High Data Rate Characterization Report

Similar documents
High Data Rate Characterization Report

High Data Rate Characterization Report

High Data Rate Characterization Report

High Speed Characterization Report

High Speed Characterization Report

High Speed Characterization Report

High Speed Characterization Report

High Speed Competitive Comparison Report. Samtec MMCX-J-P-H-ST-TH1 Mated With MMCX-P-P-H-ST-TH1 Competitor A (Mated Set) Competitor B (Mated Set)

High Speed Characterization Report

EQCD High Speed Characterization Summary

SPICE Model Validation Report

High Speed Characterization Report

High Speed Characterization Report. Contact Plating Effects on Signal Integrity Gold on Post / Gold on Tail vs. Gold on Post / Matte Tin on Tail

High Speed Characterization Report

High Speed Characterization Report

High Speed Characterization Report

High Speed Characterization Report

High Speed Characterization Report

High Speed Characterization Report

High Speed Characterization Report

High Speed Characterization Report

High Speed Characterization Report

RF Characterization Report

High Speed Characterization Report

High Speed Characterization Report

High Speed Characterization Report

Tektronix Inc. DisplayPort Standard. Revision Tektronix MOI for Cable Tests (DSA8200 based sampling instrument with IConnect software)

ABSTRACT. List of Figures

Validation Report Comparison of Eye Patterns Generated By Synopsys HSPICE and the Agilent PLTS

VHDM & VHDM-L Series. High Speed. Electrical Characterization

Aries QFP microstrip socket

Test ID 5-15 Utility Line Impedance Test Procedures Guide

Aries Kapton CSP socket

Improving TDR/TDT Measurements Using Normalization Application Note

3M Shielded Controlled Impedance (SCI) Latch/Eject Header 2 mm Development Kit Instructions

Line Impedance Analyzer TDR 3000

Custom Interconnects Fuzz Button with Hardhat Test Socket/Interposer 1.00 mm pitch

Procedures Guide. Tektronix. HDMI Sink Instruments Differential Impedance Measurement

Aries Center probe CSP socket Cycling test

Aries Kapton CSP socket Cycling test

Keysight MOI for USB Type-C Connectors & Cable Assemblies Compliance Tests (Type-C to Legacy Cable Assemblies)

Shielding Effectiveness Report HQCD

Keysight MOI for USB Type-C Connectors & Cable Assemblies Compliance Tests (Type-C to Legacy Cable Assemblies)

Characterization Methodology for High Density Microwave Fixtures. Dr. Brock J. LaMeres, Montana State University

Agilent E2695A SMA Probe Head for InfiniiMax 1130 Series Active Oscilloscope Probes. User s Guide

Aries CSP microstrip socket Cycling test

EE290C - Spring 2004 Advanced Topics in Circuit Design

High Speed Characterization Report MEC8-1XX-02-X-DV-A

Keysight Technologies Using the Time-Domain Reflectometer. Application Note S-Parameter Series

Report. Description: High Phone: Samtec Inc. New Albany. IN USA. All Rights Reserved

Serial ATA International Organization

Measuring PCB, Cable and Interconnect Impedance, Dielectric Constants, Velocity Factor, and Lengths

Shielding Effectiveness Report

Application Note. Signal Integrity Modeling. SCSI Connector and Cable Modeling from TDR Measurements

Keysight Technologies High Precision Time Domain Reflectometry (TDR) Application Note

Design and experimental realization of the chirped microstrip line

LVDS Flow Through Evaluation Boards. LVDS47/48EVK Revision 1.0

SPECIFICATION AND PERFORMANCE CHARACTERISTICS SERIAL ATA CABLE ASSEMBLIES

Application Note AN-13 Copyright October, 2002

Specification. CTR 2 ESD calibration target

MIL-STD-883E METHOD 3024 SIMULTANEOUS SWITCHING NOISE MEASUREMENTS FOR DIGITAL MICROELECTRONIC DEVICES

Characterization and Measurement Based Modeling

A Technical Discussion of TDR Techniques, S-parameters, RF Sockets, and Probing Techniques for High Speed Serial Data Designs

Time Domain Reflectometry (TDR) and Time Domain Transmission (TDT) Measurement Fundamentals

Measurement Notes. Note 53. Design and Fabrication of an Ultra-Wideband High-Power Zipper Balun and Antenna. Everett G. Farr Farr Research, Inc.

