SGM mW, Capless, Stereo Headphone Amplifier with Shutdown

Transcription

1 8mW, Capless, Stereo Headphone GENERAL DESCRIPTION The SGM497 stereo headphone amplifier is designed for portable equipment where board space is at a premium. The SGM497 uses capless architecture to produce a ground-referenced output from a single power supply, eliminating the need for large DC-blocking capacitors for output, saving cost, board space, and component height. Additionally, for SGM497B, the gain is set internally (-V/V), further reducing component count. For SGM497A, the gain can be adjusted by external feedback resistors. The SGM497 delivers up to 8mW per channel into a 3Ω load and has low.% THD+N. A -78dB power supply rejection ratio (PSRR) at 7Hz allows this device to operate from noisy digital supplies without an additional linear regulator. Comprehensive click-and-pop circuitry suppresses audible clicks and pops on startup and shutdown. The SGM497 operates from a single.7v to 5.5V supply, consumes only.7ma supply current, and is specified over the extended -4 to +85 temperature range. The SGM497 is available in a Green TQFN-3 3-6L package. FEATURES SGM497A: External Feedback Gain Network SGM497B: Fixed -V/V Gain No Bulky DC-Blocking Capacitors Required Ground-Referenced Outputs Eliminate DC-Bias Voltage on Headphone Ground Pin No Degradation of Low-Frequency Response Due to Output Capacitors Differential Inputs for Enhanced Noise Cancellation 8mW into 3Ω Load from 5V Power Supply at THD+N =.% (TYP, per Channel) Low.% THD+N High PSRR (-78dB at 7Hz) Integrated Click-and-Pop Suppression.7V to 5.5V Single Supply Operation Low Quiescent Current (.7mA at V DD = 5V) Shutdown Control Under-Voltage Lockout Function -4 to +85 Operating Temperature Range Available in Green TQFN-3 3-6L Package APPLICATIONS Notebook PCs Cellular Phones PDAs MP3 Players Smart Phones Portable Audio Equipment NOVEMBER REV. A.

2 8mW, Capless, Stereo Headphone PACKAGE/ORDERING INFORMATION MODEL GAIN (V/V) PACKAGE DESCRIPTION SPECIFIED TEMPERATURE RANGE ORDERING NUMBER SGM497A ADJ TQFN-3 3-6L -4 to +85 SGM497AYTQ6G/TR SGM497B - TQFN-3 3-6L -4 to +85 SGM497BYTQ6G/TR PACKAGE MARKING 497AQ XXXXX 497BQ XXXXX PACKING OPTION Tape and Reel, 3 Tape and Reel, 3 NOTE: XXXXX = Date Code and Vendor Code. Green (RoHS & HSF): defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If you have additional comments or questions, please contact your SGMICRO representative directly. ABSOLUTE MAXIMUM RATINGS PV SS to SV SS V to +.3V PGND to SGND V to +.3V PV DD to SV DD V to +.3V PV DD and SV DD to PGND or SGND V to +6V PV SS and SV SS to PGND or SGND... -6V to +.3V IN to SGND... (SV SS -.3V) to (SV DD +.3V) SHDN to SGND V to (SV DD +.3V) OUT to SGND... (SV SS -.3V) to (SV DD +.3V) CP to PGND V to (PV DD +.3V) CN to PGND... (PV SS -.3V) to +.3V Output Short Circuit to GND or V DD... Continuous Junction Temperature Storage Temperature Range to +5 Lead Temperature (Soldering, s) ESD Susceptibility HBM... V HBM (Output pins to Supply and Ground pins)... 4V MM... 5V RECOMMENDED OPERATING CONDITIONS Supply Voltage Range....7V to 5.5V Operating Temperature Range to +85 OVERSTRESS CAUTION Stresses beyond those listed may cause permanent damage to the device. Functional operation of the device at these or any other conditions beyond those indicated in the operational section of the specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. ESD SENSITIVITY CAUTION This integrated circuit can be damaged by ESD if you don t pay attention to ESD protection. SGMICRO recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DISCLAIMER reserves the right to make any change in circuit design, specification or other related things if necessary without notice at any time. NOVEMBER

