MD80//2/5 Datasheet PINOUT CONFIGURATION PIN Function Description MD85 CPC S MD80//2 Figure2.PinConfigurationofMD80//2/5(Topview) Pin # Name Function

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1 MD80//2/5 Datasheet High performance primary side regulator (PSR) offline switch power supply (SMPS) controller PRODUCT DESCRIPTION MD8X is high performance primary sensing regulator (PSR) and monolithic switch power controller which is designed for small-power supply equipment with current mode control. Built-in accurate CV/CC control circuit, eliminates optocoupler, TL43 and its related loop devices. High integration design, a high performance power BJT and PFM controller and all kinds of protection circuits in one chip, to minimize the peripheral components to save the cost greatly. MD8X can be simply designed a typical flyback switch converter, the unique driving technology promotes the characteristics of withstand voltage and achieves excellent converting efficiency. FEATURES Built-in 70V power BJT. PSR control, eliminates optocoupler and TL43 Accurate CV/CC control Hysteresis over-temperature protection (OTP) circuit Higher efficiency and meet Level 6 efficiency standards Output voltage protection (OVP/UVP) < 00 mw no-load (5* rating) Auto-Restart function Ultra-low start-up current Quasi-resonant operation Line under voltage protection(luvp) Good EMC characteristic allows the simple EMC circuit APPLICATIONS FigurePackgediagram Output Power Table P/N S Packge(SOP-7 ) Packge S S PPackge (DIP-7) 90Vac-265Vac Adapter OpenFrame Intelligent mobile phone/small size tablet computer MD82 S W 2W Digital cameras and other small digital products Power adapters for network products etc. APPLICATION DIAGRAM MD80//2/5 MD80 MD8 5W 8W 6W 0W MD85 P 5W 8W Notes:. Continuous maximum output power is tested in typical non-ventilated closed adapter measured at environment temperature t The biggest actual continuous output power is tested in the condition of that peripheral circuit is designed properly and enough space for heat dissipation. Package: S: SOP - 7; P: DIP-8 Output CC/CV VI Characteristic MIX-DESIGNSemiconductorLtd@203 Page -Jul-203@Rve.02 MIX-PD-55786

2 MD80//2/5 Datasheet PINOUT CONFIGURATION PIN Function Description MD85 CPC S MD80//2 Figure2.PinConfigurationofMD80//2/5(Topview) Pin # Name Function Description 5,4 CS,3 CPC 2, VCC 4,2 FB 7-8,5-6 HV Conntect external primary current sensing resistor RCS, the controller can detect the primary current through the external sens resistor. When the voltage on the resistor achieves the maximum value, the internal power BJT will be turn off immediately. to connect with a 00+nf capacitor, the pin will become output cable drop compensation pin. Power supplying pin of the controller, In order to let the controller gain more stable supply voltage, the external filter capacitor must use low equivalent impedance (Low ESR) of the electrolytic capacitor. Output feedback pin, to detect the output condition through the auxiliary winding voltage of the transformer. To connect the collector of internal power BJT 6,- NC Not connected (Only for D Packge) 3,8 GND The referring grounding pin of the controller MIX-DESIGNSemiconductorLtd@203 Page2 -Jul-203@Rve.02 MIX-PD-55786

3 MD80//2/5 Datasheet FUNCTIONAL BlOCK DIAGRAM Figure3.FunctionalblockdiagramofMD80//2/5 Page3 MIX-PD-55786

4 MD80//2/5 Datasheet ABSOLUTE MAXIMUM RATINGS HVPINMaximumVoltage Voltage ICPeakCurrent: VCCPinVoltage FBPinVoltage OthersPinVoltage OperatingTemperature(Tj) MD80 MD8 MD82 MD85 ELECTRICAL CHARACTERISTICS Parameter VDD UVLO Star-up Voltage Shut down Star-up Current Operating Current Max. Operating Voltage CURRENT SENSE SECTION FBReferenceVoltage Current Sense Threshold Voltage Leading Edge Blanking FEEDBACK INPUT SECTION FBReferenceVoltage InputResistanceofFBPin FeedbackThresholdVoltage POWER BJT SECTION Collector-emitter Voltage -0.3~700V 600mA 800mA 200mA 500mA 9V 7.5V Vcc+0.3V 0~+50 StorageTemperature LeadTemperature ESD(HumanBodyModel) Notes: -55~ /0S 2000V.AllvoltagesreferredtoICGND(TA=25 ), 2.Durationnotexceed2msec. 3.Instantmaximumratingsspecifiedwillnotcausepermanentdamage totheproduct,whilelongmaximumratingsspecifiedappliedwilldo andmayaffectproductreliability. Symbol Conditions Min Type Max V DD-ON V DD-OFF I Star I DD Staticcurrent V DD-MAX V V Unit I CS ua V CS 500 mv T LEB Ic=mA ns V REF-FB V R FB MΩ V FB-MAX 5 V Collector-emitter Saturation Voltage Collector-BaseVoltage OVER TEMPERATURE PROTECTION(OTP) V CE(SAT) Io=.0mA 0.3 V V CEO 450 V V CBO 700 V V ua ShutdownTemperature t T SHDN MIX-DESIGNSemiconductorLtd@203 Page4 -Jul-203@Rve.02 MIX-PD-55786

