FASTIRFET IRFHE4250DPbF
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1 Q Q2 V DSS V R DS(on) max (@V GS = 4.5V) m Qg (typical) 3 35 nc FASTIRFET IRFHE4250DPbF HEXFET Power MOSFET I D (@T C = 25 C) A Applications Control and Synchronous MOSFETs for synchronous buck converters Features Benefits Control and synchronous MOSFETs in one package Increased power density Low thermal resistance path to the PCB Increased power density Low thermal resistance path to the top Increased power density Low charge control MOSFET (3nC typical) results in Lower switching losses Low R DSON synchronous MOSFET (<.35m ) Lower conduction losses Intrinsic schottky diode with low forward voltage on Q2 Lower switching losses RoHS compliant, halogen-free Environmentally friendlier MSL2, industrial qualification Increased reliability Base part number Package Type Standard Pack Orderable Part Number Form Quantity IRFHE4250DPbF Dual PQFN 6mm x 6mm Tape and Reel 4000 IRFHE4250DTRPbF Absolute Maximum Ratings Parameter Q Max. Q2 Max. Units V GS Gate-to-Source Voltage ± 6 V I T C = 25 C Continuous Drain Current, V V A I T C = 70 C Continuous Drain Current, V V I T C = 25 C Continuous Drain Current (Source Bonding Technology Limited) I DM Pulsed Drain Current P C = 25 C Power Dissipation W P C = 70 C Power Dissipation Linear Derating Factor.3.3 W/ C T J Operating Junction and C -55 to + 50 Storage Temperature Range T STG Notes through are on page 2 DUAL PQFN 6X6 mm Thermal Resistance Parameter Q Max. Q2 Max. Units R JC (Bottom) Junction-to-Case R JC (Top) Junction-to-Case C/W R JA Junction-to-Ambient R JA (<s) Junction-to-Ambient International Rectifier September 26, 203
2 T J = 25 C (unless otherwise specified) Parameter Min. Typ. Max. Units Conditions BV DSS Drain-to-Source Breakdown Voltage Q 25 V V GS = 0V, I D = 250µA Q2 25 V GS = 0V, I D =.0mA BV DSS / T J Breakdown Voltage Temp. Coefficient Q 23 mv/ C Reference to 25 C, I D =.0mA Q2 2 Reference to 25 C, I D = ma Q V GS = V, I D = 27A R DS(on) Static Drain-to-Source On-Resistance Q m V GS = V, I D = 27A Q V GS = 4.5V, I D = 27A Q V GS = 4.5V, I D = 27A V GS(th) Gate Threshold Voltage Q V Q: V DS = V GS, I D = 35µA Q Q2: V DS = V GS, I D = µa V GS(th) / T J Gate Threshold Voltage Coefficient Q -5.8 mv/ C Q: V DS = V GS, I D = 35µA Q2-7.8 Q2: V DS = V GS, I D =.0mA I DSS Drain-to-Source Leakage Current Q.0 µa V DS = 20V, V GS = 0V Q2 500 V DS = 20V, V GS = 0V I GSS Gate-to-Source Forward Leakage Q/Q2 na V GS = 6V Gate-to-Source Reverse Leakage Q/Q2 - V GS = -6V gfs Forward Transconductance Q 73 S V DS = V, I D = 4A Q2 2 V DS = V, I D = 23A Q g Total Gate Charge Q 3 20 Q Q gs Pre-Vth Gate-to-Source Charge Q 3.6 Q Q2 8.6 V DS = 3V Q gs2 Post-Vth Gate-to-Source Charge Q.3 V GS = 4.5V, I D = 3A Q2 3.8 nc Q gd Gate-to-Drain Charge Q 5.2 Q2 Q2 3 V DS = 3V Q godr Gate Charge Overdrive Q 2.9 V GS = 4.5V, I D = 23A Q2 9.6 Q sw Switch Charge (Q gs2 + Q gd ) Q 6.5 Q2 6.8 Q oss Output Charge Q 4 nc V DS = 6V, V GS = 0V Q2 4 R G Gate Resistance Q 0.5 Q2 0.4 t d(on) Turn-On Delay Time Q Q Q2 7 V DS = 3V V GS = 4.5V t r Rise Time Q 33 I D = 4A, Rg =.8 Q2 54 ns t d(off) Turn-Off Delay Time Q 4 Q2 Q2 24 V DS = 3V V GS = 4.5V t f Fall Time Q 2 I D = 23A, Rg =.8 Q2 6 C iss Input Capacitance Q 735 Q V GS = 0V C oss Output Capacitance Q 493 pf V DS = 3V Q2 577 ƒ =.0MHz C rss Reverse Transfer Capacitance Q 37 Q International Rectifier September 26, 203
