Ceramic Filters (CERAFILr)/ Crystal Filters. P51E.pdf Feb.5,2018

Ceramic Filters (CERAFILr)/ Crystal Filters Feb.,8

Feb.,8 EU RoHS Compliant For r o ur

Feb.,8 Contents Product specifications are as of January 8. Selection Guide Part Numbering p p3 Ceramic Filters (CERAFILr) Chip Type SFECF Series Features/Appearance/Dimensions Part Number List Standard Center Frequency Rank Code Standard Land Pattern Dimensions Test Circuit Frequency Characteristics Spurious Notice Packaging p6 p6 p p p p8 p p p Ceramic Filters (CERAFILr) Chip Type SFSKB Series Features/Applications/Appearance/Dimensions Part Number List Standard Land Pattern Dimensions Test Circuit Frequency Characteristics Spurious Notice Packaging p3 p3 p3 p3 p36 p3 p38 p 3 3 Ceramic Filters (CERAFILr) Chip Type SFECV/SFECK Series Features/Applications/Appearance/Dimensions Part Number List Standard Center Frequency Rank Code Standard Land Pattern Dimensions Test Circuit Frequency Characteristics Spurious Notice Packaging Ceramic Filters (CERAFILr) Chip Type SFSCE Series Features/Applications/Appearance/Dimensions Part Number List Standard Land Pattern Dimensions Test Circuit Frequency Characteristics Notice Packaging p p p6 p6 p6 p6 p p8 p p p p p p p3 p 6 Ceramic Trap (CERAFILr) Chip Type TPSKA Series Features/Appearance/Dimensions Part Number List Standard Land Pattern Dimensions Test Circuit Frequency Characteristics Spurious Notice Packaging Ceramic Discriminator (CERAFILr) Chip Type CDSCB Series Features/Appearance/Dimensions Part Number List Standard Center Frequency Rank Code Standard Land Pattern Dimensions Test Circuit Recovered Audio Curve S Curve Notice Packaging p p p p p p p3 p p6 p6 p6 p p p9 p p p3 6 Ceramic Filters (CERAFILr) Chip Type SFSKA Series Features/Appearance/Dimensions Part Number List Standard Land Pattern Dimensions Test Circuit Frequency Characteristics Spurious Notice Packaging p8 p8 p8 p8 p9 p3 p3 p33 8 Crystal Filters Chip Type XDCAF/XDCAG/XDCAH/XDCBA Series Features/Applications/Appearance/Dimensions p Series p Part Number List p Test Circuit p6 Frequency Characteristics p Spurious p8 Notice p9 Packaging p6 8 Please check the MURATA website (https://www.murata.com/) if you cannot find a part number in this catalog.

Feb.,8 Selection Guides Applications Audio Visual/Communications Industrial Filters Traps Discriminators Crystal Filters SFECF 3. 3..mm.-.MHz TPSKA 8. 3.8.mm.-6.MHz CDSCB...mm.-.8MHz XDCAF...mm poles SFECV/SFECK 6.9.9.mm.-.MHz XDCAG...mm poles SFSCE. 3.8.mm.-.MHz XDCAH...mm poles SFSKA 8. 3.8.mm.-6.MHz XDCBA 3.8 3.8.mm poles SFSKB. 3.8.mm.3-.MHz

Feb.,8 o Part Numbering CERAFILr for FM (Part Number) SF E CF 3 M F A 6 A -R 8 Product ID Product ID SF Oscillation/Number of Elements Code E T V K 3Structure/Size Code Cp Ceramic Filters Oscillation/Number of Elements Elements Thickness Expander Mode 3 Elements Thickness Expander Mode Elements Thickness Expander Mode (nd Harmonic) Elements Thickness Expander Mode (3rd Overtone) Structure/Size Chip Type p is "A" or subsequent code, which indicates the structure/size. Nominal Center Frequency Expressed by four-digit alphanumerics. The unit is in hertz (Hz). Decimal point is expressed by capital letter "M" in case of MHz. 6Center Frequency/Tolerance Code Center Frequency Tolerance A Center Frequency Mentioned by Specification ±3kHz F Nominal Center Frequency 3dB bandwidth of "F" signifies the frequency difference (both + and -) from reference frequency, which is nominal center frequency. Series Code A 8Packaging Code -B Series Two-digit Alphanumerics Express Series Packaging Bulk -R Embossed Taping ø8mm -R Embossed Taping ø33mm Radial taping is applied to lead type and embossed taping to chip type. With non-standard products, two-digit alphanumerics indicating "Individual Specification" are added between "Series" and "8Packaging." 3dB Bandwidth Code C D E F G H J K L M N 3dB Bandwidth khz min 3kHz min 33kHz 8kHz 3kHz 8kHz khz khz 8kHz khz 3kHz 3

Feb.,8 CERAFILr (Part Number) SF S KA 3 M CF 6 -R Product ID Product ID SF Oscillation/Numbers of Element Code S 3Structure/Size Ceramic Filters Oscillation/Numbers of Element Elements Thickness Shear Mode Code Structure/Size Kp Chip Type p is "A" or subsequent code, which indicates the structure/size. Nominal Center Frequency Expressed by four-digit alphanumerics. The unit is in hertz (Hz). Decimal point is expressed by capital letter "M" in case of MHz. Product Specification Code () Code Product Specification Code () BF Tight Bandwidth Type CF Standard Bandwidth Type DF Broad Bandwidth Type EF Ultra-broad Bandwidth Type 6Product Specification Code () Code Product Specification Code () Standard Type Packaging Code -B -R Packaging Bulk Embossed Taping ø=33mm With non-standard products, two-digit alphanumerics indicating "Individual Specification" is added between "6Product Specification Code ()" and "Packaging." Ceramic Traps (Part Number) TP S KA 3 M B 6 -R Product ID Product ID TP Function Code S 3Structure/Size Ceramic Traps Function Single Traps Code Structure/Size Kp Chip Type p is "A" or subsequent code, which indicates the structure/size. Nominal Center Frequency Expressed by four-digit alphanumerics. The unit is in hertz (Hz). Decimal point is expressed by capital letter "M" in case of MHz. Product Specification Code () Code Product Specification () B Broad Bandwidth Type C Low Capacitance Type 6Product Specification Code () Code Product Specification () Standard Type Packaging Code -B -R Packaging Bulk Embossed Taping ø=33mm With non-standard products, three-digit alphanumerics indicating "Individual Specification" is added between "6Product Specification Code ()" and "Packaging."

