Micromechanical Circuits for Wireless Communications

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1 Micromechanical Circuits for Wireless Communications Clark T.-C. Nguyen Center for Integrated Microsystems Dept. of Electrical Engineering and Computer Science University of Michigan Ann Arbor, Michigan

2 Outline Miniaturization of Transceivers the need for high-q High-Q Micromechanical Resonators Micromechanical Circuits micromechanical filters micromechanical mixer-filters micromechanical switches Power Savings Via High-Q MEMS trade Q (or selectivity) for power MEMS-based xceiver architecture Research Issues Conclusions

3 Frequency Division Multiplexed Communications Information is transmitted in specific frequency channels within specific bands Transmitted Power Band GSM Band Adj. Band DCS1800 Band Frequency

4 Frequency Division Multiplexed Communications Information is transmitted in specific frequency channels within specific bands Transmitted Power Band Filter GSM Band Adj. Band DCS1800 Band Frequency

5 Frequency Division Multiplexed Communications Information is transmitted in specific frequency channels within specific bands Transmitted Power Band Filter GSM Band Adj. Band DCS1800 Band Frequency

6 Need for High-Q: Selective Low-Loss Filters In resonator-based filters: high tank Q low insertion loss At right: a 0.3% bandwidth 70 MHz (simulated) heavy insertion loss for resonator Q < 5,000

7 Miniaturization of Transceivers High-Q functionality required by oscillators and filters cannot be realized using standard IC components use off-chip mechanical components SAW, ceramic, and crystal resonators pose bottlenecks against ultimate miniaturization

8 Surface Micromachining Fabrication steps compatible with planar IC processing

9 Post-CMOS Circuits+μMechanics Integration Completely monolithic, low phase noise, high-q oscillator (effectively, an integrated crystal oscillator) [Nguyen, Howe] To allow the use of >600 o C processing temperatures, tungsten (instead of aluminum) is used for metallization

10 Target Application: Integrated Transceivers Off-chip high-q mechanical components present bottlenecks to miniaturization replace them with μmechanical versions

11 Outline Κ Κ Miniaturization of Transceivers the need for high-q High-Q Micromechanical Resonators Micromechanical Circuits micromechanical filters micromechanical mixer-filters micromechanical switches Power Savings Via High-Q MEMS trade Q (or selectivity) for power MEMS-based xceiver architecture Research Issues Conclusions

12 Vertically-Driven Micromechanical Resonator To date, most used design to achieve VHF frequencies Smaller mass higher frequency range and lower series C. RT.-C. x Nguyen Univ. of Michigan

13 Fabricated HF μmechanical Resonator Surface-micromachined, POCl 3 -doped polycrystalline silicon Extracted Q = 8,000 (vacuum) Freq. influenced by dc-bias and anchor effects

14 Desired Filter Characteristics Small shape factor generally preferred

15 Micromechanical Filter Circuit

16 Ideal Spring-Coupled μmechanical Filter Symmetric Mode Anti-Symmetric Mode BW ~ k s12 k r c r 1 m r1 k s 12 m r2 c r 2 k r 1 k r 2

17 Micromechanical Filter Circuit

18 HF Spring-Coupled Micromechanical Filter

19 High-Order μmechanical Filter

20 Fundamental Building Block: Micromechanical Circuits MEMS for Wireless Communications Equivalent Building Block Ckt.: Circuit Example: Key Design Property: High-Q

21 Electromechanical Mixing MEMS for Wireless Communications ω o =ω IF Electrical Signal Input Filter Response ω IF ω LO ω RF ω Mechanical Signal Input ω IF ω LO ω RF ω

22 Micromechanical Mixer-Filter

23 Micromechanical Switch Operate the micromechanical beam in an up/down binary fashion [C. Goldsmith, 1995] Performance: I.L.~0.1dB, IIP3 ~ 66dBm (extremely linear) Issues: switching voltage ~ 20V, switching time: μs