3 Avalanche Characteristics Parameter Typ. Q Max. Q2 Max. Units E AS Single Pulse Avalanche Energy 7 48 mj I AR Avalanche Current A Diode Characteristics Parameter Min. Typ. Max. Units Conditions I S Continuous Source Current Q 60 A MOSFET symbol (Body Diode) Q2 60 showing the I SM Pulsed Source Current Q 80 A integral reverse (Body Diode) Q2 525 p-n junction diode. V SD Diode Forward Voltage Q V T J = 25 C, I S = 4A, V GS = 0V Q T J = 25 C, I S = 27A, V GS = 0V t rr Reverse Recovery Time Q 9 29 ns Q T J = 25 C, I F = 30A Q V DD = 3V, di/dt = 200A/µs Q rr Reverse Recovery Charge Q 6 24 nc Q2 T J = 25 C, I F = 30A Q V DD = 3V, di/dt = 200A/µs International Rectifier September 26, 203
4 I D, Drain-to-Source Current (A) I D, Drain-to-Source Current (A) I D, Drain-to-Source Current (A) I D, Drain-to-Source Current (A) I D, Drain-to-Source Current (A) I D, Drain-to-Source Current (A) IRFHE4250DPbF 0 Q - Control FET VGS TOP V 5.0V 4.5V 4.0V 3.5V 3.25V 3.0V BOTTOM 2.75V 0 Q2 - Synchronous FET VGS TOP V 4.5V 4.0V 3.5V 3.25V 3.0V 2.75V BOTTOM 2.5V 2.5V 60µs PULSE WIDTH 2.75V Tj = 25 C 0. 0 Fig. Typical Output Characteristics 60µs PULSE WIDTH Tj = 25 C Fig 2. Typical Output Characteristics 0 VGS TOP V 5.0V 4.5V 4.0V 3.5V 3.25V 3.0V BOTTOM 2.75V 0 VGS TOP V 4.5V 4.0V 3.5V 3.25V 3.0V 2.75V BOTTOM 2.5V 2.75V 2.5V 0 60µs PULSE WIDTH Tj = 50 C 0. 0 Fig 3. Typical Output Characteristics 0 60µs PULSE WIDTH Tj = 50 C 0. 0 Fig 4. Typical Output Characteristics T J = 50 C T J = 50 C T J = 25 C T J = 25 C V DS = 5V 60µs PULSE WIDTH V GS, Gate-to-Source Voltage (V) Fig 5. Typical Transfer Characteristics V DS = 5V 60µs PULSE WIDTH V GS, Gate-to-Source Voltage (V) Fig 6. Typical Transfer Characteristics International Rectifier September 26, 203
5 I D, Drain-to-Source Current (A) I D, Drain-to-Source Current (A) V GS, Gate-to-Source Voltage (V) V GS, Gate-to-Source Voltage (V) C, Capacitance (pf) C, Capacitance (pf) IRFHE4250DPbF 00 Q - Control FET V GS = 0V, f = MHZ C iss = C gs + C gd, C ds SHORTED 000 Q2 - Synchronous FET V GS = 0V, f = MHZ C iss = C gs + C gd, C ds SHORTED C rss = C gd C oss = C ds + C gd C rss = C gd C oss = C ds + C gd C iss 00 0 C oss C iss C oss 0 C rss C rss Fig 7. Typical Capacitance vs. Drain-to-Source Voltage Fig 8. Typical Capacitance vs. Drain-to-Source Voltage I D = 30A V DS = 20V V DS = 3V I D = 30A V DS = 20V V DS = 3V Q G, Total Gate Charge (nc) Q G, Total Gate Charge (nc) Fig 9. Typical Gate Charge vs. Gate-to-Source Voltage 0 OPERATION IN THIS AREA LIMITED BY R DS (on) Limited by package msec µsec msec DC Tc = 25 C Tj = 50 C Single Pulse Fig. Maximum Safe Operating Area Fig. Typical Gate Charge vs. Gate-to-Source Voltage 00 0 OPERATION IN THIS AREA LIMITED BY R DS (on) Limited by package msec msec µsec Tc = 25 C Tj = 50 C DC Single Pulse Fig 2. Maximum Safe Operating Area International Rectifier September 26, 203