Feb.,8 Discriminators for FM (Part Number) CD S CB 3 M G A 6 -R 8 Product ID Product ID CD Oscillation Code S 3Structure/Size Discriminators Oscillation Thickness Shear Mode Code Structure/Size Cp Chip Type p is "A" or subsequent code, which indicates the structure/size. Nominal Center Frequency Expressed by four-digit alphanumerics. The unit is in hertz (Hz). Decimal point is expressed by capital letter "M" in case of MHz. Series Code G Series Two-digit Alphanumerics Express Series 6Center Frequency/Tolerance Code Center Frequency Tolerance A F Center Frequency Mentioned by Specification Nominal Center Frequency ±3kHz 3dB bandwidth of "F" signifies the frequency difference (both + and -) from reference frequency, which is nominal center frequency. IC Code 8Packaging Code -B -R -R IC Applicable IC Control Code Packaging Bulk Embossed Taping ø=8mm Embossed Taping ø=33mm Radial taping is applied to lead type and embossed taping to chip type. With non-standard products, an alphanumerics indicating "Individual Specification" is added between "IC" and "8Packaging." Crystal Filter (Part Number) XD C A 3 F M R 6 A A 8 P 9 Product ID Product ID XD Crystal Filter Type Lead Style Code Type Lead Style C Monolithic SMD 3Size Code Size A B 3838 Structure Expressed by one alphabetic character. Number of Poles Code A G H 8Individual Specification Code *** Number of Poles ( Element) ( Element) ( Elements) Three-digit Alphanumerics Express Individual Specification. 9Packaging (Packaging quantity is expressed by one-digit number in "*") Code P*/L* Packaging Plastic Taping ø33mm Nominal Center Frequency Expressed by six-digit alphanumeric. The unit is in hertz (Hz). Decimal point is expressed by capital letter "M". 6Bandwidth Code M P Q R Bandwidth (3dB) 6.8 to 8.99kHz. to.999khz. to.999khz. to.999khz

!Note Please read rating and!caution (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc. Ceramic Filters (CERAFILr) Chip Type SFECF Series RoHS Feb.,8 The SFECFM series for FM receivers are small, high-performance and super thin (.mm max.) filters. The piezoelectric element is sandwiched by ceramic substrate. They have.mm max. thickness and a small mounting area (3.x3.mm). The SFECF series and CDSCB series (MHz Discriminator) enable customers to make VICS/RKE/TPMS sets very thin and small. Features. The filters are mountable by automatic placers.. They are slim, at only.mm max. thickness, and have a small mounting area (3.x3.mm) enabling flexible PCB design. 3. Various bandwidths are available. Select a suitable type in accordance with the desired characteristics.. Operating Temperature Range: - to +8 C (Standard Type) - to +8 C (High-reliability Type) Storage Temperature Range: - to +8 C (Standard Type) - to +8 C (High-reliability Type) Input electrode marker 3.±. 3.±. to.(.6)(.6) (.6) to. (.8)(.8).3 min..3 min..6±.3.±.3.6±.3 (): Input () () (3) ()(): Ground (6) () () (3)(): No connection (6): Output : EIAJ Monthly Code (.8)(.8) ( ): Reference to.3 to.3.8±.3.8±.3.±.3.3±. Standard Type Part Number SFECFMHA-R Center Frequency (fo) (MHz). ±3kHz Nominal Center Frequency (fn) (MHz) 3dB Bandwidth (khz) Attenuation (khz) Insertion Loss (db) Ripple (db) - 8 ±khz max..±.db. max. SFECFMHF-R -. fn± min. max. SFECFMGA-R. ±3kHz 8.max. [at fn]. max. - 3 ±khz max. 3.±.dB. max. SFECFMGF-R -. fn± min. 6 max. SFECFMFA-R. ±3kHz 8.max. [at fn]. max. - 8 ±khz 9 max. 3.±.dB. max. SFECFMFF-R -. fn±6 min. 6 max. SFECFMEA-R. ±3kHz SFECFMDA-R. ±3kHz.max. [at fn]. max. - 33 ±khz max. 3.±.dB. max. - min. 9 max. 3.±.dB 3. max. SFECFMDF-R -. fn± min. 99 max. 6.max. [at fn] 3. max. Spurious Attenuation () (db) Spurious Attenuation () (db) 3 min. 3 min. [within 9MHz to fo] [within fo to MHz] 3 min. min. [within 9MHz to fn] [within fn to MHz] 3 min. 3 min. [within 9MHz to fo] [within fo to MHz] 3 min. min. [within 9MHz to fn] [within fn to MHz] 3 min. 3 min. [within 9MHz to fo] [within fo to MHz] 3 min. min. [within 9MHz to fn] [within fn to MHz] 3 min. 3 min. [within 9MHz to fo] [within fo to MHz] 3 min. min. [within 9MHz to fo] [within fo to MHz] min. min. [within 9MHz to fn] [within fn to MHz] Input/Output Impedance (ohm) Area of Attenuation: [within db] Area of Insertion Loss: at minimum loss point Area of Ripple: within 3dB B.W. Center frequency (fo) defined by the center of 3dB bandwidth. For safety purposes, connect the output of filters to the IF amplifier through a D.C. blocking capacitor. Avoid applying a direct current to the output of ceramic filters. The order quantity should be an integral multiple of the "Minimum Quantity" shown in the packaging page. 33 33 33 33 33 33 33 33 33 6

Feb.,8 High-reliability Type Part Number Center Frequency (fo) (MHz) SFECFMHAS-R. ±3kHz Nominal Center Frequency (fn) (MHz) 3dB Bandwidth (khz) Attenuation (khz) Insertion Loss (db) Ripple (db) - 8 ±khz max..±.db. max. SFECFMHFS-R -. fn± min. max. SFECFMGAS-R. ±3kHz 8.max. [at fn]. max. - 3 ±khz max. 3.±.dB. max. SFECFMGFS-R -. fn± min. 6 max. SFECFMFAS-R. ±3kHz 8.max. [at fn]. max. - 8 ±khz 9 max. 3.±.dB. max. SFECFMFFS-R -. fn±6 min. 63 max. SFECFMEAS-R. ±3kHz.max. [at fn]. max. - 33 ±khz max. 3.±.dB. max. SFECFMDFS-R -. fn± min. 99 max. 6.max. [at fn] 3. max. Spurious Attenuation () (db) Spurious Attenuation () (db) 3 min. 3 min. [within 9MHz to fo] [within fo to MHz] 3 min. min. [within 9MHz to fn] [within fn to MHz] 3 min. 3 min. [within 9MHz to fo] [within fo to MHz] 3 min. min. [within 9MHz to fn] [within fn to MHz] 3 min. 3 min. [within 9MHz to fo] [within fo to MHz] 3 min. min. [within 9MHz to fn] [within fn to MHz] 3 min. 3 min. [within 9MHz to fo] [within fo to MHz] min. min. [within 9MHz to fn] [within fn to MHz] Input/Output Impedance (ohm) 33 33 33 33 33 33 33 33 Area of Attenuation: [within db] Area of Insertion Loss: at minimum loss point Area of Ripple: within 3dB B.W. Center frequency (fo) defined by the center of 3dB bandwidth. For safety purposes, connect the output of filters to the IF amplifier through a D.C. blocking capacitor. Avoid applying a direct current to the output of ceramic filters. The order quantity should be an integral multiple of the "Minimum Quantity" shown in the packaging page. Standard Center Frequency Rank Code CODE 3kHz Step khz Step A.MHz±3kHz.MHz±kHz Standard Land Pattern Dimensions Test Circuit.3. (6) () ().3.3.. () () (3).. (): Input.8.6.8.6.8 ()(): Ground (3)(): No connection (6): Output Indicates solder resist land pattern..... Rg S.S.G. E R (3) () () () () (6) R C E RF Voltmeter (): Input ()(): Ground (3)(): No connection Rg=Ω R=8Ω±% R=33Ω±% (6): Output C=±pF (Including stray capacitance and Input capacitance of RF voltmeter) E: S.S.G. Output Voltage

