EuroCPS. Cyber-Physical Systems
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1 LEIT ICT Information and Communication Technologies Giornata Nazionale di Lancio dei Bandi in Horizon 2020 Roma, 24/11/2017 Franco Callegati Università di Bologna Direttore Centro di ricerca industriale ICT
2 Smart Anything Everywere intiative Innovation Services for European Smartization by SMEs Coordinator: Blumorpho Smart Access to Manufacturing for Systems Integration Coordinator: Hahn-Schickard Ges. CPS Engineering Labs Coordinator: Fortiss Industrial access to CPS technologies and competencies Coordinator: CEA-Leti Ü>25M of funding invested by the European Commission to catch the CPS market Overview 2
3 in a nutshell Call: ICT Launched: Feb 1 st, 2015 Duration: 3 years 9 Countries 14 Partners 7 Technology Platforms Budget: 9,178,641 EC funding: 8,186,835 ÜIndustrial Experiment support: 76% of the funding Overview 3
4 mission Provide an easy path to build innovative CPS systems to SMEs from any sector Ø Leverage the existing regional ecosystem across the full value chain and range of competencies Facilitates user-supplier partnerships across value chains and regions Ø One-stop-shop providing a critical mass of technologies and competencies Enable a new cooperation model linking software, system and nano-electronic industries along the full CPS value chain Ø Industrial experiments initiated and led by SMEs ÜReduce development time and certification efforts Overview 4
5 Industrial Experiments Solution using existing prog. platforms SW intensive project Ü SW prototype demonstrator Solution using existing SW & HW components Overview System integration project Ü Integrated system prototype demonstrator Solution using specific SW & HW components CPS w/ innovative component project Ü System architecture virtual prototype demonstrator 5
6 platforms Software Integration system Avionics Platform Processing board & real time SW solutions provided by Thales Integrated and Open Development Platform Simulation methods and tools for development provided by AVL STM32 Microcontroller Platform 32-bit product range provided by STMicroelectronics inemo Inertial Platform A sensor platform provided by STMicroelectronics Hardware Quark System on Chip Platform Low-power platform provided by Intel Silicon Process and Package Technology Leading-edge silicon processes and package technologies provided by STMicroelectronics Silicon Process and Package Technology Leading-edge silicon processes and package technologies provided by STMicroelectronics Overview 6
7 SME financial support Ü Cascade funding (70% of the budget): Support R&D work of 3 rd parties + Platform funding: Support technology access + Competence funding: Support expertise, know-how access Overview 7
8 Open calls Dates: Apr 15 Oct 15 Apr 16 Today 9 IE funded 1 st IE batch 2 st IE batch 3 st IE batch 15 IE funded 10 IE funded Ü 1 st half of the project timed by the open calls Ü 2 nd half of the project timed by IE monitoring and exploitation Overview 8
9 Project main results Strong involvement of all the partners: Website continuously fed (visited by more than 6000 unique visitors; 2400 for the last open call) Organization and participation to 31 brokerage events (SAE events, IoT Planet ), F2F meetings, use of social platforms (Twitter, Linked in ) Communication kit (3 press releases, platform poster, ) Networking, Platform and competence working methodology with SMEs Successful launch and management of the 3 open calls: 34 IEs overs 118 proposals (acceptance rate < 29%). All the technology platform support at least 3 IEs All the competence centers support at least 2 IE Overview 9
10 IE key numbers 71% 71% AVE CF/IE = % 14% 14% Overview 10
11 Level Efficiency of the new cooperation model Initiate and boost synergies between SMEs, technology supplier and competences bring innovative CPS to business from any level enable a more tailored access to European funding Progress in technology development Develop demonstrators Increased ownership Submit scientific publications Disseminate to prospects Network (IoT planet level Improve understanding, Customer relationship, dissemination paths Better understanding of SME contraints and needs Overview 11
12 Unibo Role Active participation in all the Open Call consensus meeting Act as competenze center for 3 IEs LTIS (Winet) Italy (ER) PPSF (Stoorm5-Alleantia) Italy (ER) 3DGxGlove (EuroB) - Spain At a glance Smart agricolture (LTIS) Presentation to follow Industry 4.0 (PPSF) Predictive maintainanceby vibrations monitoring Virtaul reality (3DGxGlove) Improve interaction with 3D modeling and collaboration tools Overview 12
13 The local ecosystem Overview 13
14 CIRI ICT Promotethe technology transfer between the University and localsmes Coordinate and develop industrial research projects Offer knowledge transfer service in the ICT field while meeting the needs of industry and sustainable development. ENTRATE ICT Totale complessivo; ,67; 50% Attività commerciale; ; 13% Interessi attivi; 9354,65; 0% Trasferimenti interni; 5313,51; 0% POR FESR; ,28; 32% Contratti/Convenzioni/A ccordi programma con altre PA (Unione Europea, Ministeri, EELL); ,61; 5% Recuperi e rimborsi; 3,62; 0% 14 Overview
15 Projects ongoing: topics Hybrid cloud platform for cultural heritage data management SACHER Smart Architecture for Cultural Heritage in Emilia Romagna Improved home environment for elders and impaired people HABITAT Home Assistance Basata su Internet of Things per l Autonomia di Tutti Software semantic platform Optimized systems for power management Man-to-machine interfaces for the industry 4.0 Collaborative writing of manuals and technical documents Network architectures for 5G Wireless UWB sensors Intelligent systems for improved indoor comfort Artificial vision for quality manufacturing Overview 15
16 Lesson learnt! The IE call Standardize the process Need for a large number of candidate evaluators The IE management Potential difficulties in monitoring IE by SMEs far and previously unknown Cash flow management and cost reporting Overview 16
17 Further infos o o o o o Overview 17
18 Thanks for your attention Overview 18
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