6 I SD, Reverse Drain Current (A) I SD, Reverse Drain Current (A) R DS(on), Drain-to-Source On Resistance (Normalized) R DS(on), Drain-to-Source On Resistance (Normalized) IRFHE4250DPbF.6.4 I D = 27A V GS = 4.5V Q - Control FET I D = 27A V GS = 4.5V Q2 - Synchronous FET T J, Junction Temperature ( C) Fig 3. Normalized On-Resistance vs. Temperature T J, Junction Temperature ( C) Fig 4. Normalized On-Resistance vs. Temperature 0 T J = 50 C T J = 50 C T J = 25 C T J = 25 C V GS = 0V V SD, Source-to-Drain Voltage (V) Fig 5. Typical Source-Drain Diode Forward Voltage V GS = 0V V SD, Source-to-Drain Voltage (V) Fig 6. Typical Source-Drain Diode Forward Voltage I D = 23A 3.0 I D = 27A R DS(on), Drain-to -Source On Resistance (m ) T J = 25 C T J = 25 C V GS, Gate -to -Source Voltage (V) R DS(on), Drain-to -Source On Resistance (m ) T J = 25 C T J = 25 C V GS, Gate -to -Source Voltage (V) Fig 7. Typical On-Resistance vs. Gate Voltage Fig 8. Typical On-Resistance vs. Gate Voltage International Rectifier September 26, 203
7 E AS, Single Pulse Avalanche Energy (mj) E AS, Single Pulse Avalanche Energy (mj) V GS(th), V GS(th), Gate threshold Voltage (V) Gate threshold Voltage (V) I D, I D, Drain Current (A) Drain Current (A) IRFHE4250DPbF Q - Control FET 350 Q2 - Synchronous FET 80 Limited By Package Limited By Package T C, Case Temperature ( C) Fig 9. Maximum Drain Current vs. Case Temperature T C, Case Temperature ( C) Fig 20. Maximum Drain Current vs. Case Temperature I D = 35µA.5.0 I D =.0mA T J, Temperature ( C ) T J, Temperature ( C ) Fig 2. Threshold Voltage vs. Temperature Fig 22. Threshold Voltage vs. Temperature I D TOP 8.6A 5A BOTTOM 32A I D TOP 8A 33A BOTTOM 63A Starting T J, Junction Temperature ( C) Fig 23. Maximum Avalanche Energy vs. Drain Current Starting T J, Junction Temperature ( C) Fig 24. Maximum Avalanche Energy vs. Drain Current International Rectifier September 26, 203
8 Thermal Response ( Z thjc ) C/W 0. D = SINGLE PULSE ( THERMAL RESPONSE ) Notes:. Duty Factor D = t/t2 2. Peak Tj = P dm x Zthjc + Tc 0.00 E-006 E t, Rectangular Pulse Duration (sec) Fig 25. Maximum Effective Transient Thermal Impedance, Junction-to-Case (Q) D = Thermal Response ( Z thjc ) C/W 0.00 SINGLE PULSE ( THERMAL RESPONSE ) Notes:. Duty Factor D = t/t2 2. Peak Tj = P dm x Zthjc + Tc E-007 E-006 E t, Rectangular Pulse Duration (sec) Fig 26. Maximum Effective Transient Thermal Impedance, Junction-to-Case (Q2) 0 Avalanche Current (A) Allowed avalanche Current vs avalanche pulsewidth, tav, assuming Tj = 25 C and Tstart =25 C (Single Pulse) Allowed avalanche Current vs avalanche pulsewidth, tav, assuming j = 25 C and Tstart = 25 C. 0..0E-06.0E-05.0E-04.0E-03.0E-02.0E-0 tav (sec) Fig 27. Single Avalanche Event: Pulse Current vs. Pulse Width (Q) International Rectifier September 26, 203
