Substrate Integrated Circuits (SICs) and Systems for RF and Millimeter-wave Applications Ke Wu

Transcription

1 Substrate Integrated Circuits (SICs) and Systems for RF and Millimeter-wave Applications Ke Wu Canada Research Chair in Radio-Frequency and Millimetre-Wave Engineering Poly-Grames Research Center Center for Radio-Frequency Electronics Research (CRÉER) of Quebec Department of Electrical Engineering Ecole Polytechnique (University of Montreal), Canada

2 OUTLINE Introduction Drawbacks of standard planar transmission line technologies Need for compact, low-loss, low-cost integrated waveguides and circuits Integration issues Substrate Integrated Circuits (SICs) and Systems Performance of substrate embedded waveguides Recent achievements in the field of substrate integrated circuits (SICs) System-on-Substrate (SoS) Concepts Future challenges and possibilities Conclusions 2

3 Introduction Drawbacks of current technologies Microstrip Coplanar Waveguide (CPW) EM field singularities cause high current densities in the conductor edges high conductor losses Semi-opened and/or unbounded planar circuits are subject to packaging problem and radiation losses high cross-talk and transmission losses 3

4 Performance gap at mmw frequencies Electrically large mmw components rely on low loss technology Gap between lossy planar waveguides and bulky metal waveguides needs to be closed. 4

5 Design Examples of Microstrip to Rectangular Waveguide Transition a) Probe Type b) Ridge Type 5

6 (a) (b) (c) (d) (e) (f) Synthesized Waveguides and Substrate Integrated Circuits (SICs) non-planar structure in planar form 6

7 Substrate Integrated Circuits (SICs) Complete integration of planar circuits (surface type) and non-planar circuits (volume type) on the same dielectric substrate and fabrication process Synthesized waveguides made of metallic fences and/or dielectric contrasts compatible with planar substrate (electrically, mechanically, and thermally) Potential hybrid and monolithic features such as planar multilayer, miniaturization, self-packaging, tunability, electro-optical control and conversation 7

8 Substrate Integrated Waveguide Early version of SIW filter 8

9 Substrate Integrated Non-Radiative Dielectric Waveguide SINRD LSM 11 mode (only half the structure is shown) Early SINRD filter (7 th order, without cover) 9

10 Substrate Integrated Image Guide Fundamental E y 11 mode (only half the structure is shown) Silicon SIIG prototype 10

11 Interfacing / Transitions a r p l S w S y x z b w Microstrip SIW Courant electrique Champ magnetique Waveguide SIIG CPW SIW CPW SIIG 11

12 In-Line Four-Pole Dual-Mode Filter 12

13 Substrate Integrated Waveguide Antennas λ g /2 3λ g /4 a e slotted antenna l f o f leaky-wave antenna Ondes de fuite 13

14 Integrated SIW antenna/feeder module Antipodal Linearly Tapered Slot Antenna (ALTSA) 1 x 16 SIW-ALTSA field profile 1x 8 SIW-ALTSA photo Measured radiation pattern of 1x 8 SIW- ALTSA at 10 GHz with 18.76dBi gain 14

15 Substrate Integrated Waveguide Directional Couplers Weff Weff L1 Ls La Ws L2 L2 L (a) (b) 15

16 Substrate Integrated Waveguide Oscillator L b ATF36077 AMPLIFIER P_OSC Wp Gc W Lx Lp W c P_INJ SIW CAVITY P_B PHASE STUBS 90Ω P_A JP1 JP2 LOOP LENGTH 16

17 Integrated FMCW Radar System on Substrate (SoS) 17

18 Synthesized or Substrate Integrated NRD-Guide ε R ε R1 ε R εr1 ε R Air Holes Standard NRD Guide Generalized NRD Guide Substrate Integrated NRD Guide 18

19 94 GHz 3 rd Order Alumina SINRD Guide Filter S1 S2 S1 Wt L1 L2 L2 L1 L1 = 0.180mm, L2 = 0.449mm S1 = 1.082mm, S2 = 1.118mm, Wt = 0.737mm 19

20 Simulated and Measured Results 5 0 S 11 (sim) S 21 (sim) S 11 (mea) S 21 (mea) db GHz 20

21 System-on-Substrate (SoS) Concepts Advanced Technological Features Nano-structured zero loss and agile/tunable substrates Traveling-wave electro-optical devices Mixed integration of different waveguides on substrate High-density multilayer integration Monolithic integration of passive and active circuits on substrate including antennas (Sub)millimeter-wave VLSI (very-large scale integration) Terahertz electronics and photonics Bridging the gap between electronic and optical systems 21

22 Complementary Modal Field Profiles E field E field a) b) 22

23 Other Examples of Multi-port SICs SIW cruciform directional coupler or cross-over W-band multi-port receiver circuit Substrate integrated waveguide circulator 23

24 24/77 GHz dual band antenna system (b) GHz think-film SIW band-pass filter (Prof. Ian Robertson, University of Leeds, UK) Traveling-wave photodetector and modulator 24

25 Substrate Integrated Folded Waveguide (SIFW) (from Dr. Paul R. Young, University of Kent, UK) a a/2 3 layer a/3 a/4 4 layer 25

26 SIW and Half-Mode SIW (HMSIW) Structures HMSIW Evolution of HMSIW from SIW SIW Dominant modes in HMSIW and SIW 26

27 SIIG W-band Antennas 94-GHz SIIG planar Dielectric rod antenna 94-GHz SIIG array antenna 27

28 Substrate Integrate Circuits (SICs) Combining planar and synthesized non-planar guiding structures Example of a substrate integrated circuit 28

29 Conclusions Substrate integrated circuits (SICs) for low-cost/high-density RF/millimeterwave/terahertz and photonic wireless ICs and system applications Hybrid design platforms such as planar-substrate integrated waveguide (SIW) & planar-substrate integrated dielectric guides Potential monolithic SICs with semiconductor and/or smart substrate towards System-on-Substrate (SoS) approach for future millimeter-wave and photonic wireless applications Bridging the technological gap between electronics and photonics for GHz and THz innovations and discoveries 29

30 Acknowledgements Many year contributions by the speaker s students and research fellows as well as technical support of technologists at the Poly-Grames Research Center have made this presentation possible The speaker is grateful to Canadian NSERC (Natural Sciences and Engineering Research Council) and Quebecois funding agency (FQRNT) for their financial support through multiple grants Worldwide collaborators including Prof. Wei Hong and his team at Southeast University (China), Prof. Maurizio Bozzi and his colleagues at University of Pavia (Italy) and others have made contributions to this presentation 30