AZV358. Pin Assignments. Description DATA SHEET. Applications. Features. Functional Block Diagram. A Product Line of. Diodes Incorporated
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1 DUAL LOW VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS Description Pin Assignments The is dual low voltage (2.7V to 5.5V) operational amplifiers which have rail-to-rail output swing capability. The input commonmode voltage range includes ground. The chip exhibits excellent speed-power ratio, achieving 1MHz of bandwidth and 1V/µs of slew rate with low supply current. M/G/MM Package (SOIC-8/TSSOP-8/MSOP-8) The is built with BiCMOS process. It has bipolar input and output stages for improved noise performance, low input offset voltage and higher output current drive. is available in the package of TSSOP-8 and MSOP-8. The small packages save space on pc boards, and enable the design of small portable electronic devices. It also allows the designer to place the device closer to the signal source to reduce noise pickup and increase signal integrity. is also available in standard SOIC-8 package. OUTPUT 1 IN 1- IN OUTPUT 2 IN 2- IN 2+ Features Applications (For =5V and =V, typical unless otherwise noted) Guaranteed 2.7V to 5.5V Performance No Crossover Distortion Gain-Bandwidth Product 1MHz Industrial Temperature Range: - C to +85 C Low Supply Current: 2µA Rail-to-Rail Output Swing under kω Load: H up to -mv L near to +65mV V CM : -.1V to -.8V Active Filters Low Power, Low Voltage Applications General Purpose Portable Devices Cellular Phone, Cordless Phone Battery-Powered Systems Functional Block Diagram 8 V BIAS1 IN- 2,6 V BIAS2 1,7 OUTPUT IN+ 3,5 V BIAS3 4 1 of 15
2 Absolute Maximum Ratings A =25 C, unless otherwise specified. Note 1) Note 1: Symbol Parameter Rating Unit Power Supply Voltage 6 V T J Operation Junction Temperature 15 C T STG Storage Temperature Range -65 to 15 C T LEAD Lead Temperature (Soldering, seconds) 2 C ESD (Machine Model) V ESD (Human Body Model) V Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to Absolute Maximum Ratings for extended periods may affect device reliability. Recommended Operating Conditions Symbol Parameter Min Max Unit Supply Voltage V T A Ambient Operating Temperature Range - 85 C 2.7V Electrical Characteristics (@T A =25 C, bold typeface applies over T A =- C to 85 C, =2.7V, =V, V CM =1.V, = /2 and >1MΩ, unless otherwise specified. Note 2) Symbol Parameter Conditions Min Typ Max Unit V IO Input Offset Voltage mv I B Input Bias Current na 5 5 I IO Input Offset Current na 15 V CM Input Common Mode Voltage Range for CMRR 5dB V I CC Supply Current = /2, A VCL =1, No 1 3 load 4 μa CMRR Common Mode Rejection Ratio V CM 1.7V 5 63 db PSRR Power Supply Rejection Ratio 2.7V 5V, =1V 5 db I SOURCE =V 5 ma Output Short Circuit Current I SINK =2.7V 3 ma H V Output Voltage Swing =kω to 1.35V L 18 mv GBWP Gain Bandwidth Product =pf 1 MHz ɸ M Phase Margin deg G M Gain Margin db Note 2: Limits over the full temperature are guaranteed by design, but not tested in production. 2 of 15
