HMC599ST89 / 599ST89E. Features. The HMC599ST89(E) is ideal for: = +25 C MHz. Gain Variation Over Temperature MHz 0.

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1 HMCST / STE Typical Applications v2.3 GaAs phemt MMIC LNA, Ohm - 1 MHz Features The HMCST(E) is ideal for: High P1 Output Power: +1 m VHF / UHF Antennas HDTV Receivers CMTS Equipment CATV, Cable Modem & DBS Functional Diagram High Output IP3: +3 m Low Noise Figure: 2.2 Cascadable Ohm I/Os Single Bias Supply: +3V or +V Industry Standard SOT Package General Description The HMCST(E) is a GaAs PHemT High Linearity, Low Noise Gain Block mmic smt amplifier covering to 1 MHz. Packaged in an industry standard sot, the amplifier can be used as a cascadable Ohm rf or if gain stage as well as a PA or lo driver with up to +1 m output power. The HMCST(E) offers of gain with a +3 m output ip3 at 2 MHz, and can operate directly from a +3V or +V supply. The HMCST(E) exhibits excellent gain and output power stability over temperature, while requiring a minimal number of external bias components. Electrical Specifications, Vdd = V, T A = +2 C Gain Parameter Min. Typ. Max. Units - MHz - 1 MHz Gain Variation Over Temperature - 1 MHz. / C Input Return Loss Output Return Loss - MHz - 1 MHz - MHz - 1 MHz Reverse Isolation - 1 MHz 2 Output Power for 1 Compression (P1) - MHz 1 m Output Third Order Intercept (ip3) (Pout= -1 m per tone, 1 MHz spacing) - MHz - 1 MHz Noise Figure - 1 MHz 2.2 Supply Current (Idd) 1 ma m m - 1 For price, delivery and to place orders: Hittite Microwave Corporation, 2 Alpha Road, Chelmsford, MA 12 Phone: -333 Fax: -333 Order On-line at Application Support: Phone: -333 or apps@hittite.com

2 Broadband Gain & Return 3V RESPONSE () S21 S S22 Gain vs. 3V GAIN () v HMCST / STE GaAs phemt MMIC LNA, Ohm - 1 MHz Broadband Gain & Return V RESPONSE () Gain vs. V GAIN () S21 S S Input Return Loss vs. 3V Input Return Loss vs. V RETURN LOSS () RETURN LOSS () For price, delivery and to place orders: Hittite Microwave Corporation, 2 Alpha Road, Chelmsford, MA 12 Phone: -333 Fax: -333 Order On-line at Application Support: Phone: -333 or apps@hittite.com - 2

3 v2.3 Output Return Loss vs. 3V RETURN LOSS () Reverse Isolation vs. 3V REVERSE ISOLATION () HMCST / STE GaAs phemt MMIC LNA, Ohm - 1 MHz Output Return Loss vs. V RETURN LOSS () Reverse Isolation vs. V REVERSE ISOLATION () Noise Figure vs. 3V NOISE FIGURE () FREQUENCY (MHz) Noise Figure vs. V NOISE FIGURE () FREQUENCY (MHz) - 3 For price, delivery and to place orders: Hittite Microwave Corporation, 2 Alpha Road, Chelmsford, MA 12 Phone: -333 Fax: -333 Order On-line at Application Support: Phone: -333 or apps@hittite.com

4 IP3 vs. 3V IP3 (m) P1 vs. 3V P1 (m) v2.3 HMCST / STE GaAs phemt MMIC LNA, Ohm - 1 MHz IP3 vs. V IP3 (m) P1 vs. V P1 (m) Psat vs. 3V Psat (m) 1 Psat vs. V Psat (m) For price, delivery and to place orders: Hittite Microwave Corporation, 2 Alpha Road, Chelmsford, MA 12 Phone: -333 Fax: -333 Order On-line at Application Support: Phone: -333 or apps@hittite.com -