24 MEMS-Replaceable Transceiver Components [Yao 1997] [Bannon, Clark, Nguyen 1996] [Wang, Yu, Nguyen 1999] [J.-B. Yoon, et al. 1999] [Young, Boser 1996] A large number of off-chip high-q components replaceable with μmachined versions; e.g., using μmachined resonators, switches, capacitors, and inductors

25 Target Application: Integrated Transceivers Off-chip high-q mechanical components present bottlenecks to miniaturization replace them with μmechanical versions

26 Outline Κ Miniaturization of Transceivers the need for high-q High-Q Micromechanical Resonators Micromechanical Circuits micromechanical filters micromechanical mixer-filters micromechanical switches Power Savings Via High-Q MEMS trade Q (or selectivity) for power MEMS-based xceiver architecture Research Issues Conclusions

27 Power vs. Selectivity (or Q) Trade-Offs Example: power consumption as a function of front-end selectivity case: wideband front-end filtering Received Power Desired Signal RF Pre-Select Filter (Res.Q ~500) Antenna Frequency

28 Power vs. Selectivity (or Q) Trade-Offs Example: power consumption as a function of front-end selectivity case: wideband front-end filtering Received Power Desired Signal RF Pre-Select Filter (Res.Q ~500) Out-of-Band Interferers Removed Antenna Frequency Subsequent Electronics (e.g., LNA, mixer, ADC s) Problem: helpful, but does not go far enough subsequent electronics must still have more dynamic range than really necessary power wasted

29 Power vs. Selectivity (or Q) Trade-Offs Example: power consumption as a function of front-end selectivity better approach: narrowband front-end filtering Received Power Desired Signal RF Pre-Select Filter (Res.Q ~500) Antenna Frequency Subsequent Electronics (e.g., LNA, mixer, ADC s)

30 Power vs. Selectivity (or Q) Trade-Offs Example: power consumption as a function of front-end selectivity Received Power better approach: narrowband front-end filtering Desired Signal RF Channel-Select Filter (Q ~500) (Q ~10,000) Antenna Frequency Subsequent Electronics (e.g., LNA, mixer, ADC s)

31 Received Power Desired Signal MEMS for Wireless Communications Power vs. Selectivity (or Q) Trade-Offs Example: power consumption as a function of front-end selectivity better approach: narrowband front-end filtering RF Channel-Select Filter (Q ~500) (Q ~10,000) All Interferers Removed Antenna Frequency Subsequent Electronics (e.g., LNA, mixer, ADC s) Result: substantial power savings in subsequent circuits relaxed dynamic range requirements relaxed oscillator phase noise requirements

32 Received Power Front-End Channel Selector MEMS for Wireless Communications Power Saving Strategy: select channels right up at RF One Approach: Use a highly selective low-loss filter that is tunable from channel to channel: Filter On Filter On Filter On Filter On Antenna Frequency Subsequent Electronics (e.g., LNA, mixer, ADC s) Problem: high filter selectivity (i.e., high Q) often precludes tunability

33 Front-End Channel Selector MEMS for Wireless Communications Solution: rather than cover the band by tuning, cover with a bank of switchable filters Received Power Filter On Filter On Filter On Filter On Antenna Frequency Subsequent Electronics (e.g., LNA, mixer, ADC s) Problem: macroscopic high-q filters are too big Requirement: tiny filters μmechanical high-q filters present a good solution

34 MEMS vs. SAW Comparison MEMS offers the same or better high-q frequency selectivity with orders of magnitude smaller size

35 Micromechanical RF Pre-Selector Use a massively parallel array of tunable, switchable filters tiny size and zero dc power consumption of μmechanical filters allows this

36 MEMS-Based Transceiver Architecture Use numerous filters in a switchable bank to allow front-end channel selection Allows more efficient PA and lower dynamic range LNA and mixer Micromechanics are shaded in green

37 MEMS-Based Transceiver Architecture When replace FET switch: I.L. goes from 2dB to 0.1dB Save 280mW when transmitting 500mW Micromechanics are shaded in green

38 MEMS-Based Transceiver Architecture Use transducer nonlinearity to obtain a mixer function, followed by a filter Eliminate active mixer power Micromechanics are shaded in green

