Laser cutter ONPY-LC1
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1 Laser cutter ONPY-LC1 Extended resources for Failure Analysis (FA) in ONPY Subject: This document outlines analytical possibilities of the laser cutter system in OPNY2 Content: This system was completed in ONPY for electrical failure analysis. Components from various suppliers were used. Reference documents 12MON23542D, 12MON22866D 1
2 Laser cutter (outline) Detailed information can be found in 12MON23542D Laser EzLaze II: wavelengths: 355 nm (NUV) 533 nm (Green) Attenuator setting: Pulse continual: 1 Hz Optical system: A-ZOMM microscope polarizer/analyzer filters Magnifications: Objectives: 2x (Aperture=0.055, WD= 34 mm) 20x (Aperture=0.42, WD= 20 mm) 50x NUV * (0.42, WD= 20.5 mm) 100x NUV * (0.5, WD= 13 mm) (* appropriate for laser cutting) Prober Wentworth MP Motorized X-Y-Z stage Resolution 0.1 um 8 thermo chuck (gold plated) Theta adjustment +/- 15 Instrumentation: HP 4145B semiconductor analyzer HP4284A RLC meter Temptronics TPO3010B thermocont. Tektronix TDS3014B oscilloscope Fluke 189 handheld multimeter Fluke 62 mini IR thermometer 2
3 Dark box Dark box - EMC isolation - Optical isolation - Interlock Switch for safety operation - Warning signalization Connector panel with BNC 4 x SMU (100 ma max, HP41455B) 2 x VMU (Voltage Monitor Units) 2 x VSU (Voltage Source Units) 2 x RLC meter (HP4284A) 1 x Interlock connector 1 x 12V light power source connector Tektronix TDS3014B - 4-channel digital storage oscilloscope MHz, TCP-IP, GP-IB - 4 x voltage probe - 1 x current probe (up to 15A) Prober - 4 x precise vacuum micromanipulators determined for micro-probing - available probe needles with tip diameter 0.25 um and 0.1 um - available probe needles with 1 um (contact pads) 3
4 Electrical installation schematic L1 N PE 19 Rack safety electrical block with 15 A current limiter HP 4145B semiconductor analyzer PC1 for ATCAM CCD and VEE A-ZOOM source light source Laser power source laser power source 15 LCD Monitor Light power source light source for dark box PC2 for PMM controller Vibration table KINETICS 1~NPE 60Hz 230V/TNS 1~NPE 60Hz 110V/TNS 19 LCD Monitor Wentworth PMM prober HP4284A RLC meter Tektronix TDS3014B digital oscilloscope TP3010B Temptronic controller L1 N PE Dark box 4
5 5 Laser cutter system resources Laser cutting - cutting SiO2, SiN, Al, SOG, Poly Si, etc. - minimum cut size 1 x 1 um (using objective 100X) - maximum cut size 50 x 50 um (using 50X objective) Thermal liquid crystal analysis -hot spot analysis available liquid crystals LC1: NP4, clearing temperature: 76 C LC2: ME6N, clearing temperature: 47.5 C LC3: ME105, clearing temperature: 42,9 C LC4: BN/R42C1W, clearing temperature: 53,3 C LC5: K18 (MERK), clearing temperature: 29 C DC characterization available: - 4 x SMU, 2 x VMU, 2 x VSU - 5 x micro-manipulators + Probe card holder - applicable temperature range from 10 C 125 C (see page 7) - micro-probing Impedance characterization - characterization of capacitors, Rs, Rp, G, L, etc. - applicable temperature range from 10 C 125 C - micro-probing Automation of measurement - Agilent VEE 7.5 (Visual Engineering Environment) - GP-IB, TCP-IP communication
6 laser cutting with on-line IV monitoring by using probe card with holder Probe card format: - Electroglas compatible Available activities in parallel during probing with probe card : - Laser cutting (due to large working distance of objectives) - Additional micro-probing - Liquid crystal analysis - Thermal conditioning 6
7 Thermo-chuck characterization (measured involving Agilent VEE7.5) 7
8 Example of Laser cutting (Metal2 through SiN-ILD2-SOG-ILD1-AlCu A) PS5LV: NCP5010, triple layer metal M2 cut (Green High E300) M top M2 cut (Green High E300) M2 8
9 Example of Micro-probing (to Metal top with opened window in passivation layer) NCP5010 open in SiN (NUV High E400) needle 9
10 Example of Micro-probing (to Metal2 top with opened window in dielectric layers SiN-ILD2-SOG-ILD1) NCP5010, triple layer metal open in dielectrics needle 10
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