Micromechanical Circuits for Wireless Communications
|
|
- Sharon Hardy
- 5 years ago
- Views:
Transcription
1 Micromechanical Circuits for Wireless Communications Clark T.-C. Nguyen Center for Integrated Microsystems Dept. of Electrical Engineering and Computer Science University of Michigan Ann Arbor, Michigan
2 Outline Miniaturization of Transceivers the need for high-q High-Q Micromechanical Resonators Micromechanical Circuits micromechanical filters micromechanical mixer-filters micromechanical switches Power Savings Via High-Q MEMS trade Q (or selectivity) for power MEMS-based xceiver architecture Research Issues Conclusions
3 Frequency Division Multiplexed Communications Information is transmitted in specific frequency channels within specific bands Transmitted Power Band GSM Band Adj. Band DCS1800 Band Frequency
4 Frequency Division Multiplexed Communications Information is transmitted in specific frequency channels within specific bands Transmitted Power Band Filter GSM Band Adj. Band DCS1800 Band Frequency
5 Frequency Division Multiplexed Communications Information is transmitted in specific frequency channels within specific bands Transmitted Power Band Filter GSM Band Adj. Band DCS1800 Band Frequency
6 Need for High-Q: Selective Low-Loss Filters In resonator-based filters: high tank Q low insertion loss At right: a 0.3% bandwidth 70 MHz (simulated) heavy insertion loss for resonator Q < 5,000
7 Miniaturization of Transceivers High-Q functionality required by oscillators and filters cannot be realized using standard IC components use off-chip mechanical components SAW, ceramic, and crystal resonators pose bottlenecks against ultimate miniaturization
8 Surface Micromachining Fabrication steps compatible with planar IC processing
9 Post-CMOS Circuits+μMechanics Integration Completely monolithic, low phase noise, high-q oscillator (effectively, an integrated crystal oscillator) [Nguyen, Howe] To allow the use of >600 o C processing temperatures, tungsten (instead of aluminum) is used for metallization
10 Target Application: Integrated Transceivers Off-chip high-q mechanical components present bottlenecks to miniaturization replace them with μmechanical versions
11 Outline Κ Κ Miniaturization of Transceivers the need for high-q High-Q Micromechanical Resonators Micromechanical Circuits micromechanical filters micromechanical mixer-filters micromechanical switches Power Savings Via High-Q MEMS trade Q (or selectivity) for power MEMS-based xceiver architecture Research Issues Conclusions
12 Vertically-Driven Micromechanical Resonator To date, most used design to achieve VHF frequencies Smaller mass higher frequency range and lower series C. RT.-C. x Nguyen Univ. of Michigan
13 Fabricated HF μmechanical Resonator Surface-micromachined, POCl 3 -doped polycrystalline silicon Extracted Q = 8,000 (vacuum) Freq. influenced by dc-bias and anchor effects
14 Desired Filter Characteristics Small shape factor generally preferred
15 Micromechanical Filter Circuit
16 Ideal Spring-Coupled μmechanical Filter Symmetric Mode Anti-Symmetric Mode BW ~ k s12 k r c r 1 m r1 k s 12 m r2 c r 2 k r 1 k r 2
17 Micromechanical Filter Circuit
18 HF Spring-Coupled Micromechanical Filter
19 High-Order μmechanical Filter
20 Fundamental Building Block: Micromechanical Circuits MEMS for Wireless Communications Equivalent Building Block Ckt.: Circuit Example: Key Design Property: High-Q
21 Electromechanical Mixing MEMS for Wireless Communications ω o =ω IF Electrical Signal Input Filter Response ω IF ω LO ω RF ω Mechanical Signal Input ω IF ω LO ω RF ω
22 Micromechanical Mixer-Filter
23 Micromechanical Switch Operate the micromechanical beam in an up/down binary fashion [C. Goldsmith, 1995] Performance: I.L.~0.1dB, IIP3 ~ 66dBm (extremely linear) Issues: switching voltage ~ 20V, switching time: μs
24 MEMS-Replaceable Transceiver Components [Yao 1997] [Bannon, Clark, Nguyen 1996] [Wang, Yu, Nguyen 1999] [J.-B. Yoon, et al. 1999] [Young, Boser 1996] A large number of off-chip high-q components replaceable with μmachined versions; e.g., using μmachined resonators, switches, capacitors, and inductors
25 Target Application: Integrated Transceivers Off-chip high-q mechanical components present bottlenecks to miniaturization replace them with μmechanical versions
26 Outline Κ Miniaturization of Transceivers the need for high-q High-Q Micromechanical Resonators Micromechanical Circuits micromechanical filters micromechanical mixer-filters micromechanical switches Power Savings Via High-Q MEMS trade Q (or selectivity) for power MEMS-based xceiver architecture Research Issues Conclusions
27 Power vs. Selectivity (or Q) Trade-Offs Example: power consumption as a function of front-end selectivity case: wideband front-end filtering Received Power Desired Signal RF Pre-Select Filter (Res.Q ~500) Antenna Frequency
28 Power vs. Selectivity (or Q) Trade-Offs Example: power consumption as a function of front-end selectivity case: wideband front-end filtering Received Power Desired Signal RF Pre-Select Filter (Res.Q ~500) Out-of-Band Interferers Removed Antenna Frequency Subsequent Electronics (e.g., LNA, mixer, ADC s) Problem: helpful, but does not go far enough subsequent electronics must still have more dynamic range than really necessary power wasted
29 Power vs. Selectivity (or Q) Trade-Offs Example: power consumption as a function of front-end selectivity better approach: narrowband front-end filtering Received Power Desired Signal RF Pre-Select Filter (Res.Q ~500) Antenna Frequency Subsequent Electronics (e.g., LNA, mixer, ADC s)
30 Power vs. Selectivity (or Q) Trade-Offs Example: power consumption as a function of front-end selectivity Received Power better approach: narrowband front-end filtering Desired Signal RF Channel-Select Filter (Q ~500) (Q ~10,000) Antenna Frequency Subsequent Electronics (e.g., LNA, mixer, ADC s)
