A Review of Applications for High Power GaN HEMT Transistors and MMICs. Ray Pengelly and Chris Harris, Cree RF Products April, 2013
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1 A Review of Applications for High Power GaN HEMT Transistors and MMICs Ray Pengelly and Chris Harris, Cree RF Products April, 2013
2 Summary Available High Power RF Markets for VEDs and GaN HEMTs Advantages of GaN HEMT Technology and Impact on High Power PA Engineering Reliability and Robustness Thermal Management CW, Pulsed and Linear Examples of Commercially Available Devices Examples of Hardware Realizations Different Methods of Power Combining Conclusions pg. 2
3 Available High Power RF Markets for VEDs and GaN HEMTs (1) Many microwave and mm-wave high power VEDs (vacuum electron devices) are designed for long lifetime programs that continue for decades Business forecast for VEDs is flat at a TAM of around $1B US per year up to Total VED Market Share by Type 2012 Total VED Market Share by Vendor Total TWT Device Revenue by Year Source: ABI Research October 2012 Total Klystron Device Revenue by Year pg. 3
4 Available High Power RF Markets for VEDs and GaN HEMTs (2) GaN HEMT deployments to replace VEDs in many current equipments are limited by electromechanical and logistical reasons Opportunities for GaN HEMT deployments in new high power applications are very promising e.g. GaN HEMTs have been qualified for space applications Total GaN Device TWT Application Replacement Revenue Percentage of TWT Application Revenue Vulnerable to GaN Device Replacement Source: ABI Research October 2012 pg. 4
5 Advantages of GaN HEMT Technology and Impact on High Power PA Engineering pg. 5
6 Summary of GaN HEMT Advantages As the state-of-the-art in solid state device technology advances, vacuum tube microwave devices used in high power electromagnetic systems as well as military radar systems are being replaced with solid state power amplifiers (SSPA s) Wide bandgap semiconductor materials like GaN HEMTs have potential to operate at power densities many times higher than Si-LDMOS, GaAs FET, and silicon carbide (SiC) devices High power density is an important factor for high power devices enabling smaller die sizes and more easily realized input and output matching networks GaN HEMTs have other advantages: High breakdown voltages (200+ volts) High saturated electron velocity Good thermal conductivity Low parasitic capacitances and low turn-on resistances High cut off frequencies. pg. 6
7 A Summary of TWTA and SSPA Advantages and Disadvantages Function TWTA SSPA Advantage Disadvantage Advantage Disadvantage Linearity and Intermodulation Distortion No memory effects Can have high harmonic content Maybe memory effects Available Output Power Generally higher output power Efficiency of Operation i.e. AC Power Consumption TWTA s are efficient in back-off state High Voltage Can be high currents Size and Weight Total TWTA package may be smaller Basic RF modules are smaller than TWTA s Heat sinks may make total size larger than TWTA s Heat Dissipation Heat dissipation over large area Heat dissipation is a challenging problem Reliability Many years of reliable space operation Tubes have limited life of 100,000 hours of operation MTBF s proven to be greater than 1 million hours Power supplies may be less reliable than RF transistors Temperature Stability Very stable over temperature Solid state power amplifiers need temperature compensation pg. 7
8 Reliability and Robustness pg. 8
9 Different Amplifier Technologies for EMC Testing Applications Amplifier Linearity 1dB point Harmonics at 1dB Harmonics above 1dB* Noise power density/ Spurious Ability to handle VSWR* Frequency coverage Tube Bad Good Worst Bad Best Low freq. <250 MHz TWTA Worst Worst Worst Worst Worst High freq. >1 GHz Solid state Class A Solid state Class AB Solid state Class B Best Best Best Good Best Full coverage Bad Good Good Good Good Full coverage Bad Good Bad Best Good to bad Full coverage * Results greatly depends on how the technology is implemented Courtesy: G. Barth, Amplifier Research pg. 9
