FEATURES Conversion loss: db LO to RF isolation: db LO to IF isolation: 3 db Input third-order intercept (IP3): 1 dbm Input second-order intercept (IP2): dbm LO port return loss: dbm RF port return loss: 1 dbm Passive double balanced topology Wide IF bandwidth: dc to 3 GHz 24-terminal ceramic leadless chip carrier package APPLICATIONS WiMAX and fixed wireless Point to point radios Point to multipoint radios Test equipment and sensors Military end use GENERAL DESCRIPTION The HMC7A is a general-purpose, double balanced mixer in a 24-terminal, ceramic leadless chip carrier, RoHS-compliant package. The device can be used as an upconverter or downconverter from 2. GHz to 7. GHz. This mixer is fabricated in a gallium arsenide (GaAs) metal semiconductor field effect transistor (MESFET) process and requires no external components or matching circuitry. GaAs, MMIC Fundamental Mixer, 2. GHz to 7. GHz HMC7A FUNCTIONAL BLOCK DIAGRAM 1 GND 2 LO 3 GND 4 24 23 22 21 2 19 7 9 1 11 GND IF GND = NO INTERNAL CONNECTION. Figure 1. 1 17 GND 1 RF GND 14 13 PACKAGE BASE GND The HMC7A provides excellent local oscillator (LO) to radio frequency (RF) and LO to intermediate frequency (IF) isolation due to optimized balun structures. The RoHS-compliant HMC7A eliminates the need for wire bonding and is compatible with high volume surface-mount manufacturing techniques. 1311-11 Rev. F Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 91, Norwood, MA 22-91, U.S.A. Tel: 71.329.47 2 21 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com
HMC7A TABLE OF CONTENTS Features... 1 Applications... 1 Functional Block Diagram... 1 General Description... 1 Revision History... 2 Electrical Specifications... 3 2. GHz to. GHz Frequency Range... 3. GHz to 7. GHz Frequency Range... 3 Absolute Maximum Ratings... 4 ESD Caution... 4 Pin Configuration and Function Descriptions... Interface Schematics... Typical Performance Characteristics... 7 Downconverter Performance with Upper Sideband Selected, IF = 1 MHz... 7 Downconverter Performance with Upper Sideband Selected, IF = 1 MHz... 9 Downconverter Performance with Upper Sideband Selected, IF = 2 MHz... 1 Downconverter Performance with Lower Sideband Selected, IF = 1 MHz... 11 Data Sheet Downconverter Performance with Lower Sideband Selected, IF = 1 MHz... Downconverter Performance with Lower Sideband Selected, IF = 2 MHz... 13 P1dB Performance with Downconverter Mode Selected at LO Drive = dbm... 14 Upconverter Performance with Upper Sideband Selected, IF = 1 MHz... Upconverter Performance with Upper Sideband Selected, IF = 1 MHz... 1 Upconverter Performance with Upper Sideband Selected, IF = 2 MHz... 17 Upconverter Performance with Lower Sideband Selected, IF = 1 MHz... 1 Upconverter Performance with Lower Sideband Selected, IF = 1 MHz... 19 Upconverter Performance with Lower Sideband Selected, IF = 2 MHz... 2 Spurious Performance with Upper Sideband Selected, IF = 1 MHz... 21 Applications Information... 22 Outline Dimensions... 23 Ordering Guide... 23 REVISION HISTORY 4/21 Rev. E to Rev. F Changes to Table 3... 4 1/217 Rev. D to Rev. E Added Field Induced Charge Device Model (FICDM) Parameter, Table 3... 4 Changes to Ordering Guide... 23 /217 Rev. C to Rev. D Changes to Ordering Guide... 23 /21 Rev. B to Rev. C Changes to Ordering Guide... 23 1/21 Rev. A to Rev. B Change to LO to RF Isolation Parameter, Table 2... 3 9/2 Rev. to Rev. A Changes to Features Section... 1 Added Maximum Peak Reflow Temperature Parameter, Table 3... 4 Updated Outline Dimensions... 23 Changes to Ordering Guide... 23 7/2 Revision : Initial Version Rev. F Page 2 of 23