3 8mW, Capless, Stereo Headphone PIN CONFIGURATION (TOP VIEW) SHDN INL+ INL PV DD OUTL CP SV SS PGND 3 OUTR CN 4 9 SV DD PVSS SGND INR+ TQFN-3 3-6L INR- PIN DESCRIPTION PIN NAME DESCRIPTION PV DD Charge-Pump Power Supply. Powers charge-pump inverter, charge-pump logic, and oscillator. Connect to positive supply (.7V to 5.5V). Bypass with a capacitor to PGND as close to the pin as possible. CP Flying Capacitor Positive Terminal. 3 PGND Power Ground. Connect to ground. 4 CN Flying Capacitor Negative Terminal. 5 PV SS Charge-Pump Output. Connect to SV SS. 6 SGND Signal Ground. Connect to ground. 7 INR+ Noninverting Right-Channel Audio Input. 8 INR- Inverting Right-Channel Audio Input. 9,3 SV DD Amplifier Positive Power Supply. Connect to positive supply (.7V to 5.5V). Bypass with a capacitor to SGND as close to the pin as possible. OUTR Right-Channel Output. SV SS Amplifier Negative Power Supply. Connect to PV SS. OUTL Left-Channel Output. 4 INL- Inverting Left-Channel Audio Input. 5 INL+ Noninverting Left-Channel Audio Input. 6 SHDN Active-Low Shutdown Input. Exposed Paddle Exposed Paddle. Can be connected to GND or left floating. NOVEMBER 3

4 8mW, Capless, Stereo Headphone ELECTRICAL CHARACTERISTICS (PV DD = SV DD = 5V, PGND = SGND = V, SHDN = SV DD, C = C =, R L =, resistive load referenced to ground; for SGM497A, gain = -V/V (R IN = R F = kω); for SGM497B, gain = -V/V (internally set). T A = +5, unless otherwise noted.) () GENERAL PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage Range V DD V Quiescent Supply Current I DD ma Shutdown Supply Current I SHDN SHDN = SGND = PGND. 8 µa SHDN Input Logic High V IH. V SHDN Input Logic Low V IL.4 V SHDN to Full Operation Time t SON 3. ms AMPLIFIERS Voltage Gain A V SGM497B V/V Gain Matching Output Offset Voltage ΔA V V OS SGM497B, between the right and left channels Between IN+ and IN-, input AC-coupled to ground (SGM497A). % mv Input Impedance R IN SGM497B, measured at INL and INR kω Common Mode Rejection Ratio CMRR Input referred, SGM497A -7 db Power Supply Rejection Ratio PSRR f = 7Hz, V RIPPLE = mv P-P -78 f = khz, V RIPPLE = mv P-P -7 Output Power P OUT R L = 3Ω, THD+N =.% 8 mw Output Impedance in Shutdown kω Total Harmonic Distortion Plus Noise THD+N R L = 3Ω, P OUT = 55mW, f = khz. % Signal-to-Noise Ratio SNR R L = 3Ω, P OUT = mw, BW < khz db Capacitive Drive C L No sustained oscillation pf Charge-Pump Oscillator Frequency f OSC 35 5 khz Crosstalk R L = 3Ω, V IN = mv P-P, f = khz A V = -V/V db 9 db Thermal Shutdown Threshold 37 Thermal Shutdown Hysteresis NOTE:. For C IN, C and etc, please refer to the FUNCTIONAL DIAGRAM/TYPICAL APPLICATION CIRCUIT on pages 8 and 9. NOVEMBER 4

