Hall Effect Micro Switch IC Features General Description Micro Power Operation for Battery Applications Chopper Stabilized Amplifier Independent of North or South Pole Magnet, Easy for Manufacture Small Size Package Lead Free and Green Devices Available (RoHS Compliant) Applications The APX9132, integrated circuit, is an ultra-sensitive, pole independent Hall-effect switch with a latched digital output. A 2.5 volt to 3.5 volt operation and an unique clocking scheme reduce the average operating power requirements, either a north or south pole of sufficient flux will turn the output on; in the absence of a magnetic field, the output is off. The polarity independence and minimal power requirement allow this device to be easily replaced reed switch for superior for signal conditioning. Advanced CMOS processing is used to take advantage of low-voltage and low-power requirements, SOT-23-3 package provided a optimized package for most applications. Micro Switch Handheld Wireless Application Wake Up Switch Clamp Shell Type Application Switch Magnet Switch in Low Duty Cycle Applications Pin Configuration GND APX9132 VDD VOUT Ordering and Marking Information SOT-23-3 APX9132 Assembly Material Handling Code Temperature Range Package Code Package Code A : SOT-23-3 AT : TSOT-23-3 Temperature Range I : -4 to 85 o C Handling Code TR : Tape & Reel Assembly Material G : Halogen and Lead Free Device APX9132 A/AT: X32X X - Date Code Note: ANPEC lead-free products contain molding compounds/die attach materials and 1% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-2C for MSL classification at lead-free peak reflow temperature. ANPEC defines Green to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 9ppm by weight in homogeneous material and total of Br and Cl does not exceed 15ppm by weight). ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. 1
Absolute Maximum Ratings T A = 25 C unless otherwise noted Symbol Parameter Rating Unit Supply Voltage 5 V V OUT Output Voltage 5 V I OUT Output Current ±1 ma T J Junction Temperature Range 15 C T STG Storage Temperature Range -65 to +15 C Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Thermal Characteristics Symbol Parameter Typical Value Unit θ JA P D (Note 2) Junction-to-Ambient Resistance in Free Air SOT-23 Power Dissipation, T A=25 o C TSOT-23 SOT-23 TSOT-23 26 275.385.364 Note 2: θ JA is measured with the component mounted on a high effective thermal conductivity test board in free air. ο C/W W Electrical Characteristics T A = 25 C, =3V unless otherwise noted Symbol Characteristic Test Conditions APX9132 Min. Typ. Max. Unit Supply Voltage Range Operating 2.5-3.5 V Average - 5 1 µa I DD Supply Current Awake - 1.2 2 ma Sleep - 2 8 µa I OFF Output Leakage Current V OUT=3.5V, B RPN<B<B RPS - - 1. µa V OH Output High Voltage I OUT=-1mA -.4 - - V V OL Output Low Voltage I OUT=1mA - 2 4 mv t awake Wake up Time - 18 - µs t period Period - 6 - ms d.c. Duty Cycle -.3 - % f c Chopping Frequency - 11 - khz 2
Magnetic Characteristics T A = 25 C, =3V unless otherwise noted Symbol Characteristic Test Conditions APX9132 Min. Typ. Max. Unit B OPS 15 3 45 G Operate Points -45-3 -15 G B OPN B RPS 1 2 4 G Release Points -4-2 -1 G B RPN B hys Hysteresis - 1 - G 3
