NYE8-B6TG Protected TRIAC Silicon Bidirectional Thyristor Designed for use in solid state relays, MPU interface, TTL logic and any other light industrial or consumer application. Supplied in an inexpensive TO92 package which is readily adaptable for use in automatic insertion equipment. Features OnePiece, InjectionMolded Package Blocking Voltage to 6 V Sensitive Gate Triggering in Two Trigger Modes (Quadrants) Improved Noise Immunity (dv/dt Minimum of 5 V/ sec at 125 C) Compliant with IEC645 High Surge Current of 8 A These are PbFree Devices PROTECTED TRIAC.8 AMPERE RMS 6 VOLTS OUT G MAXIMUM RATINGS (T J = 25 C unless otherwise noted) Rating Symbol Value Unit Peak Repetitive OffState Voltage (Note 1) (Sine Wave, 5 to 6 Hz, Gate Open, T J = 25 to 125 C) OnState Current RMS (T C = 8 C) (Full Sine Wave 5 to 6 Hz) Peak Nonrepetitive Surge Current (One Full Cycle Sine Wave, 6 Hz, T C = 25 C) Circuit Fusing Considerations (Pulse Width = 8.3 ms) Peak Gate Power (T C = 8 C, Pulse Width 1. s) Average Gate Power (T C = 8 C, t = 8.3 ms) NonRepetitive Line Peak Voltage (IEC645) V DRM, 6 V V RRM I T(RMS).8 A I TSM 8. A I 2 t.4 A 2 s P GM 5. W P G(AV).1 W V PP 2. kv 1 1 2 2 3 3 STRAIGHT LEAD BENT LEAD BULK PACK TAPE & REEL AMMO PACK TO92 (TO226AA) CASE 2911 MARKING DIAGRAM E8 B6 YWW Critical Rate of Rise of AllState Current (I G = 2 x I GT, t r < s, T J = 125 C) di/dt A/ s Operating Junction Temperature Range T J 4 to +125 C Storage Temperature Range T stg 4 to +15 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. V DRM and V RRM for all types can be applied on a continuous basis. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded. 1 2 3 x = 3,7,9 Y = Year WW = Work Week = PbFree Package (Note: Microdot may be in either location) PIN ASSIGNMENT 1 2 3 OUT Gate ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. Semiconductor Components Industries, LLC, 212 November, 212 Rev. 1 Publication Order Number: NYE8B6/D
NYE8B6TG THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Thermal Resistance, JunctiontoAmbient PCB Mounted per Figure TBD R JA 156 C/W Thermal Resistance, JunctiontoTab Measured on OUT Tab Adjacent to Epoxy R JT 25 C/W Maximum Device Temperature for Soldering Purposes for Secs Maximum T L 26 C ELECTRICAL CHARACTERISTICS (T C = 25 C unless otherwise noted; Electricals apply in both directions) Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS Peak Repetitive Blocking Current T J = 25 C (V D = Rated V DRM /V RRM ; Gate Open) T J = +125 C ON CHARACTERISTICS Peak OnState Voltage (I TM = 1.1 A Peak; Pulse Width 2. ms, Duty Cycle 2.%) I DRM, I RRM 2. 2 V TM 1.3 V A A Gate Trigger Current (dc) (V D = 12 Vdc, R L = ) OUT(+), G() OUT(), G() I GT.15.15 ma Latching Current (V D = 12 V, I G = 1.2 x I GT ) OUT(+), G() All Types OUT(), G() All Types Gate Trigger Voltage (dc) (V D = 12 Vdc, R L = ) V GT 1. V Gate NonTrigger Voltage (V D = 12 V, R L =, T J = 125 C) Quadrants 2, 3 I L V GD.15 V Dynamic Resistance R D m Holding Current (V D = 12 Vdc, Initiating Current = 5 ma, Gate Open) I H 25 ma DYNAMIC CHARACTERISTICS ma Rate of Change of Commutating Current (Commutating dv/dt = 15 V/ s, Gate Open, T J = 125 C, f = 25 Hz, without Snubber) di/dt(c).3 A/ms Critical Rate of Rise of OffState Voltage (V D = 67% V DRM, Exponential Waveform, Gate Open, T J = 125 C) dv/dt 5 V/ s Clamping Voltage (I CL = 1. ma, t p = 1 ms, T J = 125 C) V CL 65 V 2
NYE8B6TG Voltage Current Characteristic of Triacs (Bidirectional Device) + Current Symbol V DRM I DRM V RRM I RRM Parameter Peak Repetitive Forward Off State Voltage Peak Forward Blocking Current Peak Repetitive Reverse Off State Voltage Peak Reverse Blocking Current I RRM at V RRM on state I H V TM Quadrant 1 OUT+ V TM I H Maximum On State Voltage Holding Current I H off state + Voltage I DRM at V DRM Quadrant 3 OUT V TM Quadrant Definitions for a Triac OUT POSITIVE (Positive Half Cycle) + (+) OUT (+) OUT Quadrant II () I GT (+) I GT Quadrant I I GT + I GT () OUT () OUT Quadrant III () I GT (+) I GT Quadrant IV OUT NEGATIVE (Negative Half Cycle) All polarities are referenced to. 3
