Advanced Packaging Technology Symposium
General Information Date Wednesday, September 7 th, 2016 Venue Theme Forum Chairman Moderator 08:30 17:00 (08:30 09:00 for registration) Grande Luxe Banquet Grand Ballroom, Chinatrust Financial Building Fan Out Solutions Cost effective FO Solution, 3D/SiP FO solution, Fine Patterning Mr. Mike Liang / 梁明成, President, Amkor/ Vice Chairman, SEMI PKG&TEST Committee Mr. Min Yoo/ 柳敏, Vice President, Amkor Technology Taiwan, Inc.
Advanced Packaging Technology Symposium Theme: Fan Out Solutions Cost effective FO Solution, 3D/SiP FO solution, Fine Patterning Outline Typical technology stream of advanced packages have been pursuing the needs for higher performance with lower power consumption, especially in mobile devices. However, various applications are recently driving new trends and innovations which are Internet of Things, Wearable Electronics, and Automotive Electronics as well Mobile Handsets. Wafer Level Package (WLP) driving stronger unit volume growth is one of typical example for best scaling with chip size package platform, but has the limitation to get high I/O density. Obviously, Wafer Level Fan-Out (WLFO) has been introduced into production to provide high I/O density as a solution by extending package size without using substrate. And it enables the creation of 3D structure and side by side integration of multiple dies. However 3D and side by side integration capabilities of traditional WLFO are limited by processes and equipment used for circuit patterning. This includes very dense routing between multiple dies, fine pitch vertical interface for 3D stack, passive integration for SiP and package profile reduction. In this year, Advanced Packaging Technology Forum will be get emphasized to provide various Fan out solution by experts and valuable topics (Cost effectiveness, 3D/SiP and Fine patterning) interacting with core advanced packaging technology to overcome technical hurdle for fan out packages.
SEMICON 2016 Adv. PKG Forum Tentative Agenda Topic & Speaker 08:30-09:00 Registration 09:00-09:03 Welcome Remarks by SEMI Executives Mr. Peter Gillespie, Chief Marketing Officer, SEMI 09:03-09:10 Opening Remarks & Moderator Mr. Min Yoo/, Vice President, Amkor Technology Taiwan, Inc. 09:10-09:35 Emerging Trends and Applications of IoT in Post-Smartphone Era Mr. Ray Yang/, Deputy Program Director, IEK Choice of Wafer Level Fan Out or Panel Level Fan Out 09:35-10:00 Dr. ChoonHeung Lee, Vice President/ Global CTO,Advanced Packaging, Lam Research USA 10:00-10:25 Advanced Fan Out Packaging Roadmap Mr. Ron Huemoeller, Corporate VP/Head of WWRD & Technology Strategy, Amkor 10:25-10:45 Break 10:45-11:10 Fan Out, the Next Wave Heterogeneous Integration Solution Mr. Walter Jau/, Sr. Technical Director, ASE 11:10-11:35 Full-field Projection Scanner Patterning Resolution and Overlay Performance Dr. Markus Arendt, President, SUSS MicroTec Photonic Systems, Inc. 11:35-12:00 Multi Beam Laser Dicing Technology for Chipping Free WLCSP Mr. Peter Dijstra, Director Sales, Service & Marketing, ASM 12:00-13:30 Lunch Break
SEMICON 2016 Adv. PKG Forum Tentative Agenda Topic & Speaker 13:30-13:35 Opening Remarks & Moderator Mr. Min Yoo/ 柳敏, Vice President, Amkor Technology Taiwan, Inc. 13:35-14:00 Plasma Dicing: More Die Stronger Die Mr. Richard Barnett, Manager, Etch Products, SPTS 14:00-14:25 Innovative Wafer Molding System for Fan Out Mr. Akira Katsuyama, Sales Professional, APIC YAMADA CORPORATION Understanding and Mitigating Electrodeposition Throughput 14:25-14:50 Limitations Dr. Steven Mayer, Managing Director and Corporate Fellow, Lam Research 14:50-15:15 Solder Alloy Development for FOWLP Mr. Hikaru Nomura, Solder Technical Center Reseacher, Senju 15:15-15:35 Break Optimizing Equipment Selection for Diverse Fan-Out Process 15:35-16:00 Flows Mr. Tom Strothmann, Director Product Management, Kulicke & Soffa 16:00-16:25 Integrated Die-level E-test, Vision and T&R Solutions for WLCSP Mr. Fumiaki Shigeoka, Chief Technology Officer, Ueno SEIKI 16:25-16:50 Topic: TBD Protec 16:50 Adjournment