SFF 2x10 GPON Class B+ ONU Transceiver 2.488Gbps Downstream/1.244Gbps Upstream

Transcription

1 SFF 2x10 GPON Class B+ ONU Transceiver 2.488Gbps Downstream/1.244Gbps Upstream FEATURES OPGP-34-A4B3ZV(T) ITU-T G compliant GPON ONU Class B+ Support Digital Diagnostic Monitoring Interface 2x10 pin SFF package with 900mm pigtail fiber and SC/APC connector 1310nm Transmitter, 1490nm Receiver Integrated with WDM filter to cut 1550nm and 1650nm optical signal off for Voice/Data FTTx ONT/ONU applications Single +3.3V power supply with LVTTL Bias Control input and Rx Signal Detect output Description DELTA s high capacity GPON ONU transceiver module is designed for Passive Optical Network (PON) application, 2.488Gbps downstream and 1.244Gbps upstream. It is compliant with ITU-T G standard. The GPON ONU transceiver is provided with SC pigtail connector complied with SC connector industry standard. The module consists 1310nm un-cool DFB laser, InGaAs/InP APD, Preamplifier and WDM filter in a high-integrated optical sub-assembly, and it receives up to 2.488Gbps of continuous data at 1490nm, and transmits 1.244Gbps of burst-mode data at 1310nm. Application GPON ONU Class B+ Burst mode application FTTx WDM Broadband Access Performance OPGP-34-A4B3ZV(T) data link up to 20km in 9/125um single mode fiber. The pre-bias time is less than 16bits. 1 Revision: S4

2 1. Absolute Maximum Ratings Parameter Symbol Min. Typ. Max. Unit Note Storage Temperature Ts ºC Storage Ambient Humidity HA 5 95 % Power Supply Voltage VCC 0 5 V Signal Input Voltage -0.3 Vcc+0.3 V Optical Input Power (Peak) 7 dbm Lead Soldering Temperature T SOLD 260 ºC Lead Soldering Time t SOLD 10 sec 2. Recommended Operating Conditions Parameter Symbol Min. Typ. Max. Unit Note Operating Case Temperature OPGP-34-A4B3ZV TC ºC OPGP-34-A4B3ZVT Ambient Humidity HA 5 90 % Non-condensing Power Supply Voltage VCC V Power Supply Off Voltage Voff V Power Supply Current ICC 400 ma Power Supply Noise Rejection 100 mvp-p 100Hz to 1MHz Data Rate of Transmitter Mbps Data Rate of Receiver Mbps Line Code Scrambled NRZ Transmission Distance 20 km 3. Specification of Transmitter Parameter Symbol Min. Typ. Max. Unit Note Average Launched Power P O dbm Note (1) Optical Extinction Ratio ER 10 db Center Wavelength λ C nm DFB Laser -20dB Spectrum Width (RMS) σ 1 nm Side Mode Suppression Ratio SMSR 30 db Transmitter OFF Output Power P Off -45 dbm Tx Enable Ton 16 bits 12.8ns Tx Disable Toff 16 bits 12.8ns Transmitter Reflectance (1260 to 1360nm) -6 db Tolerance to the Transmitter s -15 db incident Light Power Jitter Generation 0.33 UIp-p 4KHz~10MHz Output Eye Mask Compliant with ITU-T G Note (3) ORL of ODN at Oru and Ord 32 db Time to Initialize, Including Soft TX disable t_init 300 ms Note(4) Note (1). Launched power (avg.) is end-of-life power coupled into a single mode fiber. Note (2). Transmitter eye mask definition 2 Revision: S4

3 Upstream Bit rate (Mbps) Mbit/s x1/x4 0.22/0.78 x2/x3 0.40/0.60 y1/y4 0.17/0.83 y2/y3 0.20/0.80 Eye Mask Test Setup Optical Transmitter Attenuator O/E Converter 4 th order Thomson Filter* Waveform Monitor * f -3dB = 0.75 times the nominal bit rate. Note (3). Time to Initialize V cc>3.135v Soft TX Disable BEN Optical Output t_init 3 Revision: S4

