ECSE 6300 IC Fabrication Laboratory Lecture 10 Device Characterization. Die Image
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1 ECSE 6300 IC Fabrication Laboratory Lecture 10 Device Characterization Prof. Bldg. CII, Rooms 6229 Rensselaer Polytechnic Institute Troy, NY Tel. (518) s: /index.html 10-1 Die Image = Rectangular FETs = Circular Geometry FETs = Capacitors = Resistance Macros = Alignment and CD Structures Test Structures: C=Capacitors R=Resistors VdP=Van de Pauw structures K=Kelvin TLM=Transmission Line Structures n + -Cap p-cap Cross Section ILD-Cap Al Contact ILD Oxide Field Oxide Source Gate Drain Gate Source Silicon Rectangular MOSFETs: W/L(µm) = 20/2, 40/4,100/10, 400/40, 600/60, 800/80,1000/100 Circular MOSFETs: L = 6, 10, 40, 60, 80, 100 µm 10-2
2 N Channel MOSFET Structures Source Gate Drain Poly Si Gate Oxide ILD n+ Channel n+ P Substrate SEM Cross-Section 10-3 MOSFET Characteristics Source Gate Drain (n-mosfet) ILD Poly Si n+ Channel n+ P Substrate C-V GS At I -V GS 10-4
3 MOSFET Characteristics Ideal MOSFET with Gradual Channel Approximation: I -V ln At low drain voltages (linear region): W I nscox ( VGS VT ) V L 2 At pinch off and beyond (saturation region): Current Source I W nsc 2L ox ( V GS V T 2 ) 10-5 MOSFET Characteristics Channel length modulation (after channel pinch off): 2 S L V V, sat qn A Channel length modulation parameter : 10-6
4 Basic Test Equipment Training Students need to know how to operate Wafer probing station (Never touch a wafer with bare hands!!) HP 4192 LCR Meter Keithley 4200 SCS Semiconductor Characterization, or System Sony/Tektronix 370A curve tracer, or HP 4145/4155 Parametric Analyzer 10-7 Probe Station & e Testing Karl Suss Probe Station Keithley 4200 SCS 10-8
5 e Testing using Probe Station Circular 60μm MOSFET Linear 2μm MOSFET Linear 40 μm MOSFET Sheet resistance testing Contact Resistance Van Der Pauw Technique Kelvin Contact Resistance Transmission Line structure 10-9 Keithley 4200 SCS Semiconductor Characterization System I V (sat) V GS I V GS V V T 10-10
6 HP 4192 LCR Meter Basic TEG Testing Determine the sheet resistance, R S, of n+ source by measuring Van de Pauw structures Measure specific contact resistance, R c, of Kelvin or transmission line structures to determine the adequacy of metal contacts to n+ source/drain regions Measure C V on MOS capacitors or FETs to determine oxide thickness, t ox, and flatband, V FB, and/or threshold voltage, V T 10-12
7 Basic MOSFET Testing Check for Gate to Source/Drain shorts Determine threshold voltage, V T Gate voltage at which I = 0 and V = 0.1V Interpolate it from the I vs. V GS curve (Why?) Measure transconductance (g m ) and hence fieldeffect mobility ( FE ): g m I V GS V In the linear region: Measure g m and FE in the saturation region g m FE ( W / L) m g / C ( W / L) V ox FE C ox V MOSFET Testing Measure ON resistance (R on ) I Ron VGS 5V V at V = V Measure breakdown voltage (BV S ) Drain voltage (with the gate grounded) at which I increases rapidly, typical I (max) = 10A Assess the effect of substrate bias on V T Determine the channel length modulation parameter Measure the subthreshold region parameters (e.g., subthrehold swing S) 10-14
8 MOSFET Testing Measure various capacitances Gate capacitances (C GSS, C GSO, C G, C GDO ) Measure switching characteristics Turn on and turn off times (t ON, t OFF ) Gate charge during turn on and turn off Determine the dependence of basic device parameters on temperature Data Analysis Assess threshold voltage value on processing and material parameters (e.g., gate oxide thickness, substrate doping) Determine the dependence of static performance data (g m, BV) on device design (channel length, circular vs. linear geometry) Determine the dependence of dynamic performance data (t on, t off, C GXX s) on device design (channel length, circular vs. linear geometry) Compare with your simulation wherever possible 10-16
9 Guidelines for IC FabLab Report Cover with group names and responsibility Acknowledgement Abstract Chapter 1: Technical Background Introduction Device Physics Process Considerations Basic MOSFET Processing Processing & Device Modeling TSUPREM, MEDICI, Sentaurus Device Characteristics & Testing Techniques Chapter 2: Processing Procedures Detailed process flows with comments/suggestions Inspection results with photos Chapter 3: Electrical Test Results and Discussions I V, C V, Device variations, etc., with tables/plots Chapter 4: Summary & Conclusions References & Appendix Guidelines for IC FabLab Final Report Data: Statistics: accuracy, standard variation (), system errors Analysis: comparison between theory and experimental results and between different devices; Interpretation: theoretical understanding and explanation, linking to the processing and simulation Presentations: Schematics (introduction, processing, testing) Plots (Figures): right data groups and clear labels Tables: process steps, critical data and comparison Equations to show relationships Images: devices, blocks, cross sections, wafer, tools, test conditions, people, etc. Components: Structures: Abstract/Summary/Conclusion, Introductions, Processing, Testing, Acknowledgement and References Clear responsibility of each team member: writing, simulation, processing, testing and analysis 10-18
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