Typical Operating Characteristics Switching Points vs. Ambient Temperature Switching Points vs. Supply Voltage 4 3 B OPS 4 3 B OPS T A =25 o C Switching Points (G) 2 1-1 -2 B RPS B RPN Switching Points (G) 2 1-1 -2 B RPS B RPN -3 B OPN -3-4 -4-2 2 4 6 8 1 Ambient Temperature ( C) B OPN -4 2.5 3 3.5 4 4.5 5 Supply Voltage (V) Average Supply Current (µa) Average Supply Current vs. Ambient Temperature 1 8 6 4 2-4 -2 2 4 6 8 1 Ambient Temperature ( C) Average Supply Current (µa) Average Supply Current vs.supply Voltage 2 T A =25 o C 18 16 14 12 1 8 6 4 2 2.5 3 3.5 4 4.5 5 Supply Voltage (V) 4
Typical Operating Characteristics (Cont.) Output Source Current vs. -V OUT Voltage 5 Output Sink Current vs. Output Low Voltage 1 Output Source Current (ma) =5V 4 3 =4V 2 =3V 1.2.4.6.8 1 Output Sink Current (ma) 9 8 =4V 7 6 =5V 5 =3V 4 3 2 1.2.4.6.8 1 -V OUT Voltage (V) Output Low Voltage (V) Output Switch Waveform Output Switch Waveform Output Voltage (.5V/div) V OUT (.5V/div) =3V CL=12pF Output Voltage (.5V/div) =3V CL=12pF V OUT (.5V/div) Time (5µs/div) Time (5µs/div) 5
Pin Description PIN NO. NAME 1 VDD Power Input FUNCTION 2 VOUT When a magnetic field enters the hall element and exceeds the operate point B OPS (or less than B OPN) the output turns on (output is low). When the magnetic field is below the release point B RPS (or above B RPN), the output turns off (output is high). 3 GND Ground Connection Block Diagram VDD Awake & Sleep Timing Logic Hall Plane Dynamic Offset Cancellation Latch Circuit VOUT Chopper Amplifier Hysteresis Control GND Typical Application Circuit VOUT VDD + APX9132 GND.1µF - 2.5V-3.5V SOT-23 (Top View) 6
Function Description Operation The output of APX9132 switches low (turn-on) when in presence of strong flux density facing the marked side of package exceeds the operate point B OPS (or is less than B OPN ). After turn-on, the output is capable of sinking up to 1mA and the output voltage is low (turn-on). In absence of flux density below the release point B RPS (or increased above B RPN ), the APX9132 output switches high (turns off). After turn-off, the output is capable of sourcing up to 1mA and the output voltage is high (turn-off). The difference in the magnetic operated and released point is the hysteresis (B hys ) of the device. This built-in hysteresis allows clean switching of the output even in the presence of external mechanical bouncing vibration and electrical noise. 5V MAX B OPN OUTPUT OFF B OPS OUTPUT VOLTAGE B RPN B RPS OUTPUT ON -B +B MAGNETIC FLUX 7
Application Information It is strongly recommended that an external bypass capacitor be connected (is close to the Hall sensor) between the supply and ground of the device to reduce both external noise and noise generated by the chopper-stabilization technique. This is especially true due to the relatively high impedance of battery supplies. Pole-independent The pole-independent sensing technique allows for operation with either a north or south pole magnet orientation, enhancing the manufacturability of the device. The state-of-the-art technology provides the same output polarity for either pole in presence. Awake & Sleep Internal awake & sleep timing block circuit activates the sensor for 18 µs and deactivates it for the remainder of the period (6 ms). A short awake time allows for stabilization prior to the sensor sampling and data latching on the falling edge of the timing pulse. While in sleep cycle, the output is latched in its previous state. Chopper Stabilized Technique The chopper stabilized technique cancels the mismatching of the hall element, the amplifier offset voltage and temperature sensitive drift by the dynamic offset cancellation and switched capacitor technique. This technique produces devices have an extremely stable Hall output voltage, therefore, the magnetic switch points are stable. 8
