Announcements. Outline. Power Electronics Circuits. malfunctioning, for report. Experiment 1 Report Due Tuesday
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1 Power Electronics Circuits Prof. Daniel Costinett ECE 482 Lecture 3 January 26, 2017 Outline 1. Motor Back EMF Shape 2. Power Converter Layout 3. Loss Analysis and Design Low Frequency Conduction Losses Inductor AC Losses Core Losses Inductor Design Approaches Announcements Experiment 1 Report Due Tuesday Prelab 3 due Thursday All assignments turned in digitally By e mailing to Daniel.costinett@utk.edu Include [ECE 482] in the subject Parts kit purchased prior to Tuesday s class Capture waveforms, even if something is malfunctioning, for report PMSM vs BLDC BACK EMF SHAPE
2 Sinusoidal back EMF achieved with sinusoidal winding distribution Generally termed Permanent Magnet Synchronous Motor (PMSM) BLDC Motor Winding Shape of Back EMF PMSM Winding Brushless DC (BLDC) Motors are not wound sinusoidally This results in Trapezoidal back emf, rather than sinusoidal Can be driven simply with SquareͲwaves to achieve relatively low torque ripple Winding Voltage Equation Single Phase Motor (Simplified)
3 Complete winding of Phase A Stator Winding 56 pole 63 teeth Complete winding of all phases Traditional motors are innerͳrotor On eͳbike, need hub to remain stationary and outer wheel to spin OuterͲ vs. InnerͲRotor Rotor and Poles Outer rotor (to which spokes/wheel are attached) Magnets alternate NͲS Motor Teeth/Poles Example
4 Shape of Back EMF theta [deg] Normalized Coupled Flux [Tesla*coil] stator ABC 33 Teeth, 22 Poles Teeth/Pole/Phase = 0.5 rotor S N theta [deg] Normalized Coupled Flux [Tesla*coil] Simulation of BLDC and PMSM 15 Shape of Back EMF 36 Teeth, 22 Poles Teeth/Pole/Phase = stator ABC rotor S N Experiment 3
5 Boost Design Design Assessment POWER CONVERTER LAYOUT
6 Power Converter Layout: Buck Example Parasitic Wire Inductances Loop Minimization Effect of Loop Inductance L loop = 1.6nH D Reusch, Optimizing PCB Layout L loop = 0.4nH
7 Half Bridge Gate Drive Waveforms Gate driver chip must implement v gs waveforms Sources will have pulsating currents and need decoupling Driving a Power MOSFET Switch PWM Pulses from controller/ Fcn Generator Gate Drain Source MOSFET gate driver is used as a logic buffer with high output current (~1.8 A) capability The amplitude of the gate voltage equals the supply voltage VCC Decoupling capacitors are necessary at all supply pins of LM5104 (and all ICs) Gate resistance used to slow dv/dt at switch node Driving a Power MOSFET Switch MOSFET is off when v gs < V th 3 V MOSFET fully on when v gs is sufficiently large (10 15 V) ~100 Warning: MOSFET gate oxide breaks down and the device fails when v gs > 20 V. 8 2 Fast turn on or turn off (10 s of ns) requires a large spike (1 2 A) of gate current to charge or discharge the gate capacitance MOSFET gate driver is a logic buffer that has high output current capability Gate Drive Implementation Gate driver is cascades back half bridges of decreasing size to obtain quick rise times Reminder: keep loops which handle pulsating current small by decoupling and making close connections
8 Decoupling Always add bypass capacitor at power supply for any IC/reference Use small valued (~100nf), low ESR and ESL capacitors (ceramic) Limit loop for any di/dt Gate Drive Losses Gate charge is supplied through driver resistance during switch turn on Gate charge is dissipated in gate driver on switch turn off Capacitor Sizing Notes Area of current pulse is total charge supplied to gate of capacitor All charge must be supplied from gate drive decoupling capacitor High Side Signal Ground Gate driver chip must implement v gs waveforms Issue: source of Q 2 is not grounded
9 Generating Floating Supply A Note on Grounding Isolated supplies sometimes used; Isolated DC DC, batteries Bootstrap concept: capacitor can be charged when V s is low, then switched UCC27211a Internal Diagram Fairchild Semi App Note AN 6076
10 Parasitics to be Aware of Power Loop Inductances Persson E., What really limits MOSFET performance: silicon, package, driver or circuit board? Complete Routing of Signal Star Grounding Vs. Daisy Chain Always consider return path Ground plane can help, but still need to consider the path and optimize
11 Another View Kester, W. Tips about printed circuit board design: Part 1 Dealing with harmful PCB effects Efficiency Measurement Boost Converter Kelvin Connection POWER CONVERTER DESIGN AND LOSS ANALYSIS
12 Converter Design Design Specifications Analytical Model Loss Model Thermal Model Performance Specification MOSFET Selection Cost Model. Inductor Design Switching Frequency Design Assessment Additional Resources Additional lectures in ECE /schedule.php Accessible only from campus network Switching Overlap Loss L4 L5 Device Capacitances L6 L7 Magnetics Losses L19(2 nd half) and L20 Analytical Loss Modeling High efficiency approximation is acceptable for hand calculations, as long as it is justified Solve ideal waveforms of lossless converter, then calculate losses Argue which losses need to be included, and which may be neglected Rough approximation to gain insight into significance Boost Converter Loss Analysis Begin by solving important waveforms throughout converter assuming lossless operation
13 Power Stage Losses Low Frequency Losses MOSFETS Body Diodes Inductor Capacitors R on V F R dc ESR R d Frequency Dependent Losses C oss Overlap P g T d cond. C d Reverse Recovery Skin Effect Core Loss Fringing Proximity Dielectric Losses MOSFET Equivalent Circuit Considering only power stage losses (gate drive neglected) MOSFET operated as power switch Intrinsic body diode behaviors considered using normal diode analysis LOW FREQUENCY CONDUCTION LOSSES MOSFET On Resistance On resistance extracted from datasheet waveforms Significantly dependent on V gs amplitude, temperature
