A61 and A62 2-Wire Chopper Stabilized Hall Effect Switches Discontinued Product These parts are no longer in production The device should not be purchased for new design applications. Samples are no longer available. Date of status change: May 1, 2006 Recommended Substitutions: For existing customer transition, and for new customers or new applications, refer to the A1142 and A114. NOTE: For detailed information on purchasing options, contact your local Allegro field applications engineer or sales representative. Allegro MicroSystems, Inc. reserves the right to make, from time to time, revisions to the anticipated product life cycle plan for a product to accommodate changes in production capabilities, alternative product availabilities, or market demand. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use; nor for any infringements of patents or other rights of third parties which may result from its use. m
SUPPLY GROUND NO (INTERNAL) CONNECTION Data Sheet 27621.50a SUNSTAR 传感与控制 http://www.sensor-ic.com/ 61 AND 62 Suffix Code 'LH' Pinning (SOT2W) X NC 1 2 Dwg. PH-00-5 Pinning is shown viewed from branded side. The A61x and A62x Hall-effect switches are extremely temperature-stable and stress-resistant sensors. Superior performance over temperature is made possible through dynamic offset cancellation, which reduces the residual offset voltage normally caused by device overmolding, temperature dependencies, and thermal stress. The two devices differ only in output polarity; the A61x output current goes low in the presence of a south pole of sufficient strength; the A62x output current goes high. Each device includes on a single silicon chip a voltage regulator, Hall-voltage generator, small-signal amplifier, chopper stabilization, Schmitt trigger, and a constant-current open-collector output. An on-board regulator permits operation with supply voltages of.5 to 24 volts. Noise radiation is limited by control of the output current slew rate. Three package styles provide a magnetically optimized package for most applications. Suffix xlh is a miniature SOT2W low-profile surface-mount package, and suffix 'xua' is a three-lead ultra-mini SIP for through-hole mounting. ABSOLUTE MAXIMUM RATINGS at T A =+25 C Supply Voltage, V CC... 26.5 V Reverse Battery Voltage, V RCC... -16 V Magnetic Flux Density, B... Unlimited Package Power Dissipation, P D. See Graph Junction Temperature, T J... +170 C Operating Temperature Range, T A... -40 C to +85 C Storage Temperature Range, T S... -65 C to +170 C FEATURES Internal Current Regulator for 2-Wire Operation Resistant to Physical Stress Superior Temperature Stability Operation From Unregulated Supply Solid-State Reliability Small Size Always order by complete part number: the prefix 'A' + the basic four-digit part number + a suffix to indicate operating temperature range (E) + a two-letter suffix to indicate package style, e.g., A61ELH. m
SUPPLY GROUND GROUND DYNAMIC OFFSET CANCELLATION SAMPLE & HOLD LOW-PASS FILTER SUNSTAR 传感与控制 http://www.sensor-ic.com/ FUNCTIONAL BLOCK DIAGRAM SUPPLY REG. TO ALL SUBCIRCUITS X GROUND Dwg. FH-020-4 Suffix Code 'UA' Pinning (ultra-mini SIP) X 1 2 Dwg. PH-00-7A Pinning is shown viewed from branded side. 2 115 Northeast Cutoff, Box 1506 Worcester, Massachusetts 01615-006 (508) 85-5000m Copyright 2002, 200 Allegro MicroSystems, Inc.
ELECTRICAL CHARACTERISTICS over operating temperature range. Limits Characteristic Symbol Test Conditions Min. Typ. Max. Units Supply Voltage V CC Operating.5 12 24 V Output Current I GND(L) Output Current Low 6.9 ma I GND(H) Output Current High 12 17 ma Chopping Frequency f C 40 khz Output Settling Time t sd C L = 20 pf 50 µs Output Rise Time t r C L = 20 pf.5 µs Output Fall Time t f C L = 20 pf.5 µs Reverse Battery Current I CC V RCC = -16 V -15 ma NOTE: Typical Data is at T A = +25 C and V CC = 12 V and is for design information only. A61 MAGNETIC CHARACTERISTICS over operating supply voltage and temperature ranges. Limits Characteristic Symbol Test Conditions Min. Typ. Max. Units Operate Point B OP B > B OP, I GND = LOW 125 G Release Point B RP B < B RP, I GND = HIGH 40 G Hysteresis B hys B OP - B RP 0 G A62 MAGNETIC CHARACTERISTICS over operating supply voltage and temperature ranges. Limits Characteristic Symbol Test Conditions Min. Typ. Max. Units Operate Point B OP B > B OP, I GND = HIGH 125 G Release Point B RP B < B RP, I GND = LOW 40 G Hysteresis B hys B OP - B RP 0 G NOTE: 1 gauss is exactly equal to 0.1 millitesla (mt). www.allegromicro.com m