Signal Integrity Tips and Techniques Using TDR, VNA and Modeling. Russ Kramer O.J. Danzy

PicoSource PG900 Series

HP 16533A 1-GSa/s and HP 16534A 2-GSa/s Digitizing Oscilloscope

Keysight Technologies Signal Integrity Tips and Techniques Using TDR, VNA and Modeling

CERTIFICATE OF CALIBRATION

3.003 Lab 3 Part A. Measurement of Speed of Light

Electronic Package Failure Analysis Using TDR

TDR Primer. Introduction. Single-ended TDR measurements. Application Note

The data rates of today s highspeed

Advanced Signal Integrity Measurements of High- Speed Differential Channels

Samtec MODS-LJ Series (LIFEJACK ) Category 5/5e Qualification

Signal Integrity Testing with a Vector Network Analyzer. Neil Jarvis Applications Engineer

Step Response Measurement

High Speed Characterization Report

PRODUCT SPECIFICATION

TDR Impedance Measurements: A Foundation for Signal Integrity

Probing Techniques for Signal Performance Measurements in High Data Rate Testing

Agilent Correlation between TDR oscilloscope and VNA generated time domain waveform

USB 3.1 Cable-Connector Assembly Compliance Tests. Test Solution Overview Using the Keysight E5071C ENA Option TDR. Last Update 2015/02/06

High Speed Characterization Report

Logic Analyzer Probing Techniques for High-Speed Digital Systems

PicoSource PG900 Series USB differential pulse generators

Instruction Manual. P GHz Differential Probe

TileCal Analogue Cable Measurement Report

D0 Note Impedance Matching and Frequency Analysis of the BLS Trigger and Pleated Foil Cables for the Run IIb L1 Calorimeter Trigger Upgrade

Student Research & Creative Works

QPairs QTE-DP/QSE-DP Final Inch Designs in Serial ATA Generation 1 Applications 5mm Stack Height. REVISION DATE: January 12, 2005

TDR Tutorial. 1 Single Ended TDR. February 24, Turn on the oscilloscope and put it into TDR Mode. Figure 1:

Shielding Effectiveness Report HQDP

High Speed Digital Systems Require Advanced Probing Techniques for Logic Analyzer Debug

LVDS Owner s Manual. A General Design Guide for National s Low Voltage Differential Signaling (LVDS) Products. Moving Info with LVDS

Level III measurement accuracy of field testers for Twisted Pair Copper Cabling Explained in Technical Detail

AC Current Probes CT1 CT2 CT6 Data Sheet

High Speed Characterization Report

Probe Considerations for Low Voltage Measurements such as Ripple

Transcription:

High Data Rate Characterization Report EQCD-020-39.37-STR-TTL-1 EQCD-020-39.37-STR-TEU-2 Mated with: QTE-020-01-X-D-A and QSE-020-01-X-D-A Description: 0.8mm High-Speed Coax Cable Assembly Samtec, Inc. 2005 All Rights Reserved

Table of Contents Introduction...2 Product Description...2 Results Summary...4 Time Domain Data...4 Impedance...4 Timing Measurements...4 NEXT...5 FEXT...5 Insertion Loss...6 Return Loss...7 Near End Crosstalk...8 Test Procedures...10 Fixturing:...10 Time Domain Testing...12 Impedance:...12 Propagation Delay:...12 Skew:...12 NEXT and FEXT:...12 Frequency Domain Testing...13 Equipment...15 Time Domain Testing...15 Samtec, Inc. 2005 Page: ii All Rights Reserved