HMC7A ELECTRICAL SPECIFICATIONS 2. GHz TO. GHz FREQUENCY RANGE TA = C, IF = 1 MHz, LO drive = dbm. All measurements performed as a downconverter with the upper sideband selected, unless otherwise noted. Table 1. Parameter Min Typ Max Unit OPERATING CONDITIONS RF Frequency Range 2.. GHz LO Frequency Range 2.. GHz IF Frequency Range DC 3 GHz PERFORMANCE Conversion Loss 1. db Noise Figure, Single Sideband (SSB) db LO to RF Isolation 4 db LO to IF Isolation 2 3 db RF to IF Isolation 2 db Input Third-Order Intercept (IP3) 14 1 dbm Input Second-Order Intercept (IP2) dbm Input Power for 1 db Compression (P1dB) 1 dbm RF Port Return Loss 1 db LO Port Return Loss db. GHz TO 7. GHz FREQUENCY RANGE TA = C, IF = 1 MHz, LO drive = dbm. All measurements performed as a downconverter with the upper sideband selected, unless otherwise noted. Table 2. Parameter Min Typ Max Unit OPERATING CONDITIONS RF Frequency Range. 7. GHz LO Frequency Range. 7. GHz IF Frequency Range DC 3 GHz PERFORMANCE Conversion Loss. 1. db Noise Figure, Single Sideband (SSB). db LO to RF Isolation 37 43 db LO to IF Isolation 33 db RF to IF Isolation db Input Third-Order Intercept (IP3) 14 1 dbm Input Second-Order Intercept (IP2) dbm Input Power for 1 db Compression (P1dB) 1 dbm RF Port Return Loss db LO Port Return Loss db Rev. F Page 3 of 23
HMC7A ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating RF Input Power dbm LO Input Power 27 dbm Channel Temperature 17 C Continuous PDISS (T = C), Derate 9. mw/ C 7 mw Above C) Thermal Resistance (Channel to Ground Pad) C/W Maximum Peak Reflow Temperature (MSL3) 2 C Storage Temperature Range C to + C Operating Temperature Range 4 C to + C ESD Sensitivity, Human Body Model (HBM) 1 V (Class 1C) Field Induced Charge Device Model (FICDM) 1 V (Class C3) Data Sheet Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. ESD CAUTION Rev. F Page 4 of 23
HMC7A PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 24 23 22 21 2 19 1 GND 2 LO 3 GND 4 HMC7A TOP VIEW (Not to Scale) 1 17 1 14 13 GND RF GND 7 9 GND IF GND 1 11 NOTES 1. = NO INTERNAL CONNECTION. 2. CONNECT THE EXPOSED PAD TO A LOW IMPEDANCE THERMAL AND ELECTRICAL GROUND PLANE. 1311- Figure 2. Pin Configuration Table 4. Pin Function Descriptions Pin No. Mnemonic Description 1, to 7, 11 to 14, 1 to 24 No Internal Connection. No connection is required on these pins. These pins are not internally connected. However, all data is measured with these pins connected to RF/dc ground externally. 2, 4,, 1,, 17 GND Ground Connect. Connect these pins and the package bottom to RF/dc ground. 3 LO Local Oscillator Port. This pin is dc-coupled and matched to Ω. 9 IF Intermediate Frequency Port. This pin is dc-coupled. For applications not requiring operation to dc, block this pin externally using a series capacitor with a value chosen to pass the necessary IF frequency range. For operation to dc, this pin must not source or sink more than 2 ma of current or device nonfunctionality or device failure may result. 1 RF Radio Frequency Port. This pin is dc-coupled and matched to Ω. EPAD Exposed Pad. Connect the exposed pad to a low impedance thermal and electrical ground plane. Rev. F Page of 23
