High Voltage Surface Mount Input Rectifier Diode, 20 A

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1 VS-2ETS8SPbF, VS-2ETS2SPbF High Voltage Surface Mount Input Rectifier Diode, 2 FETURES 2 TO-263 (D 2 PK) 3 node ase cathode 2 3 node Meets MSL level, per J-STD-2, LF maximum peak of 26 C Glass passivated pellet chip junction Designed and qualified according to JEDEC -JESD 47 Material categorization: for definitions of compliance please see PRODUCT SUMMRY Package TO-263 (D 2 PK) I F(V) 2 V R 8 V, 2 V V F at I F. V I FSM 3 T J max. 5 C Diode variation Single die PPLICTIONS Input rectification switches and output rectifiers which are available in identical package outlines DESCRIPTION The VS-2ETS...SPbF rectifier High Voltage Series has been optimized for very low forward voltage drop, with moderate leakage. The glass passivation technology used has reliable operation up to 5 C junction temperature. OUTPUT CURRENT IN TYPICL PPLICTIONS PPLICTIONS SINGLE-PHSE RIDGE THREE-PHSE RIDGE UNITS Capacitive input filter T = 55 C, T J = 25 C common heatsink of C/W MJOR RTINGS ND CHRCTERISTICS SYMOL CHRCTERISTICS VLUES UNITS I F(V) Sinusoidal waveform 2 V RRM 8/2 V I FSM 3 V F 2, T J = 25 C. V T J -4 to +5 C VOLTGE RTINGS PRT NUMER V RRM, MXIMUM PEK REVERSE VOLTGE V V RSM, MXIMUM NON-REPETITIVE PEK REVERSE VOLTGE V VS-2ETS8SPbF 8 9 VS-2ETS2SPbF 2 3 I RRM T 5 C m Revision: 2-Feb-6 Document Number: 9434 RE SUJECT TO SPECIFIC DISCLIMERS, SET FORTH T

2 VS-2ETS8SPbF, VS-2ETS2SPbF SOLUTE MXIMUM RTINGS PRMETER SYMOL TEST CONDITIONS VLUES UNITS Maximum average forward current I F(V) T C = 5 C, 8 conduction half sine wave 2 Maximum peak one cycle ms sine pulse, rated V RRM applied 25 I non-repetitive surge current FSM ms sine pulse, no voltage reapplied 3 ms sine pulse, rated V RRM applied 36 Maximum I 2 t for fusing I 2 t ms sine pulse, no voltage reapplied s Maximum I 2 t for fusing I 2 t t =. ms to ms, no voltage reapplied s ELECTRICL SPECIFICTIONS PRMETER SYMOL TEST CONDITIONS VLUES UNITS Maximum forward voltage drop V FM 2, T J = 25 C. V Forward slope resistance r t.4 m T J = 5 C Threshold voltage V F(TO).85 V T J = 25 C. Maximum reverse leakage current I RM V R = Rated V RRM T J = 5 C. m THERML - MECHNICL SPECIFICTIONS PRMETER SYMOL TEST CONDITIONS VLUES UNITS Maximum junction and storage temperature range T J, T Stg - 4 to 5 C Maximum thermal resistance, junction to case R thjc DC operation.3 Maximum thermal resistance, junction to ambient Typical thermal resistance, case to heatsink pproximate weight Mounting torque Marking device R thj () For D 2 PK version 62 R thcs Mounting surface, smooth and greased.5 Note () When mounted on square (65 mm 2 ) PC of FR-4 or G- material 4 oz. (4 μm) copper 4 C/W For recommended footprint and soldering techniques refer to application note #N-994 C/W 2 g.7 oz. minimum 6. (5.) kgf cm maximum 2 () (lbf in) Case style TO-263 (D 2 PK) 2ETS8S 2ETS2S Revision: 2-Feb-6 2 Document Number: 9434 RE SUJECT TO SPECIFIC DISCLIMERS, SET FORTH T

3 VS-2ETS8SPbF, VS-2ETS2SPbF Maximum llowable Case Temperature ( C) R thjc (DC) =.3 C/W 3 Conduction angle Maximum verage Forward Power Loss (W) RMS limit DC Conduction period T J = 5 C verage Forward Current () verage Forward Current () Fig. - Current Rating Characteristics Fig. 4 - Forward Power Loss Characteristics Maximum llowable Case Temperature ( C) R thjc (DC) =.3 C/W Conduction period DC Peak Half Sine Wave Forward Current () t any rated load condition and with rated V RRM applied following surge. Initial T J = 5 C at 6 Hz.83 s at 5 Hz. s verage Forward Current () Fig. 2 - Current Rating Characteristics Number of Equal mplitude Half Cycle Current Pulse (N) Fig. 5 - Maximum Non-Repetitive Surge Current Maximum verage Forward Power Loss (W) RMS limit Conduction angle T J = 5 C Peak Half Sine Wave Forward Current () Maximum non-repetitive surge current versus pulse train duration. Initial T J = 5 C No voltage reapplied Rated V RRM reapplied verage Forward Current () Pulse Train Duration (s) Fig. 3 - Forward Power Loss Characteristics Fig. 6 - Maximum Non-Repetitive Surge Current Revision: 2-Feb-6 3 Document Number: 9434 RE SUJECT TO SPECIFIC DISCLIMERS, SET FORTH T

