STANDARDIZED MILITARY DRAWING REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED M. A. Frye

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1 REVISIONS LTR DESCRIPTION DTE (YR-MO-D) PPROVED dd case outline 3. dd vendor CGE ES66. Made changes to tables I and II, and figures and M.. Frye REV REV REV STTUS OF S REV PMIC N/ MILITRY DRWING THIS DRWING IS VILBLE FOR USE BY LL DEPRTMENTS ND GENCIES OF THE DEPRTMENT OF DEFENSE MSC N/ PREPRED BY Rick C. Officer CHECKED BY Charles E. Besore PPROVED BY Michael. Frye DRWING PPROVL DTE 7 ugust 989 DYTON OHIO MICROCIRCUIT, LINER, 8-BIT /D CONVERTERS, HIGH SPEED, MONOLITHIC SILICON CGE CODE OF 2 DESC FORM 93 Use previous edition until exhausted. JUL E45 DISTRIBUTION STTEMENT. pproved for public release; distribution is unlimited.

2 . SCOPE. Scope. This drawing describes device requirements for class B microcircuits in accordance with.2. of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-jn devices"..2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example: L X Drawing number Device type Case outline Lead finish per (.2.) (.2.2) MIL-M Device type(s). The device type(s) shall identify the circuit function as follows: Device type Generic number Circuit function Total unadjusted error 7824T 4-channel 8-bit DC ±. LSB U 4-channel 8-bit DC ±.5 LSB T 8-channel 8-bit DC ±. LSB U 8-channel 8-bit DC ±.5 LSB.2.2 Case outline(s). The case outline(s) shall be as designated in appendix C of MIL-M-385, and as follows: Outline letter Case outline L D-9 (24-lead,.28" x.3" x.2"), dual-in-line package X D- (28-lead,.49" x.6" x.232"), dual-in-line package 3 C-4 (28-terminal,.46" x.46" x."), leadless chip carrier package.3 bsolute maximum ratings. V DD to ground range... V dc to +7 V dc Digital input voltage to ground... (RD, CS,, and 2)-.3 V dc to V DD Digital output voltage to ground (DB, DB7, RDY and INT) V dc to V DD V REF(+) to ground... V REF(-) to VDD V REF(-) to ground... V dc to V REF(+) nalog input, any channel V dc to V DD Storage temperature range (C to +5(C Lead temperature (soldering, seconds)... +3(C Power dissipation (P D) mw / Thermal resistance, junction-to-case ( JC)... See MIL-M-385, appendix C Thermal resistance, junction-to-ambient ( J) (all cases)... 2(C/W Junction temperature (T J) (C.4 Recommended operating conditions. Supply voltage range (V DD) V dc to V dc Positive reference voltage (V REF+) V dc Negative reference voltage (V REF-)... V dc Ground potential (GND)... V dc mbient operating temperature range (T ) (C to +25(C / Derate above T = +75(C at 6. mw/(c for case outlines L, X, and 3. 2 DESC FORM 93 JUL 9

3 2. PPLICBLE DOCUMENTS 2. Government specification, standard, and bulletin. Unless otherwise specified, the following specification, standard, and bulletin of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. SPECIFICTION MILITRY MIL-M Microcircuits, General Specification for. STNDRD MILITRY MIL-STD Test Methods and Procedures for Microelectronics. BULLETIN MILITRY MIL-BUL-3 - List of Standardized Military Drawings (SMD's). (Copies of the specification, standard, and bulletin required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing shall take precedence. 3. REQUIREMENTS 3. Item requirements. The individual item requirements shall be in accordance with.2. of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-jn devices" and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-M-385 and herein Case outline(s). The case outline(s) shall be in accordance with.2.2 herein Terminal connections. The terminal connections shall be as specified on figure Truth table. The truth table shall be as specified on figure Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-STD-883 (see 3. herein). The part shall be marked with the PIN listed in.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-BUL-3 (see 6.6 herein). 3.6 Certificate of compliance. certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-BUL-3 (see 6.6 herein). The certificate of compliance submitted to DESC-ECS prior to listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-STD-883 (see 3. herein) and the requirements herein. 3.7 Certificate of conformance. certificate of conformance as required in MIL-STD-883 (see 3. herein) shall be provided with each lot of microcircuits delivered to this drawing. 3 DESC FORM 93 JUL 9