Feb.,8 Frequency Characteristics Standard Type SFECFMHA-R/SFECFMHF-R. SFECFMGA-R/SFECFMGF-R. 6. 6. 3.. 3.. Group Delay Time (μ sec.) 3.. 3.. Group Delay Time (μ sec.) 6. 6...3...9...3...9. SFECFMFA-R/SFECFMFF-R SFECFMEA-R.. 6. 6. 3.. 3.. Group Delay Time (μ sec.) 3.. 3.. Group Delay Time (μ sec.) 6. 6...3...9...3...9. SFECFMDA-R SFECFMDF-R.. 6. 6. 3.. 3.. Group Delay Time (μ sec.) 3.. 3.. Group Delay Time (μ sec.) 6. 6...3...9...3...9. 8

Feb.,8 Frequency Characteristics High-reliability Type SFECFMHAS-R/SFECFMHFS-R. SFECFMGAS-R/SFECFMGFS-R. 6. 6. 3.. 3.. Group Delay Time (μ sec.) 3.. 3.. Group Delay Time (μ sec.) 6. 6...3...9...3...9. SFECFMFAS-R/SFECFMFFS-R SFECFMEAS-R.. 6. 6. 3.. 3.. Group Delay Time (μ sec.) 3.. 3.. Group Delay Time (μ sec.) 6. 6...3...9...3...9. SFECFMDFS-R. 3 6 6... 3... Group Delay Time (μ sec.)..3...9. 9

Feb.,8 Frequency Characteristics (Spurious) Standard Type SFECFMHA-R/SFECFMHF-R SFECFMGA-R/SFECFMGF-R 3 3 6 6 8. 9.... 8. 9.... SFECFMFA-R/SFECFMFF-R SFECFMEA-R 3 3 6 6 8. 9.... 8. 9.... SFECFMDA-R/SFECFMDF-R 3 6 8. 9....

Feb.,8 Frequency Characteristics (Spurious) High-reliability Type SFECFMHAS-R/SFECFMHFS-R SFECFMGAS-R/SFECFMGFS-R 3 3 6 6 8. 9.... 8. 9.... SFECFMFAS-R/SFECFMFFS-R SFECFMEAS-R 3 3 6 6 8. 9.... 8. 9.... SFECFMDFS-R 3 6 8. 9....

Feb.,8 Notice Ceramic Filters (CERAFILr) Chip Type SFECF Series e Soldering and Mounting e. Standard Reflow Soldering Conditions () Reflow Filter is soldered twice within the following temperature conditions. Temperature ( C) 6 3 Pre-heating (-8 C) Peak (6 C max.) Heating (3 C) Gradual Cooling 3 sec. min. 6- sec. sec. max. sec. min. () Soldering Iron Filter is soldered at +3± C for 3.±. seconds. The soldering iron should not touch the filter while soldering. (3) Conditions for Placement Machines The component is recommended for use with placement machines that employ optical placement capabilities. The component might be damaged by excessive mechanical force. Please make sure that you have evaluated by using placement machines before going into mass production. Do not use placement machines that utilize mechanical positioning. Please contact Murata for details beforehand. () Other (a) The component may be damaged if excess mechanical stress is applied to it mounted on the printed circuit board. (b) Design layout of components on the PC board to minimize the stress imposed on the warp or flexure of the board. (c) After installing components, if solder is excessively applied to the circuit board, mechanical stress will cause destruction resistance characteristics to degrade. To prevent this, be extremely careful in determining shape and dimension before designing the circuit board diagram. (d) When the positioning claws and pick-up nozzle are worn, the load is applied to the components while positioning is concentrated on positioning accuracy, etc. Careful checking and maintenance are necessary to prevent unexpected trouble. (e) When correcting components with a soldering iron, the tip of the soldering iron should not directly touch the component. Depending on the soldering conditions, the effective area of terminations may be reduced. Solder containing Ag should be used to prevent electrode erosion. (f) Do not use strong acidity flux, more than.wt% chlorine content, in reflow soldering. [Component Direction] [Component Layout Close to Board] Perforation A B Slit C Place the component lateral to the direction in which stress acts. Susceptibility to stress is in the order of: A>C>B Continued on the following page.

Notice Continued from the preceding page.. Wash Do not clean or wash the component as it is not hermetically sealed. Feb.,8 3. Coating In case of overcoating the component, conditions such as material of resin, cure temperature, and so on should be evaluated well. e Storage and Operating Conditions e. Product Storage Conditions Please store the products in a room where the temperature/humidity is stable, and avoid places where there are large temperature changes. Please store the products under the following conditions: Temperature: - to + C Humidity: to 8% R.H.. Expiration Date on Storage Expiration date (shelf life) of the products is six months after delivery under the conditions of a sealed and unopened package. Please use the products within six months after delivery. If you store the products for a long time (more than six months), use carefully because solderability may be degraded due to storage under poor conditions. Please confirm solderability and characteristics for the products regularly. 3. Notice on Product Storage () Please do not store the products in a chemical atmosphere (Acids, Alkali, Bases, Organic gas, Sulfides and so on), because quality and solderability may be degraded due to storage in a chemical atmosphere. () Please do not put the products directly on the floor without anything under them to avoid damp places and/or dusty places. (3) Please do not store the products in places such as a damp heated place or any place exposed to direct sunlight or excessive vibration. () Please use the products immediately after package is opened, because quality and solderability may be degraded due to storage under poor conditions. () To avoid cracking of the ceramic element, please do not drop the products.. Other Please be sure to consult with our sales representative or engineer whenever the products are to be used in conditions not listed above. e Rating e The component may be damaged if excessive mechanical stress is applied. e Handling e. Accurate test circuit values are required to measure electrical characteristics. Miscorrelation may be caused if there is any deviation, especially stray capacitance, from the test circuit in the specification.. The components, packed in a moisture proof bag (dry pack), are sensitive to moisture. The following treatment is required before applying reflow soldering, to avoid reliability degradation caused by thermal stress. When unpacked, store the component in an atmosphere of reflow 3 C and below 6%R.H., and solder within week. 3