5 MD80//2/5 Datasheet FUNCTION DESCRIPTION MD8X is specially designed for the charger/adapter of small power digital products. To use PSR control technology to provide accurate (CV/CC) characteristics. The controller works in PFM mode and the switching frequency can be automaticially adjusted as per the load. Optimized driving circuit greatly promotes withstand voltage of the power BJT and minimizes the switching loss, so as to make the circuit have excellent converting efficiency. CONSTANT VOLTAGE(CV) OPERATION When the circuit is operates in CV area, FB will detect the output voltage when the power BJT turn-off through the sensing voltage by auxiliary winding of the transformer, to make the output voltage stablized in the fixed value. In the turn-on period of the output rectifier diode D,it's given the output winding voltage and auxiliary winding voltage as follows: Vaux : auxiliary winding voltage;nb:subsidiary winding turns;ns: output winding turns; Vd:forward voltage drop of output rectifier diode FB will test the auxiliary winding voltage while the power BJT off-time to regulate the output voltage. In order to avoid the peak influence happens in power BJT turn-off resulting from the leakage inductance of the transformer, and considering the accuracy of sampling voltage, FB captures the auxiliary winding detection sampling points as below: Figure 4.Auxiliary Voltage Wavaform CONSTANT CURRENT(CC ) OPETATION MD8X CC control circuit is requested the converter oprating in DCM. In CC operation mode, the CC control circuit will fix the proportion p between the Tons and Toffs produced by diode rectifier D. When Tons time, the primary energy of the transformer will be converted to the secondary winding, via the rectifier diode then charge the output capacitor and supply load simultaneously. When Toffs, the primary coil stores the energy, the output filter capacitor makes load discharge. In CC operation area, MD8X switch frequency will follow the output load direct ratio control detected by FB Voltage. Figure 5. Secondary Current Wavaform The secondary rectifier diode peak current is determinated by the peak current of primary-side inductance which also affects the output current. The corresponding relation between the primary peak current and the secondary peak current is as follows. Ipk: primary peak current ; NP: primary winding turns; NS: secondary winding turns; Ipks:secondary peak current And primary inductance peak current is determinated by Pin 4 to RCS resistance, the primary inductance peak current and RCS resistance are in inverse proportion, so only need to adjust CS resistance to achieve different output currents. Output current Iout and primary current are given by: Iout: Output current; Tons: secondary rectifier diode on-time; Toffs: secondary rectifier diode off-time OUTPUT CABLE COMPENSATION MD8X built-in output cable drop compensation circuit. When it outputs different loads, the cable drop compensation circuit provides cable drop voltage compensation which is in fixed proportion with output voltage. The internal circuit will generate one cable drop compensation signal once have one 00nF capacitor connected with external Pin CPC. PROTECTIVE FUNCTIONS In order to guarantee a safe and reliable circuit to all occasions, MD8X built-in rich protection circuits, such as OCP,OVP, FB open-loop protection etc as intergration. Once abnormality, it will come into protection mode. MIX-DESIGNSemiconductorLtd@203 Page5 -Jul-203@Rve.02 MIX-PD-55786

6 MD80//2/5 Datasheet TYPICAL APPLICATION CIRCUIT 85~265Vac CN R - + L2 D~D4 C C2 C3 BOM LIST 5VA Charger With MD80 R3 R4 VCC ST-CPC GND C5 HV FB CS UMD8 C4 D5 Figure6.TypicalapplicationofMD80(Output:5VA) Position Description Q'ty Position Description Q'ty D-D4 N4007A/KVDO-4 4 R4 330K206±5% D5 FR07A/KVDO-4 R7.3R206±% D7 SB3403A/40VDO-5 R5 200R206±5% C,C2 4.7uF/400V±20%8*2 2 R8 30K0805±% C4 02KV±0% R9 22K0805±% C5 0uF/6V±20%5* R0 2K0805±5% 5% D6 R7 R5 C3 0425V±0%SMD R 202R0805±5% C6 470uF/0V±20%6*2LowESR 2 L mhwinductor C8 02/00V0805 T EE35+5Transformer R 0R/W±5% U MD80SGB-TRSOP-7 R3 20M/W±5% R8 R9 T2 D7 R0 C6 C8 Vo+ R Vo- + - MIX-DESIGNSemiconductorLtd@203 Page6 -Jul-203@Rve.02 MIX-PD-55786