5 8mW, Capless, Stereo Headphone TYPICAL PERFORMANCE CHARACTERISTICS THD+N (%) V DD = 5V R L = 3Ω f = khz BW < khz THD+N vs. Output Power Output Power (mw) OUTPUTS IN PHASE ONE CHANNEL DRIVEN THD+N (%) V DD = 3V R L = 3Ω f = khz BW < khz THD+N vs. Output Power Output Power (mw) OUTPUTS IN PHASE ONE CHANNEL DRIVEN Pow er Dissipation vs. Output Pow er 5 Pow er Dissipation vs. Output Pow er Power Dissipation (mw) OUTPUTS IN PHASE 5 V DD = 5V, R L = 3Ω f = khz, BW < khz Output Pow er (mw) ONE CHANNEL DRIVEN Power Dissipation (mw) V DD = 3V, R L = 3Ω f = khz, BW < khz Output Pow er (mw) OUTPUTS IN PHASE ONE CHANNEL DRIVEN Output Power (mw) Output Pow er vs. Supply Voltage R L = 3Ω, f = khz, BW < khz ONE CHANNEL DRIVEN THD+N % THD+N % Output Power (mw) Output Pow er vs. Supply Voltage R L = 3Ω, f = khz, BW < khz OUTPUTS IN PHASE THD+N % THD+N % Supply Voltage (V) Supply Voltage (V) NOVEMBER 5

6 8mW, Capless, Stereo Headphone TYPICAL PERFORMANCE CHARACTERISTICS (continued) Crosstalk (db) -4-8 Crosstalk vs. Frequency V DD = 5V, R L = 3Ω V OUT = 7mV RMS, A V = - LEFT TO RIGHT RIGHT TO LEFT -.. Crosstalk (db) -4-8 Crosstalk vs. Frequency V DD = 3V, R L = 3Ω V OUT = 7mV RMS, A V = - RIGHT TO LEFT LEFT TO RIGHT -.. Crosstalk (db) -4-8 Crosstalk vs. Frequency V DD = 5V, R L = 3Ω V IN = mv P-P, A V = - LEFT TO RIGHT RIGHT TO LEFT Crosstalk (db) -4-8 Crosstalk vs. Frequency V DD = 3V, R L = 3Ω V IN = mv P-P, A V = - RIGHT TO LEFT LEFT TO RIGHT THD+N (%) V DD = 5V R L = 3Ω A V = -V/V BW < khz THD+N vs. Frequency P O = 5mW P O = mw P O = 8mW. 5 5 k k 5k k k 5k k THD+N (%) V DD = 3V R L = 3Ω A V = -V/V BW < khz THD+N vs. Frequency P O = 5mW P O = mw P O = 4mW 5 5 k k 5k k k 5k k Frequency (Hz) Frequency (Hz) NOVEMBER 6

7 8mW, Capless, Stereo Headphone TYPICAL PERFORMANCE CHARACTERISTICS (continued) - Pow er Supply Rejection Ratio vs. Frequency V DD = 5V, R L = 3Ω Input AC-coupled to GND V RIPPLE = mv P-P - Pow er Supply Rejection Ratio vs. Frequency V DD = 3V, R L = 3Ω Input AC-coupled to GND V RIPPLE = mv P-P PSRR (db) -4-8 LEFT CHANNEL PSRR (db) -4-8 LEFT CHANNEL RIGHT CHANNEL.. RIGHT CHANNEL.. PSRR (db) Pow er Supply Rejection Ratio vs. Frequency V DD = 5V, R L = 3Ω Input AC-coupled to GND V RIPPLE = mv P-P LEFT CHANNEL RIGHT CHANNEL.. PSRR (db) Pow er Supply Rejection Ratio vs. Frequency V DD = 3V, R L = 3Ω Input AC-coupled to GND V RIPPLE = mv P-P LEFT CHANNEL RIGHT CHANNEL.. PSRR (db) f = khz V RIPPLE = mv P-P PSRR vs. Supply Voltage LEFT CHANNEL RIGHT CHANNEL Supply Voltage (V) Turn On Time (ms) Turn On Time vs. Supply Voltage Supply Voltage (V) NOVEMBER 7

