Thin Film Mini-MELF Resistors

Transcription

1 FEATURES Advanced thin film technology AEC-Q2 qualified Low TCR and tight tolerances Excellent stability in different environmental conditions Pure tin termination on nickel barrier, plated on press fit steel caps Compliant to RoHS Directive 22/95/EC STANDARD ELECTRICAL SPECIFICATIONS MODEL POWER RATING P 7 W LIMITING ELEMENT VOLTAGE DC or AC RMS V TEMPERATURE COEFFICIENT ppm/k TOLERANCE % RESISTANCE RANGE E-SERIES.25 2 ± 5 ±. ±.25 ±.5 43R to 22 22R to 22 R to 22 24; 96; ± 25 ±. ±.25 ±.5 43R to 5 22R to 5 R to M 24; 96; ± 5 ±.5 ± R to M R82 to M 24; 96; 92 24; ± ± 5 R22 to M 24 Zero-Ohm-Resistor: OMM24 R max. = m I max. = 3 A s EN83 E and OMM24 EN83 E respectively are available versions with IECQ-CECC approval to EN 44-83, version A, with nominal failure rate level E. The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 55 C is not exceeded. TECHNICAL SPECIFICATIONS PARAMETER UNIT Power rating P 7 W.25 Limiting element voltage, DC or AC RMS V 2 Insulation voltage ( min), DC or AC PEAK V 3 Insulation resistance Category temperature range C - 55 to + 25 (+ 55) Failure rate: FIT observed. x -9 /h s The upper temperature limit of 25 C reflects the prescriptions of the detail specification EN However, the products may be operated up 55 C, if the tradeoff through decreased drift stability is acceptable to the specific application. The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 25 C or 55 C respectively is not exceeded. The specification of this product is based on a test board according to EN 44, providing a thermal resistance of approximately 22 K/W. These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime. The IECQ-CECC approved product versions EN83 E and OMM24 EN83 E respectively feature a quality factor Q = 3 for the purpose of system MTBF calculations, compared with Q = for the standard versions. ** Please see document Vishay Material Category Policy : For technical questions, contact: melf@vishay.com Document Number: 24 3 Revision: 6-Sep- THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

2 DIMENSIONS K L L D D DIMENSIONS AND MASS TYPE L D max. L min. D K MASS (mg) OMM / D + / / s Color code marking is applied according to IEC 662 in four bands for 5 % tolerance, or in five bands. Each color band appears as a single solid line, voids are permissible if at least 2 / 3 of the band is visible from each radial angle of view. The last color band for tolerance is approximately 5 % wider than the other bands. The color of the body coating is light green for jumpers and for a temperature coefficient of ± 5 ppm/k or of ± ppm/k, pink for ± 25 ppm/k, or violet for ± 5 ppm/k. Zero ohm jumper are marked with one centered black band. PATTERN STYLES FOR MELF RESISTORS G X Z Y RECOMMENDED SOLDER PAD DIMENSIONS WAVE SOLDERING REFLOW SOLDERING TYPE G Y X Z G Y X Z OMM The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC x, or in publication IPC-735. They do not guarantee any supposed thermal properties, however, they will be found adequate for most general applications. Document Number: 24 For technical questions, contact: melf@vishay.com Revision: 6-Sep- 3 THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

3 PART NUMBER AND PRODUCT DESCRIPTION Part Number: C562FB Part Number: OMM24B S M M 2 4 C F B O M M 2 4 B MODEL VERSION TCR RESISTANCE TOLERANCE PACKAGING OMM24 = Neutral V = EN 44-83, version A, nominal failure rate level E E = ± 5 ppm/k D = ± 25 ppm/k C = ± 5 ppm/k B = ± ppm/k = Jumper 3 digit value digit multiplier = Jumper MULTIPLIER 7 = * -3 2 = * 2 8 = * -2 3 = * 3 9 = * - 4 = * 4 = * 5 = * 5 = * Products can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION. B = ±. % C = ±.25 % D = ±.5 % F = ± % J = ± 5 % = Jumper Product Description: 5 562R % B Product Description: OMM24 R B 5 562R % B - OMM24 - R - B - MODEL TCR RESISTANCE TOLERANCE PACKAGING VERSION OMM24 ± 5 ppm/k ± 25 ppm/k ± 5 ppm/k ± ppm/k R = 2M2 = 2.2 M R = Jumper ±. % ±.25 % ±.5 % ± % ± 5 % B B3 B M3 B B3 B M3 PACKAGING TYPE CODE QUANTITY CARRIER TAPE WIDTH PITCH REEL DIAMETER OMM24 Blister tape 8 mm/7" B3 3 acc. IEC Type II 8 mm 4 mm B 33 mm/3" M3 3 Bulk case acc. IEC EN83 E OMM24 EN83 E B Blister tape 8 mm/7" B3 3 acc. IEC Type II 8 mm 4 mm B 33 mm/3" () Package of pieces, code B, is available only for products with TCR ± 25 ppm/k or ± 5 ppm/k, and with tolerance ±.25 % or ±. %. For technical questions, contact: melf@vishay.com Document Number: Revision: 6-Sep- THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