Feb.,8 Packaging Minimum Quantity/Dimensions of Reel Embossed Tape ø8mm, (pcs.) Dimensions of Reel Trailer 6 to 9 Empty Components ø3.±. Leader Cover film Empty to 8 to 6 +. 6 - + 8 -..±..±. +. 3. - Dimensions of Carrier Tape Dimensions of Carrier Tape ø.±..±..±. Chip filter.±..±..±..±. 3 max. Peeling strength (. to.n) Cover film max..±. +. 3.3-. (3 ).3±. (.).8±..±. User direction of feed ( ): Reference

Ceramic Filters (CERAFILr) Chip Type SFECV/SFECK Series RoHS Feb.,8 6.9±.3 The SFECV/SFECKM series for FM receivers are monolithic type ceramic filters that utilize the thickness expander mode of piezoelectric ceramics. The SFECV series enable customers to make an AM/FM set very thin, and it can be useful to the total chip circuit..9±.3.±..±..±.3.±..±. * * (3) () () * Features. The piezoelectric element is sandwiched by heat resistant substrate, thus it has excellent mechanical strength, and it is suitable for automatic mounting.. Various bandwidths are available. Select a suitable type in accordance with the desired characteristics. 3. Operating Temperature Range: - to +8 C (Standard Type) - to +8 C (High-reliability Type) Storage Temperature Range: - to +8 C (Standard Type) - to +8 C (High-reliability Type).±..±..±..±. ** : EIAJ Monthly Code ** : Center Frequency Rank Code : Marking () : Input () : Ground (3) : Output Applications. Small, thin radios. Automotive radios 3. Headphone stereos Standard Type Center Part Number Frequency (fo) (MHz) SFECVMEQ-R. ±khz SFECVMKA-R SFECVMJA-R 3dB Bandwidth (khz) Attenuation (khz) Insertion Loss (db) Ripple (db) 3 min. max..max.. max. Spurious Attenuation () (db) 3 min. [within MHz to fo]. ±3kHz ±3kHz 3 max. 6.±.dB. max. 3 min. [within 9MHz to fo]. ±3kHz ±khz 38 max..±.db. max. 3 min. [within 9MHz to fo] Spurious Attenuation () (db) 3 min. [within fo to 6MHz] 3 min. [within fo to MHz] 3 min. [within fo to MHz] Input/Output Impedance (ohm) Area of Attenuation: [within db] Area of Insertion Loss: at minimum loss point Center frequency (fo) defined by the center of 3dB bandwidth. For safety purposes, connect the output of filters to the IF amplifier through a D.C. blocking capacitor. Avoid applying a direct current to the output of ceramic filters. The order quantity should be an integral multiple of the "Minimum Quantity" shown in the packaging page. 33 33 33 High-reliability Type Center Part Number Frequency (fo) (MHz) SFECKMKAS-R. ±3kHz SFECKMJAS-R. ±3kHz 3dB Bandwidth (khz) Attenuation (khz) Insertion Loss (db) Ripple (db) ±3kHz 3 max. 6.±.dB. max. ±khz 38 max..±.db. max. Spurious Attenuation () (db) Spurious Attenuation () (db) 3 min. 3 min. [within 9MHz to fo] [within fo to MHz] 3 min. 3 min. [within 9MHz to fo] [within fo to MHz] Input/Output Impedance (ohm) 33 33 Area of Attenuation: [within db] Area of Insertion Loss: at minimum loss point Center frequency (fo) defined by the center of 3dB bandwidth. For safety purposes, connect the output of filters to the IF amplifier through a D.C. blocking capacitor. Avoid applying a direct current to the output of ceramic filters. The order quantity should be an integral multiple of the "Minimum Quantity" shown in the packaging page.

Feb.,8 Standard Center Frequency Rank Code CODE 3kHz Step khz Step A.MHz±3kHz.MHz±kHz Standard Land Pattern Dimensions Test Circuit... R () (3). Rg S.S.G. =-dbm E () R C E RF Voltmeter.6.6.8.8 Land (): Input (): Ground (3): Output Rg=Ω R=8Ω±% R=33Ω±% C=±pF (Including stray capacitance and Input capacitance of RF voltmeter) E: S.S.G. Output Voltage Frequency Characteristics Standard Type SFECVMEQ-R SFECVMKA-R.. 6 8 8. 6... Group Delay Time (μ sec.) 3 6 6. 6..... Group Delay Time (μ sec.)...8.9....3 3..3...9. SFECVMJA-R 8. 3 6.. 6. 6... Group Delay Time (μ sec.)..3...9. 6

Feb.,8 Frequency Characteristics High-reliability Type SFECKMKAS-R SFECKMJAS-R. 8. 6.. 3 6.... Group Delay Time (μ sec.) 3. 6. 6.. Group Delay Time (μ sec.) 6. 6. 3..3...9...3...9. Frequency Characteristics (Spurious) Standard Type SFECVMEQ-R SFECVMKA-R 3 6 3 6 8 3... 6.. 8. 9.... SFECVMJA-R 3 6 8. 9.... Frequency Characteristics (Spurious) High-reliability Type SFECKMKAS-R SFECKMJAS-R 3 3 6 6 8. 9.... 8. 9....