HMC7A Data Sheet INTERFACE SCHEMATICS GND 1311-77 IF 1311-79 Figure 3. GND Interface Schematic Figure. IF Interface Schematic LO 1311-7 RF 1311- Figure 4. LO Interface Schematic Figure. RF Interface Schematic Rev. F Page of 23
HMC7A TYPICAL PERFORMANCE CHARACTERISTICS DOWNCONVERTER PERFORMANCE WITH UPPER SIDEBAND SELECTED, IF = 1 MHz T A = C 1 RF TO IF LO TO RF LO TO IF ISOLATION (db) 2 3 2 Figure 7. Conversion Gain vs. RF Frequency at Various Temperatures, 2 Figure. Conversion Gain vs. RF Frequency at Various LO Drives 1311-1 1311-2 LO RETURN LOSS (db) 1 2 RF/LO FREQUENCY (GHz) Figure 1. Isolation vs. RF/LO Frequency 3 T A = C 3 LO FREQUENCY (GHz) Figure 11. LO Port Return Loss vs. LO Frequency, 1311-4 1311- CONVERSION GAIN IF RETURN LOSS T A = C RESPONSE (db) 1 2 RF RETURN LOSS (db) 1 2 3 3 3. 1. 1. 2. 2. 3. 3. 4. IF FREQUENCY (GHz) Figure 9. Conversion Gain and IF Return Loss Response vs. IF Frequency, LO Frequency = 4. GHz 1311-3 3 Figure. RF Port Return Loss vs. RF Frequency, LO Frequency = 4. GHz, 1311- Rev. F Page 7 of 23
HMC7A Data Sheet 3 3 2 2 1 1 T A = C 1311-7 1311- Figure 13. Input IP3 vs. RF Frequency at Various Temperatures, Figure. Input IP3 vs. RF Frequency at Various LO Drives 7 T A = C 7 IP2 (dbm) 4 IP2 (dbm) 4 3 2 1 1311-9 3 2 1 1311-1 Figure 14. Input IP2 vs. RF Frequency at Various Temperatures, Figure 1. Input IP2 vs. RF Frequency at Various LO Drives Rev. F Page of 23
HMC7A DOWNCONVERTER PERFORMANCE WITH UPPER SIDEBAND SELECTED, IF = 1 MHz T A = C 2 Figure 17. Conversion Gain vs. RF Frequency at Various Temperatures, 1311-11 2 Figure 2. Conversion Gain vs. RF Frequency at Various LO Drives 1311-3 T A = C 3 2 2 1 1 1311-13 1311-14 Figure 1. Input IP3 vs. RF Frequency at Various Temperatures, Figure 21. Input IP3 vs. RF Frequency at Various LO Drives 7 T A = C 7 IP2 (dbm) 4 IP2 (dbm) 4 3 2 1 1311-3 2 1 1311-1 Figure 19. Input IP2 vs. RF Frequency at Various Temperatures, Figure 22. Input IP2 vs. RF Frequency at Various LO Drives Rev. F Page 9 of 23
HMC7A Data Sheet DOWNCONVERTER PERFORMANCE WITH UPPER SIDEBAND SELECTED, IF = 2 MHz T A = C 2 Figure 23. Conversion Gain vs. RF Frequency at Various Temperatures, 1311-17 2 Figure 2. Conversion Gain vs. RF Frequency at Various LO Drives 1311-1 3 T A = C 3 2 2 1 1 1311-19 1311-2 Figure 24. Input IP3 vs. RF Frequency at Various Temperatures, Figure 27. Input IP3 vs. RF Frequency at Various LO Drives 7 T A = C 7 IP2 (dbm) 4 IP2 (dbm) 4 3 2 1 1311-21 3 2 1 1311-22 Figure. Input IP2 vs. RF Frequency at Various Temperatures, Figure 2. Input IP2 vs. RF Frequency at Various LO Drives Rev. F Page 1 of 23
HMC7A DOWNCONVERTER PERFORMANCE WITH LOWER SIDEBAND SELECTED, IF = 1 MHz T A = C 2 Figure 29. Conversion Gain vs. RF Frequency at Various Temperatures, 3 1311-23 2 Figure 32. Conversion Gain vs. RF Frequency at Various LO Drives 3 1311-24 2 2 1 1 T A = C 1311-1311-2 Figure 3. Input IP3 vs. RF Frequency at Various Temperatures, Figure 33. Input IP3 vs. RF Frequency at Various LO Drives 7 T A = C 7 IP2 (db) 4 IP2 (dbm) 4 3 2 1 1311-27 3 2 1 1311-2 Figure 31. Input IP2 vs. RF Frequency at Various Temperatures, Figure 34. Input IP2 vs. RF Frequency at Various LO Drives Rev. F Page 11 of 23
HMC7A Data Sheet DOWNCONVERTER PERFORMANCE WITH LOWER SIDEBAND SELECTED, IF = 1 MHz T A = C 2 Figure 3. Conversion Gain vs. RF Frequency at Various Temperatures, 1311-29 2 Figure 3. Conversion Gain vs. RF Frequency at Various LO Drives 1311-3 3 T A = C 3 2 2 1 1 1311-31 1311-32 Figure 3. Input IP3 vs. RF Frequency at Various Temperatures, Figure 39. Input IP3 vs. RF Frequency at Various LO Drives 7 T A = C 7 IP2 (dbm) 4 IP2 (dbm) 4 3 2 1 1311-33 3 2 1 1311-34 Figure 37. Input IP2 vs. RF Frequency at Various Temperatures, Figure 4. Input IP2 vs. RF Frequency at Various LO Drives Rev. F Page of 23