31 Received Power Desired Signal MEMS for Wireless Communications Power vs. Selectivity (or Q) Trade-Offs Example: power consumption as a function of front-end selectivity better approach: narrowband front-end filtering RF Channel-Select Filter (Q ~500) (Q ~10,000) All Interferers Removed Antenna Frequency Subsequent Electronics (e.g., LNA, mixer, ADC s) Result: substantial power savings in subsequent circuits relaxed dynamic range requirements relaxed oscillator phase noise requirements
32 Received Power Front-End Channel Selector MEMS for Wireless Communications Power Saving Strategy: select channels right up at RF One Approach: Use a highly selective low-loss filter that is tunable from channel to channel: Filter On Filter On Filter On Filter On Antenna Frequency Subsequent Electronics (e.g., LNA, mixer, ADC s) Problem: high filter selectivity (i.e., high Q) often precludes tunability
33 Front-End Channel Selector MEMS for Wireless Communications Solution: rather than cover the band by tuning, cover with a bank of switchable filters Received Power Filter On Filter On Filter On Filter On Antenna Frequency Subsequent Electronics (e.g., LNA, mixer, ADC s) Problem: macroscopic high-q filters are too big Requirement: tiny filters μmechanical high-q filters present a good solution
34 MEMS vs. SAW Comparison MEMS offers the same or better high-q frequency selectivity with orders of magnitude smaller size
35 Micromechanical RF Pre-Selector Use a massively parallel array of tunable, switchable filters tiny size and zero dc power consumption of μmechanical filters allows this
36 MEMS-Based Transceiver Architecture Use numerous filters in a switchable bank to allow front-end channel selection Allows more efficient PA and lower dynamic range LNA and mixer Micromechanics are shaded in green
37 MEMS-Based Transceiver Architecture When replace FET switch: I.L. goes from 2dB to 0.1dB Save 280mW when transmitting 500mW Micromechanics are shaded in green
38 MEMS-Based Transceiver Architecture Use transducer nonlinearity to obtain a mixer function, followed by a filter Eliminate active mixer power Micromechanics are shaded in green
39 MEMS-Based Transceiver Architecture Substantial power savings if resonator Q>1,000 Another example of Q versus power trade-off Micromechanics are shaded in green
40 Outline Κ Miniaturization of Transceivers the need for high-q High-Q Micromechanical Resonators Micromechanical Circuits micromechanical filters micromechanical mixer-filters micromechanical switches Power Savings Via High-Q MEMS trade Q (or selectivity) for power MEMS-based xceiver architecture Research Issues Conclusions
41 Research Issue: Frequency Extension To extend the frequency range shrink beam dimensions must shrink gap d dimensions, as well Possible Problem: Q reduction with frequency material and anchor loss mechanisms solution: defensive mechanical design, materials engineering
42 Anchor Dissipation in Fixed-Fixed Beams f o Q
43 92 MHz Free-Free Beam μresonator Free-free beam μmechanical resonator with non-intrusive supports reduce anchor dissipation higher Q
44 92 MHz Free-Free Beam μresonator Free-free beam μmechanical resonator with non-intrusive supports reduce anchor dissipation higher Q
45 Research Issue: Frequency Extension To extend the frequency range shrink beam dimensions must shrink gap d dimensions, as well Possible Problem: Q reduction with frequency material and anchor loss mechanisms solution: defensive mechanical design, materials engineering Possible Problem: size vs. power handling trade-offs may limit the degree of size reduction allowable solution: transducer design, other vibration modes
46 156 MHz Radial Contour-Mode Disk μmechanical Resonator Below: Balanced radial-mode disk polysilicon μmechanical resonator (34 μm diameter) μmechanical Disk Resonator Metal Electrode R Design/Performance: R=17μm, t=2μm d=1,000å, V P =35V f o =156.23MHz, Q=9,400 Metal Electrode Anchor f o =156MHz Q=9,400 [Clark, Hsu, Nguyen IEDM 00]
47 500 MHz Radial Disk μmechanical Resonator Below: Balanced radial-mode disk polysilicon μmechanical resonator (11 μm diameter) μmechanical Disk Resonator Electrode Electrode [Clark, Hsu, Nguyen IEDM 00]
48 Other Research Issues:
49 Research Issues: Frequency Trimming For banks of filters or resonators need automated trimming on a massive scale, preferably voltage-activated Localized Annealing: current through structure heats it like a filament extremely fast thermal time constants allow for ultra-rapid annealing 16 ppm f o shift per anneal pulse [Wang, Wong, Hsu, Nguyen 1997]
50 Research Issues: Thermal Stability [Wang, Yu, Nguyen 2000] Need temperature compensation or control methods
51 Research Issues: Contamination Sensitivity Contamination fluctuations f o and Q fluctuations Typical μresonator mass: kg Larger frequency fluctuations for microsized resonators than for more massive quartz crystals Factors influencing contamination-derived instabilities contaminant molecule size and weight pressure and temperature Need encapsulation for contamination protection
52 Research Issue: Vacuum Encapsulation Below: localized heated bonding to seal a vacuum cap over a released micromechanical resonator Schematic of the Bonding Encapsulation Procedure Broken Glass Cap V anneal Glass Cap Microcavity Q µheater and Aluminum Solder [Cheng, Hsu, Lin, Nguyen, Najafi 2000] Weeks weeks at 25 mtorr
53 Conclusions: Via enhanced selectivity on a massive scale, micromechanical circuits using high-q elements have the potential for shifting communication transceiver design paradigms, greatly enhancing their capabilities Advantages of Micromechanical Circuits: orders of magnitude smaller size than present mechanical resonator devices better performance than other single-chip solutions potentially large reduction in power consumption alternative transceiver architectures that maximize the use of high-q, frequency selective devices for improved performance but there is much work yet to be done...