3 5V Electrical Characteristics A =25 C, bold typeface applies over T A =- o C to 85 o C, =5V, =V, V CM =2.V, = /2 and >1MΩ, unless otherwise specified. Note 2) Symbol Parameter Conditions Min Typ Max Unit V IO Input Offset Voltage mv I B I IO V CM I CC Input Bias Current Input Offset Current Input Common Mode Voltage Range Supply Current na na for CMRR 5dB V = /2, A VCL =1, No 2 4 load 615 μa 84 G V Large Signal Voltage Gain =2kΩ db 8 CMRR Common Mode Rejection Ratio V CM 4V 5 63 db PSRR Power Supply Rejection Ratio 2.7V 5V, =1V, V CM =1V 5 db I SOURCE =V 5 ma Output Short Circuit Current I SINK =5V 1 ma H L Output Voltage Swing =2kΩ to 2.5V =kω to 2.5V =2kΩ to 2.5V =kω to 2.5V SR Slew Rate 1 V/μs GBWP Gain Bandwidth Product =pf 1 MHz ɸ M Phase Margin deg G M Gain Margin db V mv Note 2: Limits over the full temperature are guaranteed by design, but not tested in production. 3 of 15
4 Performance Characteristics Supply Current vs. Supply Voltage Supply Current vs. Temperature 3 25 = /2 No Load = /2 No Load Supply Current ( A) 15 T A = - o C T A =25 o C T 5 A =85 o C Supply Voltage (V) Supply Current ( A) =5V =2.7V Temperature ( O C) Slew Rate vs. Supply Voltage Output Short Circuit Current vs. Supply Voltage Slew Rate (V/ S) Falling Edge Rising Edge A V =1 V IN =1Vp-p =K to 1/ Supply Voltage (V) Output Short Circuit Current_I SOURCE (ma) 5 3 =V short to Supply Voltage (V) Output Short Circuit Current vs. Supply Voltage Output Short Circuit Current vs. Temperature Output Short Circuit Current_I SINK (ma) =V short to Supply Voltage (V) Output Short Circuit Current _ I Source (ma) =5V =V to =2.7V Temperature ( O C) 4 of 15
5 Performance Characteristics (Cont.) Output Short Circuit Current vs. Temperature Output Voltage vs. Output Source Current Output Short Circuit Current_I SINK (ma) =V to =5V =2.7V Temperature ( O C) - Output Voltage Referenced to (V) =5V, = 1E Source Current (ma) Output Voltage vs. Output Source Current Output Voltage vs. Output Sink Current -Output Voltage Reference to (V) =2.7V =V E Source Current (ma) Output Voltage (V) 1 =5V = Sink Current (ma) Output Voltage vs. Output Sink Current Output Voltage Swing vs. Supply Voltage Output Voltage (V) 1.1 =2.7V =V Output Voltage Swing (mv) Negative Swing_L Positive Swing_ -H =K to /2 1 Sink Current (ma) Supply Voltage (V) 5 of 15
6 Performance Characteristics (Cont.) Output Voltage Swing vs. Temperature Gain and Phase vs. Frequency and Resistive Load Output Voltage Swing (mv) =K to /2 Negative Swing_L =5V =2.7V Positive Swing_ -H =5V =2.7V Temperature ( O C) Open Loop Gain (db) =6 =2K =K Phase Margin =6 =2K =K Gain =2.5V, =-2.5V = k k 1M Frequency (Hz) 8 - Phase Margin (Degree) Gain and Phase vs. Frequency and Capacitive Load Gain and Phase vs. Frequency and Capacitive Load Open Loop Gain (db) =pf =pf =47pF =pf =2.5V, =-2.5V =6 =pf =pf =47pF =pf Phase Margin Gain Phase Margin (Degree) Open Loop Gain (db) =pf =pf =pf Phase Margin =pf =pf =pf Gain =2.5V =-2.5V =K Phase Margin (Degree) -3 k k 1M Frequency (Hz) - - k k 1M Frequency (Hz) - THD+N vs. Frequency Non-Inverting Input Small Signal Pulse Response 1 =2.5V, =-2.5V =K A V =1 V IN =5V, =V =2KΩ V IN =mvp-p Unity Gain THD+N (%).1 =1Vp-p UT.1 =2.5Vp-p 1E-3 1k k k Frequency (Hz) 6 of 15
7 Performance Characteristics (Cont.) Non-Inverting Input Large Signal Pulse Response Non-Inverting Input Small Signal Response V IN =5V, =V =2KΩ V IN =1Vp-p Unity Gain V IN =2.5V =-2.5V =5pF =2KΩ V IN =mvp-p Unity Gain UT UT Non-Inverting Input Small Signal Response V IN =2.5V =-2.5V =pf =2KΩ V IN =mvp-p Unity Gain UT 7 of 15