Introduction This testing was performed to evaluate the electrical performance of the EQCD series of 0.8-mm High-Speed Coax Cable Assemblies. Testing was performed in accordance to the High Performance Electrical Interconnect (HPEI) SFF-8416, Level 1 1 testing standards when applicable. Time domain and frequency domain measurements were made. Time domain measurements included impedance, propagation delay, crosstalk and skew. Frequency domain measurements were preformed using Tektronix s IConnect and Measurement XTractor software (Version 3.6.0) and included insertion loss (IL), return loss (RL), near end crosstalk (NEXT) and far end crosstalk (FEXT). All measurements were made utilizing test boards specifically designed for this project and are referred to as test board in this report. The test boards were identified as PCB0442_QSE and PCB0442_QTE. A calibration board was also utilized (PCB0442_SMA_CAL). Product Description Each test sample consists of two micro-coaxial ribbon cables that contain 20 lines each. At each end of the cable there is a connector that is terminated to a small transition PCB. Each connector is soldered to its respective PCB. The connector terminals are on 0.8-mm centers. Assembly length is 39.37 inches. There are two types of connectors that are terminated: edge-mount (EM) and vertical mount (DV). The transition PCBs are of two types and allow for two different wiring options. The 1 wiring option provides a Pin 1 to Pin 1 mapping between the cable ends. The 2 wiring option provides a Pin 1 to Pin 2 mapping between cable ends. The EQCD assemblies were tested by mating to a QTE header at End 1 and to a QSE socket at End 2. One sample of each assembly type was tested. The actual part numbers that were tested are shown in Table 1, which also identifies End 1 and End 2 of the assemblies; a relative sample picture is shown in Figure 1. Two lines, a long path (LP) and a short path (SP), of each sample were tested. Length Part Number Termination End 1 End 2 39.37 in. EQCD-020-39.37-STR-TTL-1 DV DV STR TTL 39.37 in. EQCD-020-39.37-STR-TEU-2 DV EM STR TEU Table 1: Sample Description 1 Measurement and Performance Requirements for HPEI Bulk Cable, Rev 15, June 27, 2005 Samtec, Inc. 2005 Page: 2 All Rights Reserved

Figure 1: Test Sample Configuration Samtec, Inc. 2005 Page: 3 All Rights Reserved

Results Summary Time Domain Data Impedance Impedance measurements were performed using a filtered risetime of 100 ps. Note that all measurements were performed with the assembly mated to the respective connector/test board. Data was measured at the cable connector and at 200 ps into the cable. Assembly STR-TTL-1 STR-TEU-2 End Option Cable Path End 1 End 2 End 1 End 2 Z Min (Ω) Z Max (Ω) Z Min (Ω) Z Max (Ω) Z max (Ω) Z max (Ω) Long 45.4 63.7 48.4 56.2 49.4 49.8 Short 50.4 57.1 50.4 53.3 48.4 48.6 Long 45.7 58.5 49.3 61.4 49.2 49.2 Short 51.1 55.4 47.7 60.3 49.0 49.6 Table 2: Impedance Measurements Timing Measurements Skew was calculated as the difference between the propagation delays of the longest and the shortest electrical paths. End 1 of the assembly was the source end for these measurements. The results are tabulated below. Assembly EQCD-020-39.37-STR-TTL-1 EQCD-020-39.37-STR-TEU-2 Table 3: Timing Measurements Path Propagation Delay (ns) Long 5.099 Short 5.041 Long 5.127 Short 5.044 Skew (ns) 0.058 0.083 Samtec, Inc. 2005 Page: 4 All Rights Reserved

NEXT The near end crosstalk was measured in the time domain and converted to a percentage and reported below in Table 4. The incident pulse amplitude from the TDR was 228 mv. The acquired data was measured using a filtered rise time of 100 ps. The End 1 heading in Table 4 represents the near-end of the assembly, i.e. the source end. All NEXT measurements were performed with the assembly mated to the respective connector/test board. Since most of the crosstalk occurs in the connectors, the values in Table 4 represent the crosstalk that occurs in the near-end mated assembly and the test board connectors. Assembly STR-TTL-1 STR-TEU-2 Path END1 END 2 NEXT (mv) NEXT (%) NEXT (mv) NEXT (%) Long 28.0 12.3 29.2 12.8 Short 23.2 10.2 22.8 10.0 Long 28.4 12.5 30.4 13.3 Short 23.6 10.4 26.0 11.4 Table 4: % NEXT FEXT The far end crosstalk was measured in the time domain and converted to a percentage and reported below in Table 5. The incident pulse amplitude from the TDR was 228 mv. The acquired data was measured using a filtered rise time of 100 ps. The End 1 heading in Table 5 represents the near-end cable assembly connector, i.e. the source end. All FEXT measurements were performed with the cable assembly mated to the respective connector/test board. The values in Table 5 represent the crosstalk measured at the far end of the assembly. Assembly STR-TTL-1 STR-TEU-2 Path END1 END 2 FEXT (mv) FEXT (%) FEXT (mv) FEXT (%) Long 13.6 6.0 13.0 5.7 Short 9.2 4.0 9.6 4.2 Long 15.0 6.6 16.2 7.1 Short 11.2 4.9 11.4 5.0 Table 5: % FEXT Samtec, Inc. 2005 Page: 5 All Rights Reserved

