SCT2080KE. 1200V 80m 35A 179W. R DS(on) (Typ.) N-channel SiC power MOSFET. Datasheet. Outline TO-247. Features. Inner circuit 1) Low on-resistance

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1 Nchannel SiC power MOSFET SCT28KE Datasheet V DSS R DS(on) (Typ.) I D P D 2V 8m 35A 79W Outline TO247 () (2) (3) Features Inner circuit ) Low onresistance (2) 2) Fast switching speed 3) Fast reverse recovery 4) Easy to parallel 5) Simple to drive () (3) * () Gate (2) Drain (3) Source * Body Diode 6) Pbfree lead plating ; RoHS compliant Packaging specifications Packing Tube Application Solar inverters DC/DC converters Induction heating Motor drives Type Reel size (mm) Tape width (mm) Basic ordering unit (pcs) 3 Taping code Marking SCT28KE Absolute maximum ratings (T a = 25 C) Parameter Symbol Value Unit Drain Source voltage V DSS 2 V Continuous drain current T c = 25 C T c = C * I D * I D A A drain current I D,pulse *2 8 A Gate Source voltage V GSS 6 to 22 V Power dissipation (T c = 25 C) P D 79 W Junction temperature T j 5 C Range of storage temperature T stg 55 to 5 C / Rev.B

2 Thermal resistance Parameter Symbol Min. Values Typ. Max. Unit Thermal resistance, junction case R thjc.7 C/W Thermal resistance, junction ambient R thja 5 C/W Soldering temperature, wavesoldering for s T sold 265 C Electrical characteristics (T a = 25 C) Parameter Symbol Conditions Min. Values Typ. Max. Unit Drain Source breakdown voltage V (BR)DSS V GS = V, I D = ma 2 V Zero gate voltage drain current V DS = 2V, V GS = V I DSS T j = 25 C T j = 5 C 2 A Gate Source leakage current I GSS V GS = 22V, V DS = V na Gate Source leakage current I GSS V GS = 6V, V DS = V na Gate threshold voltage V GS (th) V DS = V GS, I D = 4.4mA.6 4. V Static drain source on state resistance R DS(on) V GS = 8V, I D = A T j = 25 C 8 7 T j = 25 C 25 m Gate input resistance R G f = MHz, open drain 6.3 2/ Rev.B

3 Electrical characteristics (T a = 25 C) Parameter Symbol Conditions Min. Values Typ. Max. Unit Transconductance g fs V DS = V, I D = A 3.7 S Input capacitance C iss V GS = V 28 Output capacitance C oss V DS = 8V 77 pf Reverse transfer capacitance C rss f = MHz 6 Effective output capacitance, energy related C o(er) V GS = V V DS = V to 5V 6 pf Turn on delay time t d(on) V DD = 4V, V GS = 8V 35 Rise time t r Turn off delay time t d(off) I D = A R L = ns Fall time R G = t f 22 Gate Charge characteristics (T a = 25 C) Parameter Symbol Conditions Min. Values Typ. Max. Unit Total gate charge Q g V DD = 4V 6 Gate Source charge Q gs I D = A 27 nc Gate Drain charge Q gd V GS = 8V 3 Gate plateau voltage V (plateau) V DD = 4V, I D = A 9.7 V * Limited only by maximum temperature allowed. *2 PW s, Duty cycle % 3/ Rev.B

4 Body diode electrical characteristics (SourceDrain) (T a = 25 C) Parameter Symbol Conditions Min. Values Typ. Max. Unit Inverse diode continuous, forward current Inverse diode direct current, pulsed I S * I SM *2 T c = 25 C 25 8 A A Forward voltage V SD V GS = V, I S = A 4.6 V Reverse recovery time Reverse recovery charge Peak reverse recovery current t rr Q rr I rrm I F = A, V R = 4V di/dt = 5A/ s 3 ns 44 nc 2.3 A Typical Transient Thermal Characteristics Symbol Value Unit Symbol Value Unit R th.98 C th.5 R th2.237 K/W C th2.32 Ws/K R th3.22 C th / Rev.B

5 Electrical characteristic curves Fig. Power Dissipation Derating Curve Fig.2 Maximum Safe Operating Area 2 P W = us Power Dissipation : P D /P D max. [%] Operation in this area is limited by R DS(ON) P W = ms P W = ms P W = ms Single Pulse.. Junction Temperature : Tj [ C] Drain Source Voltage : V DS [V] Transient Thermal Resistance : R th [K/W].. Fig.3 Typical Transient Thermal Resistance vs. Pulse Width Single Pulse..... Pulse Width : PW [s] 5/ Rev.B