54 Acknowledgments Former and present graduate students, especially Kun Wang, Frank Bannon III, and Ark-Chew Wong, who are largely responsible for the micromechanical filter work, and Wan-Thai Hsu and Mustafa Demirci, who are largely responsible for the resonator work My government funding sources: DARPA, NASA/JPL, NSF, and an ARO MURI
Vibrating RF MEMS for Low Power Wireless Communications
Vibrating RF MEMS for Low Power Wireless Communications Clark T.-C. Nguyen Center for Wireless Integrated Microsystems Dept. of Electrical Engineering and Computer Science University of Michigan Ann Arbor,
More informationRF MEMS for Low-Power Communications
RF MEMS for Low-Power Communications Clark T.-C. Nguyen Center for Wireless Integrated Microsystems Dept. of Electrical Engineering and Computer Science University of Michigan Ann Arbor, Michigan 48109-2122
More informationMicromechanical Signal Processors for Low-Power Communications Instructor: Clark T.-C. Nguyen
First International Conference and School on Nanoscale/Molecular Mechanics: Maui, HI; May 2002 School Lecture/Tutorial on Micromechanical Signal Processors for Low-Power Communications Instructor: Clark
More informationMEMS Technologies for Communications
MEMS Technologies for Communications Clark T.-C. Nguyen Program Manager, MPG/CSAC/MX Microsystems Technology Office () Defense Advanced Research Projects Agency Nanotech 03 Feb. 25, 2003 Outline Introduction:
More informationMEMS Technologies and Devices for Single-Chip RF Front-Ends
MEMS Technologies and Devices for Single-Chip RF Front-Ends Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Science University of Michigan Ann Arbor, Michigan 48105-2122 CCMT 06 April 25,
More informationMicromachining Technologies for Miniaturized Communication Devices
Micromachining Technologies for Miniaturized Communication Devices Clark T.-C. Nguyen Center for Integrated Sensors and Circuits Department of Electrical Engineering and Computer Science University of
More informationMicroelectromechanical Devices for Wireless Communications
Microelectromechanical Devices for Wireless Communications Clark T.-C. Nguyen Center for Integrated Sensors and Circuits Department of Electrical Engineering and Computer Science University of Michigan
More informationMicromechanical Circuits for Wireless Communications
Proceedings, 2000 European Solid-State Device Research Conference, Cork, Ireland, September 11-13, 2000, pp. 2-12. Micromechanical Circuits for Wireless Communications Clark T.-C. Nguyen Center for Integrated
More informationRF MEMS in Wireless Architectures
26.4 RF MEMS in Wireless Architectures Clark T.-C. Nguyen DARPA/MTO 3701 North Farifax Drive, Arlington, Virginia 22203-1714 (On leave from the University of Michigan, Ann Arbor, Michigan 48109-2122) 1-571-218-4586
More informationABSTRACT 1. INTRODUCTION
C. T.-C. Nguyen, Micromechanical components for miniaturized low-power communications (invited plenary), Proceedings, 1999 IEEE MTT-S International Microwave Symposium RF MEMS Workshop (on Microelectromechanical
More informationEE C245 ME C218 Introduction to MEMS Design Fall 2007
EE C245 ME C218 Introduction to MEMS Design Fall 2007 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 Lecture 1: Definition
More informationMicromechanical Circuits for Communication Transceivers
Micromechanical Circuits for Communication Transceivers C. T.-C. Nguyen, Micromechanical circuits for communication transceivers (invited), Proceedings, 2000 Bipolar/BiCMOS Circuits and Technology Meeting
More informationEE C245 ME C218 Introduction to MEMS Design Fall 2010
Instructor: Prof. Clark T.-C. Nguyen EE C245 ME C218 Introduction to MEMS Design Fall 2010 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley
More informationEE C245 ME C218 Introduction to MEMS Design
EE C245 ME C218 Introduction to MEMS Design Fall 2008 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 Lecture 2: Benefits
More informationEE C245 ME C218 Introduction to MEMS Design Fall 2010
Basic Concept: Scaling Guitar Strings EE C245 ME C218 ntroduction to MEMS Design Fall 21 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley
More informationEE C245 ME C218 Introduction to MEMS Design
EE C245 ME C218 Introduction to MEMS Design Fall 2008 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 Lecture 1: Definition
More informationMicromechanical filters for miniaturized low-power communications
C. T.-C. Nguyen, Micromechanical filters for miniaturized low-power communications (invited), to be published in Proceedings of SPIE: Smart Structures and Materials (Smart Electronics and MEMS), Newport
More informationVibrating RF MEMS Overview: Applications to Wireless Communications
C. T.-C. Nguyen, Vibrating RF MEMS overview: applications to wireless communications, Proceedings of SPIE: Micromachining and Microfabrication Process Technology, vol. 5715, Photonics West: MOEMS-MEMS
More informationDEVELOPMENT OF RF MEMS SYSTEMS
DEVELOPMENT OF RF MEMS SYSTEMS Ivan Puchades, Ph.D. Research Assistant Professor Electrical and Microelectronic Engineering Kate Gleason College of Engineering Rochester Institute of Technology 82 Lomb
