APM9948K. Pin Description. Features. Applications. Ordering and Marking Information. Dual N-Channel Enhancement Mode MOSFET 60V/4A, R DS(ON) = 10V

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1 ual N-Channel Enhancement Mode MOSFET Features 60V/4, R S(ON) = V GS = 0V R S(ON) = V GS = 4.5V Super High ense Cell esign Reliable and Rugged Lead Free and Green evices vailable (RoHS Compliant) Pin escription S G S G Top View of SOP 8 (8) (7) (6) (5) 2 2 pplications Power Management in C/C Converter, C/C Inverter Systems. (2) G (4) G2 Ordering and Marking Information S () N-Channel MOSFET S2 (3) PM9948 PM9948 K : PM9948 XXXXX Lead Free Code Handling Code Temp. Range Package Code Package Code K : SOP-8 Operating Junction Temp. Range C : -55 to 50 oc Handling Code TR : Tape & Reel Lead Free Code L : Lead Free evice G : Halogen and Lead Free evice XXXXX - ate Code Note: NPEC lead-free products contain molding compounds/die attach materials and 00% matte tin plate termination finish; which are fully compliant with RoHS. NPEC lead-free products meet or exceed the lead-free requirements of IPC/JEEC J-ST-020C for MSL classification at lead-free peak reflow temperature. NPEC defines Green to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 500ppm by weight). NPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders.

2 bsolute Maximum Ratings (T = 25 C unless otherwise noted) Symbol Parameter Rating Unit V SS rain-source Voltage 60 V GSS Gate-Source Voltage ±20 V I * Continuous rain Current 4 V GS =0V I M * 300µs Pulsed rain Current 6 I S * iode Continuous Forward Current 2.5 T J Maximum Junction Temperature 50 T STG Storage Temperature Range -55 to 50 C P * Maximum Power issipation T =25 C 2 T =00 C 0.8 W R θj * Thermal Resistance-Junction to mbient 62.5 C/W Note: *Surface Mounted on in 2 pad area, t 0sec. Electrical Characteristics (T = 25 C unless otherwise noted) Symbol Parameter Test Condition Min. Typ. Max. Unit Static Characteristics BV SS rain-source Breakdown Voltage V GS =0V, I S =250µ 60 V I SS Zero Gate Voltage rain Current V S =48V, V GS =0V T =85 C 30 V GS(th) Gate Threshold Voltage V S =V GS, I S =250µ.9 3 V I GSS Gate Leakage Current V GS =±6V, V S =0V ±0 µ R S(ON) a rain-source On-state Resistance V GS =0V, I S = V GS =4.5V, I S = iode Characteristics V S a iode Forward Voltage I S =2.5, V GS =0V 0.8. V t rr Reverse Recovery Time 28 ns I S =4, dl S /dt=00/µs Reverse Recovery Charge 28 nc Q rr µ mω 2

3 Electrical Characteristics (Cont.) (T = 25 C unless otherwise noted) Symbol Parameter Test Condition Min. Typ. Max. Unit ynamic Characteristics b R G Gate Resistance V GS =0V,V S =0V,F=MHz 4.3 Ω C iss Input Capacitance V GS =0V, 600 C oss Output Capacitance V S =30V, 50 Reverse Transfer Capacitance Frequency=.0MHz 30 C rss t d(on) Turn-on elay Time 7 4 T r Turn-on Rise Time V =30V, R L =30Ω, 7 4 I S =, V GEN =0V, t d(off) Turn-off elay Time R G =6Ω Turn-off Fall Time 4 8 T f pf ns Gate Charge Characteristics b Q g Total Gate Charge Q gs Gate-Source Charge V S =30V, V GS =0V, I S =4.9 Gate-rain Charge 3.2 Q gd nc Notes: a : Pulse test ; pulse width 300µs, duty cycle 2%. b : Guaranteed by design, not subject to production testing. 3

4 Typical Characteristics Power issipation rain Current Ptot - Power (W).5.0 I - rain Current () T =25 o C,V G =0V Tj - Junction Temperature ( C) Tj - Junction Temperature ( C) Safe Operation rea Thermal Transient Impedance I - rain Current () Rds(on) Limit 300µs ms 0ms 00ms s C T =25 o C Normalized Transient Thermal Resistance Single Pulse uty = 0.5 Mounted on in 2 pad R θj :62.5 o C/W E-3 E-4 E VS - rain - Source Voltage (V) Square Wave Pulse uration (sec) 4