Feb.,8 Notice Ceramic Filters (CERAFILr) Chip Type SFECV/SFECK Series e Soldering and Mounting e. Standard Reflow Soldering Conditions () Reflow Filter is soldered twice within the following temperature conditions. Temperature ( C) 3 Pre-heating (-8 C) Peak ( C max.) Heating (3 C) Gradual Cooling 3 sec. min. 6- sec. 3 sec. max. sec. min. () Soldering Iron Filter is soldered at +3± C for 3.±. seconds. The soldering iron should not touch the filter while soldering. (3) Conditions for Placement Machines The component is recommended for use with placement machines that employ optical placement capabilities. Damage may result from excessive mechanical force. Please make sure that you have evaluated by using placement machines before going into mass production. Do not use placement machines that utilize mechanical positioning. Please contact Murata for details beforehand. () Other (a) The component may be damaged if excess mechanical stress is applied to it mounted on the printed circuit board. (b) Design layout of components on the PC board to minimize the stress imposed on the warp or flexure of the board. (c) After installing components, if solder is excessively applied to the circuit board, mechanical stress will cause destruction resistance characteristics to degrade. To prevent this, be extremely careful in determining shape and dimension before designing the circuit board diagram. (d) When the positioning claws and pick-up nozzle are worn, the load is applied to the components while positioning is concentrated to one positioning accuracy, etc. Careful checking and maintenance are necessary to prevent unexpected trouble. (e) When correcting components with a soldering iron, the tip of the soldering iron should not directly touch the component. Depending on the soldering conditions, the effective area of terminations may be reduced. Solder containing Ag should be used to prevent electrode erosion. (f) Do not use strong acidity flux, more than.wt% chlorine content, in reflow soldering. [Component Direction] [Component Layout Close to Board] Perforation A B Slit C Put the component lateral to the direction in which stress acts. Susceptibility to stress is in the order of: A>C>B Continued on the following page. 8

Feb.,8 Notice Continued from the preceding page.. Wash Do not clean or wash the component as it is not hermetically sealed. 3. Coating In case of overcoating the component, conditions such as material of resin, cure temperature, and so on should be evaluated well. e Storage and Operating Conditions e. Product Storage Conditions Please store the products in room where the temperature/humidity is stable, and avoid places where there are large temperature changes. Please store the products under the following conditions: Temperature: - to + C Humidity: to 8% R.H.. Expiration Date on Storage Expiration date (Shelf life) of the products is six months after delivery under the conditions of a sealed and unopened package. Please use the products within six months after delivery. If you store the products for a long time (more than six months), use carefully because the products may be degraded in solderability due to storage under poor conditions. Please confirm solderability and characteristics for the products regularly. 3. Notice on Product Storage () Please do not store the products in a chemical atmosphere (Acids, Alkali, Bases, Organic gas, Sulfides and so on), because quality and solderability may be degraded due to the storage in a chemical atmosphere. () Please do not put the products directly on the floor without anything under them to avoid damp places and/or dusty places. (3) Please do not store the products in the places such as a damp heated place or any place exposed to direct sunlight or excessive vibration. () Please use the products immediately after package is opened, because quality and solderability may be degraded due to storage under the poor conditions. () To avoid cracking of the ceramic element, please do not drop the products.. Other Please be sure to consult with our sales representative or engineer whenever the products are to be used in conditions not listed above. e Rating e The component may be damaged if excessive mechanical stress is applied. e Handling e Accurate test circuit values are required to measure electrical characteristics. Miscorrelation may be caused if there is any deviation, especially stray capacitance, from the test circuit in the specification. 9

Feb.,8 Packaging Minimum Quantity/Dimensions of Reel Embossed Tape ø8mm, Dimensions of Reel Trailer 6-9 Empty Components ø3.±. (pcs.) Leader Cover film Empty -8-6 6 +. 8 +..±. 3. +..±. Dimensions of Carrier Tape ø. +...±..±. * ** * ** * ** * ** * **.3±..±..±..±..±. Peeling strength. to.n Cover film max. 3.±. (3 ).3±.. +...9±. ( ) : Reference

Ceramic Filters (CERAFILr) Chip Type SFSCE Series RoHS Feb.,8 The SFSCE series are chip surface mount filters available for 3dB bandwidth at khz to.3mhz (more than twice the width compared with current types). They have.mm max. thickness and small mounting area (.x3.8mm). Features. The filters are mountable by automatic placers.. They are slim, at only.mm max. thickness, and have a small mounting area (.x3.8mm) enabling flexible PCB design. 3. Available lead (Pb) free solder reflow.. Operating temperature range: - to +8 C Storage temperature range: - to +8 C. () () 3.8 (.8) () (-R.3) () () (.) (.) (.3) * (3) () (3). max..8..3.6.. (3.). (): Input (): Output (3): No Connection (): Ground *: EIAJ Monthly Code Tolerance unless otherwise specified: ±. ( ): Reference 3 Applications. SS digital communication system. Digital wireless audio 3. PHS Evolution system. RFID Reader Writer. RKE Part Number Nominal Center Frequency (fn) (MHz) SFSCEMWF3-R. SFSCEMWF-R. SFSCEMWF-R. 3dB Bandwidth (khz) fn±. min. fn±. min. fn±3. min. Stop Bandwidth (MHz). max. (Total) [within db].8 max. (Total) [within db]. max. (Total) [within db] Insertion Loss (db) 6. max. [at minimum loss point] 6. max. [at minimum loss point] 6. max. [at minimum loss point] Ripple (db). max. [within 3dB Bandwidth]. max. [within 3dB Bandwidth]. max. [within 3dB Bandwidth] Spurious Response (db) 3/ min. [within.mhz to fn / fn to.mhz] 3/ min. [within.mhz to fn / fn to.mhz] /3 min. [within.mhz to fn / fn to.mhz] GDT Deviation (µs).6 max. [within fn±khz].6 max. [within fn±3khz].6 max. [within fn±khz] Input/Output Impedance (ohm) For safety purposes, connect the output of filters to the IF amplifier through a DC blocking capacitor. Avoid applying a direct current to the output of ceramic filters. The order quantity should be an integral multiple of the "Minimum Quantity" shown in packaging page in this catalog. Standard Land Pattern Dimensions Test Circuit.... (3) ()...8.3 S.S.G. Rg R () () (3) () R C RF Voltmeter. () (). (): Input (): Output (3): No Connection (): Ground Indicates solder resist land pattern. (): Input (): Output (3): No Connection (): Ground R+Rg=R=Input/Output Impedance, Rg=Ω C=pF (Including stray capacitance and Input capacitance of RF Voltmeter) E: S.S.G. Output Voltage

Feb.,8 Frequency Characteristics SFSCEMWF3-R SFSCEMWF3-R. 6 8.6..8. Group Delay Time (μ sec.) 6. 9. 9.9.3....9 8 6. 8.... 3

