8V Normally-Open Single-Pole 6-Pin OptoMOS Relay Parameter Rating Units Load Voltage 8 V P Load Current 1 ma rms 8 ma DC On-Resistance (max) Input Control Current 2 ma Features Guaranteed Specifications at 1ºC -4ºC to +1ºC Operational Temperature Range ma Input Control Current Over Operating Temperature Range 8V P Blocking Voltage 6.8mm Pad-to-Pad Separation of Output Pins V rms Input/Output Isolation Small Surface Mount Package Arc-Free With No Snubbing Circuits No EMI/RFI Generation Flammability Rating UL 94 V- Applications Industrial Controls Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment Patient/Equipment Isolation Description IXYS IC Division's is a single-pole, normallyopen (1-Form-A) Solid State Relay, rated for operation up to 1ºC, that uses optically coupled MOSFET technology to provide an en hanced input to output isolation of V rms. The unique device pinout provides more than 6.8mm of pad-to-pad separation between the high voltage output pins. Control of the optically coupled output is by the input infrared LED. The is designed to replace electromechanical relays, and provides bounce-free switching in a compact, surface-mount package. Approvals UL Approval Pending EN/IEC 69-1 Approval Pending Ordering Information Part # TR Pin Configuration Description 6-Pin (8-Pin Body) Flatpack (/Tube) 6-Pin (8-Pin Body) Flatpack, Tape & Reel (1/Reel) 1 NC 2 + Control 3 Control 4 NC AC/DC Configuration 8 Load Load Switching Characteristics of Normally-Open Devices Form-A 9% 1% I LOAD t on t off DS--R1 www.ixysic.com 1
Absolute Maximum Ratings (@ 2ºC Unless otherwise noted) Parameter Ratings Units Blocking Voltage (-4ºC to +1ºC) 8 V P Reverse Input Voltage V Input Control Current ma Peak (1ms) 1 A Input Power Dissipation 1 1 mw Output Power Dissipation AC Load Current 2 89 DC Load Current 3 667 mw Isolation Voltage, Input to Output (6 Seconds) V rms Operational Temperature -4 to +1 C Storage Temperature -4 to +12 C 1 Derate linearly 1.33 mw / ºC 2 Derate linearly 8.9 mw / ºC 3 Derate linearly 6.67 mw / ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at the specified temperatures and are the result of engineering evaluations. They are provided for information purposes only and are not part of the manufacturing testing requirements. Electrical Characteristics Parameter Conditions Symbol Min Typ Max Units Output Characteristics @ 2 C Load Current =2mA AC 1 - - 1 ma Continuous I rms DC 2 L - - 8 ma DC Peak t=1ms I LPK - - ±3 ma P On-Resistance 3 =2mA, I L = 1mA - 37 R I ON F =2mA, I L =1mA - 7 8 Off-State Leakage Current V L =8V P I LEAK - - 1 µa Switching Speeds Turn-On t =ma, I L =1mA on - 1.2 Turn-Off t off -. ms Output Capacitance =ma, V L =2V, f=1mhz C OUT - 1 - pf Output Characteristics @ 1 C On-Resistance 3 =ma, I L =3mA - 7 11 R I ON F =ma, I L =1mA - 11 14 Off-State Leakage Current V L =8V P I LEAK - - µa Switching Speeds Turn-On t =ma, I L =3mA on - - 1 Turn-Off t off - - 1 ms Input Characteristics @ 2 C Input Control Current to Activate 4 I L =1mA -.3 2 ma Input Control Current to Deactivate -. - - ma Input Voltage Drop =ma V F.9 1.2 1. V Reverse Input Current V R =V I R - - 1 A Input Characteristics @ 1 C Input Control Current to Activate I L =3mA - - ma Common Characteristics @ 2 C Input to Output Capacitance V IO =V, f=1mhz C IO - 1 - pf 1 Load derates linearly from 1mA @ 2 o C to 44mA @1 o C (.7mA/ºC). 2 Load derates linearly from 8mA @ 2ºC to 38mA @ 1ºC (.9mA/ºC). 3 Measurement taken within 1 second of on-time. 4 For applications requiring high temperature operation (greater than 6 o C) a minimum LED drive current of ma is recommended. 2 www.ixysic.com R1