5 Gain vs. Supply Voltage GAIN () V 3.V.V.V.V v2.3 IP3 (m) HMCST / STE GaAs phemt MMIC LNA, Ohm - 1 MHz NOISE FIGURE() 1 IP3 vs. Supply Voltage Noise Figure vs. Supply Voltage V 3.V.V.V.V FREQUENCY (MHz) 2 2.V 3.V.V.V.V P1 vs. Supply Voltage 2 Psat vs. Supply Voltage P1 (m) P1 (m) 2.V 3.V.V.V.V 2.V 3.V.V.V.V - For price, delivery and to place orders: Hittite Microwave Corporation, 2 Alpha Road, Chelmsford, MA 12 Phone: -333 Fax: -333 Order On-line at Application Support: Phone: -333 or apps@hittite.com

6 Absolute Maximum Ratings v2.3 HMCST / STE GaAs phemt MMIC LNA, Ohm - 1 MHz Typical Supply Current vs. Vdd Drain Bias Voltage (Vdd) RF Input Power (RFIN) Outline Drawing + Vdc +1 m Channel Temperature C Continuous Pdiss (T = C) (derate. mw/ C above C) Thermal Resistance (junction to ground paddle). W. C/W Storage Temperature - to + C Operating Temperature - to + C Vdd (Vdc) Idd (ma) + +3 ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS NOTES: 1. PACKAGE BODY MATERIAL: MOLDING COMPOUND MP-1S OR EQUIVALENT. 2. LEAD MATERIAL: Cu w/ Ag SPOT PLATING. 3. LEAD PLATING: 1% MATTE TIN.. DIMENSIONS ARE IN INCHES [MILLIMETERS]. DIMENSION DOES NOT INCLUDE MOLDFLASH OF. mm PER SIDE.. DIMENSION DOES NOT INCLUDE MOLDFLASH OF.2 mm PER SIDE.. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND. Package Information Part Number Package Body Material Lead Finish msl Rating Package Marking [3] [1] H HMCST Low Stress Injection Molded Plastic Sn/Pb Solder msl1 XXXX [2] H HMCSTE RoHS-compliant Low Stress Injection Molded Plastic 1% matte Sn msl1 XXXX [1] Max peak reflow temperature of 23 C [2] Max peak reflow temperature of 2 C [3] -Digit lot number XXXX For price, delivery and to place orders: Hittite Microwave Corporation, 2 Alpha Road, Chelmsford, MA 12 Phone: -333 Fax: -333 Order On-line at Application Support: Phone: -333 or apps@hittite.com -

7 HMCST / STE Pin Descriptions v2.3 GaAs phemt MMIC LNA, Ohm - 1 MHz Pin Number Function Description Interface Schematic 1 IN Application Circuit This pin is DC coupled. See the application circuit for off-chip components 3 OUT RF output and DC Bias (Vdd) for the output stage. 2, GND These pins and package bottom must be connected to RF/DC ground. - For price, delivery and to place orders: Hittite Microwave Corporation, 2 Alpha Road, Chelmsford, MA 12 Phone: -333 Fax: -333 Order On-line at Application Support: Phone: -333 or apps@hittite.com

8 HMCST / STE Evaluation PCB v2.3 GaAs phemt MMIC LNA, Ohm - 1 MHz List of Materials for Evaluation PCB [1] Item J1 - J2 J3 Description PCB Mount Ohm Connector DC Pin C1, C3 1 pf Capacitor, 3 Pkg. C2 C C C L1 3 pf Capacitor, 3 Pkg. 2.2 µf Capacitor, Tantalum 1 KpF Capacitor, 2 Pkg.. pf Capacitor, 2 Pkg.. μh Inductor, 1 Pkg. L2, L3 2.2 nh Inductor, 3 Pkg. R1 U1 PCB [2] Ohm Resistor, 2 Pkg. HMCST / HMCSTE Evaluation PCB [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 3 [3] Evaluation board tuned for MHz operation The circuit board used in the application should use rf circuit design techniques. Signal lines should have Ohm impedance while the package ground leads and package bottom should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation board should be mounted to an appropriate heat sink. The evaluation circuit board shown is available from Hittite upon request. For price, delivery and to place orders: Hittite Microwave Corporation, 2 Alpha Road, Chelmsford, MA 12 Phone: -333 Fax: -333 Order On-line at Application Support: Phone: -333 or apps@hittite.com -

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