Feb.,8 Notice SFSCEMWF3-R Notice e Soldering and Mounting e. Standard Reflow Soldering Conditions () Reflow Filter is soldered twice within the following temperature conditions. Peak ( C max.) Temperature ( C) 3 Pre-heating (-8 C) Heating (3 C) Gradual Cooling 3 sec. min. 6- sec. 3 sec. max. sec. min. 3 () Soldering Iron Filter is soldered at +8± C for 3.±. seconds. The soldering iron should not touch the filter while soldering. (3) Condition for Placement Machines The component is recommended for placement machines that employ optical placement capabilities. The component might be damaged by excessive mechanical force. Please make sure that you have evaluated by using placement machines before going into mass production. Do not use placement machines that utilize mechanical positioning. Please contact Murata for details beforehand. () Other (a) The component may be damaged if excess mechanical stress is applied to it mounted on the printed circuit board. (b) Design layout of components on the PC board to minimize the stress imposed on the warp or flexure of the board. (c) After installing components, if solder is excessively applied to the circuit board, mechanical stress will cause destruction resistance characteristics to degrade. To prevent this, be extremely careful in determining shape and dimension before designing the circuit board diagram. (d) When the positioning claws and pick-up nozzle are worn, the load is applied to the components while positioning is concentrated on positioning accuracy, etc. Careful checking and maintenance are necessary to prevent unexpected trouble. (e) When correcting components with a soldering iron, the tip of the soldering iron should not directly touch the component. (f) Do not use strong acidity flux, more than.wt% chlorine content, in reflow soldering. [Component Layout Close to Board] Perforation A Slit [Component Direction] B C Susceptibility to stress is in the order of: A>C>B Place the component laterally to the direction in which stress acts. Continued on the following page. 3

Feb.,8 Notice Continued from the preceding page.. Wash Do not clean or wash the component as it is not hermetically sealed. 3. Coating In case of overcoating the component, conditions such as material of resin, cure temperature, and so on should be evaluated well. 3 e Storage and Operating Conditions e. Product Storage Condition Please store the products in a room where the temperature/humidity is stable, and avoid places where there are large temperature changes. Please store the products under the following conditions: Temperature: - to + C Humidity: to 8% R.H.. Expiration Date on Storage Expiration date (shelf life) of the products is six months after delivery under the conditions of a sealed and unopened package. Please use the products within six months after delivery. If you store the products for a long time (more than six months), use carefully because solderability may be degraded due to storage under poor conditions. Please confirm solderability and characteristics for the products regularly. 3. Notice on Product Storage () Please do not store the products in a chemical atmosphere (Acids, Alkali, Bases, Organic gas, Sulfides and so on), because the characteristics may be reduced in quality and may be degraded in solderability due to storage in a chemical atmosphere. () Please do not put the products directly on the floor without anything under them to avoid damp places and/or dusty places. (3) Please do not store the products in places such as a damp heated place or any place exposed to direct sunlight or excessive vibration. () Please use the products immediately after the package is opened, because the characteristics may be reduced in quality and/or be degraded in solderability due to storage under poor condition. () Please do not drop the products to avoid cracking of the ceramic element.. Other Please be sure to consult with our sales representative or engineer whenever the products are to be used in conditions not listed above. e Rating e The component may be damaged if excessive mechanical stress is applied. e Handling e Accurate test circuit values are required to measure electrical characteristics. Miscorrelation may be caused if there is any deviation, especially stray capacitance, from the test circuit in the specification.

Feb.,8 Notice SFSCEMWF/-R Notice e Soldering and Mounting e. Standard Reflow Soldering Conditions () Reflow Filter is soldered twice within the following temperature conditions. 6 Peak (6 C max.) Temperature ( C) 3 Pre-heating (-8 C) Heating (3 C) Gradual Cooling 3 sec. min. 6- sec. sec. max. sec. min. 3 () Soldering Iron Filter is soldered at +8± C for 3.±. seconds. The soldering iron should not touch the filter while soldering. (3) Condition for Placement Machines The component is recommended for placement machines that employ optical placement capabilities. The component might be damaged by excessive mechanical force. Please make sure that you have evaluated by using placement machines before going into mass production. Do not use placement machines that utilize mechanical positioning. Please contact Murata for details beforehand. () Other (a) The component may be damaged if excess mechanical stress is applied to it mounted on the printed circuit board. (b) Design layout of components on the PC board to minimize the stress imposed on the warp or flexure of the board. (c) After installing components, if solder is excessively applied to the circuit board, mechanical stress will cause destruction resistance characteristics to degrade. To prevent this, be extremely careful in determining shape and dimension before designing the circuit board diagram. (d) When the positioning claws and pick-up nozzle are worn, the load is applied to the components while positioning is concentrated on positioning accuracy, etc. Careful checking and maintenance are necessary to prevent unexpected trouble. (e) When correcting components with a soldering iron, the tip of the soldering iron should not directly touch the component. (f) Do not use strong acidity flux, more than.wt% chlorine content, in reflow soldering. [Component Layout Close to Board] Perforation A Slit [Component Direction] B C Susceptibility to stress is in the order of: A>C>B Place the component laterally to the direction in which stress acts. Continued on the following page.

Feb.,8 Notice Continued from the preceding page.. Wash Do not clean or wash the component as it is not hermetically sealed. 3. Coating In case of overcoating the component, conditions such as material of resin, cure temperature, and so on should be evaluated well. 3 e Storage and Operating Conditions e. Product Storage Condition Please store the products in a room where the temperature/humidity is stable, and avoid places where there are large temperature changes. Please store the products under the following conditions: Temperature: - to + C Humidity: to 8% R.H.. Expiration Date on Storage Expiration date (shelf life) of the products is six months after delivery under the conditions of a sealed and unopened package. Please use the products within six months after delivery. If you store the products for a long time (more than six months), use carefully because solderability may be degraded due to storage under poor conditions. Please confirm solderability and characteristics for the products regularly. 3. Notice on Product Storage () Please do not store the products in a chemical atmosphere (Acids, Alkali, Bases, Organic gas, Sulfides and so on), because the characteristics may be reduced in quality and may be degraded in solderability due to storage in a chemical atmosphere. () Please do not put the products directly on the floor without anything under them to avoid damp places and/or dusty places. (3) Please do not store the products in places such as a damp heated place or any place exposed to direct sunlight or excessive vibration. () Please use the products immediately after the package is opened, because the characteristics may be reduced in quality and/or be degraded in solderability due to storage under poor condition. () Please do not drop the products to avoid cracking of the ceramic element.. Other Please be sure to consult with our sales representative or engineer whenever the products are to be used in conditions not listed above. e Rating e The component may be damaged if excessive mechanical stress is applied. e Handling e Accurate test circuit values are required to measure electrical characteristics. Miscorrelation may be caused if there is any deviation, especially stray capacitance, from the test circuit in the specification. 6

Feb.,8 Packaging Minimum Quantity/Dimensions of Reel Embossed Tape ø8mm, (pcs.) Dimensions of Reel Trailer 6 to 9 Leader Cover film + 8-. Empty Components ø3.±. Empty to 8 to 6 3.±..±. +. 3. - Dimensions of Carrier Tape Dimensions of Carrier Tape ± ± ± ± ± ± ± ± ± (3 ) ± ± ± ±

