C3D30065D Silicon Carbide Schottky Diode Z-Rec Rectifier
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1 C3D365D Silicon Carbide Schottky Diode Z-Rec Rectifier Features 65 Volt Schottky Rectifier Zero Reverse Recovery Current Zero Forward Recovery Voltage High-Frequency Operation Temperature-Independent Switching Behavior Extremely Fast Switching Positive Temperature Coefficient on V F Benefits Replace Bipolar with Unipolar Rectifiers Essentially No Switching Losses Higher Efficiency Reduction of Heat Sink Requirements Parallel Devices Without Thermal Runaway Package TO RM = 65 V ( =135 C) = 36 ** Q c = 89 nc ** pplications Switch Mode Power Supplies (SMPS) Boost diodes in PFC or DC/DC stages Free Wheeling Diodes in Inverter stages C/DC converters Part Number Package Marking C3D365D TO C3D365 Maximum Ratings (=25 C unless otherwise specified) Symbol Parameter Value Test Conditions Note RM Repetitive Peak Reverse Voltage 65 V SM Surge Peak Reverse Voltage 65 V V DC DC Blocking Voltage 65 V Continuous Forward Current (Per Leg/Device) 39/78 18/36 15/3 =25 C =135 C =145 C Fig. 3 RM Repetitive Peak Forward Surge Current 66* 46* =1 ms, Half Sine Pulse -11 C, t P =1 ms, Half Sine Pulse SM Non-Repetitive Peak Forward Surge Current =1 ms, Half Sine Pulse =11 C, t P =1 ms, Half Sine Pulse Fig. 8,Max Non-Repetitive Peak Forward Current =1 ms, Pulse =11 C, t P =1 ms, Pulse Fig. 8 P tot Power Dissipation(Per Leg/Device) W =25 C =11 C Fig. 4 dv/dt Diode dv/dt ruggedness 2 V/ns =-6V i 2 dt i 2 t value 131* 112.5* 2 s =1 ms =11 C, t P =1 ms T J, T stg Operating Junction and Storage Temperature -55 to +175 C TO-247 Mounting Torque Nm lbf-in M3 Screw 6-32 Screw * Per Leg, ** Per Device 1 C3D365D Rev. -, 9-216
2 Electrical Characteristics (Per Leg) Symbol Parameter Typ. Max. Unit Test Conditions Note V F I R Forward Voltage Reverse Current Q C Total Capacitive Charge 44.5 nc C Total Capacitance V μ pf = 16 T J =25 C = 16 T J =175 C = 65 V T J =25 C = 65 V T J =175 C = 4 V, = 16 di/dt = 5 /μs T J = 25 C = V, T J = 25 C, f = 1 MHz = 2 V, T J = 25 C, f = 1 MHz = 4 V, T J = 25 C, f = 1 MHz Fig. 1 Fig. 2 Fig. 5 Fig. 6 E C Capacitance Stored Energy 6.2 μj = 4 V Fig. 7 Note:This is a majority carrier diode, so there is no reverse recovery charge. Thermal Characteristics Symbol Parameter Typ. Unit Note R θjc Thermal Resistance from Junction to Case * Per Leg, ** Per Device 1*.5** C/W Fig. 9 Typical Performance (Per Leg) 45 3 Fowa ard Current, I () F () T J = -55 C T J = 75 C T J = 125 C T J = 175 C Reverse Leaka age Current, I RR (u) I R (μ) T J = 175 C T J = 125 C T J = 75 C T J = -55 C Foward VVoltage, F (V) V F (V) (V) (V) Figure 1. Forward Characteristics Figure 2. Reverse Characteristics 2 C3D365D Rev. -, 9-216
3 Typical Performance (Per Leg) (peak) () % Duty 2% Duty 3% Duty 5% Duty 7% Duty DC P Tot (W) C C Figure 3. Current Derating Figure 4. Power Derating Capacit tive Q Charge, C (nc) Q C (nc) Conditions: Ca apacitance C (pf) (pf) Conditions: F test = 1 MHz V test = 25 mv (V) (V) (V) (V) Figure 5. Total Capacitance Charge vs. Reverse Voltage Figure 6. Capacitance vs. Reverse Voltage 3 C3D365D Rev. -, 9-216
4 Typical Performance (Per Leg) , Capacitance Sto ored E Energy, E C (µj) C (mj) (V) (V) SM FSM () 1 T J_initial = 25 C T J_initial = 11 C 1 1E-6 1E-6 1E-3 1E-3 t p (s) Time, t p (s) Figure 7. Capacitance Stored Energy Figure 8. Non-repetitive peak forward surge current versus pulse duration (sinusoidal waveform) 1 Thermal Resistance ( C/W) 1E-3 1E SinglePulse 1E-3 1E-6 1E-6 1E-6 1E-3 1E-3 1E-3 1 T (Sec) Figure 9. Transient Thermal Impedance 4 C3D365D Rev. -, 9-216
5 Package Dimensions Package TO e Recommended Solder Pad Layout Inches Millimeters POS Min Max Min Max b b b c D D D E E E E E e.214 BSC 5.44 BSC L L N 3 ØP Q S T W X 17.5 REF 3.5 REF 4 REF PRELIMINRY Part Number Package Marking C3D365D TO C3D365 TO all units are in inches Note: Recommended soldering profiles can be found in the applications note here: 5 C3D365D Rev. -, 9-216
6 Diode Model (Per Leg) Vf T = V T + If * R T V T =.94 + (T J * -1.*1-3 ) R T =.27 + (T J * 2.8*1-4 ) Notes Note: T V T R j = Diode Junction Temperature In Degrees Celsius, T valid from 25 C to 175 C RoHS Compliance The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 211/65/EC (RoHS2), as implemented January 2, 213. RoHS Declarations for this product can be obtained from your Wolfpseed representative or from the Product Ecology section of our website at RECh Compliance RECh substances of high concern (SVHCs) information is available for this product. Since the European Chemical gency (ECH) has published notice of their intent to frequently revise the SVHC listing for the foreseeable future,please contact a Cree representative to insure you get the most up-to-date RECh SVHC Declaration. RECh banned substance information (RECh rticle 67) is also available upon request. PRELIMINRY This product has not been designed or tested for use in, and is not intended for use in, applications implanted into the human body nor in applications in which failure of the product could lead to death, personal injury or property damage, including but not limited to equipment used in the operation of nuclear facilities, life-support machines, cardiac defibrillators or similar emergency medical equipment, aircraft navigation or communication or control systems, or air traffic control systems. Related Links Cree SiC Schottky diode portfolio: Schottky diode Spice models: SiC MOSFET and diode reference designs: Copyright 216 Cree, Inc. ll rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo, and Zero Recovery are registered trademarks of Cree, Inc. Cree, Inc. 46 Silicon Drive Durham, NC 2773 US Tel: Fax: C3D365D Rev. -, 9-216
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