8 Ordering Information - Package Temperature Range SOIC-8 - to 85 C Circuit Type Package M: SOIC-8 G: TSSOP-8 MM: MSOP-8 Part Number E1: Lead Free G1: Green Blank: Tube TR: Tape & Reel Marking ID Lead Free Green Lead Free Green Packing Type M-E1 M-G1 M-E1 M-G1 Tube MTR-E1 MTR-G1 M-E1 M-G1 Tape & Reel TSSOP-8 - to 85 C MSOP-8 - to 85 C G-E1 G-G1 EG3E GG3E Tube GTR-E1 GTR-G1 EG3E GG3E Tape & Reel MM-E1 MM-G1 MM-E1 MM-G1 Tube MMTR-E1 MMTR-G1 MM-E1 MM-G1 Tape & Reel BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant. Products with G1 suffix are available in green packages. 8 of 15
9 Package Outline Dimensions (All dimensions in mm(inch).) SOIC-8 1.(.39) Option (.185) 5.(.1) 1.27(. 5).(.4).3(.12) R.15(.6) 3.8(.15) 4.(.157) 1.35(.53) 1.75(.69).675(. 27).725(. 29) D 8 D :1.3(.13) 5.8(. 228) 6.(. 244) 8 8 Option 1.3(.12).5(.).15(.6).25(.).9(.35) (.17).8(.31) R.15(.6) Option 2.35(.14) Note: Eject hole, oriented hole and mold mark is optional. 9 of 15
10 Package Outline Dimensions (Cont.) (All dimensions in mm(inch).) TSSOP-8.5(.2).15(.6).8(.31) 1.5(.41) 2.9(.114) 3.(.122) 1.(.47) MAX.9(.4).(.8) SEE DETAIL A 12 TOP & BOTTOM R.9(.4) 4.3(.169) 4.5(.177) 6.(.252) R.9(.4) GAGE PLANE 8.(.16) SEATING PLANE.45(.18).75(.3).65(.26) 1.95(.77).19(.7).3(.12).25(.) DETAIL A 1.(.39) REF Note: Eject hole, oriented hole and mold mark is optional. of 15
11 Package Outline Dimensions (Cont.) (All dimensions in mm(inch).) MSOP-8.3(.12).65(.26).15(.6) 4.7(.185) 5.(.1).(.16).8(.31) 2.9(.114) 3.(.122) 8.75(.3).97(.38) 2.9(.114) 3.(.122).(.).(.8).8(.31) 1.(.47) ` Note: Eject hole, oriented hole and mold mark is optional. 11 of 15
12 Suggested Pad Layout SOIC-8 Grid placement courtyard G Z Y E X Z G X Y E Dimensions (mm)/(inch) (mm)/(inch) (mm)/(inch) (mm)/(inch) (mm)/(inch) Value 6.9/ / / / /.5 12 of 15
13 Suggested Pad Layout (Cont.) TSSOP-8 G Z Y E E1 X Dimensions Z (mm)/(inch) G (mm)/(inch) X (mm)/(inch) Y (mm)/(inch) E (mm)/(inch) E1 (mm)/(inch) Value 7.7/ /.164.4/ /.7.65/ / of 15
14 Suggested Pad Layout (Cont.) MSOP-8 E X G Z Y Z G X Y E Dimensions (mm)/(inch) (mm)/(inch) (mm)/(inch) (mm)/(inch) (mm)/(inch) Value 5.5/ /.1.45/ /.53.65/ of 15
15 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. does not assume any liability arising out of the application or use of this document or any product described herein; neither does convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold and all the companies whose products are represented on website, harmless against all damages. does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use products for any unintended or unauthorized application, Customers shall indemnify and hold and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by. LIFE SUPPORT products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by. Further, Customers must fully indemnify and its representatives against any damages arising out of the use of products in such safety-critical, life support devices or systems. Copyright 13, 15 of 15
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Multi-Channel Relay and Inductive Load Sink Driver Description Pin Assignments The ULN2003V2 and ULN2003F2 are multi-channel sink drivers comprised of 7-channel and 4-channel output stages respectively.