8 8mW, Capless, Stereo Headphone FUNCTIONAL DIAGRAM/TYPICAL APPLICATION CIRCUIT C3.7V to 5.5V LEFT CHANNEL AUDIO IN To External Power Supply or Control I/O CIN kω 9, PVDD SHDN INL+ INL- RF* RIN* _ OUTL CP UVLO/ SHUTDOWN CONTROL + SVSS HEADPHONE JACK C CHARGE PUMP CLICK-AND-POP SUPPRESSION 4 CN RIN* + _ OUTR SVSS RF* PVSS SVSS PGND SGND INR+ INR C RIGHT CHANNEL AUDIO IN CIN * FOR SGM497A, RIN AND RF ARE EXTERNAL TO THE DEVICE. FOR SGM497B, RIN = 5kΩ, RF = 3kΩ Figure. Typical Single-Ended Input Application Circuit NOTES:. To ensure the normal operation of the device, decoupling capacitor (C3) must be placed as close to SGM497 as possible. The loop length formed by C3, SV DD and GND should be no longer than.cm; otherwise the device will not start up at high supply voltage.. In order to get good performance, it s important to select the right C, C and C3 in application. All tests are performed with circuit set up with X5R and X7R capacitors. Capacitors having high dissipative loss, such as Y5V capacitor, may cause performance degradation and unexpected system behavior. 3. A kω resistor must be serially connected to SHDN pin. NOVEMBER 8

9 8mW, Capless, Stereo Headphone FUNCTIONAL DIAGRAM/TYPICAL APPLICATION CIRCUIT (continued) C3.7V to 5.5V LEFT CHANNEL AUDIO IN To External Power Supply or Control I/O kω CIN RIN* RF* CIN LEFT CHANNEL AUDIO IN 9, PVDD SHDN INL+ INL- RF* RIN* _ OUTL CP UVLO/ SHUTDOWN CONTROL + SVSS HEADPHONE JACK C CHARGE PUMP CLICK-AND-POP SUPPRESSION 4 CN RIN* + _ OUTR SVSS RF* PVSS SVSS PGND SGND INR+ INR- C RIGHT CHANNEL AUDIO IN CIN RIN* RF* 7 8 CIN RIGHT CHANNEL AUDIO IN * FOR SGM497A, RIN_ AND RF_ ARE EXTERNAL TO THE DEVICE. FOR SGM497B, RIN = 5kΩ, RF = 3kΩ RIN = 5kΩ, RF = 3kΩ Figure. Typical Differential Input Application Circuit NOTES:. To ensure the normal operation of the device, decoupling capacitor (C3) must be placed as close to SGM497 as possible. The loop length formed by C3, SV DD and GND should be no longer than.cm; otherwise the device will not start up at high supply voltage.. In order to get good performance, it s important to select the right C, C and C3 in application. All tests are performed with circuit set up with X5R and X7R capacitors. Capacitors having high dissipative loss, such as Y5V capacitor, may cause performance degradation and unexpected system behavior. 3. A kω resistor must be serially connected to SHDN pin. NOVEMBER 9

10 PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS TQFN-3 3-6L D e N6 L D N E E k b N5 TOP VIEW BOTTOM VIEW.7.7 A A SIDE VIEW A.5.4 RECOMMENDED LAND PATTERN (Unit: mm) Dimensions In Millimeters Dimensions In Inches Symbol MIN MAX MIN MAX A A..5.. A.3 REF.8 REF D D E E k. MIN.8 MIN b e.5 TYP. TYP L TX8.

11 PACKAGE INFORMATION TAPE AND REEL INFORMATION REEL DIMENSIONS TAPE DIMENSIONS P P W Q Q Q Q Q Q B Q3 Q4 Q3 Q4 Q3 Q4 Reel Diameter P A K Reel Width (W) DIRECTION OF FEED NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF TAPE AND REEL Package Type Reel Diameter Reel Width W A B K P P P W Pin Quadrant TQFN-3 3-6L Q DD TX.

12 PACKAGE INFORMATION CARTON BOX DIMENSIONS NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF CARTON BOX Reel Type Length Width Height Pizza/Carton DD TX.