9 0 Avalanche Current (A) Allowed avalanche Current vs avalanche pulsewidth, tav, assuming Tj = 25 C and Tstart =25 C (Single Pulse) Allowed avalanche Current vs avalanche pulsewidth, tav, assuming j = 25 C and Tstart = 25 C..0E-06.0E-05.0E-04.0E-03.0E-02.0E-0 tav (sec) Fig 28. Single Avalanche Event: Pulse Current vs. Pulse Width (Q2) International Rectifier September 26, 203
10 Fig 29. Peak Diode Recovery dv/dt Test Circuit for N-Channel HEXFET Power MOSFETs V (BR)DSS 5V tp V DS L DRIVER R G 20V tp D.U.T I AS V DD A I AS Fig 30a. Unclamped Inductive Test Circuit Fig 30b. Unclamped Inductive Waveforms Fig 3a. Switching Time Test Circuit Fig 3b. Switching Time Waveforms Vds Id Vgs VDD Vgs(th) Qgs Qgs2 Qgd Qgodr Fig 32a. Gate Charge Test Circuit Fig 32b. Gate Charge Waveform International Rectifier September 26, 203
11 Dual PQFN 6x6 Outline Package Details For more information on board mounting, including footprint and stencil recommendation, please refer to application note AN-36: For more information on package inspection techniques, please refer to application note AN-54: Note: For the most current drawing please refer to IR website at International Rectifier September 26, 203
12 Dual PQFN 6x6 Outline Tape and Reel Note: For the most current drawing please refer to IR website at Qualification Information Qualification level Industrial (per JEDEC JESD47F guidelines ) Moisture Sensitivity Level RoHS Compliant DUAL PQFN 6mm x 6mm Yes MSL2 (per JEDEC J-STD-020D ) Qualification standards can be found at International Rectifier s web site Applicable version of JEDEC standard at the time of product release. Notes: Repetitive rating; pulse width limited by max. junction temperature. Starting T J = 25 C, Q: L = 0.4 mh, R G = 50, I AS = 32A; Q2: L = 0.24 mh, R G = 50, I AS = 63A. Pulse width 400µs; duty cycle 2%. R is measured at T J approximately 90 C. When mounted on inch square PCB (FR-4). Please refer to AN-994 for more details: Calculated continuous current based on maximum allowable junction temperature. Current is limited to Q = 60A & Q2 = 60A by source bonding technology. Pulsed drain current is limited to 240A by source bonding technology. IR WORLD HEADQUARTERS: N. Sepulveda Blvd., El Segundo, California 90245, USA To contact International Rectifier, please visit International Rectifier September 26, 203
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Features Advanced Process Technology Ultra Low On-Resistance Dynamic dv/dt Rating 75 C Operating Temperature Fast Switching Repetitive Avalanche Allowed up to Tjmax Lead-Free, RoHS Compliant Automotive
More informationIRFR3704Z IRFU3704Z HEXFET Power MOSFET
Applications l High Frequency Synchronous Buck Converters for Computer Processor Power l High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Industrial Use Benefits
More informationIRFR1018EPbF IRFU1018EPbF
