DATA SHEET. OM2052 Wideband amplifier module DISCRETE SEMICONDUCTORS Nov 28
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1 DISCRETE SEMICONDUCTORS DATA SHEET Supersedes data of November 99 File under Discrete Semiconductors, SC6 995 Nov 28
2 DESCRIPTION A two-stage wideband amplifier in hybrid integrated circuit form on a thin-film substrate. The device is intended as an amplifier in MATV and CATV systems. PINNING PIN DESCRIPTION input 2 common ( ) 3 common ( ) 4 common ( ) 5 not connected 6 common ( ) 7 output/supply (+) handbook, halfpage pin identification MLA420 Fig. Simplified outline. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT f frequency range MHz Z S, Z L source and load impedance 75 Ω G T transducer gain = S db G T flatness of frequency response db V o(rms) output voltage (RMS value) d im = 60 db; 07 dbµv 3 rd order intermodulation (3-tone) F noise figure 4.5 db V B DC supply voltage V T amb ambient operating temperature C 995 Nov 28 2
3 CIRCUIT DIAGRAM AND PRINTED-CIRCUIT BOARD handbook, full pagewidth C R R4 7 TR TR2 R3 R5 R7 R8 R2 C3 MCD498 2, 3, 4, 6 Fig.2 Circuit diagram. handbook, halfpage top view L 75 Ω track C C 75 Ω track bottom view MCD497 L>5µH; e.g. catalogue No , or 27 turns enamelled 0.3 mm copper wire wound on a ferrite core with a diameter of.6 mm. C > 220 pf ceramic capacitor. Fig.3 Printed-circuit board holes and tracks. 995 Nov 28 3
4 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 34). SYMBOL PARAMETER MIN. MAX. UNIT V B DC supply voltage 5 V P IM peak incident powers on pins and 8 00 mw T amb ambient operating temperature C T stg storage temperature C CHARACTERISTICS SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Measuring conditions T amb ambient operating temperature 25 C V B DC supply voltage V Z S source impedance 75 Ω Z L load impedance 75 Ω Z 0 characteristic impedance of 75 Ω HF connections f frequency range MHz Performance I B supply current ma G T transducer gain = S db G T flatness of frequency response db VSWR in individual maximum VSWR input; note 2.2 VSWR out individual maximum VSWR output; note 2. S 2 2 back attenuation f = 00 MHz 36 db f = 860 MHz 29 db V o(rms) output voltage (RMS value) d im = 60 db; 07 dbµv 3 rd order intermodulation (3-tone) F noise figure 4.5 db Operating conditions T amb ambient operating temperature C V B DC supply voltage V f frequency range MHz Z S source impedance 75 Ω Z L load impedance 75 Ω Note. Highest value (for sample) occurring in the frequency range. 995 Nov 28 4
5 32 handbook, full pagewidth 2 S 2 (db) 30 MCD Gain over entire frequency range. Z 0 =75Ω. f (MHz) 000 Fig.4 Transducer gain as a function of frequency. 995 Nov 28 5
6 handbook, full pagewidth j j 40 MHz MHz MCD448 Fig.5 Input impedance derived from input reflection coefficient (S ), co-ordinates in ohms 75; typical values. handbook, full pagewidth j 0 40 MHz j 860 MHz MCD449 Fig.6 Output impedance derived from output reflection coefficient (S 22 ), co-ordinates in ohms 75; typical values. 995 Nov 28 6
7 MOUNTING The module should preferably be mounted on a double-sided printed-circuit board, see Fig.3. Input and output should be connected to 75 Ω tracks. The connection to the common pins should be as close to the seating plane as possible. SOLDERING Hand soldering The maximum contact time for a soldering iron temperature of 260 C up to the seating plane is 5 s. Dip or wave soldering The maximum permissible temperature for the solder is 260 C. It must not be in contact with the joint for more than 5s. The total contact time of successive solder waves must not exceed 5 s. The device may be mounted against the printed-circuit board, but the temperature of the device must not exceed 25 C. If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature below the allowable limit. PACKAGE OUTLINE pin identification handbook, full pagewidth 9 max 3 max seating plane 8 max max 2.54 (6x) MLA49 Dimensions in mm. Fig.7 Resin coated encapsulation. 995 Nov 28 7
8 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 34). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 995 Nov 28 8
9 NOTES 995 Nov 28 9
10 NOTES 995 Nov 28 0
11 NOTES 995 Nov 28
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