO =. ma, VO < 0. V ma VFLH IO = -0.02 ma, VO >.0 V 0.8 V *All typical values are at Ta=2 C, = V, IF(ON)=2 ma unless otherwise specified Isolation Characteristics (Ta = 2 C) Characteristic Symbol Test Conditions Min Typ. Max Unit Capacitance input to output C S Vs = 0,f = MHz (Note 2) 0.8 pf R.H. 0%, V Isolation resistance R S = 00 V S (Note 2) 0 2 0 Ω AC, minute 70 V rms Isolation voltage BV S AC, second,in oil 0000 DC, minute,in oil 0000 Vdc Note :A ceramic capacitor(0. μf) should be connected from pin to pin to stabilize the operation of the high gain linear amplifier. Failure to provide the bypass may impair the switching property. The total lead length between capacitor and coupler should not exceed cm.
Switching Characteristics (Unless otherwise specified, Ta=-0 to 00 C, =. to. V) TLPA Characteristic Symbol Test Circuit Conditions Min. Typ. Max. Unit Propagation delay time tphl IF = 0 2 ma R IN = 00 Ω 0 ns to logic high output CL = pf Propagation delay time tplh IF = 2 0 ma (Note ) 0 ns to logic low output Propagation delay time V IN = 0 V R tphl IN = 70 Ω 0 ns to logic high output (IF = 0 8 ma) C IN = 27 pf Propagation delay time V IN = 0 V CL = pf tplh to logic low output (IF = 8 0 ma) (Note ) 0 ns Switching time dispersion tphl- IF = 2 ma, R IN = 00 Ω, between ON and OFF tplh CL =v pf (Note ) 0 ns Output fall time(90-0%) tf IF = 0 2 ma R IN = 00 Ω ns Output rise time(0-90%) tr IF = 2 0 ma CL = pf (Note ) ns Common mode transient immunity at high Level output Common mode transient immunity at low level output CMH CML 7 VCM = 000 Vp-p, IF = 0 ma, Vo(Min) = V, Ta = 2 C VCM = 000 Vp-p, IF = 2 ma, Vo(Max) = 0. V, Ta = 2 C 0000 V/μs -0000 V/μs *All typical values are at Ta=2 C Note : CL is approximately pf which includes probe and Jig/stray wiring capacitance. TEST CIRCUIT : VOL TEST CIRCUIT 2: VOH I F 0. μf V OL I OL V V 0. μf V OH I OH TEST CIRCUIT : ICCL TEST CIRCUIT : ICCH I F I CCL A I CCH A 0. μf 0. μf
TLPA TEST CIRCUIT : tphl, tplh I F = 2 ma(p.g) (f = MHz, duty = 0% less than tr = tf = ns) CL= pf INPUT MONITORING NODE R IN =00 Ω 0. μf Vo MONITORING NODE CL = pf IF V O. V tf tr 0% 0% 90% VOH VOL tphl tplh CL is capacitance of the probe and JIG. (P.G): Pulse Generator TEST CIRCUIT : tphl, tplh V IN = V(P.G) (f = MHz, duty = 0% less than tr = tf = ns) C IN =27 pf CL= pf INPUT MONITORING NODE R IN =70 Ω 0. μf Vo MONITORING NODE CL= pf IF V O tf tr 0% 90% VOH. V 0% VOL CL is capacitance of the probe and JIG. (P.G): Pulse Generator tphl tplh TEST CIRCUIT 7: Common-Mode Transient Immunity Test Circuit 90% 000 V SW I F A B V CM 0. V O 0% SW B : IF=0 ma SW A : IF= ma tr V tf 0. V CM H CM L CM H 800( V ) = tr ( μs) CM L 800( V ) = t f ( μs)
TLPA Specification for Embossed Tape Packing (TPL)(TPR) for SO Coupler. Applicable Package Package SO Product Type Mini-flat coupler 2. Product Naming System Type of package used for shipment is denoted by a symbol suffix after a product number. The method of classification is as below. (Example) TLPA(TPL) Tape type Device name. Tape Dimensions. Specification Classification Are as Shown in Table Table Tape Type Classification Tape type Classification Quantity (pcs/reel) TPL L direction 000 TPR R direction 000.2 Orientation of Device in Relation to Direction of Tape Movement Device orientation in the recesses is as shown in Figure. Direction of Tape L direction R direction Figure Device Orientation
TLPA. Empty Device Recesses Are as Shown in Table 2. Table 2 Empty Device Recesses Occurrences of 2 or more successive empty device recesses Standard 0 Remarks Within any given 0-mm section of tape, not including leader and trailer Single empty device recesses devices (max.) per reel Not including leader and trailer. Start and End of Tape The start of the tape has 0 or more empty holes. The end of tape has 0 or more empty holes and two empty turns only for a cover tape.. Tape Specification () Tape material: Plastic (protection against electrostatics) (2) Dimensions: The tape dimensions are as shown in Figure 2 and Table. 0. ± 0.0 φ. +0. 0 G A B D 2.0 ± 0. E K 0 F. ± 0.2 φ. ± 0. Figure 2 Tape Forms Table Tape Dimensions Symbol Dimension Remark A.2 B 7. Unit: mm Unless otherwise specified: ±0. D. Center line of indented square hole and sprocket hole E.7 Distance between tape edge and hole center F 8.0 +0. Cumulative error -0. (max) per 0 feed holes G.0 Cumulative error +0. -0. (max) per 0 feed holes K 0 2.8 Internal space 7
TLPA. Reel () Material: Plastic (2) Dimensions: The reel dimensions are as shown in Figure and Table. E U C B A W W2 Figure Reel Form Table Reel Dimensions Unit: mm Symbol Dimension A Φ80 ±2 B Φ80 ± C Φ ±0. E 2.0 ±0. U.0 ±0. W. ±0. W2 7. ±.0. Packing Either one reel or five reels of photocoupler are packed in a shipping carton.. Label Indication The carton bears a label indicating the product number, the symbol representing classification of standard, the quantity, the lot number and the Toshiba company name.. Ordering Method When placing an order, please specify the product number, the tape type and the quantity as shown in the following example. (Example) TLPA (TPL) 000 pcs Quantity (must be a multiple of 000) Tape type Device name 8
TLPA RESTRICTIONS ON PRODUCT USE Toshiba Corporation, and its subsidiaries and affiliates (collectively TOSHIBA ), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively Product ) without notice. This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA s written permission, reproduction is permissible only if reproduction is without alteration/omission. Though TOSHIBA works continually to improve Product s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the TOSHIBA Semiconductor Reliability Handbook and (b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS PRODUCT DESIGN OR APPLICATIONS. Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact ( Unintended Use ). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA () ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 9