Main Applications High specification down lighting High profile architectural lighting Spot lighting High-Bay & Low-Bay lighting Grid lighting

Transcription

1 ProLight PABA-50FxL-xB4x 50W COB Light-Engine LEDs Technical Datasheet Version: 1.2 Features High flux densit of lighting source Good color uniformit RoHS compliant Energ Star binning structure, neutral white and warm white with 3 steps guarantee. More energ efficient than incandescent and most halogen lamps No UV Long lifetime Main Applications High specification down lighting High profile architectural lighting Spot lighting High-Ba & Low-Ba lighting Grid lighting Introduction The input power is 50 Watt, the multi-chip ultra high power ProEngine Series delivers never before seen luminous flux output from a single emitter. The superficial illuminating nature of ProEngine makes them the preference in High-Ba and Low-Ba lighting, tpical applications include commercial down lighting, in task lighting, spot lighting, tunnel lighting and high profile architectural lighting. 2014/04 DS-0169

2 Emitter Mechanical Dimensions PROLIGHT Notes: 1. Slots in aluminum-core PCB for M2.5 or #4 mounting screw. 2. Solder pads are labeled + and - to denote positive and negative, respectivel. 3. Drawing not to scale. 4. All dimensions are in millimeters. 5. Unless otherwise indicated, tolerances are ± 0.30mm. 6. Please do not use a force of over 0.3kgf impact or pressure on the lens of the LED, otherwise it will cause a catastrophic failure. *The appearance and specifications of the product ma be modified for improvement without notice. 2

3 Flux Characteristics, T C = 25 C Radiation Pattern Lambertian Color White Neutral White Warm White Part Number COB PABA-50FWL-NB4N PABA-50FNL-BB4P PABA-50FVL-BB4P PABA-50FVL-DB4P DC Forward Current (ma) Luminous Flux Φ V (lm) CRI Minimum Tpical Minimum * * * * The mark * indicated product is tested and binned at the specified drive current. ProLight maintains a tolerance of ± 10% on flux and power measurements. ProLight maintains a tolerance of ± 2 on CRI measurements. Please do not drive at rated current more than 1 second without proper heat sink. Electrical Characteristics at 1400mA, T C = 25 C Forward Voltage V F (V) Thermal Resistance Color Min. Tp. Max. Junction to Board ( /W) White Neutral White Warm White ProLight maintains a tolerance of ± 1V for Voltage measurements. Optical Characteristics at 1400mA, T C = 25 C Total included Angle Viewing Angle Radiation Color Temperature CCT (degrees) (degrees) Color Pattern Min. Tp. Max. θ 0.90V 2 θ 1/2 Lambertian White 5300 K 5700 K 6020 K Neutral White 3840 K 4000 K 4130 K K 2700 K 2800 K Warm White 2860 K 2940 K 3020 K K 3000 K 3130 K ProLight maintains a tolerance of ± 5% for CCT measurements. 3

4 Absolute Maximum Ratings Parameter White/Neutral White/Warm White Max DC Forward Current (ma) 1500 Peak Pulsed Forward Current (ma) 2000 (less than 1/10 dut Average Forward Current (ma) 1500 ESD Sensitivit (HBM per MIL-STD-883E Method ) ±2000V LED Junction Temperature 120 C Operating Board Temperature at Maximum DC Forward Current -40 C - 90 C Storage Temperature -40 C C Reverse Voltage Not designed to be driven in reverse bias 4

5 Color Bin White Binning Structure Graphical Representation 0.40 ANSI C K W0 Planckian (BBL) White White Bin Structure Bin Code x W Tolerance on each color bin (x, ) is ± 0.01 Tp. CCT (K) 5700 X 5

6 Color Bin Neutral White Binning Structure Graphical Representation 0.44 color range ANSI C IEC step ellipse K 0.38 S0 Planckian (BBL) 0.36 F Neutral White Neutral White Bin Structure X Bin Code S0 x Center Oval parameter a b Ɵ Tp. CCT (K) 4000 Color range sta within MacAdam 3-step ellipse from the chromaticit center. The chromaticit center refers to ANSI C Tolerance on each color bin (x, ) is ±

7 Color Bin Warm White Binning Structure Graphical Representation 0.48 color range ANSI C IEC step ellipse K 2940 K 2700 K 0.40 N0 NC M0 Planckian (BBL) 0.38 F 3000 P Warm White Warm White Bin Structure Bin Code M0 x Center X Oval Tp. CCT Oval Bin Code Center parameter (K) parameter a a x b N0 b Ɵ Ɵ Tp. CCT (K) 3000 Color range sta within MacAdam 3-step ellipse from the chromaticit center. The chromaticit center refers to ANSI C Tolerance on each color bin (x, ) is ± 0.01 Bin Code NC x Center Oval parameter a b Ɵ Tp. CCT (K) 2940 Color range sta within MacAdam 3-step ellipse from the chromaticit center. The chromaticit center refers to IEC Tolerance on each color bin (x, ) is ±