PD - 9729A IRFR8EPbF IRFU8EPbF Applications l High Efficiency Synchronous Rectification in SMPS l Uninterruptible Power Supply l High Speed Power Switching l Hard Switched and High Frequency Circuits Benefits
More informationIRF6646 DirectFET Power MOSFET
Typical R DS(on) (Ω) V GS, Gate-to-Source Voltage (V) l RoHS compliant containing no lead or bromide l Low Profile (
More informationIRF3709ZCS IRF3709ZCL
PD - 95836 IRF3709ZCS IRF3709ZCL Applications l High Frequency Synchronous Buck Converters for Computer Processor Power HEXFET Power MOSFET V DSS R DSon) max Qg 30V 6.3m: 7nC Benefits l l l Low R DSon)
More informationIRLS3036PbF IRLSL3036PbF HEXFET Power MOSFET
Applications l DC Motor Drive l High Efficiency Synchronous Rectification in SMPS l Uninterruptible Power Supply l High Speed Power Switching l Hard Switched and High Frequency Circuits G D S PD -97358
More informationIRL3714Z IRL3714ZS IRL3714ZL
Applications l High Frequency Synchronous Buck Converters for Computer Processor Power PD - 94798 IRL3714Z IRL3714ZS IRL3714ZL HEXFET Power MOSFET V DSS R DS(on) max Qg 20V 16m: 4.8nC Benefits l l l Low
More informationV DSS R DS(on) max Qg. 380 P C = 25 C Maximum Power Dissipation 89 P C = 100 C Maximum Power Dissipation Linear Derating Factor
Applications l High Frequency Synchronous Buck Converters for Computer Processor Power l High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Industrial Use Benefits
More informationAUIRLS3034-7P AUTOMOTIVE GRADE. HEXFET Power MOSFET
Features Advanced Process Technology Ultra Low On-Resistance Logic Level Gate Drive Dynamic dv/dt Rating 175 C Operating Temperature Fast Switching Repetitive Avalanche Allowed up to Tjmax Lead-Free, RoHS
More information40V V DSS. R DS(on) typ. I D (Silicon Limited) I D (Package Limited) 409Ac 195A. HEXFET Power MOSFET
R DS(on), Drainto Source On Resistance (m ) I D, Drain Current (A) PD 97782A Applications StrongIRFET l Brushed Motor drive applications l BLDC Motor drive applications l Battery powered circuits l Halfbridge
More informationAUIRFR4105Z AUIRFU4105Z
Features Advanced Process Technology Ultra Low On-Resistance 175 C Operating Temperature Fast Switching Repetitive Avalanche Allowed up to Tjmax Lead-Free, RoHS Compliant Automotive Qualified * AUTOMOTIVE
More informationIR MOSFET StrongIRFET IRFP7718PbF
I D, Drain Current (A) IR MOSFET StrongIRFET Application Brushed Motor drive applications BLDC Motor drive applications Battery powered circuits Half-bridge and full-bridge topologies Synchronous rectifier
More informationIRLS3034PbF IRLSL3034PbF
PD -97364A IRLS334PbF IRLSL334PbF Applications l DC Motor Drive l High Efficiency Synchronous Rectification in SMPS l Uninterruptible Power Supply l High Speed Power Switching l Hard Switched and High
More informationAUTOMOTIVE GRADE. Base part number Package Type Standard Pack Orderable Part Number
Features Advanced Process Technology Ultra Low On-Resistance 175 C Operating Temperature Fast Switching Repetitive Avalanche Allowed up to Tjmax Lead-Free, RoHS Compliant Automotive Qualified * AUTOMOTIVE
More informationIRFS3004-7PPbF HEXFET Power MOSFET
