0.65A High-e. Fully Step-d. efficiency. down (1.25V BZ6A7D06. Description. Features. Applications. spec. ver.0.1. Target 1/12. etc.

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1 One Package Regulator Series 0.65A Output, High-e efficiency Fully Integrated, Step-d down Switching Power Supp ly Module (1.25V Fix type) BZ6A7D06 GM No.11xxxEATxx Description BZ6A7D06GM is a fully integrated power supply module that is useful for shortening the product at the design period and shortening the product launch time for electronics product, communication of portable it, and various applications industrial etc. The BZ6A7D06GM is based on a highh efficiency 6MHz synchronous step-down switching regulator with ultra low current PFM mode. It provides up to 650mA load current and an input voltage range from 2.3V to 5..5V, optimized for battery powered portable applications. BZ6A7D06GM has a mode control pin that allows thee user to select Forced PWM(Pulse Widthh Modulation) )mode or PFM(Pulse Frequency Modulation) and PWM auto change mode utilized power save operation at light load current. Features 1) No External components required SMPS 2) Over 80% peak efficiency 3) High speed 6MHz switching frequency 4) Wide input voltage VIN=2.3V to 5.5V 5) Fixed output voltage 1.25V 6) 45uA typical quiescent current 6) Fast transient response 7) Automatic PFM/PWM operation (CTL=L)( 8) Forced PWM operation (CTL=H) 9) 120us Quick Start(EN=H ) 10) Under voltage lockout 11) Over current protection 12) Thermal shutdown 13) Low radiated emissions (EMI) 14) Low Profile Solution (t=1.0mm Max) 15) Ultra small and low profile package (2.9mm 2.3mm ) BZ6A7D06GM Photograph L : PWM/PFM MODE H : PWM MODE MODE TSD UVLO PWM/PFM control Cin VIN 2.3 ~5.5V Applications Smart Phones, Cell phones, RF applications, Portable applications, POL applications and USB Line Application(5V) FB VOUT VREF - + ERROR COMP Switching Control Logic and Gate Driver L Co VOUT EN H : ON L : OFF SHUTDOWN Frequency control GND Figure 1. Typical Application 1/12

2 Absolute maximum ratings Parameter Symbol Rating Unit Maximum input power supply voltage VIN 7 V Power dissipation Pd 0.75(*1) W Operating temperature range Topr -40 ~ +85 Storage temperature range Tstg -50 ~ +125 Junction temperature Tjmax +125 (*1) When used as a stand-alone IC (for Ta=25 and over),the value is reduced by 7.6mW/ Recommended Operating range Parameter Symbol Rating Unit Input Voltage VIN 2.3 to 5.5 V Output Current IOUT 0 to 650 ma Electrical Specifications Item Switching regulator part Symbol TA = 25 C, VIN = 3.6V, unless otherwise noted. Rating Unit Condition Min. Typ. Max. Output voltage VOUT V MODE:H Soft start part Soft start time Tss usec Driver part PchFET on resistance RonP mω NchFET on resistance RonN mω Control pin part EN pin control voltage MODE pin control voltage UVLO Operation VENH VIN V Non Operation VENL V Operation VMODEH VIN V Forced PWM Non Operation VMODEL V Automatic PFM/PWM Protect threshold voltage Uvth V Hysteresis Uvhy mv Circuit current Operating quiescent current IINS ua EN:3.6V, MODE:L, Shutdown current SHD ua EN=0V No design for durability against radiation 2/12

3 Z6A7D06GM aracteristic curves (Reference data) EN 2V/div 20us VOUT 500mV/div 100us Fig.2 Start up Fig.3 Shut down 50mV/div 1.2V offset 4us 10us IOUT I 200mA/div g.4 Load transient responsee 5mA to 200mA tr=tf= =100ns, Mode :Low Fig.5 Load transient response 50mA to 350mA tr=tf=100ns, Mode :Low ww.rohm.com 2011 ROHM Co., Ltd. All rights reserved. 3/12

4 50mV/div ac coupled 20mV/div ac coupled 2us 2us Iout I 100mA/div Iout 100mA/div Fig.6 PFM/PWM Auto mode Iout=50mA Fig.7 PWM mode Iout= =50mA 50mV/div ac coupled 20mV/div ac coupled Iout 100mA/div 2us Iout 100mA/div 2us Fig.8 PFM/PWMM Auto mode Iout=100mA Fig.9 PWMM mode Iout=100mA 50mV/div ac coupled 20mV/div ac coupled Iout 100mA/div Iout 100mA/div 2us 2us Fig.10 PFM/PWM Auto mode Iout=200mA Fig.11 PWM mode Iout= =200mA 4/12

5 10us MODE 2V/div 10us MODE 2V/div 50mV/div ac coupled 50mV/ /div ac coupled Fig.12 Mode Change Response MODE Low to High Fig.13 Mode Change Response MODE High to Low Fig.14 Load regulation PWM mode Fig.15 Efficiency vs Load current PWM Mode Fig.16 Load regulation PWM/PFM Auto mode Fig.17 Efficiency vs Load current PWM/PFM Auto Mode 5/12

