Copper Leadframe for Improved Thermal and Optical Characteristics

Transcription

1 High-Performance T- 3 /4 (5 mm) TS AlGaAs Infrared (875 nm) Lamp Technical Data HSDL-42 Series HSDL HSDL Features Very High Power TS AlGaAs Technology 875 nm Wavelength T- 3 /4 Package Low Cost Very High Intensity: HSDL mw/sr HSDL mw/sr Choice of Viewing Angle: HSDL HSDL Low Forward Voltage for Series Operation High Speed: 4 ns Rise Times Package Dimensions 8.7 ±.2 (.343 ±.8).27 (.5) NOM..4 ±.2 (.45 ±.8) 3.4 (.23) MIN. 5.8 ±.2 (.228 ±.8) Copper Leadframe for Improved Thermal and Optical Characteristics Applications IR Audio IR Telephones High Speed IR Communications IR LANs IR Modems IR Dongles Industrial IR Equipment IR Portable Instruments 5. ±.2 (.97 ±.8) 2.35 (.93) MAX..7 (.28) MAX. CATHODE.5 ±. (.2 ±.4) SQUARE CATHODE 2.54 (.) NOM. Interfaces with Crystal Semiconductor CS83 Infrared Transceiver Description The HSDL-42 series of emitters are the first in a sequence of emitters that are aimed at high power, low forward voltage, and high speed. These emitters utilize the Transparent Substrate, double heterojunction, Aluminum Gallium Arsenide (TS AlGaAs) LED technology. These devices are optimized for speed and efficiency at emission wavelengths of 875 nm. This material produces high radiant efficiency over a wide range of currents up to 5 ma peak current. The HSDL-42 series of emitters are available in a choice of viewing angles, the HSDL-423 at 7 and the HSDL-422 at 3. Both lamps are packaged in clear T- 3 /4 (5 mm) packages.

2 2 The package design of these emitters is optimized for efficient power dissipation. Copper leadframes are used to obtain better thermal performance than the traditional steel leadframes. The wide angle emitter, HSDL- 422, is compatible with the IrDA SIR standard and can be used with the HSDL- integrated SIR transceiver. Absolute Maximum Ratings Parameter Symbol Min. Max. Unit Reference Peak Forward Current I FPK 5 ma [2], Fig. 2b Duty Factor = 2% Pulse Width = µs Average Forward Current I FAVG ma [2] DC Forward Current I FDC ma [], Fig. 2a Power Dissipation P DISS 26 mw Reverse Voltage (I R = µa) V R 5 V Transient Forward Current ( µs Pulse) I FTR. A [3] Operating Temperature T O 7 C Storage Temperature T S C LED Junction Temperature T J C Lead Soldering Temperature 26 for C [.6 mm (.63 in.) from body] 5 seconds Notes:. Derate linearly as shown in Figure Any pulsed operation cannot exceed the Absolute Max Peak Forward Current as specified in Figure The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and the wire bonds. Electrical Characteristics at 25 C Parameter Symbol Min. Typ. Max. Unit Condition Reference Forward Voltage V F V I FDC = 5 ma Fig. 2a 2.5 I FPK = 25 ma Fig. 2b Forward Voltage V/ T -2. mv/ C I FDC = 5 ma Fig. 2c Temperature Coefficient -2. I FDC = ma Series Resistance R S 2.8 ohms I FDC = ma Diode Capacitance C O 4 pf V, MHz Reverse Voltage V R 2 2 V I R = µa Thermal Resistance, Rθ jp C/W Junction to Pin

3 3 Optical Characteristics at 25 C Parameter Symbol Min. Typ. Max. Unit Condition Reference Radiant Optical Power HSDL-422 P O 9 mw I FDC = 5 ma 38 I FDC = ma HSDL-423 P O 6 mw I FDC = 5 ma 32 I FDC = ma Radiant On-Axis Intensity HSDL-422 I E mw/sr I FDC = 5 ma Fig. 3a 76 I FDC = ma 9 I FPK = 25 ma Fig. 3b HSDL-423 I E mw/sr I FDC = 5 ma Fig. 3a 5 I FDC = ma 375 I FPK = 25 ma Fig. 3b Radiant On-Axis Intensity I E / T -.35 %/ C I FDC = 5 ma Temperature Coefficient -.35 I FDC = ma Viewing Angle HSDL-422 2θ /2 3 deg I FDC = 5 ma Fig. 6 HSDL-423 2θ /2 7 deg I FDC = 5 ma Fig. 7 Peak Wavelength λ PK nm I FDC = 5 ma Fig. Peak Wavelength λ/ T.25 nm/ C I FDC = 5 ma Temperature Coefficient Spectral Width at FWHM λ 37 nm I FDC = 5 ma Fig. Optical Rise and Fall t r /t f 4 ns I FDC = 5 ma Times, %-9% Bandwidth f c 9 MHz I F = 5 ma Fig. 8 ± ma Ordering Information Part Number Lead Form Shipping Option HSDL-422 Straight Bulk HSDL-423 Straight Bulk

4 IFPK PEAK FORWARD CURRENT ma I FDC = 5 ma I FDC DC FORWARD CURRENT ma, , λ WAVELENGTH nm V F FORWARD VOLTAGE V V F FORWARD VOLTAGE V Figure. Relative Radiant Intensity vs. Wavelength. Figure 2a. DC Forward Current vs. Forward Voltage. Figure 2b. Peak Forward Current vs. Forward Voltage. V F FORWARD VOLTAGE V I FDC = ma I FDC = 5 ma I FDC = ma (NORMALIZED AT 5 ma) NORMALIZED RADIANT INTENSITY 2. NORMALIZED TO I FPK = 25 ma.5..5 VALID FOR PULSE WIDTH =.6 µs TO µs T A AMBIENT TEMPERATURE C I FDC DC FORWARD CURRENT ma I FPK PEAK FORWARD CURRENT ma Figure 2c. Forward Voltage vs Ambient Temperature. Figure 3a. Relative Radiant Intensity vs. DC Forward Current. Figure 3b. Normalized Radiant Intensity vs. Peak Forward Current. I FDC MAX. DC FORWARD CURRENT ma Rθ JA = 4 C/W Rθ JA = 5 C/W Rθ JA = 3 C/W T A AMBIENT TEMPERATURE C I FPK PEAK FORWARD CURRENT ma,. PULSE WIDTH < µs. DUTY FACTOR Figure 4. Maximum DC Forward Current vs. Ambient Temperature. Derated Based on T JMAX = C. Figure 5. Maximum Peak Forward Current vs. Duty Factor.

5 T = 25 C A θ ANGLE FROM OPTICAL CENTERLINE DEGREES (CONE HALF ANGLE) Figure 6. Relative Radiant Intensity vs. Angular Displacement HSDL T = 25 C A θ ANGLE FROM OPTICAL CENTERLINE DEGREES (CONE HALF ANGLE) Figure 7. Relative Radiant Intensity vs. Angular Displacement HSDL-423. db E+5 9 MHz E+6 E+7 E+8 f FREQUENCY Hz Figure 8. Relative Radiant Intensity vs. Frequency.

6 6 For technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: or Far East/Australasia: Call your local HP sales office. Japan: (8 3) Europe: Call your local HP sales office. Data subject to change. Copyright 999 Hewlett-Packard Co. Obsoletes E (8/98) E (6/99)

7 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Lite-On: HSDL-422 HSDL-423