FEATURES. Parameter Symbol Limit Unit Gate-Source Voltage V GS ± 20 V I D T C = 100 C
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1 N-Channel 6 V (D-S) Super Junction Power MOSFET DTK63SJ PRODUCT SUMMARY V DS (V) R DS(on) ( ) I D (A) a.35 at V GS = V at V GS = 4.5 V FEATURES 75 C Junction Temperature TrenchFET II Power MOSFET Material categorization: TO-263 D G Top View G D S S N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS (T C = 25 C, unless otherwise noted) Parameter Symbol Limit Unit Gate-Source Voltage V GS ± 2 V T Continuous Drain Current (T J = 75 C) b C = 25 C 3 I D T C = C a Pulsed Drain Current I DM 48 Continuous Source Current (Diode Conduction) I S a Avalanche Current I AS Single Avalanche Energy (Duty Cycle %) L =. mh E AS 5 mj T C = 25 C 8 Maximum Power Dissipation P D W T A = 25 C 3 b, 8.5 b, c Operating Junction and Storage Temperature Range T J, T stg - 55 to 75 C A THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit Maximum Junction-to-Ambient a t sec 5 8 R thja Steady State 4 5 C/W Maximum Junction-to-Case R thjc.85. Notes: a. Package limited. b. Surface mounted on " x " FR4 board. c. t s.
2 SPECIFICATIONS (T J = 25 C, unless otherwise noted) Parameter Symbol Test Conditions Min. Typ. a Max. Unit Static Drain-Source Breakdown Voltage V DS V GS = V, I D = 25 µa 6 Gate Threshold Voltage V GS(th) V DS = V GS, I D = 25 µa Gate-Body Leakage I GSS V DS = V, V GS = ± 2 V ± na Zero Gate Voltage Drain Current I DSS V DS = 48 V, V GS = V, T J = 25 C 5 V DS = 48 V, V GS = V Notes: a. For design aid only; not subject to production testing. b. Pulse test; pulse width 3 µs, duty cycle 2 %. c. Independent of operating temperature. V DS = 48 V, V GS = V, T J = 75 C 25 On-State Drain Current b I D(on) V DS = 5 V, V GS = V 3 A Drain-Source On-State Resistance b R DS(on) V GS = V, I D = 2 A.35.4 V GS = V, I D = 2 A, T J = 25 C.4.5 V GS = V, I D = A, T J = 75 C V GS = 4.5 V, I D = 5 A.42.5 Forward Transconductance b g fs V DS = 48 V, I D = 2 A 5 S Dynamic Input Capacitance C iss Output Capacitance C oss V GS = V, V DS = 48 V, f = MHz 67 Reverse Transfer Capacitance C rss 23 Total Gate Charge c Q g V DS = 48 V, V GS = V, I D = 2 A Gate-Source Charge c Q gs 2 Gate-Drain Charge c Q gd 8.5 Turn-On Delay Time c t d(on) Rise Time c t r V DD = 48 V, R L = Turn-Off Delay Time c t d(off) I D 2 A, V GEN = V, R g = Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability Fall Time c t f 2 2 Source-Drain Diode Ratings and Characteristics (T C = 25 C) DTK63SJ Pulsed Current I SM 3 A Diode Forward Voltage V SD I F = 2 A, V GS = V.2 V Reverse Recovery Time t rr I F = 2 A, di/dt = A/µs 45 ns 2.5 V µa pf nc ns 2
3 TYPICAL CHARACTERISTICS (25 C unless noted) DTK63SJ 8 V GS = thru 5 V V 2 2 V, 3 V V DS - Drain-to-Source Voltage (V) 6 4 T C = 25 C 2 25 C - 55 C V GS - Gate-to-Source Voltage (V) Output Characteristics Transfer Characteristics 2. - Transconductance (S) g fs T C = - 55 C 25 C 25 C R DS(on) V GS = 4.5 V V GS = V Transconductance On-Resistance vs. Drain Current 6 C - Capacitance (pf) C iss C oss C rss V DS - Drain-to-Source Voltage (V) Capacitance - Gate-to-Source Voltage (V) V GS V DS = 3 V I D = 2 A Q g - Total Gate Charge (nc) Gate Charge 3
4 TYPICAL CHARACTERISTICS (25 C unless noted) DTK63SJ 2.5 R DS(on) - On-Resistance (Normalized) V GS = V I D = 2 A - Source Current (A) I S T J = 5 C T J = 25 C T J - Junction Temperature ( C) On-Resistance vs. Junction Temperature V SD - Source-to-Drain Voltage (V) Source-Drain Diode Forward Voltage 4
5 THERMAL RATINGS DTK63SJ Limited by R DS(on)* µs µs ms ms ms DC 25. T C = 25 C Single Pulse T A - Ambient Temperature ( C) Maximum Drain Current vs. Ambient Temperature.. V DS - Drain-to-Source Voltage (V) * V GS > minimum V GS at which R DS(on) is specified Safe Operating Area 2 Duty Cycle =.5 Normalized Effective Transient Thermal Impedance Single Pulse Square Wave Pulse Duration (s) Normalized Thermal Transient Impedance, Junction-to-Case 5
6 Package Information TO-263 (D 2 PAK): 3-LEAD -B- E -A- A c2 D4 L2 E K E3 D L3 L D D2 D3 6 A A e b2 b Detail A c E2. M A M 2 PL - 5 L L4 DETAIL A (ROTATED 9 ) M b b SECTION A-A Notes. Plane B includes maximum features of heat sink tab and plastic. 2. No more than 25 % of L can fall above seating plane by max. 8 mils. 3. Pin-to-pin coplanarity max. 4 mils. 4. *: Thin lead is for SUB, SYB. Thick lead is for SUM, SYM, SQM. 5. Use inches as the primary measurement. 6. This feature is for thick lead. c c INCHES MILLIMETERS DIM. MIN. MAX. MIN. MAX. A b b b c* Thin lead Thick lead c Thin lead Thick lead c D D D D D E E E E e. BSC 2.54 BSC K L L L L L4. BSC.254 BSC M ECN: T3-77-Rev. K, 3-Sep-3 DWG: 5843
7 Package Information RECOMMENDED MINIMUM PADS FOR D 2 PAK: 3-Lead.42 (.668).635 (6.29).355 (9.7).45 (3.683).35 (3.429).2 (5.8).5 (.257) Recommended Minimum Pads Dimensions in Inches/(mm)
8 Disclaimer Legal Disclaimer Notice ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Din-Tek Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, Din-Tek ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Din-Tek makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Din-Tek disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Din-Tek s knowledge of typical requirements that are often placed on Din-Tek products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer s technical experts. Product specifications do not expand or otherwise modify Din-Tek s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Din-Tek products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Din-Tek product could result in personal injury or death. Customers using or selling Din-Tek products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Din-Tek personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Din-Tek. Product names and markings noted herein may be trademarks of their respective owners. Material Category Policy Din-Tek Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the definitions and restrictions defined under Directive 2/65/EU of The European Parliament and of the Council of June 8, 2 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (EEE) - recast, unless otherwise specified as non-compliant. Please note that some Din-Tek documentation may still make reference to RoHS Directive 22/95/EC. We confirm that all the products identified as being compliant to Directive 22/95/EC conform to Directive 2/65/EU. Din-Tek Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS79A standards. Please note that some Din-Tek documentation may still make reference to the IEC definition. We confirm that all the products identified as being compliant to IEC conform to JEDEC JS79A standards.
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