10 Amplifiers and VSWR Withstand (1) TWTAs have a relatively low threshold to VSWR The TWT will fail at high VSWR without protection or precautions. 2:1 VSWR at rated power 1. Fold back at 20% reflected power (best) pulsed amplifiers fold back at 50% reflected power 2. Shutdown at 2:1 VSWR 3. Rely on user to take responsibility to be proactive Low Power Solid State can have high threshold to VSWR Dependent on technology used Infinite VSWR handling, no protection needed pg. 10
11 Amplifiers and VSWR Withstand (2) High Power Solid State PA s can have high threshold to VSWR Dependent on the technology used High VSWR handling, some protection required GaN can usually handle up to 67% of rated power (10:1 VSWR) when used at full power Folds back so that reverse power does not exceed reverse power limit Latest LDMOSFETs claim to handle up to 94% of rated power Why can t higher power amplifiers handle infinite VSWR like lower power versions? Combining Components see up to twice the power (4x voltage and current) Combiners also act as splitters and direct energy back to output stages GaN HEMTs because of high power density, high breakdown voltage and good thermal characteristics are ideal for broadband EMC testing PA s pg. 11
12 Reliability and VSWR Robustness of GaN HEMTs Cree 28 volt qualified GaN HEMT process Robustness data from Fraunhofer Institute MTTF at 225 deg C Channel Temperature is >20 million hours Most GaN transistors are specified to withstand a 10:1 output mismatch at fully rated output power. Worst case in example above shows PAE of 7% and a maximum channel temperature of 278 O C but device does not fail pg. 12
13 Broadband EMC Power Amplifier Examples Amplifier Research Milmega 1 to 6 GHz GaN HEMT Power Amplifier >70 watts 48 db Gain Mismatch tolerance of 100% without fold-back 60 lb and 3400 cu. in. 1.8 to 6 GHz GaN HEMT Power Amplifier 130 watts 46 db Gain 100% tested into short and open 103 lb and 3900 cu. in. pg. 13
14 Thermal Management pg. 14
15 Thermal Management of GaN HEMT Transistors (1) GaN HEMTs (particularly at 50 volts) have very high RF power densities (typically 4 to 8 watts per mm of gate periphery) and high power dissipation per unit area Onus of heat dissipation is placed not only on die transistor design (dependent on mode of operation e.g. CW versus pulsed or backed-off linear) BUT also on heat sink material and die attach Thermal Conductivity, W/mK Coefficient of Thermal Expansion, ppm/k CuW-10 10%Cu 90%W Thermal Conductivity, W/mK Coefficient of Thermal Expansion, ppm/k CuMoCu 30%Cu 70%Mo CMC Cu/Mo/Cu 1:1:1 CPC Cu/CuMo/Cu 1:4:1 Alumina to Super CMC Cu/Mo multilayers Aluminum Diamond/Silver Diamond 370 >500/800 6 to /<10 Flange materials need High thermal conductivity Thermal expansion coefficient match to SiC and alumina ceramic ring frames Stable properties such as Bowing and flatness Low surface roughness Void free die attach pg. 15
16 Thermal Management of GaN HEMT Transistors (2) For pulsed applications (large range of pulse widths and duty factors) the thermal resistance jc is modeled as a function of time. Transient thermal analysis requires a knowledge of the properties of all the materials in the stack including die, solder, flange etc. Material Density (gm/cm 3 ) Specific Heat (J/KgC) GaN SiC Au AuSn Cu Mo pg. 16
17 Examples of Commercially Available Devices pg. 17
18 Some GaN HEMT Suppliers Worldwide COTS, MOTS and Foundry Cree M/A-Com Mitsubishi RFMD SEDI Toshiba Triquint UMS Captive Foundry BAE Systems Hughes Research Laboratories Lockheed-Martin Northrop-Grumman Aerospace Systems Raytheon Copyright 2012, Cree, Inc. pg. 18
19 Summary of High Power Transistors available from Cree 28 volt products Product Name Frequency, GHz Small Signal Gain, db Output Power, Watts Drain Efficiency, % Drain Voltage, Volts Application CGH40120F Up to General purpose CGH40180PP Up to General purpose CGH31240F Radar CGH35240F Radar CGH09120F UHF Pave Pave 28 Telecom CGH21120F Pave Pave 28 Telecom CGH21240F Pave Pave 28 Telecom CGH25120F Pave 28 Telecom Lower power transistors are also available to provide complete PA line-ups pg. 19
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