4 4. Specification of Receiver Parameter Symbol Min. Typ. Max. Unit Note Input Optical Wavelength λ IN nm APD Receiver Sensitivity P IN -28 dbm Note (1) Input Saturation Power (Overload) P SAT -8 dbm Signal Detect- Assert Power P A -28 dbm Signal Detect- Deassert Power P D -44 dbm Note (2) Signal Detect- Hysteresis P A -P D db Receiver Reflectance -20 db Note (3) (1480 to 1500nm) Optical Isolation of Receiver 40 db (1260 to 1360nm) Note (1). Measured with 1490nm, ER=10dB; BER 23-1 NRZ without FEC Note (2). When Signal Detect Deasserted, the data output is Low-level (fixed) Note (3). When the terminal is viewed from the optical path, the reflection toward the optical path of the optical signal with a central wavelength of 1480nm to 1500nm transmitted to terminal. 5. Electrical Interface Characteristics Parameter Symbol Min. Typ. Max. Unit Note Transmitter Total Supply Current I CC A ma Note (1) Differential line input Impedance R IN Ohm Differential Data Input Swing VDT mv p-p DC-Coupled BiasCNT Input Voltage- High V BCNTH 2 V CC BiasCNT Input Voltage- Low V BCNTL LVTTL Receiver Total Supply Current I CC B ma Note (1) Differential Data Output Swing VDR mv p-p Note (2) Signal Detect Output Voltage-High V LOSH 2 V CC +0.3 V Signal Detect Output Voltage-Low V LOSL V LVTTL Note (1). A (TX)+ B (RX) = 400mA (Not include termination circuit) Note (2). CML Interface, AC coupled to 100ohm differential Load. 4 Revision: S4

5 6. Transmitter Burst Mode Timing Characteristics VccT BiasCNT Data Input Optical Output VccT < 0.8V X X OFF VccT > 3.13V Low/NC X OFF High No Other Yes Laser bias and modulation signal output X = Don t care Other = Less than +8dBm (peak) High = Logic high level, Low = logic low level No = Data NOT Present, Yes = Data Present, OFF = Optical Power is less than 45dBm BiasCNT Preamble Payload TD (p) Optical Output Ton<16 bits Within 15% of steady state Toff<16 bits Tx Enable Ton/Toff Time Definition Tx Disable 7. Digital Diagnostic Monitor Accuracy Parameter Accuracy Calibration Note Transceiver Internal Temperature ± 3 Internal TA=0~+70 / -40~85 Power Supply Internal Voltage ± 3% Internal VCC=3.13~3.47V TX Optical Power ± 3dB Internal +0.5~5dBm TX Bias Current ± 10% Internal Specified by nominal bias value RX Optical Power ± 3dB Internal -28 to -8dBm Note. Temperature and Voltage is measured internal to the transceiver. 5 Revision: S4

6 8. Enhanced Digital Diagnostic Interface The memory map in the following describes an extension to the memory map defined in SFF-8472 MSA. The enhanced interface uses the two wire serial bus address X(A2h) to provide diagnostic information about the module s present operating conditions. 2 wire address X (A0h) 2 wire address X (A2h) 0 0 Serial ID Defined by SFP MSA 55 (96 bytes) Vender Specific (32 bytes) Alarm and Warning Thresholds (56 bytes) Cal Constants (40 bytes) Real Time Diagnostic Interface (24 bytes) Vender Specific 6 Revision: S4

7 8.1 EEPROM Serial ID Memory Contents (2-Wire Address A0h) Address Name of Field Hex Description Base ID Fields 00 Identifier 02 SFF physical device (soldered device) 01 Ext. Identifier 04 Serial ID module supported 02 Connector 0B Optical pigtail Transceiver Codes 00 Undefined for GPON 11 Encoding 03 Compatible with NRZ encoding code 12 BR, Nominal 0C Nominal 1244Mbps (indicate transmitter data rate) 13 Reserved Length (9um)-km 14 fiber 15 Length (9um)-100m C8 fiber Length for MMF 00 Undefined for GPON 19 Reserved Vendor Name C 54 DELTA (ASCII character) Channel Spacing 00 Undefined Vendor OUI 00 Undefined Vendor P/N 4F D D OPGP-34-A4B3ZV(T) (ASCII character) 5A (54) Vendor P/N Rev S0 (ASCII character) Laser Wavelength 05 1E 1310nm in Hex byte 62 DWDM Wavelength Fraction 00 Undefined 63 CC_BASE XX Check sum of bytes 0-62 Extended ID Fields Options Signal Detect is implemented 66 BR, Max. 00 Undefined 67 BR, Min. 00 Undefined Vendor SN SN Vendor serial number in ASCII character Date Code DC Vendor date code in ASCII character 92 Diagnostic Monitoring Type 28 Implemented with internal calibration and received power measurement type by Avg. power 93 Enhanced options F0 Alarm/Warning flags monitor are implemented 94 SFF-8472 compliant 02 SFF-8472 compliant with revision CC_EXT XX Check sum of bytes Vendor Specific ID Fields Vendor Specific 00 Vendor specific EEPROM Reserved 00 Reserved for future use 7 Revision: S4

