LC Low Capacitance 3.3 Volt TVS for High Speed Interfaces. PROTECTION PRODUCTS Description. Features. Applications

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1 Descrition The LC33.3 transient voltage suressor is designed to rotect comonents which are connected to high seed data and telecommunication lines from voltage surges caused by lightning, electrostatic discharge (ESD), and electrical fast transients (EFT). TS diodes are ideal for use as board level rotection of sensitive semiconductor comonents. The LC3 3.3 combines a TS diode with a rectifier bridge to rovide transient rotection in both common and differential mode with a single device. The LC33.3 utilizes Semtech s EPD technology for suerior electrical characteristics at 3.3 volts. The caacitance of the device is minimized to ensure correct signal transmission on high seed lines. The LC33.3 meets the shorthaul (intrabuilding) transient immunity requirements of Bellcore 9 for telecommunications alications. LC33.3 Low Caacitance 3.3 olt TS for High Seed Interfaces Features watts eak ulse ower (t = /2µs) Transient rotection for highseed data lines to Bellcore 9 (IntraBuilding) A (2/µs) ITU K.2 =4A (5/3µs) IEC 642 (ESD) ±5k (air), ±k (contact) IEC 644 (EFT) 4A (5/5ns) IEC 645 (Lightning) A (/2µs) Protects two lines in common and differential mode Low caacitance for highseed interfaces Low oerating voltage (3.3) Low claming voltage Integrated structure saves board sace and increases reliability Solidstate EPD technology Mechanical Characteristics JEDEC SO ackage RoHS/WEEE Comliant Molding comound flammability rating: UL 94 Marking : Part number, date code Packaging : Tube or Tae and Reel er EIA 4 Alications Low Interfaces T3/E3 / Ethernet SetTo Box ISDN Interfaces Circuit Diagram Schematic & PIN Configuration Pin and 2 7 Pin 2, 3, 6, and 7 Ground 3 6 Pin 4 and SO (To iew) Revision //2

2 Absolute Maximum Rating PRELIMINARY Rating Symbol alue Units Peak Pulse Power (t = /2µs) P k Peak Pulse Current (t = /2µs) I P P Watts A Lead Soldering Temerature T L 26 ( sec. ) C Oerating Temerature T J 55 to +25 C Storage Temerature T STG 55 to +5 C Electrical Characteristics LC33.3 Parameter Symbol Conditions Minimum Tyical Maximum Units Reverse StandOff WM R. 3 3 PunchThrough SnaBack PT SB I PT I SB = 2µ A 3. 5 = 5mA 2. Reverse Leakage Current I R RWM = 3.3, T=25 C µ A Claming C = 5A, t = /2µ s LinetoGround Claming C = 5A, t = /2µ s LinetoLine Claming C = A, t = /2µ s LinetoGround Claming C = A, t = /2µ s LinetoLine Junction Caacitance C j Between I/O ins and Ground =, f = MHz R Between I/O ins =, f = MHz R F 2 F 2 Semtech Cor. 2

3 Tyical Characteristics Peak Pulse Power Pk (kw) NonReetitive Peak Pulse Power vs. Pulse Time.. Pulse Duration t (µs) Pulse Waveform % of Rated Power or IPP Power Derating Curve Ambient Temerature T A ( o C) Claming vs. Peak Pulse Current Percent of IPP e t td = IPP/2 Waveform Parameters: tr = µs td = 2µs Time (µs) Claming C () LineToLine LineToGround Waveform Parameters: tr = µs td = 2µs Peak Pulse Current (A) Normalized Caacitance vs. Reverse Insertion Loss S2 (Line to Ground).4 CH S2 LOG 3 db/ REF db.2 C J ( R ) / C J ( R =) f = MHz Reverse R () START. 3 MHz STOP 3. MHz 2 Semtech Cor. 3

4 Alications Information Device Connection Otions for Protection of Two HighSeed Data Lines The LC33.3 is designed to rotect two highseed data lines (one differential air) from transient overvoltages which result from lightning and ESD. The device can be configured to rotect in differential (LinetoLine) and common (LinetoGround) mode. Data line inuts/oututs are connected at ins to, and 4 to 5 as shown. Pins 2, 3, 6, and 7 are connected to ground. These ins should be connected directly to a ground lane on the board for best results. The ath length is ket as short as ossible to minimize arasitic inductance. In alications where high common mode voltages are resent, differential rotection is achieved by leaving ins 2, 3, 6, and 7 not connected. PRELIMINARY Matte Tin Lead Finish Matte tin has become the industry standard leadfree relacement for SnPb lead finishes. A matte tin finish is comosed of % tin solder with large grains. Since the solder volume on the leads is small comared to the solder aste volume that is laced on the land attern of the PCB, the reflow rofile will be determined by the requirements of the solder aste. Therefore, these devices are comatible with both leadfree and SnPb assembly techniques. In addition, unlike other leadfree comositions, matte tin does not have any added alloys that can cause degradation of the solder joint. Connection for Differential (LinetoLine) and Common Mode Protection (LinetoGround) Connection for Differential Protection (LinetoLine) 2 Semtech Cor. 4

5 Alications Information SPICE Model.7 nh D LC33.3 Sice Model LC33.3 Sice Parameters Parameter IS B J RS IB CJO TT U nit D (TS) (LCRD) Am.E2 3.9E3 olt olt Ohm Am E3 E3 Farad 3.4e9.E2 sec 2.54E E 9 M N.. EG e.. 2 Semtech Cor. 5

6 Outline Drawing SO PRELIMINARY 2X E/2 ccc C 2X N/2 TIPS aaa C SEATING PLANE C N A 2 D e D E E e/2 B A2 A A bxn bbb C AB D GAGE PLANE.25 H SIDE IEW h L (L) DETAIL A h c SEE DETAIL A DIMENSIONS INCHES MILLIMETERS DIM MIN NOM MAX MIN NOM MAX A A A b c D E E.236 BSC 6. BSC e.5 BSC.27 BSC h L L N (.4) (.4) aaa bbb ccc..2 NOTES:. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS A AND B TO BE DETERMINED AT DATUM PLANE H 3. DIMENSIONS "E" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. REFERENCE JEDEC STD MS2, ARIATION AA. Land Pattern SO X DIMENSIONS DIM INCHES MILLIMETERS C (.25) (5.2) (C) G Z G. 3. P.5.27 X.24.6 Y Y Z P NOTES:. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2. REFERENCE IPCSM72A, RLP NO. 3A. 2 Semtech Cor. 6

7 Ordering Information Part Number Lead Finish Qty er Reel Reel Size LC33.3.TB LC33.3.TBT SnPb 5 7 Inch Pb Free 5 7 Inch Marking Diagram SC YYWW LC33.3 Note: YYWW = Date Code Contact Information Semtech Cororation Protection Products Division 2 Flynn Road, Camarillo, CA 932 Phone: (5)492 FAX (5) Semtech Cor. 7