More informationIntroduction to Microeletromechanical Systems (MEMS) Lecture 12 Topics. MEMS Overview
Introduction to Microeletromechanical Systems (MEMS) Lecture 2 Topics MEMS for Wireless Communication Components for Wireless Communication Mechanical/Electrical Systems Mechanical Resonators o Quality
More informationFrequency-Selective MEMS for Miniaturized Low-Power Communication Devices. Clark T.-C. Nguyen, Member, IEEE. (Invited Paper)
1486 IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 47, NO. 8, AUGUST 1999 Frequency-Selective MEMS for Miniaturized Low-Power Communication Devices Clark T.-C. Nguyen, Member, IEEE (Invited
More informationLocation-Dependent Frequency Tuning of Vibrating Micromechanical Resonators Via Laser Trimming
Location-Dependent Frequency Tuning of Vibrating Micromechanical Resonators Via Laser Trimming Mohamed A. Abdelmoneum, Mustafa U. Demirci, Yu-Wei Lin, and Clark T.-C Nguyen Center for Wireless Integrated
More informationINF 5490 RF MEMS. LN10: Micromechanical filters. Spring 2011, Oddvar Søråsen Jan Erik Ramstad Department of Informatics, UoO
INF 5490 RF MEMS LN10: Micromechanical filters Spring 2011, Oddvar Søråsen Jan Erik Ramstad Department of Informatics, UoO 1 Today s lecture Properties of mechanical filters Visualization and working principle
More informationMEMS BASED QUARTZ OSCILLATORS and FILTERS for on-chip INTEGRATION
MEMS BASED QUARTZ OSCILLATORS and FILTERS for on-chip INTEGRATION R. L. Kubena, F. P. Stratton, D. T. Chang, R. J. Joyce, and T. Y. Hsu Sensors and Materials Laboratory, HRL Laboratories, LLC Malibu, CA
More informationINF 5490 RF MEMS. L12: Micromechanical filters. S2008, Oddvar Søråsen Department of Informatics, UoO
INF 5490 RF MEMS L12: Micromechanical filters S2008, Oddvar Søråsen Department of Informatics, UoO 1 Today s lecture Properties of mechanical filters Visualization and working principle Design, modeling
More informationINF 5490 RF MEMS. LN10: Micromechanical filters. Spring 2012, Oddvar Søråsen Department of Informatics, UoO
INF 5490 RF MEMS LN10: Micromechanical filters Spring 2012, Oddvar Søråsen Department of Informatics, UoO 1 Today s lecture Properties of mechanical filters Visualization and working principle Modeling
More informationVibrating MEMS resonators
Vibrating MEMS resonators Vibrating resonators can be scaled down to micrometer lengths Analogy with IC-technology Reduced dimensions give mass reduction and increased spring constant increased resonance
More informationFrequency-Selective MEMS for Miniaturized Communication Devices
C. T.-C. Nguyen, Frequency-selective MEMS for miniaturized communication devices (invited), Proceedings, 1998 IEEE Aerospace Conference, vol. 1, Snowmass, Colorado, March 21-28, 1998, pp. 445-460. Frequency-Selective
More informationIntegration of AlN Micromechanical Contour- Mode Technology Filters with Three-Finger Dual Beam AlN MEMS Switches
University of Pennsylvania From the SelectedWorks of Nipun Sinha 29 Integration of AlN Micromechanical Contour- Mode Technology Filters with Three-Finger Dual Beam AlN MEMS Switches Nipun Sinha, University
More informationSurface Micromachining
Surface Micromachining An IC-Compatible Sensor Technology Bernhard E. Boser Berkeley Sensor & Actuator Center Dept. of Electrical Engineering and Computer Sciences University of California, Berkeley Sensor
More informationCascaded Channel-Select Filter Array Architecture Using High-K Transducers for Spectrum Analysis
Cascaded Channel-Select Filter Array Architecture Using High-K Transducers for Spectrum Analysis Eugene Hwang, Tanay A. Gosavi, Sunil A. Bhave School of Electrical and Computer Engineering Cornell University
More informationMicro Electro Mechanical Systems Programs at MTO. Clark T.-C. Nguyen Program Manager, DARPA/MTO
Micro Electro Mechanical Systems Programs at MTO Clark T.-C. Nguyen Program Manager, DARPA/MTO Microsystems Technology Office Technology for Chip-Level Integration of E. P. M. MEMS Application Domains
More informationEE C245 ME C218 Introduction to MEMS Design
EE C45 ME C18 Introduction to MEMS Design Fall 008 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 9470 Lecture 7: Noise &
More informationMEMS for RF, Micro Optics and Scanning Probe Nanotechnology Applications
MEMS for RF, Micro Optics and Scanning Probe Nanotechnology Applications Part I: RF Applications Introductions and Motivations What are RF MEMS? Example Devices RFIC RFIC consists of Active components
More informationSwitch-less Dual-frequency Reconfigurable CMOS Oscillator using One Single Piezoelectric AlN MEMS Resonator with Co-existing S0 and S1 Lamb-wave Modes
From the SelectedWorks of Chengjie Zuo January, 11 Switch-less Dual-frequency Reconfigurable CMOS Oscillator using One Single Piezoelectric AlN MEMS Resonator with Co-existing S and S1 Lamb-wave Modes
More informationEE C247B ME C218. EE C245: Introduction to MEMS Design. Spring EE C247B/ME C218: Introduction to MEMS Lecture 3m: Benefits of Scaling II
EE C247B/ME C218: ntroduction to MEMS Basic Concept: Scaling Guitar Strings Guitar String Vib. Amplitude EE C247B ME C218 ntroduction to MEMS Design Spring 2015 Prof. Clark T.- Freq. [Bannon 1996] Freq.