Package Information SOT-23-3 D e SEE VIEW A A2 A.25 E1 E b c e1 A1 L GAUGE PLANE SEATING PLANE S Y M B O L A A1 A2 b c D E E1 e e1 L.3 MIN...9.3.8 MILLIMETERS.95 BSC 1.9 BSC MAX. 1.45.15 1.3.5.22 SOT-23-3 VIEW A MIN...35.12.3.6.12 INCHES.37 BSC.75 BSC MAX..57.6.51.2.9 2.7 3.1.16.122 2.6 1.4 3. 1.8.12.55.118.71.24 8 8 Note : Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 1 mil per side. 9
Package Information TSOT-23-3 D e SEE VIEW A E1 E b c e1 A2 A1 A L.25 GAUGE PLANE SEATING PLANE VIEW A S Y M MILLIMETERS B O L MIN. MAX. A A1 c D E E1 e e1 L.75.8.3.3.5 A2.7.75 b.3.5.8.2 2.6 3. 1.4 1.8.95 BSC 1.9BSC.3.6 TSOT-23-3 MIN..1 INCHES.37 BSC MAX..31.2.28.3.12.2.3.8 2.7 3.1.16.122.12.118.55.71.75 BSC.12.24 8 8 Note : Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 1 mil per side. 1
Carrier Tape & Reel Dimensions OD P P2 P1 A E1 OD1 B A T B W F K B A SECTION A-A SECTION B-B d H A T1 Application A H T1 C d D W E1 F SOT-23-3 178. 2. 5 MIN. 8.4+2. -. 13.+.5 -.2 1.5 MIN. 2.2 MIN. 8..3 1.75.1 3.5.5 P P1 P2 D D1 T A B K 4..1 4..1 2..5 1.5+.1 -. 1. MIN..6+. -.4 3.2.2 3.1.2 1.5.2 Application A H T1 C d D W E1 F TSOT-23-3 178. 2. 5 MIN. 8.4+2. -. 13.+.5 -.2 1.5 MIN. 2.2 MIN. 8..3 1.75.1 3.5.5 P P1 P2 D D1 T A B K 4..1 4..1 2..1 1.5+.1 -. 1. MIN..6+. -.4 3.2.2 3.1.2 1.5.2 Devices Per Unit Package Type Unit Quantity SOT-23-3 Tape & Reel 3 TSOT-23-3 Tape & Reel 3 11
Taping Direction Information (T)SOT-23-3 USER DIRECTION OF FEED Classification Profile 12
Classification Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Preheat & Soak Temperature min (T smin) Temperature max (T smax) Time (T smin to T smax) (t s) 1 C 15 C 6-12 seconds 15 C 2 C 6-12 seconds Average ramp-up rate (T smax to T P) 3 C/second max. 3 C/second max. Liquidous temperature (T L) Time at liquidous (t L) Peak package body Temperature (T p)* Time (t P)** within 5 C of the specified classification temperature (T c) 183 C 6-15 seconds 217 C 6-15 seconds See Classification Temp in table 1 See Classification Temp in table 2 2** seconds 3** seconds Average ramp-down rate (T p to T smax) 6 C/second max. 6 C/second max. Time 25 C to peak temperature 6 minutes max. 8 minutes max. * Tolerance for peak profile Temperature (T p) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (t p) is defined as a supplier minimum and a user maximum. Table 1. SnPb Eutectic Process Classification Temperatures (Tc) Package Thickness Volume mm 3 <35 Volume mm 3 35 <2.5 mm 235 C 22 C 2.5 mm 22 C 22 C Table 2. Pb-free Process Classification Temperatures (Tc) Package Thickness Volume mm 3 <35 Volume mm 3 35-2 Volume mm 3 >2 <1.6 mm 26 C 26 C 26 C 1.6 mm 2.5 mm 26 C 25 C 245 C 2.5 mm 25 C 245 C 245 C Reliability Test Program Test item Method Description SOLDERABILITY JESD-22, B12 5 Sec, 245 C HOLT JESD-22, A18 1 Hrs, Bias @ 125 C PCT JESD-22, A12 168 Hrs, 1%RH, 2atm, 121 C TCT JESD-22, A14 5 Cycles, -65 C~15 C ESD MIL-STD-883-315.7 VHBM 2KV, VMM 2V Latch-Up JESD 78 1ms, 1 tr 1mA 13
Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan Tel : 886-3-5642 Fax : 886-3-56425 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-291-3838 Fax : 886-2-2917-3838 14