5 Typical Characteristics (Cont.) Output Characteristics rain-source On Resistance 6 00 I - rain Current () V GS = 4,4.5,5,6,7,8,9,0V 3.5V 3V RS(ON) - On - Resistance (mω) V GS =4.5V V GS =0V VS - rain-source Voltage (V) I - rain Current () rain-source On Resistance Gate Threshold Voltage 90 I =4.6 I S = 250µ 85.4 RS(ON) - On - Resistance (mω) Normalized Threshold Voltage VGS - Gate - Source Voltage (V) Tj - Junction Temperature ( C) 5

6 Typical Characteristics (Cont.) rain-source On Resistance Source-rain iode Forward Normalized On Resistance V GS = 0V I S = 4 IS - Source Current () 20 0 T j =50 o C T j =25 o C 0.2 R j =25 o C: 60mΩ Tj - Junction Temperature ( C) VS - Source - rain Voltage (V) C - Capacitance (pf) Capacitance 000 Frequency=MHz Ciss Coss Crss VS - rain - Source Voltage (V) VGS - Gate - source Voltage (V) V S =30V I S = 4 Gate Charge QG - Gate Charge (nc) 6

7 Package Information SOP-8 SEE VIEW E E h X 45 e b c 2 VIEW L 0.25 GUGE PLNE SETING PLNE S Y M SOP-8 B O L MIN. MX. MIN MX b c E E e.27 BSC BSC h L MILLIMETERS INCHES Note:. Follow JEEC MS imension does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. imension E does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 0 mil per side. 7

8 Carrier Tape & Reel imensions O0 P0 P2 P H E O B T B0 W F K0 B 0 SECTION - SECTION B-B d T pplication H T C d W E F SOP ± MIN MIN MIN. 2.0± ± ±0.05 P0 P P2 0 T 0 B0 K ± ± ± MIN. 6.40± ± ± (mm) evices Per Unit Package Type Unit Quantity SOP-8 Tape & Reel

9 Reflow Condition (IR/Convection or VPR Reflow) T P Ramp-up tp Critical Zone T L to T P Temperature T L Tsmax Tsmin ts Preheat t L Ramp-down 25 t 25 C to Peak Reliability Test Program Time Test item Method escription SOLERBILITY MIL-ST C, 5 sec HOLT MIL-ST Hrs C PCT JES-22-B, Hrs, 00%RH, 2 C TST MIL-ST C~50 C, 200 Cycles Classification Reflow Profiles Profile Feature Sn-Pb Eutectic ssembly Pb-Free ssembly verage ramp-up rate (T L to T P ) 3 C/second max. 3 C/second max. Preheat 00 C 50 C - Temperature Min (Tsmin) - Temperature Max (Tsmax) 50 C 200 C seconds seconds - Time (min to max) (ts) Time maintained above: - Temperature (T L ) - Time (t L ) 83 C seconds 27 C seconds Peak/Classification Temperature (Tp) See table See table 2 Time within 5 C of actual Peak Temperature (tp) 0-30 seconds seconds Ramp-down Rate 6 C/second max. 6 C/second max. Time 25 C to Peak Temperature 6 minutes max. 8 minutes max. Note: ll temperatures refer to topside of the package. Measured on the body surface. 9

10 Classification Reflow Profiles (Cont.) Table. SnPb Eutectic Process Package Peak Reflow Temperatures Package Thickness Volume mm 3 <350 Volume mm <2.5 mm /-5 C /-5 C 2.5 mm /-5 C /-5 C Table 2. Pb-free Process Package Classification Reflow Temperatures Package Thickness Volume mm 3 <350 Volume mm Volume mm 3 >2000 <.6 mm C* C* C*.6 mm 2.5 mm C* C* C* 2.5 mm C* C* C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0 C. For example 260 C+0 C) at the rated MSL level. Customer Service npec Electronics Corp. Head Office : No.6, using st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : Fax : Taipei Branch : 2F, No., Lane 28, Sec 2 Jhongsing Rd., Sindain City, Taipei County 2346, Taiwan Tel : Fax :