More informationMEMS BASED QUARTZ OSCILLATORS and FILTERS for on-chip INTEGRATION
MEMS BASED QUARTZ OSCILLATORS and FILTERS for on-chip INTEGRATION R. L. Kubena, F. P. Stratton, D. T. Chang, R. J. Joyce, and T. Y. Hsu Sensors and Materials Laboratory, HRL Laboratories, LLC Malibu, CA
More informationMEMS Reference Oscillators. EECS 242B Fall 2014 Prof. Ali M. Niknejad
MEMS Reference Oscillators EECS 242B Fall 2014 Prof. Ali M. Niknejad Why replace XTAL Resonators? XTAL resonators have excellent performance in terms of quality factor (Q ~ 100,000), temperature stability
More informationResearch and Development Activities in RF and Analog IC Design. RFIC Building Blocks. Single-Chip Transceiver Systems (I) Howard Luong
Research and Development Activities in RF and Analog IC Design Howard Luong Analog Research Laboratory Department of Electrical and Electronic Engineering Hong Kong University of Science and Technology
More informationPAR4CR: THE DEVELOPMENT OF A NEW SDR-BASED PLATFORM TOWARDS COGNITIVE RADIO
PAR4CR: THE DEVELOPMENT OF A NEW SDR-BASED PLATFORM TOWARDS COGNITIVE RADIO Olga Zlydareva Co-authors: Martha Suarez Rob Mestrom Fabian Riviere Outline 1 Introduction System Requirements Methodology System
More informationDesign of Clamped-Clamped Beam Resonator in Thick-Film Epitaxial Polysilicon Technology
Design of Clamped-Clamped Beam Resonator in Thick-Film Epitaxial Polysilicon Technology D. Galayko, A. Kaiser, B. Legrand, L. Buchaillot, D. Collard, C. Combi IEMN-ISEN UMR CNRS 8520 Lille, France ST MICROELECTRONICS
More informationReceiver Architecture
Receiver Architecture Receiver basics Channel selection why not at RF? BPF first or LNA first? Direct digitization of RF signal Receiver architectures Sub-sampling receiver noise problem Heterodyne receiver
More informationLow-Power Ovenization of Fused Silica Resonators for Temperature-Stable Oscillators
Low-Power Ovenization of Fused Silica Resonators for Temperature-Stable Oscillators Zhengzheng Wu zzwu@umich.edu Adam Peczalski peczalsk@umich.edu Mina Rais-Zadeh minar@umich.edu Abstract In this paper,
More informationProduct Opportunities and Challenges. Commercial RF-MEMS: wi Spry. Arthur S. Morris, III CTO, VP Eng.
Commercial RF-MEMS: Product Opportunities and Challenges Arthur S. Morris, III CTO, VP Eng. Introduction Who is wispry? Spun out from Coventor at end of 2002 Developing RF-MEMS for services customers since
More informationRF MEMS Circuits Applications of MEMS switch and tunable capacitor
RF MEMS Circuits Applications of MEMS switch and tunable capacitor Dr. Jeffrey DeNatale, Manager, MEMS Department Electronics Division jdenatale@rwsc.com 85-373-4439 Panamerican Advanced Studies Institute
More informationVHF and UHF Filters for Wireless Communications Based on Piezoelectrically-Transduced Micromechanical Resonators
VHF and UHF Filters for Wireless Communications Based on Piezoelectrically-Transduced Micromechanical Resonators Jing Wang Center for Wireless and Microwave Information Systems Nanotechnology Research
More informationHigh-Q UHF Micromechanical Radial-Contour Mode Disk Resonators
1298 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 14, NO. 6, DECEMBER 2005 High-Q UHF Micromechanical Radial-Contour Mode Disk Resonators John R. Clark, Member, IEEE, Wan-Thai Hsu, Member, IEEE, Mohamed
More informationPower Reduction in RF
Power Reduction in RF SoC Architecture using MEMS Eric Mercier 1 RF domain overview Technologies Piezoelectric materials Acoustic systems Ferroelectric materials Meta materials Magnetic materials RF MEMS
More informationKun Wang, Yinglei Yu, Ark-Chew Wong, and Clark T.-C. Nguyen
K. Wang, Y. Yu, A.-C. Wong, and C. T.-C. Nguyen, VHF free-free beam high-q micromechanical resonators, Technical Digest, 12 th International IEEE Micro Electro Mechanical Systems Conference, Orlando, Florida,
More informationEE C245 ME C218 Introduction to MEMS Design Fall 2011
EE C245/ME C218: ntrductin t MEMS Lecture 2m: Benefits f Scaling Lecture Outline EE C245 ME C218 ntrductin t MEMS Design Fall 211 Prf. Clark T.-C. Nguyen Reading: Senturia, Chapter 1 Lecture Tpics: Benefits
More informationFull Duplex CMOS Transceiver with On-Chip Self-Interference Cancelation. Seyyed Amir Ayati
Full Duplex CMOS Transceiver with On-Chip Self-Interference Cancelation by Seyyed Amir Ayati A Dissertation Presented in Partial Fulfillment of the Requirements for the Degree Doctor of Philosophy Approved
More informationISSCC 2006 / SESSION 20 / WLAN/WPAN / 20.5
20.5 An Ultra-Low Power 2.4GHz RF Transceiver for Wireless Sensor Networks in 0.13µm CMOS with 400mV Supply and an Integrated Passive RX Front-End Ben W. Cook, Axel D. Berny, Alyosha Molnar, Steven Lanzisera,
More informationmm-wave Transceiver Challenges for the 5G and 60GHz Standards Prof. Emanuel Cohen Technion
