PS S Intellimod Module Dual-In-Line Intelligent Power Module 20 Amperes/600 Volts
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- Geoffrey Hodges
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1 Dual-In-Line Intelligent Power Module R O A D N P X K C L AF R P U HEATSINK SIDE Outline Drawing and Circuit Diagram Dimensions Inches Millimeters A 1.50± ±0.5 B 0.94± ±0.5 C D E 0.57± ±0.5 F 0.74± ±0.5 G 1.15± ±0.5 H J K L 0.06± ±0.05 M (VNC) 6 VP 2 VUFB 7 WP 3 VVFB 8 VP1 4 VWFB 9 VNC 5 UP 10 UN N 1.39± ±0.3 O 0.07± ±0.2 P Q R VN 12 WN 13 VN1 14 FO 15 CIN DETAIL "A" 23 DETAIL "C" Z 24 TERMINAL CODE 16 VNC 17 VNO 18 NW 19 NV 20 NU T 25 AH 21 W 22 V 23 U 24 P 25 NC AE Q AA B AB W V G K E F DETAIL "A" E Y AC W H M HEATSINK SIDE Dimensions Inches Millimeters S T U 0.1± ±0.2 V 1.33± ±0.5 W X Y Z AA 0.22± ±0.5 AB 0.37± ±0.5 AC 0 ~ 5 0 ~ 5 AD 0.06 Min. 1.5 Min. AE AF Rad. 1.6 Rad. AG Min. 3.0 Min. AH Min. 2.5 Min. J AD DETAIL "B" DETAIL "B" AG S DETAIL "C" Description: DIP-IPMs are intelligent power modules that integrate power devices, drivers, and protection circuitry in an ultra compact dual-in-line transfer-mold package for use in driving small three phase motors. Use of 5th generation IGBTs, DIP packaging, and application specif ic HVICs allow the designer to reduce inverter size and overall design time. Features: Compact Packages Single Power Supply Integrated HVICs Direct Connection to CPU Reduced R th Applications: Refrigerators Air Conditioners Small Servo Motors Small Motor Control Ordering Information: is a 600V, 20 Ampere short pin DIP Intelligent Power Module.
2 Absolute Maximum Ratings, T j = 25 C unless otherwise specified Characteristics Symbol Units Power Device Junction Temperature* T j -20 to 150 C Storage Temperature T stg -40 to 125 C Case Operating Temperature (Note 1) T C -20 to 100 C Mounting Torque, M3 Mounting Screws 6.9 in-lb Module Weight (Typical) 10 Grams Heatsink Flatness (Note 2) -50 to 100 µm Self-protection Supply Voltage Limit (Short Circuit Protection Capability)** V CC(prot.) 400 Volts Isolation Voltage, AC 1 minute, 60Hz Sinusoidal, Connection Pins to Heatsink Plate V ISO 1500 Volts *The ma ximum junction temperature rating of the power chips integrated within the DIP-IPM is 150 C (@T C 100 C). However, to ensure safe operation of the DIP-IPM, the average junction temperature should be limited to T j(avg) 125 C (@T C 100 C). **V D = 13.5 ~ 16.5V, Inverter Part, T j = 125 C, Non-repetitive, Less than 2µs IGBT Inverter Sector Collector-Emitter Voltage V CES 600 Volts Each Collector Current, ± (T C = 25 C) I C 20 Amperes Each Peak Collector Current, ± (T C = 25 C, Less than 1ms) I CP 40 Amperes Supply Voltage (Applied between P - N) V CC 450 Volts Supply Voltage, Surge (Applied between P - N) V CC(surge) 500 Volts Collector Dissipation (T C = 25 C, per 1 Chip) P C 35.7 Watts Control Sector Supply Voltage (Applied between V P1 -V NC, V N1 -V NC ) V D 20 Volts Supply Voltage (Applied between V UFB -U, V VFB -V, V WFB -W) V DB 20 Volts Input Voltage (Applied between U P, V P, W P -V NC, U N, V N, W N -V NC ) V IN -0.5 ~ V D +0.5 Volts Fault Output Supply Voltage (Applied between F O -V NC ) V FO -0.5 ~ V D +0.5 Volts Fault Output Current (Sink Current at F O Terminal) I FO 1 ma Current Sensing Input Voltage (Applied between C IN -V NC ) V SC -0.5 ~ V D +0.5 Volts Note 1 T C Measure Point Note 2 Flatness Measurement Position CONTROL TERMINALS DIP-IPM MEASUREMENT POINT 11.6mm 3.0mm + 4.6mm IGBT CHIP FWDi CHIP T C POINT HEATSINK SIDE HEATSINK PLACE TO CONTACT A HEATSINK POWER TERMINALS + HEATSINK
3 Electrical and Mechanical Characteristics, T j = 25 C unless otherwise specified Characteristics Symbol Test Conditions Min. Typ. Max. Units IGBT Inverter Sector Collector-Emitter Saturation Voltage V CE(sat) V D = V DB = 15V, I C = 20A, V IN = 5V, T j = 25 C Volts V D = V DB = 15V, I C = 20A, V IN = 5V, T j = 125 C Volts Diode Forward Voltage V EC -I C = 20A, V IN = 0V Volts Inductive Load Switching Times t on µs t rr V CC = 300V, V D = V DB = 15V, 0.30 µs t C(on) I C = 20A, T j = 125 C, µs t off V IN = 0 5V, Inductive Load, µs t C(off) µs Collector Cutoff Current I CES V CE = V CES, T j = 25 C 1.0 ma Control Sector V CE = V CES, T j = 125 C 10 ma Circuit Current I D V IN = 5V Total of V P1 -V NC, V N1 -V NC 2.80 ma V D = V DB = 15V V UFB -U, V VFB -V, V WFB -W 0.55 ma V IN = 0V Total of V P1 -V NC, V N1 -V NC 2.80 ma V UFB -U, V VFB -V, V WFB -W 0.55 ma Fault Output Voltage V FOH V SC = 0V, F O Terminal Pull-up to 5V by 10kΩ 4.9 Volts V FOL V SC = 1V, I FO = 1mA 0.95 Volts Input Current I IN V IN = 5V ma Short Circuit