Ceramic Filters (CERAFILr) Chip Type SFSKA Series RoHS Feb.,8 The SFSKA_CF ceramic filter is a small and thin SMD filter sealed with a metal cap. The SFSKA_CF is recommended for LCD-TVs, and small and thin tuners. Features. High attenuation outside bandwidth. Small and thin package 3. Reflow-solderable.9±. 3.±..8±..±. 8.±. 3.8±..6±..±. () () (3).3±..3±..3±. () : Input () : Ground (3) : Output.±..±. Part Number Nominal Center Frequency (fn) (MHz) 3dB Bandwidth (khz) db Bandwidth (khz) Insertion Loss (db) Spurious Attenuation() (db) Spurious Attenuation() (db) Input/Output Impedance (ohm) SFSKAMCF-R3. fn±6 min. 6 max. 6. max. SFSKAMCF-R3. fn±6 min. 6 max. 6. max. min. [within to fn] min. [within to fn] min. [within fn to.mhz] min. [within fn to.mhz] 6 SFSKA6MCF-R3 6. fn±6 min. 6 max. 6. max. min. [within to fn] min. [within fn to.mhz] SFSKA6MCF-R3 6. fn±6 min. 6 max. 6. max. min. [within to fn] min. [within fn to 8.MHz] Area of Insertion Loss: at minimum loss point For safety purposes, connect the output of filters to the IF amplifier through a D.C. blocking capacitor. Avoid applying a direct current to the output of ceramic filters. The order quantity should be an integral multiple of the "Minimum Quantity" shown in the packaging page. Standard Land Pattern Dimensions Test Circuit SFSKAMCF-R3 () () (3)..... R.8 S.S.G. Rg E R C E RF Voltmeter (): Input (): Ground (3): Output R+Rg=R=Ω ±%, Rg=Ω C=pF (Including stray capacitance and Input capacitance of RF Voltmeter) E: S.S.G. Output voltage Continued on the following page. 8

Continued from the preceding page. Test Circuit Feb.,8 SFSKAMCF-R3 () () (3) SFSKA6MCF-R3 () () (3) R R Rg E R C E RF Voltmeter Rg E R C E RF Voltmeter S.S.G. S.S.G. (): Input (): Ground (3): Output R+Rg=R=6Ω ±%, Rg=Ω C=pF (Including stray capacitance and Input capacitance of RF Voltmeter) E: S.S.G. Output voltage (): Input (): Ground (3): Output R+Rg=R=Ω ±%, Rg=Ω C=pF (Including stray capacitance and Input capacitance of RF Voltmeter) E: S.S.G. Output voltage SFSKA6MCF-R3 () () (3) R Rg S.S.G. E R C E RF Voltmeter (): Input (): Ground (3): Output R+Rg=R=Ω ±%, Rg=Ω C=pF (Including stray capacitance and Input capacitance of RF Voltmeter) E: S.S.G. Output voltage Frequency Characteristics SFSKAMCF-R3 SFSKAMCF-R3 3 3 6 6 3. 3. 3.9..3...9..3....9..3...9 6. 6.3 6. SFSKA6MCF-R3 SFSKA6MCF-R3 3 3 6 6....6.8 6. 6. 6. 6.6 6.8....9 6. 6.3 6. 6. 6.9..3. 9

Feb.,8 Frequency Characteristics (Spurious) SFSKAMCF-R3 SFSKAMCF-R3 3 3 6 6... 6. 8.... 6. 8.. SFSKA6MCF-R3 SFSKA6MCF-R3 3 3 6 6.. 6. 8.... 6. 8.. 3

Feb.,8 Notice Ceramic Filters (CERAFILr) Chip Type SFSKA Series e Soldering and Mounting e. Standard Reflow Soldering Conditions () Reflow Filter is soldered twice within the following temperature conditions. Temperature ( C) 6 3 Pre-heating (-8 C) Peak (6 C max.) Heating (3 C) Gradual Cooling 3 sec. min. 6- sec. sec. max. sec. min. () Soldering Iron Filter is soldered at +3± C for 3.±. seconds. The soldering iron should not touch the filter while soldering. (3) Conditions for Placement Machines The component is recommended for use with placement machines that employ optical placement capabilities. Damage may result from excessive mechanical force. Please make sure that you have evaluated by using placement machines before going into mass production. Do not use placement machines that utilize mechanical positioning. Please contact Murata for details beforehand. () Other (a) The component may be damaged if excess mechanical stress is applied to it mounted on the printed circuit board. (b) Design layout of components on the PC board to minimize the stress imposed on the warp or flexure of the board. (c) After installing chips, if solder is excessively applied to the circuit board, mechanical stress will cause destruction resistance characteristics to degrade. To prevent this, be extremely careful in determining shape and dimension before designing the circuit board diagram. (d) When the positioning claws and pick-up nozzle are worn, the load is applied to the components while positioning is concentrated to one positioning accuracy, etc. Careful checking and maintenance are necessary to prevent unexpected trouble. (e) When correcting chips with a soldering iron, the tip of the soldering iron should not directly touch the chip component. [Component Direction] [Component Layout Close to Board] Perforation B A Slit C Put the component lateral to the direction in which stress acts. Susceptibility to stress is in the order of: A>C>B. Wash Do not clean or wash the component as it is not hermetically sealed. Continued on the following page. 3

Feb.,8 Notice Continued from the preceding page. 3. Coating In case of overcoating the component, conditions such as material of resin, cure temperature, and so on should be evaluated well. e Storage and Operating Conditions e. Product Storage Conditions Please store the products in room where the temperature/humidity is stable, and avoid places where there are large temperature changes. Please store the products under the following conditions: Temperature: - to + C Humidity: to 8% R.H.. Expiration Date on Storage Expiration date (Shelf life) of the products is six months after delivery under the conditions of a sealed and unopened package. Please use the products within six months after delivery. If you store the products for a long time (more than six months), use carefully because the products may be degraded in solderability due to storage under poor conditions. Please confirm solderability and characteristics for the products regularly. 3. Notice on Product Storage () Please do not store the products in a chemical atmosphere (Acids, Alkali, Bases, Organic gas, Sulfides and so on), because quality and solderability may be degraded due to the storage in a chemical atmosphere. () Please do not put the products directly on the floor without anything under them to avoid damp places and/or dusty places. (3) Please do not store the products in the places such as a damp heated place or any place exposed to direct sunlight or excessive vibration. () Please use the products immediately after package is opened, because quality and solderability may be degraded due to storage under the poor conditions. () To avoid cracking of the ceramic element, please do not drop the products.. Other Please be sure to consult with our sales representative or engineer whenever the products are to be used in conditions not listed above. e Rating e The component may be damaged if excessive mechanical stress is applied. e Handling e Accurate test circuit values are required to measure electrical characteristics. Miscorrelation may be caused if there is any deviation, especially stray capacitance, from the test circuit in the specification. 3