mm-wave Transceiver Challenges for the 5G and 60GHz Standards Prof. Emanuel Cohen Technion November 11, 11, 2015 2015 1 mm-wave advantage Why is mm-wave interesting now? Available Spectrum 7 GHz of virtually
More informationThird Order Intermodulation Distortion in Capacitive-Gap Transduced Micromechanical Filters
Third Order Intermodulation Distortion in Capacitive-Gap Transduced Micromechanical Filters Jalal Naghsh Nilchi, Ruonan Liu, Scott Li, Mehmet Akgul, Tristan O. Rocheleau, and Clark T.-C. Nguyen Berkeley
More informationLow-Q Wideband Antennas Miniaturized with Adaptive Tuning for Small-Platform Applications
Paper FR-A1.1A Low-Q Wideband Antennas Miniaturized with Adaptive Tuning for Small-Platform Applications Johnson J. H. Wang, Life Fellow Wang Electro-Opto Corporation (WEO) Marietta, GA USA Presented in
More informationSession 3. CMOS RF IC Design Principles
Session 3 CMOS RF IC Design Principles Session Delivered by: D. Varun 1 Session Topics Standards RF wireless communications Multi standard RF transceivers RF front end architectures Frequency down conversion
More informationStudy of MEMS Devices for Space Applications ~Study Status and Subject of RF-MEMS~
Study of MEMS Devices for Space Applications ~Study Status and Subject of RF-MEMS~ The 26 th Microelectronics Workshop October, 2013 Maya Kato Electronic Devices and Materials Group Japan Aerospace Exploration
More informationUWB Hardware Issues, Trends, Challenges, and Successes
UWB Hardware Issues, Trends, Challenges, and Successes Larry Larson larson@ece.ucsd.edu Center for Wireless Communications 1 UWB Motivation Ultra-Wideband Large bandwidth (3.1GHz-1.6GHz) Power spectrum
More informationCMY210. Demonstration Board Documentation / Applications Note (V1.0) Ultra linear General purpose up/down mixer 1. DESCRIPTION
Demonstration Board Documentation / (V1.0) Ultra linear General purpose up/down mixer Features: Very High Input IP3 of 24 dbm typical Very Low LO Power demand of 0 dbm typical; Wide input range Wide LO
More informationA Real-Time kHz Clock Oscillator Using a mm 2 Micromechanical Resonator Frequency-Setting Element
0.0154-mm 2 Micromechanical Resonator Frequency-Setting Element, Proceedings, IEEE International Frequency Control Symposium, Baltimore, Maryland, May 2012, to be published A Real-Time 32.768-kHz Clock
More informationGap Reduction Based Frequency Tuning for AlN Capacitive-Piezoelectric Resonators
Gap Reduction Based Frequency Tuning for AlN Capacitive-Piezoelectric Resonators Robert A. Schneider, Thura Lin Naing, Tristan O. Rocheleau, and Clark T.-C. Nguyen EECS Department, University of California,
More informationEnergy Efficient Transmitters for Future Wireless Applications
Energy Efficient Transmitters for Future Wireless Applications Christian Fager christian.fager@chalmers.se C E N T R E Microwave Electronics Laboratory Department of Microtechnology and Nanoscience Chalmers
More informationElectrically coupled MEMS bandpass filters Part I: With coupling element
Sensors and Actuators A 122 (2005) 307 316 Electrically coupled MEMS bandpass filters Part I: With coupling element Siavash Pourkamali, Farrokh Ayazi School of Electrical and Computer Engineering, Georgia
More informationSP 22.3: A 12mW Wide Dynamic Range CMOS Front-End for a Portable GPS Receiver
SP 22.3: A 12mW Wide Dynamic Range CMOS Front-End for a Portable GPS Receiver Arvin R. Shahani, Derek K. Shaeffer, Thomas H. Lee Stanford University, Stanford, CA At submicron channel lengths, CMOS is
More informationLow voltage LNA, mixer and VCO 1GHz
DESCRIPTION The is a combined RF amplifier, VCO with tracking bandpass filter and mixer designed for high-performance low-power communication systems from 800-1200MHz. The low-noise preamplifier has a
More informationRF Integrated Circuits
Introduction and Motivation RF Integrated Circuits The recent explosion in the radio frequency (RF) and wireless market has caught the semiconductor industry by surprise. The increasing demand for affordable
More informationAN MSI MICROMECHANICAL DIFFERENTIAL DISK-ARRAY FILTER. Dept. of Electrical Engineering & Computer Science, University of Michigan, Ann Arbor, USA 2
AN MSI MICROMECHANICAL DIFFERENTIAL DISKARRAY FILTER ShengShian Li 1, YuWei Lin 1, Zeying Ren 1, and Clark T.C. Nguyen 2 1 Dept. of Electrical Engineering & Computer Science, University of Michigan, Ann
More informationIntegrated Microwave Assemblies
Integrated Microwave Assemblies Integrated Microwave Assembly (IMA) Custom Solutions For more information please call us at 888.553.7531 API Technologies, a world class leader in component design and system
More informationDual-Frequency GNSS Front-End ASIC Design
Dual-Frequency GNSS Front-End ASIC Design Ed. 01 15/06/11 In the last years Acorde has been involved in the design of ASIC prototypes for several EU-funded projects in the fields of FM-UWB communications
More information1GHz low voltage LNA, mixer and VCO