HMC7A DOWNCONVERTER PERFORMANCE WITH LOWER SIDEBAND SELECTED, IF = 2 MHz T A = C 2 Figure 41. Conversion Gain vs. RF Frequency at Various Temperatures, 1311-3 2 Figure 44. Conversion Gain vs. RF Frequency at Various LO Drives 1311-3 3 T A = C 3 2 2 1 1 1311-37 1311-3 Figure 42. Input IP3 vs. RF Frequency at Various Temperatures, Figure 4. Input IP3 vs. RF Frequency at Various LO Drives 7 T A = C 7 IP2 (dbm) 4 IP2 (dbm) 4 3 2 1 1311-39 3 2 1 1311-4 Figure 43. Input IP2 vs. RF Frequency at Various Temperatures, Figure 4. Input IP2 vs. RF Frequency at Various LO Drives Rev. F Page 13 of 23
HMC7A Data Sheet P1dB PERFORMANCE WITH DOWNCONVERTER MODE SELECTED AT LO DRIVE = dbm 1 14 T A = C 1 14 T A = C 1 1 Figure 47. Input P1dB vs. RF Frequency at Various Temperatures, IF = 1 MHz, USB 1311-41 Figure. Input P1dB vs. RF Frequency at Various Temperatures, IF = 1 MHz, USB 1311-42 1 14 T A = C 1 14 T A = C 1 1 Figure 4. Input P1dB vs. RF Frequency at Various Temperatures, IF = 2 MHz, USB 1311-43 Figure 1. Input P1dB vs. RF Frequency at Various Temperatures, IF = 1 MHz, LSB 1311-44 1 14 T A = C 1 14 T A = C 1 1 1311-4 1311-4 Figure 49. Input P1dB vs. RF Frequency at Various Temperatures, IF = 1 MHz, LSB Figure 2. Input P1dB vs. RF Frequency at Various Temperatures, IF = 2 MHz, LSB Rev. F Page 14 of 23
HMC7A UPCONVERTER PERFORMANCE WITH UPPER SIDEBAND SELECTED, IF = 1 MHz T A = C 2 1311-47 2 1311-4 Figure 3. Conversion Gain vs. RF Frequency at Various Temperatures, Figure. Conversion Gain vs. RF Frequency at Various LO Drives 3 T A = C 3 2 2 1 1 1311-49 1311- Figure 4. Input IP3 vs. RF Frequency at Various Temperatures, Figure 7. Input IP3 vs. RF Frequency at Various LO Drives 1 T A = C 4 2 Figure. Input P1dB vs. RF Frequency at Various Temperatures, 1311-1 Rev. F Page of 23
HMC7A Data Sheet UPCONVERTER PERFORMANCE WITH UPPER SIDEBAND SELECTED, IF = 1 MHz T A = C 2 1311-2 2 1311-3 Figure. Conversion Gain vs. RF Frequency at Various Temperatures, Figure 1. Conversion Gain vs. RF Frequency at Various LO Drives 3 T A = C 3 2 2 1 1 1311-4 1311- Figure 9. Input IP3 vs. RF Frequency at Various Temperatures, Figure 2. Input IP3 vs. RF Frequency at Various LO Drives 1 T A = C 4 2 Figure. Input P1dB vs. RF Frequency at Various Temperatures, 1311- Rev. F Page 1 of 23
HMC7A UPCONVERTER PERFORMANCE WITH UPPER SIDEBAND SELECTED, IF = 2 MHz T A = C 2 Figure 3. Conversion Gain vs. RF Frequency at Various Temperatures, 1311-7 2 Figure. Conversion Gain vs. RF Frequency at Various LO Drives 1311-3 T A = C 3 2 2 1 1 1311-9 1311- Figure 4. Input IP3 vs. RF Frequency at Various Temperatures, Figure 7. Input IP3 vs. RF Frequency at Various LO Drives 1 T A = C 4 2 Figure. Input P1dB vs. RF Frequency at Various Temperatures, 1311-1 Rev. F Page 17 of 23
HMC7A Data Sheet UPCONVERTER PERFORMANCE WITH LOWER SIDEBAND SELECTED, IF = 1 MHz T A = C 2 Figure. Conversion Gain vs. RF Frequency at Various Temperatures, 1311-2 2 Figure 71. Conversion Gain vs. RF Frequency at Various LO Drives 1311-3 3 T A = C 3 2 2 1 1 1311-4 1311- Figure 9. Input IP3 vs. RF Frequency at Various Temperatures, Figure 72. Input IP3 vs. RF Frequency at Various LO Drives 1 T A = C 4 2 Figure 7. Input P1dB vs. RF Frequency at Various Temperatures, 1311- Rev. F Page 1 of 23
