Electronic Costing & Technology Experts

Electronic Costing & Technology Experts 21 rue la Nouë Bras de Fer 44200 Nantes France Phone : +33 (0) 240 180 916 email : info@systemplus.fr www.systemplus.fr December 2015 Version 1 Written by Elena Barbarini DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 1

Glossary 1. Overview / Introduction 4 Executive Summary Reverse Costing Methodology 2. Company Profile 9 Fingerprint Cards 3. Physical Analysis 13 Synthesis of the Physical Analysis disassembly 15 Fingerprint Scanner Removal Fingerprint Scanner Assembly 19 Fingerprint Scanner Views Fingerprint Scanner Croos-Section Fingerprint Scanner Patents Sensor Die 33 Sensor Die View & Dimensions Sensor Die Capacitors Sensor Die Edge Contact Sensor Delayering & main Blocs Sensor Die Process Sensor Die Cross-Section Sensor Die Process Characteristic ASIC Die 52 ASIC Die View & Dimensions ASIC Delayering & main Blocs ASIC Die Process ASIC Die Cross-Section ASIC Die Process Characteristic 4. Nexus 6P s vs Ascend Mate 7 s fingerprint sensor 65 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 2 4. Sensor Manufacturing Process 69 Sensor Die Front-End Process & Fabrication Unit LGA Packaging Process & Fabrication unit Sensor Die Front-End Process & Fabrication Unit Final Test & Packaging Fabrication unit Synthesis of the main parts 5. Cost Analysis 78 Synthesis of the cost analysis Yields Explanation & Hypotheses Sensor die 83 Sensor Die Front-End Cost Sensor Die Probe Test, Thinning & Dicing Sensor Die Wafer Cost Sensor Die Cost LGA Packaged Component 89 LGA Packaging Cost Back End: Final Test Component Cost ASIC Component 94 ASIC Die Front-End Cost Sensor Die Probe Test, Thinning & Dicing ASIC Component Cost Complete Module Fingerprint 99 Assembled Components Cost Synthesis of the assembling Fingerprint Component Cost 6. Huawei s vs Samsung s vs Apple s fingerprint sensor 104 Contact

This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the Assembly. The Nexus 6P is a smartphone designed and manufactured by Huawei. Likely the Ascend Mate 7, the Chinese company integrates again a fingerprint of Fingerprint Card on the back of the device but introduces significant modifications in term of resolution and packaging. Located on the back side of the smartphone, the fingerprint sensor of the Nexus 6P has dimensions of 11.6 x 11.6mm. It is assembled on a square LGA package and is protected by metal support. The sensor has a resolution of 15,600 pixels with a pixel density of 508ppi. It uses a capacitive touch technology to takes an image of the fingerprint from the subepidermal layers of the skin. The sensor die is manufactured with CMOS 65nm technology and is connected by mean of wire bonding to the rigid PCB. The components also includes an ASIC die manufactued using a 0.5µm CMOS process and connected to the flex PCB. This report includes comparisons with Ascend Mate 7 fingerprint sensor and with the latest Samsung s and Apple s fingerprints buttons. 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 3

Packaging plastic ring Flex PCB Connector metallic support Connector Protective elastomer Nexus 6P fingerprint scanner Assembly front view Fingerprint sensor surface ASIC ASIC metallic support 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 4 Nexus 6P fingerprint scanner Assembly back view

Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts. Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated) These results are open for discussion. We can reevaluate this circuit with your information. Please contact us: 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 16