DESCRIPTION The is a combined RF amplifier, VCO with tracking bandpass filter and mixer designed for high-performance low-power communication systems from 800-1200MHz. The low-noise preamplifier has a
More informationIN-CHIP DEVICE-LAYER THERMAL ISOLATION OF MEMS RESONATOR FOR LOWER POWER BUDGET
Proceedings of IMECE006 006 ASME International Mechanical Engineering Congress and Exposition November 5-10, 006, Chicago, Illinois, USA IMECE006-15176 IN-CHIP DEVICE-LAYER THERMAL ISOLATION OF MEMS RESONATOR
More informationWireless Energy for Battery-less Sensors
Wireless Energy for Battery-less Sensors Hao Gao Mixed-Signal Microelectronics Outline System of Wireless Power Transfer (WPT) RF Wireless Power Transfer RF Wireless Power Transfer Ultra Low Power sions
More informationQuiz2: Mixer and VCO Design
Quiz2: Mixer and VCO Design Fei Sun and Hao Zhong 1 Question1 - Mixer Design 1.1 Design Criteria According to the specifications described in the problem, we can get the design criteria for mixer design:
More informationProcess Technology to Fabricate High Performance MEMS on Top of Advanced LSI. Shuji Tanaka Tohoku University, Sendai, Japan
Process Technology to Fabricate High Performance MEMS on Top of Advanced LSI Shuji Tanaka Tohoku University, Sendai, Japan 1 JSAP Integrated MEMS Technology Roadmap More than Moore: Diversification More
More informationHot Topics and Cool Ideas in Scaled CMOS Analog Design
Engineering Insights 2006 Hot Topics and Cool Ideas in Scaled CMOS Analog Design C. Patrick Yue ECE, UCSB October 27, 2006 Slide 1 Our Research Focus High-speed analog and RF circuits Device modeling,
More informationAn Energy Efficient 1 Gb/s, 6-to-10 GHz CMOS IR-UWB Transmitter and Receiver With Embedded On-Chip Antenna
An Energy Efficient 1 Gb/s, 6-to-10 GHz CMOS IR-UWB Transmitter and Receiver With Embedded On-Chip Antenna Zeshan Ahmad, Khaled Al-Ashmouny, Kuo-Ken Huang EECS 522 Analog Integrated Circuits (Winter 09)
More informationOverview: Trends and Implementation Challenges for Multi-Band/Wideband Communication
Overview: Trends and Implementation Challenges for Multi-Band/Wideband Communication Mona Mostafa Hella Assistant Professor, ESCE Department Rensselaer Polytechnic Institute What is RFIC? Any integrated
More informationA GSM Band Low-Power LNA 1. LNA Schematic
A GSM Band Low-Power LNA 1. LNA Schematic Fig1.1 Schematic of the Designed LNA 2. Design Summary Specification Required Simulation Results Peak S21 (Gain) > 10dB >11 db 3dB Bandwidth > 200MHz (
More informationA COMPACT WIDEBAND MATCHING 0.18-µM CMOS UWB LOW-NOISE AMPLIFIER USING ACTIVE FEED- BACK TECHNIQUE
Progress In Electromagnetics Research C, Vol. 16, 161 169, 2010 A COMPACT WIDEBAND MATCHING 0.18-µM CMOS UWB LOW-NOISE AMPLIFIER USING ACTIVE FEED- BACK TECHNIQUE J.-Y. Li, W.-J. Lin, and M.-P. Houng Department
More informationReconfigurable 4-Frequency CMOS Oscillator Based on AlN Contour-Mode MEMS Resonators
From the SelectedWorks of Chengjie Zuo October, 2010 Reconfigurable 4-Frequency CMOS Oscillator Based on AlN Contour-Mode MEMS Resonators Matteo Rinaldi, University of Pennsylvania Chengjie Zuo, University
More informationPulse-Based Ultra-Wideband Transmitters for Digital Communication
Pulse-Based Ultra-Wideband Transmitters for Digital Communication Ph.D. Thesis Defense David Wentzloff Thesis Committee: Prof. Anantha Chandrakasan (Advisor) Prof. Joel Dawson Prof. Charles Sodini Ultra-Wideband
More informationRF/Microwave Circuits I. Introduction Fall 2003
Introduction Fall 03 Outline Trends for Microwave Designers The Role of Passive Circuits in RF/Microwave Design Examples of Some Passive Circuits Software Laboratory Assignments Grading Trends for Microwave
More informationVibrating RF MEMS for Next Generation Wireless Applications
C. T.-C. Nguyen, Vibrating RF MEMS for next generation wireless applications, Proceedings, 004 IEEE Custom Integrated Circuits Conf., Orlando, Florida, Oct. 3-6, 004, pp. 57-64. Vibrating RF MEMS for Next
More informationChapter 6. Case Study: 2.4-GHz Direct Conversion Receiver. 6.1 Receiver Front-End Design
Chapter 6 Case Study: 2.4-GHz Direct Conversion Receiver The chapter presents a 0.25-µm CMOS receiver front-end designed for 2.4-GHz direct conversion RF transceiver and demonstrates the necessity and
More information77 GHz VCO for Car Radar Systems T625_VCO2_W Preliminary Data Sheet
77 GHz VCO for Car Radar Systems Preliminary Data Sheet Operating Frequency: 76-77 GHz Tuning Range > 1 GHz Output matched to 50 Ω Application in Car Radar Systems ESD: Electrostatic discharge sensitive
More informationLow-Power RF Integrated Circuit Design Techniques for Short-Range Wireless Connectivity
Low-Power RF Integrated Circuit Design Techniques for Short-Range Wireless Connectivity Marvin Onabajo Assistant Professor Analog and Mixed-Signal Integrated Circuits (AMSIC) Research Laboratory Dept.