8 Relative Spectral Power Distribution Relative Spectral Power Distribution Relative Spectral Power Distribution Color Spectrum, T C = 25 C 1. White White Standard Ee Response Curve 2. Neutral White Wavelength (nm) Standard Ee Response Curve Neutral White Warm White Wavelength (nm) 1.0 Standard Ee Response Curve Warm White For R9 Warm White Wavelength (nm) 8

9 x Relative Luminous Flux (%) Forward Voltage (V) Case Temperature Relative Characteristics Case Temperature ( C) Case Temperature ( C) Fig 1. Case Temperature vs. Relative Luminous Flux at 1400mA. Fig 2. Case Temperature vs. Forward Voltage at 1400mA White Neutral White, Warm White White Neutral White, Warm White Case Temperature ( C) Case Temperature ( C) Fig 3. Case Temperature vs. Chromaticit Coordinate Δx at 1400mA. Fig 4. Case Temperature vs. Chromaticit Coordinate Δ at 1400mA. 9

10 Δx Δ Forward Voltage (V) Relative Luminous Flux (%) Forward Current Relative Characteristics Forward Current (ma) Forward Current (ma) Fig 5. Forward Current vs. Forward Voltage at Tc=25 C. Fig 6. Forward Current vs. Relative Luminous Flux at Tc=25 C White Neutral White, Warm White White Neutral White, Warm White Forward Current (ma) Forward Current (ma) Fig 7. Forward Current vs. Chromaticit Coordinate Δx at Tc=25 C. Fig 8. Forward Current vs. Chromaticit Coordinate Δ at Tc=25 C. 10

11 Case Temperature vs. Junction Temperature Characteristics T J ( C) T C ( C) 1300 (ma) 1400 (ma) 1500 (ma) Fig 9. Case Temperature vs. Junction Temperature at mA. 11

12 Color Coordinate vs. Forward Current, T C = 25 C White Binning Graphical Representation ma 1400 ma 1500 ma K Planckian (BBL) 0.34 W White Neutral White Binning Graphical Representation 1300 ma 1400 ma 1500 ma 0.44 X K 0.38 S0 Planckian (BBL) Neutral White X 12

13 Color Coordinate vs. Forward Current, T C = 25 C Warm White Binning Graphical Representation ma 1400 ma 1500 ma K 3000 K 2700 K M N0 NC Planckian (BBL) Warm White X 13

14 Relative Intensit (%) Tpical Representative Spatial Radiation Pattern Lambertian Radiation Pattern Angular Displacement (Degrees) Polar Radiation Pattern 14

15 Packing Specifications Product 12 pcs/tra Notes: 1. Drawing not to scale. 2. All dimensions are in millimeters. 3. Unless otherwise indicated, tolerances are ± 0.20mm. 15

16 Assembl note Regarding the high power densit of LED Arra, it is strongl recommend to use thermal grease and screws. In order to reduce thermal resistance at assembl, it is necessar to use TIM (thermal interface Material) uniforml and tighten screws on heatsink, otherwise the bad thermal resistance ma cause the packages burned out. screw TIM Heatsink Fig 10. Reference assembl as fixing with screws 16

17 Recommended Soldering Condition Please use lead free and no clean solders. Soldering shall be implemented using a soldering tip at a temperature lower than 350, and shall be finished within 3.5 seconds for each pad. During the soldering process, put the LEDs on materials whose conductivit is poor enough not to radiate heat of soldering. Properl solder tin wires before soldering them to LEDs. Avoid touching the silicone lens with the soldering iron. Please prevent flux from touching to the silicone lens. Please solder evenl on each pad. Contacts number of a soldering tip should be within twice for each pad. Next process of soldering should be carried out after the LEDs have return to ambient temperature. *ProLight cannot guarantee if usage exceeds these recommended conditions. Please use it after sufficient verification is carried out on our own risk if absolutel necessar. Precaution for Use The modules light output are intense enough to cause injur to human ees if viewed directl. Precautions must be taken to avoid looking directl at the modules with unprotected ees. The modules are sensitive to electrostatic discharge. Appropriate ESD protection measures must be taken when working with the modules. Non-compliance with ESD protection measures ma lead to damage or destruction of the product. Chemical solvents or cleaning agents must not be used to clean the modules. Mechanical stress on the Emitters must be avoided. It is best to use a soft brush, damp cloth or low-pressure compressed air. The products should be stored awa from direct light in dr location. The appearance, specifications and flux bin of the product ma be modified for improvement without notice. Please refer to the below website for the latest datasheets. Handling of Silicone Lens LEDs Notes for handling of silicone lens LEDs Please do not use a force of over 0.3kgf impact or pressure on the silicone lens, otherwise it will cause a catastrophic failure. Avoid touching the silicone lens and the optical area of the COB Arra especiall b sharp tools such as Tweezers Avoid touching the silicone lens especiall b sharp tools such as Tweezers. Avoid leaving fingerprints on the silicone lens. Please store the LEDs awa from dust areas or seal the product against dust. Please do not mold over the silicone lens with another resin. (epox, urethane, etc) 17