Feb.,8 Packaging Minimum Quantity/Dimensions of Reel Embossed Tape ø33mm 3, (pcs.) Dimensions of Reel Trailer 6 to 9 Empty.±. Components Empty to 8 min. Leader Cover film to 6 8± 33± ø3.±..±..±. Dimensions of Carrier Tape Dimensions of Carrier Tape +. ø...±..±. 9.±..±..±. 6.±. Peeling strength (. to.n) Cover film +. ø.. 8.±. max..3±. Chip filter (3 ).3±. +....3±. User direction of feed ( ) : Reference 33

Feb.,8 Ceramic Filters (CERAFILr) Chip Type SFSKB Series RoHS The SFSKB series are SMD ceramic filters suitable for IR headphone applications. Center frequencies of.3,.8, 3., 3.8,.3,.8,.,.MHz are available. Realized small, thin and lightweight package, compared with conventional LC filters. It helps to compose multi-channel circuit on one PCB. No frequency adjustment is required on PCB and it contributes to the reduction of production cost. Features 3.8±. (.).±. (.6).3±..±. () () (.).±. (.) -.3 * () (3) (.93) (3) ().3±. () () (3.).±. -.3 Terminal Connection () : Input () : Output (3) : Ground () : Terminal for external capacitor * : EIAJ Monthly Code Tolerance unless otherwise specified : ±.mm ( ) : Reference. SMD package in plastic emboss tape, available for automatic placing.. They are slim, at only.mm max. thickness, and have a small mounting area (.x3.8mm) enabling flexible PCB design. 3. Available for lead (Pb) free reflow soldering process.. Operating temperature range: to + C Storage temperature range: - to +8 C. No frequency adjustment is required in production process. 6. Small, thin and lightweight package compared with conventional LC filters Applications. IR headphone. Set Top Box for satellite broadcasting Part Number Nominal Center Frequency (fn) (MHz) 3dB Bandwidth (khz) db Bandwidth (khz) Insertion Loss (db) SFSKBM3GF-R.3 fn± min. 6 max. 6. max. SFSKBM8GF-R.8 fn± min. 6 max. 6. max. SFSKB3MFF-R 3. fn± min. 6 max. 6. max. SFSKB3M8GF-R 3.8 fn± min. 6 max. 6. max. SFSKBM3GF-R.3 fn± min. 6 max. 6. max. SFSKBM8GF-R.8 fn± min. 6 max. 6. max. SFSKBMGF-R. fn± min. 6 max. 6. max. SFSKBMGF-R. fn± min. 6 max. 6. max. Spurious Attenuation() (db) min. [within.3 to.8mhz] min. [within.8 to.3mhz] 3 min. [within. to.8mhz] 3 min. [within.8 to 3.MHz] 3 min. [within 3.3 to 3.8MHz] 3 min. [within 3.8 to.3mhz] 3 min. [within. to.8mhz] 3 min. [within. to.mhz] Spurious Attenuation() (db) 3 min. [within.8 to 3.3MHz] min. [within 3.3 to 3.8MHz] 3 min. [within 3.8 to.mhz] 3 min. [within.3 to.8mhz] 3 min. [within.8 to.3mhz] 3 min. [within. to.8mhz] 3 min. [within. to 6.MHz] 3 min. [within 6. to 6.MHz] Input/Output Impedance (ohm) For safety purposes, connect the output of filters to the IF amplifier through a D.C. blocking capacitor. Avoid applying a direct current to the output of ceramic filters. The order quantity should be an integral multiple of the "Minimum Quantity" shown in the packaging page. 3

Feb.,8 Standard Land Pattern Dimensions.8..8.3.6.3 Test Circuit SFSKBM3GF-R/SFSKB3M8GF-R SFSKBM8GF-R/SFSKB3MFF-R R () () R () () Rg S.S.G. E () (3) Cc R C E RF Voltmeter Rg S.S.G. E () (3) Cc R C E RF Voltmeter R+Rg=R=.kΩ Cc=pF±% C=pF (Including stray capacitance and Input capacitance of RF Voltmeter) E: S.S.G. Output Voltage (): Input (): Output (3): Ground (): Terminal for external capacitor R+Rg=R=.kΩ Cc=39pF±% C=pF (Including stray capacitance and Input capacitance of RF Voltmeter) E: S.S.G. Output Voltage (): Input (): Output (3): Ground (): Terminal for external capacitor SFSKBM3GF-R/SFSKBMGF-R SFSKBM8GF-R R () () R () () Rg S.S.G. E () (3) Cc R C E RF Voltmeter Rg S.S.G. E () (3) Cc R C E RF Voltmeter R+Rg=R=.kΩ Cc=33pF±% C=pF (Including stray capacitance and Input capacitance of RF Voltmeter) E: S.S.G. Output Voltage (): Input (): Output (3): Ground (): Terminal for external capacitor R+Rg=R=.kΩ Cc=pF±% C=pF (Including stray capacitance and Input capacitance of RF Voltmeter) E: S.S.G. Output Voltage (): Input (): Output (3): Ground (): Terminal for external capacitor SFSKBMGF-R R () () Rg S.S.G. E () (3) Cc R C E RF Voltmeter R+Rg=R=.kΩ Cc=pF±% C=pF (Including stray capacitance and Input capacitance of RF Voltmeter) E: S.S.G. Output Voltage (): Input (): Output (3): Ground (): Terminal for external capacitor 3

Feb.,8 Frequency Characteristics SFSKBM3GF-R SFSKBM8GF-R 3 3 6 6.3.8.3.8 3.3.8.3.8 3.3 3.8 SFSKB3MFF-R SFSKB3M8GF-R 3 3 6 6.. 3. 3.. SFSKBM3GF-R.8 3.3 3.8.3.8 SFSKBM8GF-R 3 3 6 3.3 3.8.3.8.3 6 3.8.3.8.3.8 SFSKBMGF-R SFSKBMGF-R 3 3 6 6.... 6.... 6. 6. 36

Feb.,8 Frequency Characteristics (Spurious) SFSKBM3GF-R SFSKBM8GF-R 3 3 6 6.3.3.3 3.3.3.8.8.8 3.8.8 SFSKB3MFF-R SFSKB3M8GF-R 3 3 6 6.. 3. SFSKBM3GF-R...8.8 3.8 SFSKBM8GF-R.8.8 3 3 6 6.3 3.3.3.3 6.3.8 3.8.8.8 6.8 SFSKBMGF-R SFSKBMGF-R 3 3 6 6 3... 6.. 3... 6.. 3