More informationHybrid Ultra-Compact 4th Order Band-Pass Filters Based On Piezoelectric AlN Contour- Mode MEMS Resonators
From the Selectedorks of Chengjie Zuo Summer June 1, 2008 Hybrid Ultra-Compact 4th Order Band-Pass Filters Based On Piezoelectric AlN Contour- Mode MEMS Resonators Chengjie Zuo, University of Pennsylvania
More informationMEMS in ECE at CMU. Gary K. Fedder
MEMS in ECE at CMU Gary K. Fedder Department of Electrical and Computer Engineering and The Robotics Institute Carnegie Mellon University Pittsburgh, PA 15213-3890 fedder@ece.cmu.edu http://www.ece.cmu.edu/~mems
More informationCHAPTER 4 ULTRA WIDE BAND LOW NOISE AMPLIFIER DESIGN
93 CHAPTER 4 ULTRA WIDE BAND LOW NOISE AMPLIFIER DESIGN 4.1 INTRODUCTION Ultra Wide Band (UWB) system is capable of transmitting data over a wide spectrum of frequency bands with low power and high data
More informationFall 2017 Project Proposal
Fall 2017 Project Proposal (Henry Thai Hoa Nguyen) Big Picture The goal of my research is to enable design automation in the field of radio frequency (RF) integrated communication circuits and systems.
More informationSynthesis of Optimal On-Chip Baluns
Synthesis of Optimal On-Chip Baluns Sharad Kapur, David E. Long and Robert C. Frye Integrand Software, Inc. Berkeley Heights, New Jersey Yu-Chia Chen, Ming-Hsiang Cho, Huai-Wen Chang, Jun-Hong Ou and Bigchoug
More informationRF Micro/Nano Resonators for Signal Processing
RF Micro/Nano Resonators for Signal Processing Roger T. Howe Depts. of EECS and ME Berkeley Sensor & Actuator Center University of California at Berkeley Outline FBARs vs. lateral bulk resonators Electrical
More informationAn All CMOS, 2.4 GHz, Fully Adaptive, Scalable, Frequency Hopped Transceiver
An All CMOS, 2.4 GHz, Fully Adaptive, Scalable, Frequency Hopped Transceiver Farbod Behbahani John Leete Alexandre Kral Shahrzad Tadjpour Karapet Khanoyan Paul J. Chang Hooman Darabi Maryam Rofougaran
More informationMAX2387/MAX2388/MAX2389
19-13; Rev 1; /1 EVALUATION KIT AVAILABLE W-CDMA LNA/Mixer ICs General Description The MAX37/MAX3/ low-noise amplifier (LNA), downconverter mixers designed for W-CDMA applications, are ideal for ARIB (Japan)
More informationElectrostatic actuation of silicon optomechanical resonators Suresh Sridaran and Sunil A. Bhave OxideMEMS Lab, Cornell University, Ithaca, NY, USA
Electrostatic actuation of silicon optomechanical resonators Suresh Sridaran and Sunil A. Bhave OxideMEMS Lab, Cornell University, Ithaca, NY, USA Optomechanical systems offer one of the most sensitive
More informationLow Power Communication Circuits for WSN
Low Power Communication Circuits for WSN Nate Pletcher, Prof. Jan Rabaey, (B. Otis, Y.H. Chee, S. Gambini, D. Guermandi) Berkeley Wireless Research Center Towards A Micropower Integrated Node power management
More information433MHz front-end with the SA601 or SA620
433MHz front-end with the SA60 or SA620 AN9502 Author: Rob Bouwer ABSTRACT Although designed for GHz, the SA60 and SA620 can also be used in the 433MHz ISM band. The SA60 performs amplification of the
More informationW-CDMA Upconverter and PA Driver with Power Control
19-2108; Rev 1; 8/03 EVALUATION KIT AVAILABLE W-CDMA Upconverter and PA Driver General Description The upconverter and PA driver IC is designed for emerging ARIB (Japan) and ETSI-UMTS (Europe) W-CDMA applications.
More informationA 2.4 GHZ RECEIVER IN SILICON-ON-SAPPHIRE MICHAEL PETERS. B.S., Kansas State University, 2009 A REPORT
A 2.4 GHZ RECEIVER IN SILICON-ON-SAPPHIRE by MICHAEL PETERS B.S., Kansas State University, 2009 A REPORT submitted in partial fulfillment of the requirements for the degree MASTER OF SCIENCE Department
More informationGround-Adjustable Inductor for Wide-Tuning VCO Design Wu-Shiung Feng, Chin-I Yeh, Ho-Hsin Li, and Cheng-Ming Tsao
Applied Mechanics and Materials Online: 2012-12-13 ISSN: 1662-7482, Vols. 256-259, pp 2373-2378 doi:10.4028/www.scientific.net/amm.256-259.2373 2013 Trans Tech Publications, Switzerland Ground-Adjustable
More information