8 8.2 Digital Diagnostic Monitoring Interface (2-Wire Address A2h) Alarm and Warning Thresholds (2 Wire Address A2h) OPGP-34-A4B3ZV(T) Address # Bytes Name of Field HEX Real Value Unit Temp High Alarm (64 00)* 85 (100)* Temp Low Alarm FB 00 (D8 00)* -5 (-40)* Temp High Warning (5F 00)* 80 (95)* Temp Low Warning (E2 00)* 0 (-30)* Voltage High Alarm V Voltage Low Alarm 6D V Voltage High Warning 87 8C 3.47 V Voltage Low Warning 7A V Bias High Alarm ma Bias Low Alarm 05 DC 3 ma Bias High Warning 61 A8 50 ma Bias Low Warning 07 D0 4 ma TX Power High Alarm F dbm TX Power Low Alarm 1F 07-1 dbm TX Power High Warning 7B 87 5 dbm TX Power Low Warning 2B D4 0.5 dbm RX Power High Alarm 0C 5A -5 dbm RX Power Low Alarm dbm RX Power High Warning dbm RX Power Low Warning dbm Reserved FF FF Calibration Constants (2 Wire Address A2h) Address # Bytes Name of Field HEX Description Rx_PWR (4) Set to zero for internally calibrated devices Rx_PWR (3) Set to zero for internally calibrated devices Rx_PWR (2) Set to zero for internally calibrated devices Rx_PWR (1) 3F Set to 1 for internally calibrated devices Rx_PWR (0) Set to zero for internally calibrated devices Tx_I (Slope) Set to 1 for internally calibrated devices Tx_I (Offset) Set to zero for internally calibrated devices Tx_PWR (Slope) Set to 1 for internally calibrated devices Tx_PWR (Offset) Set to zero for internally calibrated devices T (Slope) Set to 1 for internally calibrated devices T (Offset) Set to zero for internally calibrated devices V (Slope) Set to 1 for internally calibrated devices V (Offset) Set to zero for internally calibrated devices Reserved Reserved 95 1 Checksum XX Checksum of bytes Revision: S4

9 A/D Value (2 Wire Address A2h) Address # Bytes Name of Field Description Temperature (MSB, LSB) Internally measured module temperature Supply Voltage (MSB, LSB) Internally measured supply voltage in module Tx Bias Current (MSB, LSB) Internally measured TX Bias current Tx Optical Power (MSB, LSB) Internally measured TX power Rx Received Power (MSB, LSB) Measured Rx input power Reserved Notes: Temperature (Signed twos complement value) A2h Byte 96 (Temperature MSB) A2h Byte 97 (Temperature LSB) S Supply Voltage, Tx Bias Current, Tx Optical Power, Rx Received Power (Unsigned values) A2h Byte 98 (V cc MSB) A2h Byte 100 (TX Bias MSB) A2h Byte 102 (TX Power MSB) A2h Byte 99 (V cc LSB) A2h Byte 101 (TX Bias LSB) A2h Byte 103 (TX Power LSB) A2h Byte 104 (RX Power MSB) A2h Byte 105 (RX Power LSB) The digital value conversions are updated every 13ms (nominal) or 20ms (max) in rotation. After getting digital value, each measurement could be obtained by multiplying digital value by corresponding LSB value: 1 Temperature = Temp (Digital Value) LSB Temp = Temp (Digital Value) 256 ; when Temperature<128 1 Temperature = Temp (Digital Value) LSB Temp = [Temp (Digital Value) 256 ]-256; when Temperature 128 V cc = V cc(digital Value) LSB Vcc=V CC(Digital Value) 100μV TX Bias Current = TX Bias Current (Digital Value) LSB TX,Bias = TX Bias Current (Digital Value) 2μA TX Power = TX Power (Digital Value) LSB TXPower = TX Power (Digital Value) 0.1μW RX Power = RX Power (Digital Value) LSB RXPower = RX Power (Digital Value) 0.1μW 9 Revision: S4

10 Status Bits and Alarm/Warning Flag Bits (2 Wire Address A2h) Address Bit Name Description TX Disable State Read bit:digital state of Tx disable (1) and enabled (0) Soft TX Disable Read/write bit that allows software disable of Tx. Writing 1 disables Tx Reserved TX Fault State Read bit :1=Tx failure state, 0=Tx normal state Signal Detect State Read bit :Digital state of SD output pin. 1=optical signal detected, 0=no optical signal detected Data_Ready_Bar Not implemented Soft Tx Mode Not implemented Temp High Alarm Set when internal temperature exceeds high alarm level Temp Low Alarm Set when internal temperature is below low alarm level Vcc High Alarm Set when internal supply voltage exceeds high alarm level Vcc Low Alarm Set when internal supply voltage is below low alarm level TX Bias High Alarm Set when TX Bias current exceeds high alarm level TX Bias Low Alarm Set when TX Bias current is below low alarm level TX Power High Alarm Set when TX power exceeds high alarm level TX Power Low Alarm Set when TX power is below low alarm level RX Power High Alarm Set when Received Power exceeds high alarm level RX Power Low Alarm Set when Received Power is below low alarm level Reserved Alarm All Reserved Temp High Warning Set when internal temperature exceeds high warning level Temp Low Warning Set when internal temperature is below low warning level Vcc High Warning Set when internal supply voltage >high warning level Vcc Low Warning Set when internal supply voltage < low warning level TX Bias High Warning Set when TX Bias current exceeds high warning level TX Bias Low Warning Set when TX Bias current is below low warning level TX Power High Warning Set when TX Power exceeds high warning level TX Power Low Warning Set when TX Power is below low warning level RX Power High Warning Set when Received Power exceeds high warning level RX Power Low Warning Set when Received Power is below low warning level Reserved Warning All Reserved 10 Revision: S4