14 Boost Converter RMS Currents MOSFET conduction losses due to (r ds ) on depend given as Capacitor Loss Model Operation well below resonance All loss mechanisms in a capacitor are generally lumped into an empirical loss model Equivalent Series Resistance (ESR) is highly frequency dependent Datasheets may give effective impedance at a frequency, or loss factor: MOSFET Conduction Losses RMS values of commonly observed waveforms appendix from Power Book DC Inductor Resistance DC Resistance given by At room temp, = cm At 100 C, = cm Losses due to DC current:
15 Inductor Conduction Losses Conduction losses dependent on RMS current through inductor Switching Loss Modeling V gs1 t V sw t 59 Switching Loss Types of Switching Loss 1. Gate Charge Loss 2. Overlap Loss 3. Capacitive Loss 4. Body Diode Conduction 5. Reverse Recovery 6. Parasitic Inductive Losses 7. Anomalous Losses V gs2 t
16 Gate Charge Loss P Q V g g cc f s Lump Switched Node Capacitance Consider a single equivalent capacitor at switched node which combines energy storage due to all four semiconductor devices V gs2 V ds2 i d2 Overlap Loss Diode Loss Model Example loss model includes resistance and forward voltage drop extracted from datasheet t t t P overlap 1 2 I L V t sw T s M 1 M 2
17 Diode Reverse Recovery Diodes will turn on during dead time intervals Significant reverse recovery possible on both body diode and external diode I L i L t rr Q rr bus E on rr V Skin Effect in Copper Wire Current profile at high frequency is exponential function of distance from center with characteristic length INDUCTOR AC LOSSES AC Resistance r w,
18 Skin Depth Simulation Example Proximity Effect In foil conductor closely spaced with h >>, flux between layers generates additional current according to Lentz s law. Power loss in layer 2: + Needs modification for non foil conductors See Fundamentals of Power Electronics, Section 13.4
19 Frequency: 1 khz Frequency: 100 khz Frequency: 1 MHz Frequency: 10 MHz
20 Fringing Physical Origin of Core Loss Magnetic material is divided into domains of saturated material Both Hysteresis and Eddy Current losses occur from domain wall shifting Near air gap, flux may bow out significantly, causing additional eddy current losses in nearby conductors Reinert, J.; Brockmeyer, A.; De Doncker, R.W.;, "Calculation of losses in ferro- and ferrimagnetic materials based on the modified Steinmetz equation," Inductor Core Loss Steinmetz Parameter Extraction Governed by Steinmetz Equation: [mw/cm 3 ] Parameters K fe,, and extracted from manufacturer data [mw] small losses with small ripple
21 Ferroxcube Curve Fit Parameters Non Sinusoidal Waveforms Modified Steinmetz Equation (MSE) Guess that losses depend on Calculate and find frequency of equivalent sinusoid Albach,Durbau and Brockmeyer, 1996 Reinert, Brockmeyer, and Doncker, 1999 NSE/iGSE Simple Formula for Square wave voltages: INDUCTOR DESIGN Van den Bossche, A.; Valchev, V.C.; Georgiev, G.B.;, "Measurement and loss model of ferrites with non sinusoidal waveforms, K. Venkatachalam; C. R. Sullivan; T. Abdallah; H. Tacca, Accurate prediction of ferrite core loss with nonsinusoidal waveforms using only Steinmetz parameters
22 Inductor Design Equivalent Circuit Freedoms: 1. Core Size and Material 2. Number of turns and wire gauge 3. Length of Air Gap Constraints: 1. Obtain Designed L 2. Prevent Saturation 3. Minimize Losses Minimization of Losses Spreadsheet Design For given core, number of turns can be used to index possible designs, with air gap solved after (and limited) to get correct inductance A minimum sum of the two exists and can be solved Design always subject to constraint B max < B sat Use of spreadsheet permits simple iteration of design Can easily change core, switching frequency, loss constraints, etc.
23 Matlab (Programmatic) Design Matlab, or similar, permits more powerful iteration and plotting/insight into design variation K g and K gfe Methods Two closed form methods to solve for the optimal inductor design under certain constraints/assumptions Neither method considers losses other than DC copper and (possibly) steinmetz core loss Both methods particularly well suited to spreadsheet/iterative design procedures K g K gfe Losses DC Copper (specified) DC Copper, SE Core Loss (optimized) Saturation Specified Checked After B max Specified Optimized Closed Form Design Methods Fundamentals of Power Electronics Ch Step by Step design methods Simplified, and may require additional calculations K g Method Method useful for filter inductors where B is small Core loss is not included, but may be significant particularly if large ripple is present Copper loss is specified through a set target resistance The desired B max is given as a constraint Method does not check feasibility of design; must ensure that air gap is not extremely large or wire size excessively small Simple first cut design technique; useful for determining approximate core size required Step by step design procedure included on website
24 K gfe Procedure K gfe Method Method useful for cases when core loss and copper loss are expected to be significant Saturation is not included in the method, rather it must be checked afterward Enforces a design where the sum of core and copper is minimized n k n k n 1 n 1 K W n 2 A A wk u 2 Verify
25 K gfe Method: Summary Method enforces an operating B in which core and copper losses are minimized Only takes into account losses from standard Steinmetz equation; not correct unless waveforms are sinusoidal Does not consider high frequency losses Step by step design procedure included on website
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