PD 97378A HEXFET Power MOSFET Applications l High Efficiency Synchronous Rectification in SMPS l Uninterruptible Power Supply l High Speed Power Switching l Hard Switched and High Frequency Circuits Benefits
More informationAUIRFR540Z AUIRFU540Z
AUTOMOTIVE GRADE AUIRFR540Z AUIRFU540Z Application Automatic Voltage Regulator (AVR) Solenoid Injection Body Control Low Power Automotive Applications V DSS HEXFET Power MOSFET 0V R DS(on) typ. 22.5m I
More informationTO-220AB IRFB4410. W/ C V GS Gate-to-Source Voltage ± 20 dv/dt Peak Diode Recovery f 19
Applications l High Efficiency Synchronous Rectification in SMPS l Uninterruptible Power Supply l High Speed Power Switching l Hard Switched and High Frequency Circuits Benefits l Improved Gate, Avalanche
More informationAUTOMOTIVE GRADE. Thermal Resistance Symbol Parameter Typ. Max. Units R JC Junction-to-Case 1.32 R JA Junction-to-Ambient ( PCB Mount) 50 C/W
Features Advanced Process Technology Ultra Low On-Resistance 75 C Operating Temperature Fast Switching Repetitive Avalanche Allowed up to Tjmax Lead-Free, RoHS Compliant Automotive Qualified * AUTOMOTIVE
More informationAUTOMOTIVE GRADE C T STG
AUTOMOTIVE GRADE AUIRFN845 Features Advanced Process Technology Ultra Low On-Resistance 75 C Operating Temperature Fast Switching Repetitive Avalanche Allowed up to Tjmax Lead-Free, RoHS Compliant Automotive
More informationIRFS4127PbF IRFSL4127PbF
Applications l High Efficiency Synchronous Rectification in SMPS l Uninterruptible Power Supply l High Speed Power Switching l Hard Switched and High Frequency Circuits Benefits l Improved Gate, Avalanche
More informationV DSS R DS(on) max I D 80V GS = 10V 3.6A
HEXFET Power MOSFET Applications High frequency DC-DC converters Lead-Free l l V DSS R DS(on) max I D 80V 73m:@ = 0V 3.6A Benefits l Low Gate to Drain Charge to Reduce Switching Losses l Fully Characterized
More informationIRFB3507PbF IRFS3507PbF IRFSL3507PbF
Applications l High Efficiency Synchronous Rectification in SMPS l Uninterruptible Power Supply l High Speed Power Switching l Hard Switched and High Frequency Circuits l Lead-Free G D S V DSS IRFB357PbF
More informationIR MOSFET StrongIRFET IRF60B217
I D, Drain Current (A) IR MOSFET StrongIRFET IRF6B27 HEXFET Power MOSFET Application Brushed Motor drive applications BLDC Motor drive applications Battery powered circuits Half-bridge and full-bridge
More informationSMPS MOSFET. V DSS R DS(on) max I D
SMPS MOSFET Applications l Switch Mode Power Supply (SMPS) l Motor Drive l Bridge Converters l All Zero Voltage Switching Benefits l Low Gate Charge Qg results in Simple Drive Requirement l Improved Gate,
More informationV DSS R DS(on) max Qg. 30V 3.3m: 34nC
Applications l High Frequency Synchronous Buck Converters for Computer Processor Power l High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Industrial Use Benefits
More informationV DSS. 40V R DS(on) typ. 1.4mΩ max. 1.8mΩ 250Ac. I D (Silicon Limited) I D (Package Limited) 195A. HEXFET Power MOSFET.