NYE8B6TG I T, INSTANTANEOUS ONSTATE CURRENT (A) 1 T J = 125 C.1 T J = 25 C.1 T J = 4 C.1.3.8 1.3 1.8 2.3 2.8 3.3 3.8 I GT, TRIGGER CURRENT (ma) V GT, TRIGGER VOLTAGE (V) 25 2 15 5 Q2 Q3 4 25 5 2 35 5 65 8 95 1 125 1.9.8.7.6.5.4.3.2.1 Figure 2. Typical Gate Trigger Current Q2 Q3 4 25 5 2 35 5 65 8 95 1 125 Figure 3. Typical Gate Trigger Voltage V T, INSTANTANEOUS ON-STATE VOLTAGE (V) Figure 1. Maximum OnState Voltage Characteristics 6 35 I L, LATCHING CURRENT (ma) 5 4 2 Q2 Q3 I H, HOLDING CURRENT (ma) 25 2 15 5 MTI1 Negative MTI1 Positive 4 25 5 2 35 5 65 8 95 1 125 Figure 4. Typical Latching Current 4 25 5 2 35 5 65 8 95 1 125 Figure 5. Typical Holding Current 4
NYE8B6TG TO92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL H2A H2A H2B H2B H W2 H4 H5 L L1 H1 W1 W T1 T F1 F2 T2 P2 P2 P1 P Figure 6. Device Positioning on Tape D Specification Inches Millimeter Symbol Item Min Max Min Max D Tape Feedhole Diameter.1496.1653 3.8 4.2 D2 Component Lead Thickness Dimension.15.2.38.51 F1, F2 Component Lead Pitch.945.1 2.4 2.8 H Bottom of Component to Seating Plane.59.156 1.5 4. H1 Feedhole Location.3346.3741 8.5 9.5 H2A Deflection Left or Right.39 1. H2B Deflection Front or Rear.51 1. H4 Feedhole to Bottom of Component.786.768 18 19.5 H5 Feedhole to Seating Plane.6.649 15.5 16.5 L Defective Unit Clipped Dimension.3346.433 8.5 11 L1 Lead Wire Enclosure.9842 2.5 P Feedhole Pitch.4921.579 12.5 12.9 P1 Feedhole Center to Center Lead.2342.2658 5.95 6.75 P2 First Lead Spacing Dimension.1397.1556 3.55 3.95 T Adhesive Tape Thickness.6.8.15.2 T1 Overall Taped Package Thickness.567 1.44 T2 Carrier Strip Thickness.14.27.35.65 W Carrier Strip Width.6889.7481 17.5 19 W1 Adhesive Tape Width.2165.2841 5.5 6.3 W2 Adhesive Tape Position.59.1968.15.5 2. Maximum alignment deviation between leads not to be greater than.2 mm. 3. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm. 4. Component lead to tape adhesion must meet the pull test requirements. 5. Maximum noncumulative variation between tape feed holes shall not exceed 1 mm in 2 pitches. 6. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive. 7. No more than 1 consecutive missing component is permitted. 8. A tape trailer and leader, having at least three feed holes is required before the first and after the last component. 9. Splices will not interfere with the sprocket feed holes. 5
NYE8B6TG ORDERING & SHIPPING INFORMATION: Packaging Options, Device Suffix Device U.S. Europe Equivalent NYE8B6RL1G Description of TO92 Tape Orientation Package Shipping Flat side of TO92 and adhesive tape visible TO92 (PbFree) Radial 2 / Tape and Reel NYE8B6TG N/A, Bulk TO92 (PbFree) 5 Units / Box NYE8B6RLRPG Round side of TO92 and adhesive tape visible TO92 (PbFree) Radial Tape and Fan Fold Box (2 Units / Box) NYE8B6RLRFG Round side of TO92 and adhesive tape on reverse side TO92 (PbFree) Radial Tape and Fan Fold Box (2 Units / Box) 6
NYE8B6TG PACKAGE DIMENSIONS TO92 (TO226AA) CASE 2911 ISSUE AM R A N B STRAIGHT LEAD BULK PACK NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. P L SEATING INCHES MILLIMETERS PLANE K DIM MIN MAX MIN MAX A.175.25 4.45 5.2 B.17.2 4.32 5.33 C.125.165 3.18 4.19 D.16.21.47.533 X X D G.45.55 1.15 1.39 H.95.5 2.42 2.66 G J.15.2.39.5 H J K.5 --- 12.7 --- V C L.25 --- 6.35 --- N.8.5 2.4 2.66 P ---. --- 2.54 SECTION XX R.115 --- 2.93 --- 1 N V.135 --- 3.43 --- R A B BENT LEAD TAPE & REEL AMMO PACK NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. P T MILLIMETERS SEATING PLANE K DIM MIN MAX A 4.45 5.2 B 4.32 5.33 C 3.18 4.19 D.4.54 G X X D G 2.4 2.8 J.39.5 K 12.7 --- J N 2.4 2.66 V P 1.5 4. C R 2.93 --- SECTION XX V 3.43 --- 1 N ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patentmarking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 8217 USA Phone: 36752175 or 8344386 Toll Free USA/Canada Fax: 36752176 or 83443867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 82829855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 79 29 Japan Customer Focus Center Phone: 81358175 7 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NYE8B6/D