A61x OUTPUT CHARACTERISTICS A62x +I +I IOUT + ICC IOUT + ICC OUTPUT CURRENT BRP BOP OUTPUT CURRENT B RP B OP ICC ICC 0 0 FLUX DENSITY +B Dwg. GH-007-4 0 0 FLUX DENSITY +B Dwg. GH-007-4 115 Northeast Cutoff, Box 1506 Worcester, Massachusetts 01615-006 (508) 85-5000m
SENSOR LOCATIONS 800 Package Designator LH ACTIVE AREA DEPTH 0.011" 0.28 mm NOM A 0.059" 1.49 mm 1 2 0.08" 0.96 mm Dwg. MH-025 ALLOWABLE PACKAGE POWER DISSIPATION in MILLIWATTS 700 600 500 400 00 200 100 Suffix " LH" RqJA = 228 C/W Suffix " UA" RqJA = 165 C/W Allegro 0 20 40 60 80 100 120 140 160 180 AMBIENT TEMPERATURE in C Dwg. GH-046-4 APPLICATIONS INFORMATION Package Designators UA" ACTIVE AREA DEPTH 0.0195" 0.50 mm NOM BRANDED SURFACE A 0.080" 2.04 mm 1 2 0.056" 1.44 mm Dwg. MH-011-9B Although sensor location is accurate to three sigma for a particular design, product improvements may result in small changes to sensor location. Extensive applications information for Hall-effect sensors is available in: Hall-Effect IC Applications Guide, Application Note 27701; Hall-Effect Devices: Soldering, Gluing, Potting, Encapsulating, and Lead Forming, Application Note 2770.1; Soldering of Through-Hole Hall-Sensor Dervices, Application Note 2770; and Soldering of Surface-Mount Hall-Sensor Devices, Application Note 2770.2. More detailed descriptions of the chopper-stabilized circuit operation can be found in: Monolithic Magnetic Hall Sensor Using Dynamic Quadrature Offset Cancelation, Technical Paper STP 97-10; and Chopper-Stabilized Amplifiers With A Track-and-Hold Signal Demodulator, Technical Paper STP 99-1. All are provided at www.allegromicro.com www.allegromicro.com m 5
FUNCTIONAL DESCRIPTION Chopper-Stabilized Technique. The Hall element can be considered as a resistor array similar to a Wheatstone bridge. A large portion of the offset is a result of the mismatching of these resistors. These devices use a proprietary dynamic offset cancellation technique, with an internal high-frequency clock to reduce the residual offset voltage of the Hall element that is normally caused by device overmolding, temperature dependencies, and thermal stress. The chopper-stabilizing technique cancels the mismatching of the resistor circuit by changing the direction of the current flowing through the Hall plate using CMOS switches and Hall voltage measurement taps, while maintaing the Hall-voltage signal that is induced by the external magnetic flux. The signal is then captured by a sample-andhold circuit and further processed using low-offset bipolar circuitry. This technique produces devices that have an extremely stable quiescent Hall output voltage, are immune to thermal stress, and have precise recoverability after temperature cycling. This technique will also slightly degrade the device output repeatability. A relatively high sampling frequency is used in order that faster signals can be processed. Operation. As shown in the output characteristic graphs, the output of the A62 turns on when a magnetic field (south pole) perpendicular to the Hall sensor is increased above the operate point threshold (B OP ). After turn on, the output will source current equal to the device operating current plus a current source (I GND(H) ). When the magnetic field is decreased below the release point (B RP ), the output turns off and will source current equal only to the Hall-effect sensor operating current (I GND(L) ). The A61 output is inverted and the device turns off at B OP and on at B RP. The difference in the magnetic operate and release points is the hysteresis (B hys ) of the device. The hysteresis allows clean switching of the output even in the presence of external mechanical vibration or electrical noise. Applications. It is strongly recommended that an external bypass capacitor be connected (in close proximity to the Hall sensor) between the supply and ground of the device to reduce both external noise and noise generated by the chopperstabilization technique. REG +V B SAMPLE & HOLD X HALL VOLTAGE + Dwg. AH-011-2 Dwg. EH-012 'UA' PACKAGE 0.95 V X 1 2 0.1 µf + 100 Ω SUPPLY Dwg. EH-011-2A 6 115 Northeast Cutoff, Box 1506 Worcester, Massachusetts 01615-006 (508) 85-5000m