4 ,, TBLE I. Electrical performance characteristics. Test Symbol Conditions / 2/ -55(C T +25(C unless otherwise specified Group subgroups Device Type Min Limits Max Unit Resolution RES Guaranteed minimum resolution for which no codes are missing, 2, 3 ll 8. Bits Total unadjusted error 3/ TUE, 2, 3, 3 ±. LSB 2, 4 ±. LSB 2, 3, 2 ±.5 nalog input leakage current Reference input resistance 4/ I IN ny channel, 2, 3 ll ±3. µ R IN, 2, 3 ll. 4. k6 Digital input high voltage Digital input low voltage V IH,, 2, 5/, RD, CS V IL,, 2, 5/, RD, CS 2, 3 ll 2.4 V 2, 3 ll.8 V Digital input high current Digital input low current I IH CS, RD,,, 2, 5/, 2, 3 ll. µ I IL CS, RD,,, 2, 5/, 2, 3 ll -. µ Digital output high voltage Digital output low voltage Floating state leakage current V OH V OL I OUT DB O - DB 7, INT, I SOURCE = 36 µ DB O - DB 7, INT, I SINK =.6 m 6/, 2, 3 ll 4. V, 2, 3 ll.4 V RDY, I = 2.6 m 6/ SINK, 2, 3 ll.4 V DB - DB only O 7, 2, 3 ll 3. µ Supply current from V DD I DD CS = RD = 2.4 V, 2, 3 ll 2 m See footnotes at end of table. 4 DESC FORM 93 JUL 9

5 CS to CS to RD to TBLE I. Electrical performance characteristics - Continued. Test Symbol Conditions / 2/ -55(C T +25(C unless otherwise specified Group subgroups Device Type Min Limits Max Unit Power supply sensitivity PSS V = +5. V ±5.% DD, 2, 3 ll ±.25 LSB nalog input capacitance 4/ C IN V to 5. V, T = +25(C 4 ll 45 pf Digital input capacitance 4/ C IN2 T = +25(C, CS, RD,,, 2, 5/ 4 ll 8. pf Digital output capacitance 4/ Slew rate tracking 4/ C OUT SR T = +25(C 4 ll 8. pf T = +25(C 4 ll.57 V/µs Functional tests See 4.3.d and figure 2 7, 8 ll RD setup time t CSS See figure 3 9,, ll ns CS to RD hold time t CSH See figure 3 9,, ll ns RDY delay t RDY C = 5 pf, L pull-up resistor = 5. k6, See figure 3 9 ll 4 ns, 6 Conversion time, mode Data access time after RD, mode t CRD See figure 3 9 ll 2. µs, 2.8 t CC See figure 3 7/ 8/ 9 ll 85 ns, 2 INT delay t INTH C L = 5 pf 9 ll 75 ns, See footnotes at end of table. 5 DESC FORM 93 JUL 9

6 TBLE I. Electrical performance characteristics - Continued. Test Symbol Conditions / 2/ -55(C T +25(C unless otherwise specified Group subgroups Device Type Min Limits Max Unit Data hold time t DH See figure 3 and 4 9/ 9 ll 6 ns, 7 Delay time between conversions Read pulse width, mode Data access time after INT Multiplexer address setup time Multiplexer address hold time t p See figure 3 9 ll 5 ns, 6 t RD See fiure 3 9 ll 6 6 ns, 8 4 t CC2 See figure 3 7/ 8/ 9 ll 5 ns, 7 t S See figure 3 9,, ll ns t H See figure 3 9 ll 3 ns, 4 / V DD = +5. V, V REF(+) = +5. V, and V REF(-) = GND = V unless otherwise specified. Specifications apply for mode. ll input control signals are specified with t r = t f = 2 ns (% to 9% of +5. V) and timed from a voltage level of +.6 V. 2/ Subgroups and, if not tested, shall be guaranteed to the limits specified in table I. 3/ Total unadjusted error includes offset, full scale, and linearity errors. 4/ The (C IN, C IN2, R IN, C OUT, and SR measurements) are measured initially and after any process or design changes which may affect these tests. 5/ 2 applies to device types 3 and 4 only. 6/ RDY is an open drain output. 7/ Measured with load circuits of figure 5 and defined as the time required for an output to cross.8 V or 2.4 V. 8/ If not tested, shall be guaranteed to the limits specified in table I herein. 9/ Defined as the time required for the data lines to change.5 V when loaded with the circuits of figure 4 and is measured only for the initial test and after process or design changes which may affect t DH. 6 DESC FORM 93 JUL 9

7 RD INT CS RD INT CS Device types and 2 3 and 4 Case outlines L X and 3 Terminal number Terminal symbol Terminal symbol IN 4 IN 3 IN 2 IN NC DB DB DB2 DB3 GND V REF(-) V REF(+) RDY DB4 DB5 DB6 DB7 NC V DD IN 6 IN 5 IN 4 IN 3 IN 2 IN NC DB DB DB2 DB3 GND V REF(-) V REF(+) RDY DB4 DB5 DB6 DB7 2 V DD IN 8 IN 7 NC = No connection FIGURE. Terminal connections. 7 DESC FORM 93 JUL 9