R DS (on), Drain-to -Source On Resistance (mω) I D, Drain Current (A) Applications l Brushed Motor drive applications l BLDC Motor drive applications l Battery powered circuits l Half-bridge and full-bridge
More informationV DSS R DS(on) max (mw)
Typical Applications Relay replacement Anti-lock Braking System Air Bag Benefits Advanced Process Technology Ultra Low On-Resistance Fast Switching Repetitive Avalanche Allowed up to Tjmax AUTOMOTIVE MOSFET
More informationSMPS MOSFET. V DSS R DS(on) max I D
PD - 95355A SMPS MOSFET IRFR5N20DPbF IRFU5N20DPbF HEXFET Power MOSFET Applications High frequency DC-DC converters Lead-Free l l V DSS R DS(on) max I D 200V 65Ω 7A Benefits Low Gate-to-Drain Charge to
More informationAUIRLS3034 AUTOMOTIVE GRADE. HEXFET Power MOSFET
Features Advanced Process Technology Ultra Low On-Resistance Logic Level Gate Drive Dynamic dv/dt Rating 175 C Operating Temperature Fast Switching Repetitive Avalanche Allowed up to Tjmax Lead-Free, RoHS
More informationIRF6602/IRF6602TR1 HEXFET Power MOSFET
l Application Specific MOSFETs l Ideal for CPU Core DC-DC Converters l Low Conduction Losses l Low Switching Losses l Low Profile (
More information1412 P C = 25 C Maximum Power Dissipation 300 Linear Derating Factor. V/ns T J. Thermal Resistance Symbol Parameter Typ. Max.
PD 9699A HEXFET Power MOSFET Applications l High Efficiency Synchronous Rectification in SMPS l Uninterruptible Power Supply l High Speed Power Switching l Hard Switched and High Frequency Circuits G D
More informationSMPS MOSFET. V DSS R DS(on) max I D
SMPS MOSFET PD - 94445 HEXFET Power MOSFET Applications l High frequency DC-DC converters V DSS R DS(on) max I D 50V 85mΩ@V GS = V 2.6A Benefits l Low Gate to Drain Charge to Reduce Switching Losses l
More informationSMPS MOSFET. V DSS R DS(on) max I D
SMPS MOSFET Applications l Switch Mode Power Supply (SMPS) l Motor Drive l Bridge Converters l All Zero Voltage Switching l Lead-Free Benefits l Low Gate Charge Qg results in Simple Drive Requirement l
More informationV DSS. W/ C V GS Gate-to-Source Voltage ±30 E AS (Thermally limited) mj T J Operating Junction and -55 to + 175
PD 976 Applications l Motion Control Applications l High Efficiency Synchronous Rectification in SMPS l Uninterruptible Power Supply l Hard Switched and High Frequency Circuits Benefits l Low R DSON Reduces
More informationIRFR24N15DPbF IRFU24N15DPbF
PD - 95370B IRFR24N5DPbF IRFU24N5DPbF Applications l High frequency DC-DC converters HEXFET Power MOSFET S R DS(on) max I D 50V 95mΩ 24A Benefits l Low Gate-to-Drain Charge to Reduce Switching Losses l
More informationW/ C V GS Gate-to-Source Voltage ± 20 dv/dt Peak Diode Recovery f 5.3
PD 9638 Applications l High Efficiency Synchronous Rectification in SMPS l Uninterruptible Power Supply l High Speed Power Switching l Hard Switched and High Frequency Circuits l LeadFree Benefits l Improved
More informationAUTOMOTIVE MOSFET. A I T C = 25 C Continuous Drain Current, V 10V (Package Limited)
Features l Advanced Process Technology l Ultra Low On-Resistance l 175 C Operating Temperature l Fast Switching l Repetitive Avalanche Allowed up to Tjmax AUTOMOTIVE MOSFET Description Specifically designed
More informationSMPS MOSFET. V DSS R DS(on) max I D
PD - 95353A SMPS MOSFET IRFR12N25DPbF IRFU12N25DPbF HEXFET Power MOSFET Applications High frequency DC-DC converters Lead-Free l l V DSS R DS(on) max I D 250V 0.26Ω 14A Benefits Low Gate-to-Drain Charge
More informationAUTOMOTIVE GRADE. Orderable Part Number AUIRFZ44Z TO-220 Tube 50 AUIRFZ44Z AUIRFZ44ZS D 2 Tube 50 AUIRFZ44ZS Tape and Reel Left 800 AUIRFZ44ZSTRL
Features Advanced Process Technology Ultra Low On-Resistance 175 C Operating Temperature Fast Switching Repetitive Avalanche Allowed up to Tjmax Lead-Free, RoHS Compliant Automotive Qualified * AUTOMOTIVE
More informationSMPS MOSFET HEXFET Power MOSFET. V DSS R DS(on) max I D. 320 P C = 25 C Power Dissipation 260 Linear Derating Factor.