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ULTRA LOW QUIESCENT CURRENT CMOS LDO Description The series are CMOS-based positive voltage regulator ICs. Each of these ICs consists of a voltage reference, an error amplifier, a resistor network for
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SYNCHRONOUS MOSFET CONTROLLER IN Description The is intended to drive a MOSFET configured as an ideal diode replacement. The device is comprised of a differential amplifier detector stage and high current
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Green 3.0A SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER Product Summary (@T A = +25 C) V RRM (V) I O (A) V F (V) I R (μa) 1000 3.0 1.1 5 Features and Benefits Glass Passivated Die Construction Compact,
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QUADRUPLE 3-STATE BUFFERS Description Pin Assignments The provides four independent buffers with three state outputs. Each output is independently controlled by an associated output enable pin (OE) which
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More informationGreen. Top View Pin Diagram Internal Schematic. Part Number Case Packaging MSB12M-13 MSB 3,000/Tape & Reel
Green.2A SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER Product Summary (@T A = +25 C) V RRM (V) I O (A) V F (V) I R (µa),000.2. 5 Features and Benefits Glass Passivated Die Construction Compact, Thin
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COST EFFECTIVE ADJUSTABLE PRECISION SHUNT REGULATOR Description The ZTL431 and ZTL432 are three terminal adjustable shunt regulators offering excellent temperature stability and output current handling
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Low Voltage SPDT 0.8Ω Analog Switch Features CMOS Technology for Bus and Analog Applications Low On-Resistance: 0.8Ω at 3.0V Wide Range: 1.65V to 5.5V Rail-to-Rail Signal Range Control Input Overvoltage
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Green 1.0A SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER Product Summary (@ T A = +25 C) V RRM (V) I O (A) V F Max (V) I R Max (µa) 1000 1 1.1 5 Description and Applications The is a surface mount glass
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Low Skew, 1-TO-4 LVCMOS/LVTTL Fanout Buffer Features Four LVCMOS / LVTTL outputs LVCMOS / LVTTL clock input CLK can accept the following input levels: LVCMOS, LVTTL Maximum output frequency: Additive phase
More informationADC114YUQ. Mechanical Data. Features. Ordering Information (Notes 4 & 5) Marking Information NXX 1Y7 YM NXX YM
NXX YM NPN PRE-BIASED SMALL SIGNAL DUAL SURFACE MOUNT TRANSISTOR Features Mechanical Data Epitaxial Planar Die Construction Built-In Biasing Resistors Totally Lead-Free & Fully RoHS Compliant (Notes &
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HALF-BRIDGE GATE DRIVER IN SO-8 Description Features The is a high voltage / high speed gate driver capable of driving N-channel MOSFETs and IGBTs in a half bridge configuration. High voltage processing
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Green 3.0A SCHOTTKY BARRIER RECTIFIER Product Summary B320AE/B330AE/B340AE/B345AE V RRM (V) I O (A) V F(MAX) (V) I R(MAX) (ma) @ +25 C @ +25 C 20 3 0.5 0. 30 3 0.5 0.15 40 3 0.5 0.20 45 3 0.5 0.30 Features
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YM DUAL COMPLEMENTARY PRE-BIASED TRANSISTORS Features Ultra-Small Surface Mount Package Surface Mount Package Suited for Automated Assembly Simplifies Circuit Design and Reduces Board Space Totally Lead-Free
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Description Pin Assignments The is a single 2-input positive NAND gate with a standard totem pole output. The device is designed for operation with a power supply range of 1.4V to 5.5V. The inputs are
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Description The is a step-down DC/DC converter designed to drive LEDs with a constant current. The device can drive up to thirteen LEDs, depending on the forward voltage of the LEDs, in series from a voltage
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Description The ZXCT117/9/1 are high side unipolar current sense monitors. These devices eliminate the need to disrupt the ground plane when sensing a load current. The wide common-mode input voltage range