PERFORMANCE DATA* 2 Typical LED Forward Voltage Drop (N=, =ma) 3 Typical for Switch Operation (N=, I L =1mA) 2 Typical for Switch Dropout (N=, I L =1mA) 2 1 1 2 2 1 1 1 1 1.2 1.24 1.28 1.212 1.216 1.22 1.224 LED Forward Voltage (V).2.2.3.3.4.4.. LED Forward Current (ma).2.2.3.3.4.4. LED Forward Current (ms) 2 Typical On-Resistance (N=, =ma, I L =1mA) 1 Typical Turn-On Time (N=, =ma, I L =1mA) 2 Typical Turn-Off Time (N=, =ma, I L =1mA) 1 1 1 2 1 1. 1 1. 2 2. 3 3. 4 1.6 1.8 2. 2.2 2.4 2.6 2.8 3. 3.2 3.4 Turn-On Time (ms).4.4...6.6.7 Turn-Off Time (ms) 2 Typical On-Resistance (N=, =ma, I L =1mA) 2 Typical Blocking Voltage Distribution (N=) 2 1 1 1 1 33. 33. 34. 34. 3. 3. 92 96 968 976 984 992 Blocking Voltage (V P ) LED Forward Voltage (V) 1.6 1. 1.4 1.3 1.2 1.1 LED Forward Voltage Drop =ma =1mA =ma =2mA 1. - -2 2 7 1 12 Turn-On Time (ms) 7 6 4 3 2 1 Turn-On Time vs. LED Forward Current =1mA) 1 2 3 4 LED Forward Current (ma) Turn-Off Time (ms) 2. 1. 1... Turn-Off Time vs. LED Forward Current =1mA) 1 2 3 4 LED Forward Current (ma) *Unless otherwise noted, data presented in these graphs is typical of device operation at 2ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. R1 www.ixysic.com 3
PERFORMANCE DATA* LED Current (ma) 1..9.8.7.6..4.3.2.1 Typical to Activate/Deactivate Activate Deactivate - -2 2 7 1 12 Turn-On Time (ms) 1 8 6 4 2 Turn-On Time =4mA) =ma =1mA - -2 2 7 1 12 Temperature ( C) Turn-Off Time (ms) 1..8.6.4.2 Turn-Off Time =4mA) =1mA =ma. - -2 2 7 1 12 12 1 8 6 4 2 On-Resistance ( =ma, t<1s) I L =2mA I L =1mA - -2 2 7 1 12 7 6 6 4 4 3 3 On-Resistance vs. Load Current ( =ma) 1 2 3 4 Load Current (ma) Load Current (ma) Load Current vs. Load Voltage ( =ma) 12 1 7 2-2 - -7-1 -12-4 -3-2 -1 1 2 3 4 Load Voltage (V) Load Current (ma) 12 1 8 6 4 2 Maximum Continuous Load Current ( =ma) ma DC ma rms - -2 2 7 1 12 Blocking Voltage (V P ) 11 1 1 9 9 8 Typical Blocking Voltage 8 - -2 2 7 1 12 Leakage Current 1 A 1nA 1nA 1nA 1pA 1pA 1pA Typical Leakage Current 1fA - -2 2 7 1 12 *Unless otherwise noted, data presented in these graphs is typical of device operation at 2ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R1
Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-2, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-33. ESD Sensitivity Device Moisture Sensitivity Level (MSL) Classification MSL 1 This product is ESD Sensitive, and should be handled according to the industry standard JESD-62. Soldering Profile Provided in the table below is the Classification Temperature (T C ) of this product and the maximum dwell time the body temperature of this device may be (T C - )ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-2 must be observed. Board Wash Device Classification Temperature (T c ) Dwell Time (t p ) Max Reflow Cycles 2ºC 3 seconds 3 IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R1 www.ixysic.com
Package Mechanical Dimensions 9.62 ±.381 (.38 ±.1) 7.62 ±.127 (.3 ±.) min /.3 max ( min /.12 max) 2.741 ±.12 (.18 ±.4) 1.7 (.669) PCB Land Pattern 6.3 ±.127 (.2 ±.) Pin 1 2.4 ±.127 (.1 ±.) 9.398 ±.24 (.37 ±.1).9 ±.76 (.22 ±.3) 2.88 ±.2 (.12 ±.1) 7.62 ±.24 (.3 ±.1).24 ±.127 (.1 ±.) (exclusive of plating).63 ±.24 (.2 ±.1).7 (.2) 8.7 (.342) 2.4 (.1).47 ±.76 (.18 ±.3).864 ±.12 (.34 ±.4) Dimensions mm (inches) TR Tape & Reel 33.2 DIA. (13. DIA.) Top Cover Tape Thickness.12 MAX. (.4 MAX.) B =1.7 (.421) W=16 (.63) K =3.2 (.126) A =1.9 (.429) P1=12. (.472) K 1 =2.7 (.16) Embossed Carrier Embossment NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all Notes for constant dimensions listed on page of EIA-481-2 Dimensions mm (inches) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS--R1 Copyright 217, IXYS Integrated Circuits Division OptoMOS is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/8/217