7 MD80//2/5 Datasheet THERMAL IMPEDANCE P (DIP-8) Packge Impedance(Reference only) (θja)...70 /W (θjc)2... /W S (SOC-7) Packge Impedance(Reference only) (θja)...00 /W (θjc) /W Notes:. Pin7 (5), 8 (6) Soldered to 2 oz. (60 g/m2) copper clad,as large area as possible. 2. Measured on pin 7,8 (5.6) close to plastic interface(power BJT Collector) PART ORDERING INFORMATION Package MD8 XX X X G -TR (Circuit Serial Type) Part Number 0MD80 MD8 2MD82 5MD85 Package Identifier SPlasticSOP-7 PPlasticDIP-8 TPlasticSOT-23 Cable compesation A: 0%; B: 4%, C: 6%; D: 9% Package Material Green: RoHS Compliant Tape & Reel and Other Options Blank Tube TL Tape & Reel Part Number Marking ID on Body Packing Type Minimum Pack MD80SXG-TR MD80 Tape&Reel 4000PCS S(SOP-7) MD8SXG-TR MD8 Tape&Reel 4000PCS MD82SXG-TR MD82 Tape&Reel 4000PCS P(DIP-8) MD85PXG MD85 Tube 2000PCS/box MIX-DESIGNSemiconductorLtd@203 Page7 -Jul-203@Rve.02 MIX-PD-55786

8 MD80//2/5 Datasheet MECHANICAL DIMENSIONS S-SOP-7++MECHANICAL DIMENSIONS P-DIP-7 +:Package dimensions conform to JEDEC specification :MS 02; :Package outline exclusive of mold flash and metal burr; 3:Package outline inclusive of plating thickness; :Datums A and B to be determined at datum plane H; 5:Controlling dimensions are in Inches; Millineter sizes are shown in parenthesis; Angles in degrees; 6:Minimum metal to metal spacing at package body for omitted lead location is Inch(2.00mm); 6:Pin locations start with Pin, and continue counter clock wise to pin 8 when viewed from top. The notch and/or dimple are aids in locating Pin, Pin 7 is omitted; 7:Lead width measured at package body; body;+notes: :Package dimensions conform to JEDEC apecification MS 00 AB(Issue B 7/85) for standard dual in line (DIP) package ; 2:Contronlling dimensions are inches, Millineter sizes are shown in paretheses; 3:Dimensions shown do not include mold flash or other+protrusions.mold flash or protrusions shall not exceed 0.006(0.5) on any side; 4:Pin locations start with Pin, and continue counter clock wise to pin 8 when viewed from the top. The notch and/or dimple are aids in locating Pin, Pin 6 is omitted; 5:Minimum metal to metal spacing at the package body for the omitted lead location is 0.37 Inch(3.48mm); 6:Lead width measured at package body; 7:Lead spacing measured with the leads constrained to be perpendieular to plane T;+T; Notes: ++++ MIX-DESIGNSemiconductorLtd@203 Page8 -Jul-203@Rve.02 MIX-PD-55786

9 MD80//2/5 Datasheet CONTACT DETAILS MIX-DESIGN SEMICONDUCTOR TECHNOLOGY LIMITED 8F,BlockB,Building 2,Creative Industry park, No.328 Xinghu street, Suzhou industrial park, Suzhou city, Jiangsu Provice, China. Post:2543 Tel: (52) Fax: (52) Web: DISCLAIMER MIX-DESIGN semiconductor technology limited reserves the right to make changes without further notice to any products or specificationsherein.mix-design semiconductor technology limited does not assume any responsibility for use of any its products for anyparticular purpose, nor does MIX-DESIGN semiconductor technology limited assume any liability arising out of the application or useof any its products or circuits. MIX-DESIGN semiconductor technology limited does not convey any license under its patent rights or other rights nor the rights of others.to obtain the most current product information available visit: or contact us at the address shown above. VERSION INFORMATIONS Version Description Rev.0 New Release 5,Oct,202 Rev.02 Change the form,add. application informations,jul,203 SALES SUPPORT LOCATIONS SOUTH CHINA (Technical support and sevice Center) Room026-03,DongMingBuilding,Minkang Road,Longhuanewdistrict,Shenzhencity,China. Tel:(755) ;Fax:(755) ( ) Date MIX-DESIGNSemiconductorLtd@203 Page9 -Jul-203@Rve.02 MIX-PD-55786