Frequency Domain Data Insertion Loss Figure 2: EQCD-020-39.37-STR-TTL-1 Insertion Loss Figure 3: EQCD-020-39.37-STR-TEU-2 Insertion Loss Samtec, Inc. 2005 Page: 6 All Rights Reserved

Return Loss Figure 4: EQCD-020-39.37-STR-TTL-1 Return Loss Figure 5: EQCD-020-39.37-STR-TEU-2 Return Loss Samtec, Inc. 2005 Page: 7 All Rights Reserved

Near End Crosstalk Figure 6: EQCD-020-39.37-STR-TTL-1 NEXT Figure 7: EQCD-020-39.37-STR-TEU-2 NEXT Samtec, Inc. 2005 Page: 8 All Rights Reserved

Far End Crosstalk Figure 8: EQCD-020-39.37-STR-TTL-1 FEXT Figure 9: EQCD-020-39.37-STR-TEU-2 FEXT Samtec, Inc. 2005 Page: 9 All Rights Reserved

Test Procedures Fixturing: All measurements were performed using the test boards that have trace lengths of 3.70 inches (QSE) and 3.50 inches (QTE) and provide for the interconnection to the EQCD assembly by use of field replaceable SMA connectors. The calibration board provides a THRU reference trace. Figure 10 below shows how the THRU reference traces were utilized to compensate for the losses due to the coaxial test cables, SMA launches, and the test board traces during testing. Reference traces Coax Cable Coax Cable TDT TDR Tektronix 11801B SD24 Ch2 SMA Launches Tektronix 11801B SD24 Ch1 Figure 10: Test setup for Thru Reference Acquisition Measurements were then performed using the test boards as shown in Figure 11. A picture of the test board and cable is shown in Figure 12. Coax Cable Cable under test Coax Cable TDT TDR Tektronix 11801B SD24 Ch2 SMA Launches Tektronix 11801B SD24 Ch1 Figure 11: Characterization test setup Samtec, Inc. 2005 Page: 10 All Rights Reserved

Figure 12: Test setup with Test PCBs and EQCD coax cable assembly. The coax cable assembly terminations had a particular signal line configuration. The respective signal line numbers are shown in Table 6 below. There are a total of 20 positions per row. SMA jack numbers on the test boards do not correspond to the assembly line numbers. All adjacent lines are terminated where applicable. G 3 G 7 G G G G G 19 21 23 25 G G G 33 35 37 39 G 4 G 8 G G G G G 20 22 24 26 G G G 34 36 38 40 Table 6: Respective signal line numbers. Table 7 below shows the signal line numbers corresponding to the long and short paths for the different configurations tested. The assembly line numbers and the test board jack numbers corresponding to the lines tested are listed. Assembly Path Long Short EQCD-020-39.37-STR-TTL-1 39 (J10) 24 (J15) EQCD-020-39.37-STR-TEU-2 39 40 (J10 J20) 24 23 (J15 J5) Table 7: Long Path and Short Path Signal Line Numbers Samtec, Inc. 2005 Page: 11 All Rights Reserved