Operating Characteristics 7.0 Avg. IccL @.5 V 17.0 Avg.IccH@.5V 6.8 6.6 16.0 6.4 IccL (ma) 6.2 6.0 5.8 IccH (ma) 1 14.0 5.6 5.4 1.0 5.2 12.0 7.0 Avg.IccL@24V 17.0 Avg.IccH@24V 6.8 6.6 16.0 6.4 IccL (ma) 6.2 6.0 5.8 IccH (ma) 1 14.0 5.6 5.4 1.0 5.2 12.0-40 25 60 85 7.0 Avg. IccL @ 25 C 15.4 Avg. IccH @ 25 C IccH (ma) 6.8 6.6 6.4 6.2 6.0 5.8 5.6 5.4 5.2 IccL.5 IccL 24 Voltage (V) IccH (ma) 15. 15.2 15.1 1 14.9 14.8 14.7 14.6 14.5 IccH.5 IccH 24 Voltage (V) Avg. IrBat 4.5 4.0 IrBat (ma).5.0 2.5 2.0 www.allegromicro.com m 7
Operating Characteristics 120.0 Avg. Brp @ 25 C 120.0 Avg. Bop @ 25 C 29.0 Avg. Bhys @ 25 C 110.0 110.0 27.0 2 Brp (G) 100.0 90.0 80.0 70.0 Bop (G) 100.0 90.0 80.0 70.0 Bhys (G) 2.0 21.0 19.0 17.0 1 1.0 60.0 50.0 60.0 50.0 11.0 9.0 7.0 40.0 Brp.5 Brp 24 Voltage (V) 40.0 Bop.5 Bop 24 Voltage (V) Bhys.5 Bhys 24 Voltage (V) Brp (G) Avg. Brp @ 24 V 120.0 110.0 100.0 90.0 80.0 70.0 60.0 50.0 40.0 Bop (G) Avg. Bop @ 24 V 120.0 110.0 100.0 90.0 80.0 70.0 60.0 50.0 40.0 Bhys (G) Avg. Bhys @ 24 V 29.0 27.0 2 2.0 21.0 19.0 17.0 1 1.0 11.0 9.0 7.0 Brp (G) Avg. Brp @.5 V 120.0 110.0 100.0 90.0 80.0 70.0 60.0 50.0 40.0 Bop (G) Avg. Bop @.5 V 120.0 110.0 100.0 90.0 80.0 70.0 60.0 50.0 40.0 Bhys (G) Avg. Bhys @.5 V 29.0 27.0 2 2.0 21.0 19.0 17.0 1 1.0 11.0 9.0 7.0 8 115 Northeast Cutoff, Box 1506 Worcester, TEL: Massachusetts 0755-876489 01615-006 (508) 85-5000 m
PACKAGE DESIGNATOR 'LH' (fits SC-59A solder-pad layout) Dimensions in Inches (for reference only) Dimensions in Millimeters (controlling dimensions) 0.020 0.012 0.122 0.114 0.50 0.0.10 2.90 0.08 0.07 0.022 REF 0.006 0.000 1 2 0.118 0.106 0.07 BSC GAUGE PLANE SEATING PLANE 0.045 0.02 0.0079 0.0050 0.020 BSC 0 TO 8 0.020 MIN 0.55 REF 0.15 0.00 2.10 1.85 1 2.00 2.70 0.95 BSC GAUGE PLANE SEATING PLANE 1.1 0.87 0.25 BSC 0 TO 8 0.25 MIN 0.20 0.127 Dwg. MA-010-C in Dwg. MA-010-C mm 0.09 0.028 1.00 0.70 1 2 0.094 1 2 2.40 0.07 0.95 Dwg. MA-011- in Dwg. MA-011- mm NOTES: 1. Tolerances on package height and width represent allowable mold offsets. Dimensions given are measured at the widest point (parting line). 2. Exact body and lead configuration at vendor s option within limits shown.. Height does not include mold gate flash. 4. Where no tolerance is specified, dimension is nominal. 5. Add "TR" to part number for tape and reel. www.allegromicro.com m 9
Dimensions in Inches (controlling dimensions) PACKAGE DESIGNATOR UA Dimensions in Millimeters (for reference only) 0.164 0.159 4.17 4.04 45 0.062 0.058 45 1.57 1.47 0.122 0.117 45.10 2.97 45 0.085 MAX 1 2 0.01 2.16 MAX 1 2 0.79 0.640 0.600 0.017 0.018 16.26 15.24 0.44 0.5 SEE NOTE 0.0189 0.0142 SEE NOTE 0.48 0.6 0.050 BSC Dwg. MH-014E in 1.27 BSC Dwg. MH-014E mm NOTES: 1. Tolerances on package height and width represent allowable mold offsets. Dimensions given are measured at the widest point (parting line). 2. Exact body and lead configuration at vendor s option within limits shown.. Height does not include mold gate flash. 4. Recommended minimum PWB hole diameter to clear transition area is 0.05" (0.89 mm). 5. Where no tolerance is specified, dimension is nominal. 6. Supplied in bulk pack (500 pieces per bag). Radial Lead Form (order A26xEUA-LC) 0.620" 0.500" (15.7 mm 12.7 mm) 1 2 0.108" (2.74 mm) 0.100" (2.5 mm) Dwg. MH-026 NOTE: Lead-form dimensions are the nominals produced on the forming equipment. No dimensional tolerance is implied or guaranteed for bulk packaging (500 pieces per bag). www.allegromicro.com m 10
The products described herein are manufactured under one or more of the following U.S. patents: 5,045,920; 5,264,78; 5,442,28; 5,89,889; 5,581,179; 5,517,112; 5,619,17; 5,621,19; 5,650,719; 5,686,894; 5,694,08; 5,729,10; 5,917,20; and other patents pending. Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. Allegro products are not authorized for use as critical components in life-support appliances, devices, or systems without express written approval. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use; nor for any infringements of patents or other rights of third parties that may result from its use. 11 115 Northeast Cutoff, Box 1506 Worcester, Massachusetts 01615-006 (508) 85-5000m