TAIWAN EXCHANGE STOCK NO : December 26,2018
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1 TAIWAN EXCHANGE STOCK NO : 2434 December 26,2018 1
2 CONTENT DISCLAIMER STATEMENT COMPANY STATEMENT Q BALANCE SHEET(CONSOLIDATED) FUTURE PRODUCT DEVELOPMENT Q&A 2
3 DISCLAIMER STATEMENT Our discussion may include predictions, estimates or other information that might be considered forward-looking. While these forward-looking statements represent our current judgment on what the future holds, the are subject to risks and uncertainties that could cause actual results to differ materially You are cautioned not to place undue reliance on these forward-looking statements, which reflect our opinions only as of the date of this presentation, Please keep in mind that we are not obligating ourselves to revise or publicly release the results of any revision to these forward-looking statements in light of new information or future events. Throughout today s discussion, we will attempt to present some important factors relating to our business that may affect our predictions. 3
4 MOSPEC Semiconductor corp. FOUNDED IN 1987 CAPITAL : USD 23 MILLION EMPLOYEE : 98 HEADQUARTERS : TAINAN, TAIWAN CHINA FACTORY : SICHUAN, CHINA TAIWAN EXCHANGE STOCK NO. :
5 INTRODUCTION LEADING HIGH-TECH TODAY INITIATING THE WORLD OF TOMORROW A VERTICALLY INTEGRATED POWER SEMICONDUCTOR COMPANY, SPECIALIZED IN POWER TRANSISTOR, SCHOTTKY DIODE, ULTRA-FAST AND FAST RECOVERY RECTIFIER AND SILICON MATERIALS (EPITAXIAL SILICON WAFERS, PRIME WAFERS). TO BETTER SERVICE ITS DIVERSE CUSTOMERS, MOSPEC CAN PROVIDE ITS PRODUCTS IN CHIP OR WAFER FORM, OR IN VARIOUS PACKAGE TYPES, INCLUDING S.M.D.,AXIAL LEAD, AND TRANSISTOR OUTLINE (TO) FORMAT. 5
6 QUALITY & TECHNOLOGY HISTORY Green Gas Verificati ITAF 16949:2016 ISO 9001:2015 ISO 14001:2015 Green Gas Verificati 2013 ITAF CERTIFIELD 2008 INGOT GROWING PROCESS ISO CERTIFIELD INCH WAFER PROCESS 1997 ISO 9001 CERTIFIELD; POLISH WAFER PROCESS 1990 EPI WAFER PROCESS FOUND
7 MOSPEC Group H&M SEMICONDUCTOR(SICHUAN) ECONOMIC DEVELOPMENT ZONE PHOTOELECTRIC INDUSTRIAL PARK SUINING, SICHUAN TEL: TAIPEI OFFICE: 16 FL., No , SEC. 2, TUN HWA S. RD., TAIPEI, TAIWAN TEL: FAX: , MOSPEC SEMICONDUCTOR(SHENZHEN) SHENZHEN CHINA MERCHANTS BRIGHT LIGHT DISTRICT SCIENCE PARK A6, 4A UNIT TEL: Ext 201 FAX: QQ: MOSPEC SEMICONDUCTOR CORP. HEADQUARTERS: No.76, Zhongshan Rd., Xinshi Dist.,Tainan City 74442, Taiwan TEL: ( REP. ) FAX: ,
8 PRODUCTS 8
9 TYPE SILICON WAFER & SOLAR CELL 9
10 TYPE-TRANSISTORS & DIODES 10
11 MAIN PACKAGES Solar Cell DO-201AD TO-220 ITO-220 TO-263(D2 PAK) TO-220A TO-3P(TO-247) TO-3 SMA/SMB DO-41 TO-252(D PAK) TO-66 11
12 Q BALANCE SHEET(CONSOLIDATED) Unit:NT $ 1,000 12
13 Q BALANCE SHEET(CONSOLIDATED) Unit:NT $ 1,000 13
14 Q P&L (CONSOLIDATED) Unit:NT $ 1,000 14
15 15
16 Marketing analysis and forecast With a slowdown in the global semiconductor industry, caused by lack of consumer confidence in the end consumer application market and the US-China trade war, customer demand has turned conservative in the second half of this year. Coupled with industry-wide destocking of inventory, operating performance next year will face a challenging environment. The response strategy adopted by Mospec is: 16
17 Marketing analysis and forecast ( 一 ) Adjust market sales strategy: Limit exposure to mainland China market affected by price competition and US-China trade, increase focus on domestic Taiwan and export sales. 17
18 Marketing analysis and forecast ( 二 ) Adjust product portfolio: Reduce the proportion of low-margin traditional Schottky diode sales, increase proportion of higher-margin low-vf diodes, ultra-fast recovery diodes, transistors and epi-wafers. In addition, use MOSPEC brand to expand opportunities in the field effect transistor (MOSFET) market. 18
19 Marketing analysis and forecast ( 三 ) Adjust production according to production and marketing strategy: In-house production focus on high-margin low-vf diodes, ultra-fast recovery diodes, transistors and epitaxial wafers, while utilizing partner facilities for traditional Schottky diode and packaging processes. Streamline resource allocation by combining 4-inch and 6-inch wafer fabrication facilities. 19
20 Marketing analysis and forecast ( 四 ) Expansion of epi-wafer capacity and revenue: As the market for small diameter (four, six inch) epitaxial silicon processes continue to be tight, Mospc will carry out equipment upgrades for production capacity next year, in order to reduce production costs, expand production capacity, and increase operating income. 20
21 Q&A 21
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