11 9. Pin Description Tx/Rx Pin No. I/O Pin Name Description 1 NC No Function Definition 2 VeeR Receiver Ground 3 VeeR Receiver Ground 4 NC No Function Definition 5 NC No Function Definition Rx 6 VeeR Receiver Ground 7 VccR +3.3V Receiver Power Supply 8 O SD Normal Optical Input indicated by logic High, and No Optical Input indicated by logic Low. 9 O RD(n) Inverted Receiver Data Output (AC-Coupled internally) 10 O RD(p) Non-Inverted Receiver Data Output (AC-Coupled internally) 11 VccT +3.3V Transmitter Power Supply 12 VeeT Transmitter Ground 13 I BiasCNT LVTTL Logic High to Enable Burst Transmitter, and Disable Burst Transmitter by Logic Low. Floating by Low to disable Burst Transmitter. Tx 14 I TD(p) Non-Inverted Transmitter Data Input (DC-Coupled), 15 I TD(n) Inverted Transmitter Data Input (DC-Coupled), 16 VeeT Transmitter Ground (Mod-Def 0) 17 I SCL I2C Serial Clock (LVTTL) (Mod-Def 1) 18 I/O SDA I2C Serial Data (LVTTL) (Mod-Def 2) 19 I Reset Active low, the LDD is fully disabled when the pin is held low. 20 VeeT Transmitter Ground MS Mounting Studs/Connect this pin to Chassis ground 11 Revision: S4

12 10. Recommended Interface Circuit 3.3V 10uF 100nF 1uH 1uH 100nF 11.VccT DELTA Module TX_Burst 13. TX_Burst Z0=50ohm Z0=50ohm 14. TD(p) 15. TD(n) 100ohm Transmitter. VeeT Protocol IC SerDes IC 10uF 7. VccR 100nF Z0=50ohm 10. RD(p) 100nF 100ohm Z0=50ohm 9.. RD(n) 100nF 3.3V Receiver SD 8. SD RES VeeR 3.3V 3.3V SCL SDA RES RES 17. SCL 18. SDA 3.3V Microprocessor Reset 19. Reset RES * RES is 4.7K to 10K Ohms pull-up resistor. 12 Revision: S4

13 11. Outline Dimensions Parameter Unit Description Note Mechanical Dimensions mm 48.5x13.5x12.6 Connector Type - SC/APC connector Maximum Fiber Contact Temperature ºC 85 Fiber length (L) mm 900±15 SC Connector up to top the Ferrule SC Pigtail OPXX-XX-XXXXXX DEXXXXXXXXXXXX 1310 nm Tx / Rx 1490 nm Complies with 21 CFR and Class 1 Laser Product Made in X NOTE: Units: MM Unspecified tolerances is±0.2mm 13 Revision: S4

14 12. Order Information Part Number Case Operating Temp. Notes OPGP-34-A4B3ZV 0 to +70 degree C OPGP-34-A4B3ZVT -40 to +85 degree C 13. Regulatory Compliance Feature Test Method Reference Human Body Model (HBM) MIL-STD-883E Method Electrostatic Discharge (ESD) to the EIA-JESD22-A114 Electrical Pins Machine Model (MM) EIA-JESD22-A115 Electrostatic Discharge (ESD) to the Contact Discharge IEC/EN Simplex Receptacle Air Discharge IEC/EN Radio Frequency Electromagnetic IEC/EN Field Immunity Electromagnetic Interference (EMI) FCC Part 15 Class B EN Class B (CISPR 22A) FDA/CDRH FDA 21CFR , Laser Eye Safety Component Recognition TUV TUV UL EN EN EN UL Appendix A. Document Revision Version No. Date Description S Preliminary datasheet S P11.Change the description of pin 13. Open disable the Transmitter. 2. P12. Modify the recommend interface circuit S Correct the TX interface from AC to DC. S Correct the TX power monitor description on A2H. S P1 Remove Typo on feature. 2. P13 Change the fiber connector boot to19mm Max. 14 Revision: S4