More informationFeatures. Part Number Marking Reel Size (inches) Tape Width (mm) Quantity Per Reel DGD2101MS8-13 DGD ,500
HIGH-SIDE AND LOW-SIDE GATE DRIVER IN SO-8 (Type TH) Description The is a high-voltage / high-speed gate driver capable of driving N-Channel MOSFETs and IGBTs in a high-side/low-side configuration. High-voltage
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1A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER Product Summary V RRM (V) I O (A) V F(MAX) (V) @ +25 C I R(MAX) (µa) @ +25 C 80 1 0.80 5 Description and Applications Features and Benefits Low Forward Voltage
More informationFeatures. Product Marking Reel Size (inch) Tape Width (mm) Quantity per Reel DGD2103MS8-13 DGD2103M ,500
HALF-BRIDGE GATE DRIVER IN SO-8 Description The is a high-voltage / high-speed gate driver capable of driving N-channel MOSFETs and IGBTs in a half-bridge configuration. High voltage processing techniques
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.V/.V, High Bandwidth, Hot Insertion,-Bit, -Port Bus Switch with Individual Enables Features Near-Zero propagation delay -ohm switches connect inputs to outputs High Bandwidth (>00 MHz) Rail-to-Rail, or.v
More informationGreen SMC. Top View Bottom View. Part Number Case Packaging B5XXCE-13 SMC 3,000/Tape & Reel
Green 5.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER Product Summary B520CE/B530CE/B540CE V RRM (V) I O (A) V F Max (V) I R Max (ma) 20 5.0 0.55 0.2 30 5.0 0.55 0.2 40 5.0 0.55 0.2 Features and Benefits
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Description Pin Assignments is a low dropout positive fixed-mode regulator with A output current capability. The product is specifically designed to provide well-regulated supply for low voltage IC applications
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Green 3A TRENCH SCHOTTKY BARRIER RECTIFIER SMA Product Summary (@ T A = +25 C ) V RRM (V) I O (A) V F(MAX) (mv) I R(MAX) (µa) 45 3 480 280 Features and Benefits Low Leakage Current Soft, Fast Switching
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2.5V/3., High-Bandwidth, Hot-Insertion, 2-Bit, 2-Port Bus Switch w/ Individual Enables Features Near-Zero propagation delay 5Ω switches connect inputs to outputs High Bandwidth (>400 MHz) Rail-to-Rail,
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Description The combines a high-gain NPN transistor with a pre-biased NPN transistor to make a simple small footprint LED driver. 30V, ADJUSTABLE CURRENT SINK LINEAR LED DRIVER Pin Assignments The LED
More informationFeatures. Product Marking Reel Size (inches) Tape Width (mm) Quantity per Reel DGD21844S14-13 DGD ,500
HALF- BRIDGE GATE DRIVER IN SO-14 Description The is a high voltage / high speed gate driver capable of driving N-Channel MOSFETs and IGBTs in a half bridge configuration. High voltage processing techniques
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40 1A GATE DRIE SOT363 Description is a high-speed, non-inverting single gate driver for switching MOSFETs. It can transfer up to 1A peak source/sink current into the gate for effective charging and discharging
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Description Pin Assignments The is a single non-inverting buffer/bus driver with a 3-state output. The output enters a high impedance state when a LOW-level is applied to the output enable (OE) pin. The
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Features General Description LED driving current up to A High efficiency up to 92% Operating input voltage up to 48V High switching frequency up to 500kHz PWM/DC input for dimming control Built-in output
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Green 6V 7 C N-CHANNEL ENHANCEMENT MODE MOSFET Product Summary BV DSS 6V R DS(ON) max 23mΩ @ V GS = V 28mΩ @ V GS = 4.V Description and Applications I D max T C = +2 C A 4A This MOSFET is designed to meet
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Features General Description Bipolar Hall Effect Latch Sensor 3.5V to 20V DC Operation Voltage Open Collector Pre-Driver 50mA Output Sink Current Chip Power Reverse-Connection Protection Operating Temperature:
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