6 Electrical characteristic curves Fig.4 Typical Output Characteristics(I) Fig.5 Typical Output Characteristics(II) V GS = 2V V GS = 8V V GS = 6V V GS = 4V V GS = 2V V GS = V V GS = 2V V GS = 8V V GS = 6V V GS = 4V V GS = V V GS = 2V Drain Source Voltage : V DS [V] Drain Source Voltage : V DS [V] Fig.6 T j = 5 C Typical Output Fig.7 T j = 5 C Typical Output Characteristics(I) V GS = 6V V GS = 4V V GS = 2V V GS = 8V V GS = 2V V GS = V T a = 5ºC Characteristics(II) V GS = 8V V GS = 6V V GS = 4V V GS = 2V V GS = 2V V GS = V T a = 5ºC Drain Source Voltage : V DS [V] Drain Source Voltage : V DS [V] 6/ Rev.B

7 Electrical characteristic curves Fig.8 Typical Transfer Characteristics.. V DS = V T a = 5ºC T a = 75ºC T a = 25ºC Gate Threshold Voltage : V GS(th) [V] Fig.9 Gate Threshold Voltage vs. Junction Temperature V DS = V I D = ma Gate Source Voltage : V GS [V] Junction Temperature : T j [ C] Fig. Transconductance vs. Drain Current V DS = V Transconductance : g fs [S]. T a = 5ºC T a = 75ºC T a = 25ºC... 7/ Rev.B

8 Electrical characteristic curves Static Drain Source OnState Resistance : R DS(on) [Ω] Fig. Static Drain Source On State Resistance vs. Gate Source Voltage I D = A I D = 2A Gate Source Voltage : V GS [V] Static Drain Source OnState Resistance : R DS(on) [Ω].5 Fig.2 Static Drain Source On State Resistance vs. Junction Temperature..5 V GS = 8V I D = 2A I D = A Junction Temperature : T j [ºC] Static Drain Source OnState Resistance : R DS(on) [Ω] Fig.3 Static Drain Source On State Resistance vs. Drain Current. V GS = 8V.. T a = 5ºC T a = 75ºC T a = 25ºC 8/ Rev.B

9 Electrical characteristic curves Fig.4 Typical Capacitance vs. Drain Source Voltage 4 Fig.5 Coss Stored Energy Capacitance : C [pf] f = MHz V GS = V C rss C oss C iss Coss Stored Energy : E OSS [uj] Drain Source Voltage : V DS [V] Drain Source Voltage : V DS [V] Fig.6 Switching Characteristics Fig.7 Dynamic Input Characteristics 2 Switching Time : t [ns] t d(off) t r t d(on) t f V DD = 4V V GS = 8V R G = Ω Gate Source Voltage : V GS [V] 5 5 V DD = 4V I D = A Total Gate Charge : Q g [nc] 9/ Rev.B

10 Electrical characteristic curves Inverse Diode Forward Current : I S [A] Fig.8 Inverse Diode Forward Current vs. Source Drain Voltage.. V GS = V T a = 5ºC T a = 75ºC T a = 25ºC Source Drain Voltage : V SD [V] Reverse Recovery Time : t rr [ns] Fig.9 Reverse Recovery Time vs.inverse Diode Forward Current di / dt = 5A / us V R = 4V V GS = V Inverse Diode Forward Current : I S [A] / Rev.B

11 Measurement circuits Fig. Switching Time Measurement Circuit Fig.2 Switching Waveforms VGS ID VDS Pulse width RG D.U.T. RL VDD VGS VDS % 5% 9% 5% % % 9% 9% td(on) tr td(off) tf ton toff Fig.2 Gate Charge Measurement Circuit Fig.22 Gate Charge Waveform VGS ID VDS VG RL Qg IG(Const.) D.U.T. VGS VDD Qgs Qgd Charge Fig.3 di/dt Measurement Circuit Fig.32 di/dt Waveform IF D.U.T. RG IF L DRIVER MOSFET VDD trr Irr drr / dt Irr % Irr 9% Irr % / Rev.B

12 Dimensions (Unit : mm) TO247 2/ Rev.B

13 Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with generaluse electronic equipment or devices (such as audio visual equipment, officeautomation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and failsafe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclearreactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System R2A

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