39 MEMS-Based Transceiver Architecture Substantial power savings if resonator Q>1,000 Another example of Q versus power trade-off Micromechanics are shaded in green

40 Outline Κ Miniaturization of Transceivers the need for high-q High-Q Micromechanical Resonators Micromechanical Circuits micromechanical filters micromechanical mixer-filters micromechanical switches Power Savings Via High-Q MEMS trade Q (or selectivity) for power MEMS-based xceiver architecture Research Issues Conclusions

41 Research Issue: Frequency Extension To extend the frequency range shrink beam dimensions must shrink gap d dimensions, as well Possible Problem: Q reduction with frequency material and anchor loss mechanisms solution: defensive mechanical design, materials engineering

42 Anchor Dissipation in Fixed-Fixed Beams f o Q

43 92 MHz Free-Free Beam μresonator Free-free beam μmechanical resonator with non-intrusive supports reduce anchor dissipation higher Q

44 92 MHz Free-Free Beam μresonator Free-free beam μmechanical resonator with non-intrusive supports reduce anchor dissipation higher Q

45 Research Issue: Frequency Extension To extend the frequency range shrink beam dimensions must shrink gap d dimensions, as well Possible Problem: Q reduction with frequency material and anchor loss mechanisms solution: defensive mechanical design, materials engineering Possible Problem: size vs. power handling trade-offs may limit the degree of size reduction allowable solution: transducer design, other vibration modes

46 156 MHz Radial Contour-Mode Disk μmechanical Resonator Below: Balanced radial-mode disk polysilicon μmechanical resonator (34 μm diameter) μmechanical Disk Resonator Metal Electrode R Design/Performance: R=17μm, t=2μm d=1,000å, V P =35V f o =156.23MHz, Q=9,400 Metal Electrode Anchor f o =156MHz Q=9,400 [Clark, Hsu, Nguyen IEDM 00]

47 500 MHz Radial Disk μmechanical Resonator Below: Balanced radial-mode disk polysilicon μmechanical resonator (11 μm diameter) μmechanical Disk Resonator Electrode Electrode [Clark, Hsu, Nguyen IEDM 00]

48 Other Research Issues:

49 Research Issues: Frequency Trimming For banks of filters or resonators need automated trimming on a massive scale, preferably voltage-activated Localized Annealing: current through structure heats it like a filament extremely fast thermal time constants allow for ultra-rapid annealing 16 ppm f o shift per anneal pulse [Wang, Wong, Hsu, Nguyen 1997]

50 Research Issues: Thermal Stability [Wang, Yu, Nguyen 2000] Need temperature compensation or control methods

51 Research Issues: Contamination Sensitivity Contamination fluctuations f o and Q fluctuations Typical μresonator mass: kg Larger frequency fluctuations for microsized resonators than for more massive quartz crystals Factors influencing contamination-derived instabilities contaminant molecule size and weight pressure and temperature Need encapsulation for contamination protection

52 Research Issue: Vacuum Encapsulation Below: localized heated bonding to seal a vacuum cap over a released micromechanical resonator Schematic of the Bonding Encapsulation Procedure Broken Glass Cap V anneal Glass Cap Microcavity Q µheater and Aluminum Solder [Cheng, Hsu, Lin, Nguyen, Najafi 2000] Weeks weeks at 25 mtorr

53 Conclusions: Via enhanced selectivity on a massive scale, micromechanical circuits using high-q elements have the potential for shifting communication transceiver design paradigms, greatly enhancing their capabilities Advantages of Micromechanical Circuits: orders of magnitude smaller size than present mechanical resonator devices better performance than other single-chip solutions potentially large reduction in power consumption alternative transceiver architectures that maximize the use of high-q, frequency selective devices for improved performance but there is much work yet to be done...

54 Acknowledgments Former and present graduate students, especially Kun Wang, Frank Bannon III, and Ark-Chew Wong, who are largely responsible for the micromechanical filter work, and Wan-Thai Hsu and Mustafa Demirci, who are largely responsible for the resonator work My government funding sources: DARPA, NASA/JPL, NSF, and an ARO MURI

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