HMC7A UPCONVERTER PERFORMANCE WITH LOWER SIDEBAND SELECTED, IF = 1 MHz T A = C 2 Figure 73. Conversion Gain vs. RF Frequency at Various Temperatures, 1311-7 2 Figure 7. Conversion Gain vs. RF Frequency at Various LO Drives 1311-3 T A = C 3 2 2 1 1 1311-9 1311-7 Figure 74. Input IP3 vs. RF Frequency at Various Temperatures, Figure 77. Input IP3 vs. RF Frequency at Various LO Drives 1 T A = C 4 2 Figure 7. Input P1dB vs. RF Frequency at Various Temperatures, 1311-71 Rev. F Page 19 of 23
HMC7A Data Sheet UPCONVERTER PERFORMANCE WITH LOWER SIDEBAND SELECTED, IF = 2 MHz T A = C 2 Figure 7. Conversion Gain vs. RF Frequency at Various Temperatures, 1311-72 2 Figure 1. Conversion Gain vs. RF Frequency at Various LO Drives 1311-73 3 T A = C 3 2 2 1 1 1311-74 1311-7 Figure 79. Input IP3 vs. RF Frequency at Various Temperatures, Figure 2. Input IP3 vs. RF Frequency at Various LO Drives 1 T A = C 4 2 Figure. Input P1dB vs. RF Frequency at Various Temperatures, 1311-7 Rev. F Page 2 of 23
HMC7A SPURIOUS PERFORMANCE WITH UPPER SIDEBAND SELECTED, IF = 1 MHz Mixer spurious products are measured in dbc from the IF output power level. Spur values are (M RF) (N LO). M N Spurious Outputs RF frequency = GHz, RF input power = 1 dbm, LO frequency = 4.9 GHz, LO drive = dbm. M RF N LO 1 2 3 4 N/A 1 +3. +33.3 +.2 +43.3 +2. 1 +.9 +. +31.7 +3.1 +. +73.4 2 +74. +4.7 +1.2 +3. +79. +7.1 3 +74.2 +7. +. +72 +7. +79.2 4 +73.2 +77. +7.3 +7 +9.7 +79.3 92. +72.7 +7.7 +77. +1.3 +.9 1 N/A means not applicable. Rev. F Page 21 of 23
HMC7A Data Sheet APPLICATIONS INFORMATION 1311-2 Figure 3. Evaluation Printed Circuit Board (PCB) Table. List of Materials for Evaluation PCB EV1HMC7ALC4 1 Item Description J1, J2, J3 Johnson SMA connector U1 HMC7ALC4 mixer PCB 2 1173 evaluation PCB 3 1 Reference this number when ordering the complete evaluation PCB. 2 The circuit board material is Rogers 43. 3 This is the bare PCB of the evaluation PCB kit (see Figure 3). It is recommended that the application circuit board use RF circuit design techniques. Use signal lines with a Ω impedance, and connect the package ground leads and exposed pad directly to the ground plane. Use a sufficient number of via holes to connect the top and bottom ground planes. The evaluation circuit board shown in Figure 3 is available from Analog Devices, Inc., upon request. Rev. F Page 22 of 23
HMC7A OUTLINE DIMENSIONS PIN 1 INDICATOR 4. 3.9 SQ 3.7. BSC 19.3.3.24 24 PIN 1 1 1. BSC EXPOSED PAD 2. 2. SQ 2.4 PKG-44 1..9. SEATING PLANE ORDERING GUIDE Temperature Model 1 Range TOP VIEW SIDE VIEW.32 BSC 13 BOTTOM VIEW 2. REF 3.1 BSC FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. Figure 4. 24-Terminal Ceramic Leadless Chip Carrier [LCC] (E-24-1) Dimensions shown in millimeters Package Body Material Lead Finish MSL Rating 2 Package Description 7 2-27-217-B Package Option HMC7ALC4 4 C to + C Alumina Ceramic Gold over Nickel MSL3 24-Terminal Ceramic LCC E-24-1 HMC7ALC4TR 4 C to + C Alumina Ceramic Gold over Nickel MSL3 24-Terminal Ceramic LCC E-24-1 HMC7ALC4TR-R 4 C to + C Alumina Ceramic Gold over Nickel MSL3 24-Terminal Ceramic LCC E-24-1 EV1HMC7ALC4 Evaluation Board 1 All models are RoHS Compliant parts. 2 Maximum peak reflow temperature of 2 C. 2 21 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D1311--4/1(F) Rev. F Page 23 of 23