Trip Level* V SC(ref) V D = 15V* Volts Supply Circuit Under-voltage UV DBt Trip Level, T j 125 C Volts UV DBr Reset Level, T j 125 C Volts UV Dt Trip Level, T j 125 C Volts UV Dr Reset Level, T j 125 C Volts Fault Output Pulse Width** t FO 20 µs ON Threshold Voltage V th(on) Applied between Volts OFF Threshold Voltage V th(off) U P, V P, W P -V NC, Volts ON/OFF Threshold Hysteresis Voltage V th(hys) U N, V N, W N -V NC Volts * Short Circuit protection is functioning only for the low-arms. Please select the value of the external shunt resistor such that the SC trip level is less than 1.7 times the current rating. **Fault signal is asserted only for a UV or SC condition on the low side. On a SC fault the FO duration will be 20µsec. On a UV condition the fault signal will be asserted as long as the UV condition exists or for 20µsec, whichever is longer. 3
4 Thermal Characteristics Characteristic Symbol Condition Min. Typ. Max. Units Junction to Case R th(j-c)q Inverter IGBT (Per 1/6 Module) 2.8 C/Watt R th(j-c)d Inverter FWDi (Per 1/6 Module) 3.9 C/Watt Recommended Conditions for Use Characteristic Symbol Condition Min. Typ. Max. Units Supply Voltage V CC Applied between P-N Terminals Volts Control Supply Voltage V D Applied between V P1 -V NC, V N1 -V NC Volts V DB Applied between V UFB -U, Volts V VFB -V, V WFB -W Control Supply Variation dv D, dv DB -1 1 V/µs Arm Shoot-through Blocking Time t DEAD For Each Input Signal, T C 100 C 1.5 µs Allowable Minimum Input P WIN(on) 0.5 µs Pulse Width* P WIN(off) 0.5 µs V NC Voltage Variation V NC Between V NC -N (Including Surge) Volts *DIP-IPM might not make response or work properly if the input signal pulse width is less than the recommended minimum value.
5 Application Circuit
6 Protection Function Timing Diagrams Short-Circuit Protection (Lower-arms only with the external shunt resistor and RC filter) LOWER-ARMS CONTROL INPUT A6 A7 PROTECTION CIRCUIT STATE SET INTERNAL IGBT GATE A3 A1 A2 SC A4 OUTPUT CURRENT I C A8 SENSE VOLTAGE OF THE SHUNT RESISTOR FAULT OUTPUT F O A5 SC REFERENCE VOLTAGE CR CIRCUIT TIME CONTAINS DELAY (NOTE) A1: Normal operation IGBT turn on and conducting current. A2: Short-circuit current detected (SC trigger). A3: IGBT gate hard interrupted. A4: IGBT turn off. A5: F O output with a fixed pulse width of t FO(min) = 20µs. A6: Input L IGBT off. A7: Input H IGBT on is blocked during the F O output period. A8: IGBT stays in off state. Under-Voltage Protection (Lower-side, UV D ) CONTROL INPUT PROTECTION CIRCUIT STATE SET UV Dr CONTROL SUPPLY VOLTAGE V D B1 UV Dt B3 B6 B2 B4 B7 OUTPUT CURRENT I C FAULT OUTPUT F O B5 B1: Control supply voltage rise After the voltage level reaches UV Dr, the drive circuit begins to work at the rising edge of the next input signal. B2 : Normal operation IGBT turn on and conducting current. B3: Under-voltage trip (UV Dt ). B4: IGBT turn off regardless of the control input level. B5: F O output during under-voltage period, however, the minimum pulse width is 20µs. B6: Under-voltage reset (UV Dr ). B7: Normal operation IGBT turn on and conducting current.
7 Protection Function Timing Diagrams Under-Voltage Protection (Upper-side, UV DB ) CONTROL INPUT PROTECTION CIRCUIT STATE SET CONTROL SUPPLY VOLTAGE V DB UV DBr C1 UV Dt C3 C5 C2 C4 C6 OUTPUT CURRENT I C FAULT OUTPUT F O HIGH LEVEL (NO FAULT OUTPUT) C1: Control supply voltage rises After the voltage level reaches UV DBr, the drive circuit begins to work at the rising edge of the next input signal. C2: Normal operation IGBT turn on and conducting current. C3: Under-voltage trip (UV DBt ). C4: IGBT stays off regardless of the control input level, but there is no F O signal output. C5: Under-voltage reset (UV Dr ). C6: Normal operation IGBT turn on and conducting current. Typical Interface Circuit 5V LINE MCU 10kΩ DIP-IPM U P, V P, W P, U N, V N, W N 3.3kΩ (MIN) F O V NC (LOGIC) NOTE: RC coupling at each input (parts shown dotted) may change depending on the PWM control scheme used in the application and the wiring impedance of the printed circuit board. The DIP-IPM input signal section integrates a 3.3kΩ (min) pull-down resistor. Therefore, when using an external filtering resistor, care must be taken to satisfy the turn-on threshold voltage requirement. Wiring Method Around Shunt Resistor Wiring inductance should be less than 10nH. (Equivalent to the inductance of a copper pattern with length = 17mm, width = 3mm, and thickness = 100µm.) DIP-IPM NU Shunt Resistors V NC NV NW Please make the connection of shunt resistor close to V NC terminal. 7
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