6 Block diagram MODE L : H : PWM/PFM MODE PWM MODE TSD UVLO PWM/PFM control Cin VIN 2.3 ~5.5V FB VOUT - + ERROR COMP Switching Control Logic and Gate Driver L Co VOUT VREF H : L : ON OFF EN SHUTDOWN Frequency control GND Cin:C1005X5R0J225M Co:C1005X5R0J475M L :MLP2012V1R0M External dimensions/pin layout Pin layout (TOP VIEW) Pin layout (BOTTOM VIEW) Coil (Unit:mm ) (Unit:mm ) Cin Co C3 0.3 C2 B2 C1 B1 0.8 A3 0.3 A2 B2 A1 B1 0.8 A1 pin INDEX MARK A3 1.0 A2 A1 A1 pin C3 1.0 C2 C1 Pin number/name/functions Number Symbol Name Function 1 A1 VOUT Output pin(1.25v) 2 A2 VIN Power supply input pin 3 A3 VIN Power supply input pin 4 B1 MODE Forced PWM mode pin. 5 B2 EN Enable pin. 6 C1 GND GND pin 7 C2 GND GND pin 8 C3 GND GND pin 6/12

7 Footprint dimensions (Optimize footprint dimensions to the board design and soldering condition) External dimensions 7/12

8 Functional descriptions The BZ6A7D06GM is a synchronous step-down DC/DC converter that achieves fast transient response from light load to heavy load by hysteretic PWM control system and current constant PFM control system. PWM control BZ6A7D06GM operates by hysteretic PWM control. This scheme ensures fast switching, high efficiency, and fast transient response. When the output voltage is below the VREF voltage, the error comparator output is low to high and turning on P-channel MOSFET until above the VREF voltage and minimum on time. PFM control At light load the regulator and MODE=low, the regulator operates with reduced switching frequency and improves the efficiency. During PFM operation, the output voltage slightly higher than typical output voltage. output PWM mode voltage PFM (constant current)threshold. turn off Pch FET PFM Threshold. turn on PFET PFM Mode at Light Load PWM Mode at Moderate to Heavy Loads Fig18. Operation of PFM mode and PWM mode 8/12

9 Description of operations 1) Shutdown If the EN input pin set to low (<0.4V), all circuit are shut down and the regulator is standby mode. Do not leave the EN pin floating. When EN pin input voltage is high and UVLO is not detected, BZ6A7D06GM starts operation. 2) Soft start function The regulator has a soft start circuit that reduces in-rush current at start-up. The startup time mainly depends on the load current and the capacitance present at the output node. Typical start up times with internal 4.7uF output capacitor is 100usec. 3) Current limit The BZ6A7D06GM has a current limit circuit that protects itself and external components during overload condition. 4) Under Voltage Lock Out (UVLO) The BZ6A7D06GM has a Under Voltage Lock Out circuit that turn off device when VIN>2.05V(typ.) 5) FORCED PWM MODE Setting MODE pin high (>1.4V) places the regulator in forced PWM. 6) TSD The BZ6A7D06GM has a thermal shutdown feature to protect the device if the junction temperature exceeds 150.In thermal shutdown, the DRIVER is disabled. 9/12

10 PC Board layout The suggested PCB layout for the BZ6A7D06GM is shown in Figure. The following guidelines g should be used to ensure a proper layout. 1) Because the input capacitor is included in BZ6A7D06GM, an external input capacitor is unnecessary. 2) From the output voltage to the FB pin line should be ass separate as possible. 3) Because the output capacitor is included in BZ6A7D06GM, an external output capacitor is unnecessary. Apply the external output capacitor when it is necessary to decreasee the amplitudee of ripples at a light load byy PFM mode. Pin layout (TOP VIEW) (Unit:mm( ) A1 pin Fig. Recommended Land Pattern. Fig a. PCB layout (Mount side) Fig b. PCB layout (solder side) Figg 19. PCB Circuit. 10/12

11 Caution of use 1) Absolute maximum ratings An excess in the absolute maximum rating, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2) GND voltage The potential of GND pin must be minimum potential in all condition. As an exception, the circuit design allows voltages up to -0.3 V to be applied to the IC pin. 3) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. 5) Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 6) Mutual impedance Power supply and ground wiring should reflect consideration of the need to lower mutual impedance and minimize ripple as much as possible (by making wiring as short and thick as possible or rejecting ripple by incorporating inductance and capacitance). 7) Thermal shutdown Circuit (TSD Circuit) This model IC has a built-in TSD circuit. This circuit is only to cut off the IC from thermal runaway, and has not been design to protect or guarantee the IC. Therefore, the user should not plan to activate this circuit with continued operation in mind. 8) Regarding input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, as shown in the figures below, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used. 11/12

12 Order device name selection B Z 6 A 7 D 0 6 G M - T R Part No. Part No. 6:6MHz A:A version 12:1.2V 15:1.5V 7D:1.25V 06:0..65A 10:1..0A 03:0..3A Package GM:BGA-MD Packaging and forming specification TR: Embossed tape and reel None: Tray, each 5-pin Leadless micro module package <Dimension> <Tape and Reel information> Tape Embossed carrier tape Quantity 9000pcs Direction TR of feed (The direction is the 1pin of product is at the upper right when youu hold reel on the left hand and you pull out the tapee on the right hand) 12/12