4 FUNCTIONAL PERFORMANCE Temperature Rrise in C Function of Rated Power in % Temperature Rise.2.3 Power in W.4-55 Derating Ambient Temperature in C Non-Linearity A 3 in db Current Noise in µv/v K K M M. 5K K 5K K 5K M 5M M Non-linearity Current Noise Phase Angle γ in Ω 39 Ω Ω 47 Ω kω Z - R in % Ω 39 Ω Ω 47 Ω kω kω kω kω kω 5 HF - Performance Frequency f in MHz HF - Performance Frequency f in MHz Document Number: 24 For technical questions, contact: melf@vishay.com Revision: 6-Sep- 33 THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

5 FUNCTIONAL PERFORMANCE Test Voltage in V 3K Test Voltage in V 3K R R K K R R K K Single pulse high voltage overload capability.2/5 acc. EN 65-, 4.27 Single pulse high voltage overload capability /7 acc. EN 65-, 4.27 Pulse Load P peak max. in W Secondary conditions: a) P P 7 (permissible constant power at ϑ u 7 C) b) ϑ u 7 C c) U max. see diagram (max. pulse voltage) Pulse Rating P P 7 - Square Pulse t i in s Pulse Load P peak max. in W. Secondary conditions: a) P (peak pulse, single pulse) b) ϑ u 7 C c) U max. see diagram (max. pulse voltage) -5 Pulse Rating P Square Pulse t i in s Pulse Voltage Û max. in V MS 2 Secondary conditions: a) P see diagram (pulse rating) b) ϑ u 7 C Maximum Pulse Voltage Square Pulse t i in s For technical questions, contact: melf@vishay.com Document Number: Revision: 6-Sep- THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

6 TEST PROCEDURES AND REQUIREMENTS REQUIREMENTS PERMISSIBLE CHANGE ( R) TEST CONDITIONS OF TEST CLASS.25 CLASS.5 CLASS CLASS 2 to 332 k to < > 332 k Endurance test at 7 C IEC 65-, U = P 7 x R U max. ;.5 h on,.5 h off at 7 C, h ± (.25 % R +.5 ) ± (.5 % R +.5 ) at 7 C, 8 h ± (.5 % R +.5 ) ± (. % R +.5 ) Endurance at UCT IEC 65-, at 25 C, h ± (.25 % R +.5 ) ± (.5 % R +.5 ) Damp heat steady state 4 C/93 % RH IEC 65-, 4.24 and IEC Damp heat steady state accelerated 85 C/85 % RH Rapid change of temperature; cycles IEC 65-, 4.9 and IEC Overload test IEC 65-, 4.3 Electrostatic discharge (HBM) IEC days; U =. x P 7 x R ; U max. = 2 V h; U =.3 x P 7 x R ; U max. = 4 V 3 min at LCT; 3 min at UCT; LCT = - 55 C; UCT = 25 C U = 2.5 x P 7 x R 2 x U max. ; 2 s 3 positive + 3 negative discharges 2 kv ± (.25 % R +.5 ) ± (.5 % R +.5 ) ±. % R +.5 ) () ± (.25 % R +.5 ) ± (.5 % R +. ) ± (. % R +.5 ) ± (.5 % R +.5 ) Resistance to soldering heat IEC 65-, and IEC () For resistance > 2M2: ± (2. % R +.5 ). Solder bath method (26 ± 5) C; s ± (.5 % R +. ) ± (. % R +.5 ) APPLICABLE SPECIFICATIONS EN 65- EN 44 EN IEC x IEC Generic specification Sectional specification Detail specification Variety of environmental test procedures Packaging of SMD components Document Number: 24 For technical questions, contact: melf@vishay.com Revision: 6-Sep- 35 THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

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