Time Domain Testing Impedance: The Tektronix 11801B oscilloscope was set up in TDR (time domain reflectometry) mode using a 100-pS filtered risetime and 16 averages. The horizontal setup of the TDR used a 512 point record length and a horizontal scale of 200 ps/div to allow the near end connector and a portion of the cable to be displayed. All connector impedance measurements were made at the near-end connector. Cable impedance was measured 200 ps into the cable after the connector. Propagation Delay: The propagation delay was measured and skew calculated by first acquiring a thru reference pulse of the reference line. Using the delay function of the TDR, set at 50% amplitude of the reference pulse, the sample was inserted and the sample delay was measured. The TDR delay function calculates the sample delay by subtracting the delay measurement of the reference pulse from the delay measurement of the sample plus the test board traces. Skew: Skew is defined as the difference between of the propagation delays of the longest (maximum delay) and the shortest (minimum delay) electrical paths. NEXT and FEXT: Near end crosstalk (NEXT) and far end crosstalk (FEXT) measurements were made using the Tektronix 11801B oscilloscope. A thru reference of the coaxial test cables, SMAs, and reference board was performed to determine the pulse amplitude of the TDR generator (see Figure 10). To acquire NEXT, a signal was applied using the oscilloscope pulse generator. NEXT was measured on an adjacent signal line at the near end (see Figure 13). To acquire FEXT, a trace was driven with the oscilloscope pulse generator. FEXT was measured on an adjacent trace at the far end (see Figure 14). All adjacent lines were terminated, at both ends, with 50Ω SMA loads; refer to Figures 13 and 14. Samtec, Inc. 2005 Page: 12 All Rights Reserved

Frequency Domain Testing All frequency domain measurements were made using the Tektronix 11801B oscilloscope. Testing was performed using a risetime of 35 ps. The horizontal scale was set to 5 ns/div, the record length was set to 5120 points and the number of averages was set to 128. These values were selected to ensure the ratio between the number of points and the window length was long enough to capture the highest frequencies and still yield a small enough frequency step to gain adequate resolution. End 1 of the assembly was the source end for all frequency domain measurements. All adjacent lines were terminated at both ends with 50Ω SMA loads; refer to Figures 13 and 14. Attenuation: Insertion Loss test setup losses were compensated for by acquiring a thru measurement (reference output pulse) of the coaxial test cables, SMAs, and the reference trace (see Figure 10). A thru measurement of an assembly was taken and then post processed by using Tektronix IConnect software. The result is the insertion loss of the cable assembly. Return Loss: An open circuit reference measurement was taken using a signal trace on a test board without mating connector. A matched reflection waveform of the cable assembly, i.e. with the assembly terminated in 50-Ω SMA loads on the far end test board, was acquired and then post processed by using Tektronix IConnect software. The result is the return loss of the cable assembly. Near and Far End Crosstalk: NEXT and FEXT were measured in the time domain using the oscilloscope and then converted to frequency domain data using Tektronix IConnect software. Initially a thru reference measurement of the coaxial test cables, SMAs, and calibration board trace was performed to compensate for the test setup losses (see Figure 10). To acquire NEXT a trace was driven using the oscilloscope pulse generator. NEXT was measured, in the time domain, on an adjacent trace (see Figure 13). NEXT was then post processed using Tektronix s IConnect software to generate the NEXT of the cable assembly in the frequency domain. To acquire FEXT a trace was driven using the oscilloscope pulse generator. FEXT was measured in the time domain on an adjacent trace at the far end (see Figure 14). FEXT was then post processed using Tektronix s IConnect software to generate the FEXT of the cable assembly in the frequency domain. Samtec, Inc. 2005 Page: 13 All Rights Reserved

EQCD Sample Ch1 Ch2 SMAs NEXT test FEXT test Tektronix 11801B 50 Ω Termination Figure 13: NEXT Measurement Setup. Coax EQCD Sample Coax TDT TDR Tektronix 11801B SD24 Ch2 SMA Launches 50 Ω Termination Figure 14: FEXT Measurement Setup Tektronix 11801B SD24 Ch1 Samtec, Inc. 2005 Page: 14 All Rights Reserved

Equipment Time Domain Testing Tektronix 11801B Oscilloscope Tektronix SD24 TDR/Sampling Head Samtec, Inc. 2005 Page: 15 All Rights Reserved