8 Device types and 2 Device types 3 and 4 Channel 2 IN IN 2 IN 3 IN 4 IN 5 IN 6 IN 7 IN 8 = logic low state = Logic high state FIGURE 2. Truth table. 8 DESC FORM 93 JUL 9

9 NOTES:. ll input signal rise and fall times are measured from % to 9% of +5. V, t = t =2 ns. 2. Timing measurements reference level is (V IN + V IL)/2. FIGURE 3. Timing diagram. 9 DESC FORM 93 JUL 9

10 FIGURE 4. Load circuits for data. FIGURE 5. Load circuits for data access time. DESC FORM 93 JUL 9

11 3.8 Notification of change. Notification of change to DESC-ECS shall be required in accordance with MIL-STD-883 (see 3. herein). 3.9 Verification and review. DESC, DESC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. QULITY SSURNCE PROVISIONS 4. Sampling and inspection. Sampling and inspection procedures shall be in accordance with section 4 of MIL-M-385 to the extent specified in MIL-STD-883 (see 3. herein). 4.2 Screening. Screening shall be in accordance with method 54 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 5 of MIL-STD-883. () Test condition, B, C, or D using the circuit submitted with the certificate of compliance (see 3.6 herein). (2) T = +25(C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 55 of MIL-STD-883 including groups, B, C, and D inspections. The following additional criteria shall apply Group inspection. a. Tests shall be as specified in table II herein. b. Subgroups 5 and 6 in table I, method 55 of MIL-STD-883 shall be omitted. c. Subgroup 4 (C, C, R, C, and SR measurements) shall be measured only for the initial test and after process IN IN2 IN OUT or design changes which may affect input capacitance. d. Subgroups 7 and 8 tests shall include verification of the truth table. e. Subgroup 2 test is used for grading and part selection at T = +25(C, and is not included in PD calculations Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 5 of MIL-STD-883. () Test condition, B, C, or D using the circuit submitted with the certificate of compliance (see 3.6 herein). (2) T = +25(C, minimum. (3) Test duration:, hours, except as permitted by method 5 of MIL-STD-883. DESC FORM 93 JUL 9

12 TBLE II. Electrical test requirements. MIL-STD-883 test requirements Interim electrical parameters (method 54) Final electrical test parameters (method 54) Group test requirements (method 55) Groups C and D end-point electrical parameters (methgod 55) Subgroups (per method 55, table I) *, 2, 3, 7, 2, 2, 3, 4**, 7, 8, 9, ***, ***, 2**** * PD applies to subgroup. ** See 4.3.c. *** Subgroups and, if not tested, shall be guaranteed to the limits specified in table I. **** See 4.3.e. 5. PCKGING 5. Packaging requirements. The requirements for packaging shall be in accordance with MIL-M NOTES 6. Intended use. Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for OEM application. When a military specification exists and the product covered by this drawing has been qualified for listing on QPL-385, the device specified herein will be inactivated and will not be used for new design. The QPL-385 product shall be the preferred item for all applications. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control of SMD's. ll proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished in accordance with MIL-STD-48 using DD Form 693, Engineering Change Proposal (Short Form). 6.4 Record of users. Military and industrial users shall inform Defense Electronics Supply Center when a system application requires configuration control and the applicable SMD. DESC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DESC-ECS, telephone (53) Comments. Comments on this drawing should be directed to DESC-ECS, Dayton, Ohio 45444, or telephone (53) pproved sources of supply. pproved sources of supply are listed in MIL-BUL-3. The vendors listed in MIL-BUL-3 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DESC-ECS. 2 DESC FORM 93 JUL 9

13 SOURCE PPROVL BULLETIN DTE: pproved sources of supply for SMD are listed below for immediate acquisition only and shall be added to MIL-BUL-3 during the next revision. MIL-BUL-3 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DESC-ECS. This bulletin is superseded by the next dated revision of MIL-BUL-3. Standardized miulitary drawing PIN LX LX XX XX Vendor CGE number ES ES ES ES Vendor similar PIN / MX7824TQ/883B D7824TQ/883B MX7824UQ/883B D7824UQ/883B MX7828TQ/883B D7828TQ/883B MX7828UQ/883B D7828UQ/883B X D7828UE/883B / Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CGE number ES66 Vendor name and address Maxim Integrated Products 2 San Gabriel Drive Sunnyvale, C nalog Devices Route Industrial Park P. O. Box 96 Norwood, M 262 Point of contact: 8 Ballardvale Street Wilmington, M The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.