4 VS-2ETS8SPbF, VS-2ETS2SPbF Instantaneous Forward Current () T J = 25 C T J = 5 C Instantaneous Forwad Voltage (V) Fig. 7 - Forward Voltage Drop Characteristics Z thjc - Transient Thermal Impedance ( C/W). Single pulse D =.5 D =.33 D =.25 D =.7 D =.8 Steady state value (DC operation)..... Square Wave Pulse Duration (s) Fig. 8 - Thermal Impedance Z thjc Characteristics Revision: 2-Feb-6 4 Document Number: 9434 RE SUJECT TO SPECIFIC DISCLIMERS, SET FORTH T

5 VS-2ETS8SPbF, VS-2ETS2SPbF ORDERING INFORMTION TLE Device code VS- 2 E T S 2 S TRL PbF product 2 - Current rating (2 = 2 ) 3 - Circuit configuration E = single diode 4 - Package: T = TO-22C 5 - Type of silicon: S = standard recovery rectifier 6 - Voltage code x = V RRM 7 - S = TO-22 D 2 PK (SMD-22) version 8 - None = tube TRL = tape and reel (left oriented) TRR = tape and reel (right oriented) 9 - PbF = Lead (Pb)-free 8 = 8 V 2 = 2 V ORDERING INFORMTION (Example) PREFERRED P/N QUNTITY PER TUE MINIMUM ORDER QUNTITY PCKGING DESCRIPTION VS-2ETS8SPbF 5 ntistatic plastic tube VS-2ETS8STRRPbF 8 8 3" diameter reel VS-2ETS8STRLPbF 8 8 3" diameter reel VS-2ETS2SPbF 5 ntistatic plastic tube VS-2ETS2STRRPbF 8 8 3" diameter reel VS-2ETS2STRLPbF 8 8 3" diameter reel LINKS TO RELTED DOCUMENTS Dimensions Part marking information Packaging information SPICE model Revision: 2-Feb-6 5 Document Number: 9434 RE SUJECT TO SPECIFIC DISCLIMERS, SET FORTH T

6 DIMENSIONS in millimeters and inches D 2 PK Outline Dimensions Conforms to JEDEC outline D 2 PK (SMD-22) (3) L (2)(3) E 4 c2 (E) (D) (3) Pad layout. (.43) 9.65 (.38) D L2 2 x e 2 3 H (2) 2 x b2 2 x b C Detail. M M c ±.4 M E View - H (3) 7.9 (.7) 5. (.625) 2.32 (.8) Plating 2.64 (.3) 2.4 (.96) (4) b, b3 3.8 (.5) ase Metal Gauge plane Lead tip to 8 L3 L L4 Detail Rotated 9 CW Scale: 8: Seating plane (c) (b, b2) Section - and C - C Scale: None c (4) SYMOL MILLIMETERS INCHES MILLIMETERS INCHES NOTES SYMOL MX. MX. MX. MX. NOTES D E , 3 b E b e 2.54 SC. SC b H b L c L c L c L3.25 SC. SC D L Notes () Dimensioning and tolerancing per SME Y4.5 M-994 (2) Dimension D and E do not include mold flash. Mold flash shall not exceed.27 mm (.5") per side. These dimensions are measured at the outmost extremes of the plastic body (3) Thermal pad contour optional within dimension E, L, D and E (4) Dimension b and c apply to base metal only (5) Datum and to be determined at datum plane H (6) Controlling dimension: inch (7) Outline conforms to JEDEC outline TO-263 Revision: 8-Jul-5 Document Number: 9546 RE SUJECT TO SPECIFIC DISCLIMERS, SET FORTH T

7 Legal Disclaimer Notice Vishay Disclaimer LL PRODUCT, PRODUCT SPECIFICTIONS ND DT RE SUJECT TO CHNGE WITHOUT NOTICE TO IMPROVE RELIILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, Vishay ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. ll operating parameters, including typical parameters, must be validated for each customer application by the customer s technical experts. Product specifications do not expand or otherwise modify Vishay s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. Revision: 3-Jun-6 Document Number: 9

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