Applications l High frequency DC-DC converters l UPS and Motor Control l Lead-Free Benefits l Low Gate-to-Drain Charge to Reduce Switching Losses l Fully Characterized Capacitance Including Effective C
More informationSMPS MOSFET. V DSS R DS(on) max I D
SMPS MOSFET PD - 9506A IRFR8N5DPbF IRFU8N5DPbF HEXFET Power MOSFET Applications High frequency DC-DC converters Lead-Free l l V DSS R DS(on) max I D 50V 0.25Ω 8A Benefits l Low Gate to Drain Charge to
More informationTO-220AB IRFB3307. W/ C V GS Gate-to-Source Voltage ± 20 dv/dt Peak Diode Recovery f 11. V/ns T J Operating Junction and -55 to
Applications l High Efficiency Synchronous Rectification in SMPS l Uninterruptible Power Supply l High Speed Power Switching l Hard Switched and High Frequency Circuits Benefits l Improved Gate, Avalanche
More informationC Soldering Temperature, for 10 seconds 300 (1.6mm from case ) Mounting Torque, 6-32 or M3 screw 1.1 (10) N m (lbf in)
Typical Applications l Industrial Motor Drive Features l Advanced Process Technology l Ultra Low On-Resistance l 175 C Operating Temperature l Fast Switching l Repetitive Avalanche Allowed up to Tjmax
More informationV DSS R DS(on) max I D
PD - 95258A IRFL435PbF HEXFET Power MOSFET Applications l High frequency DC-DC converters V DSS R DS(on) max I D 50V 85mW@V GS = V 2.6A Benefits l Low Gate to Drain Charge to Reduce Switching Losses l
More informationW/ C V GS Gate-to-Source Voltage ± 20 dv/dt Peak Diode Recovery e 13
PD 97344 Applications l High Efficiency Synchronous Rectification in SMPS l Uninterruptible Power Supply l High Speed Power Switching l Hard Switched and High Frequency Circuits Benefits l Improved Gate,
More informationW/ C V GS Gate-to-Source Voltage ± 20 dv/dt Peak Diode Recovery e 26
PD 97343 IRFS47PPbF HEXFET Power MOSFET Applications l High Efficiency Synchronous Rectification in SMPS l Uninterruptible Power Supply l High Speed Power Switching l Hard Switched and High Frequency Circuits
More informationAUTOMOTIVE MOSFET. 30 Pulsed Drain Current c. I DM P C = 25 C Maximum Power Dissipation 120 Linear Derating Factor
Features l Advanced Process Technology l Ultra Low On-Resistance l Dynamic dv/dt Rating l 175 C Operating Temperature l Fast Switching l Repetitive Avalanche Allowed up to Tjmax AUTOMOTIVE MOSFET S Description
More informationSMPS MOSFET. V DSS R DS(on) max I D
Absolute Maximum Ratings SMPS MOSFET Applications l High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Industrial Use l High Frequency Buck Converters for Server Processor
More informationV DSS R DS(on) max Qg
Applications l High Frequency Synchronous Buck Converters for Computer Processor Power l High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Consumer Use l Lead-Free
More information8 S1, D2. Storage Temperature Range Soldering Temperature, for 10 seconds 300 (1.6mm from case )
Co-Pack Dual N-channel HEXFET Power MOSFET and Schottky Diode Ideal for Synchronous Buck DC-DC Converters Up to A Peak Output Low Conduction Losses Low Switching Losses Low Vf Schottky Rectifier D D 2
More information