DS1112SG. Rectifier Diode DS1112SG KEY PARAMETERS V RRM I F(AV) I FSM FEATURES 6000V 811A 10500A APPLICATIONS VOLTAGE RATINGS

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1 DS1112SG Rectifier Dide Replaces January 2000 versin, DS DS August 2001 FEATURES Duble Side Cling High Surge Capability APPLICATIONS Rectificatin Freewheel Dide DC Mtr Cntrl Pwer Supplies Welding Battery Chargers KEY PARAMETERS V RRM (AV) SM 6000V 811A 10500A VOLTAGE RATINGS Type Number DS1112SG60 DS1112SG59 DS1112SG58 DS1112SG57 DS1112SG56 DS1112SG55 Repetitive Peak Reverse Vltage V RRM V Lwer vltage grades available. Cnditins V RSM = V RRM + 100V Outline type cde: G See Package Details fr further infrmatin. Fig. 1 Package utline ORDERING INFORMATION When rdering, select the required part number shwn in the Vltage Ratings selectin table, e.g.: DS1112SG58 Nte: Please use the cmplete part number when rdering and qute this number in any future crrespndance relating t yur rder. 1/7

2 CURRENT RATINGS = 75 C unless therwise stated Symbl Parameter Cnditins Duble Side Cled Max. Units (AV) Mean frward current Half wave resistive lad 811 A (RMS) A Cntinuus (direct) frward current A Single Side Cled (Ande side) (AV) Mean frward current Half wave resistive lad 534 A (RMS) A Cntinuus (direct) frward current A = 100 C unless therwise stated Symbl Parameter Cnditins Duble Side Cled Max. Units (AV) Mean frward current Half wave resistive lad, = 100 C 630 A (RMS) = 100 C 990 A Cntinuus (direct) frward current = 100 C 900 A Single Side Cled (Ande side) (AV) Mean frward current Half wave resistive lad, = 100 C 410 A (RMS) = 100 C 644 A Cntinuus (direct) frward current = 100 C 550 A 2/7

3 SURGE RATINGS Symbl Parameter Cnditins Max. Units SM Surge (nn-repetitive) frward current 10ms half sine; = 150 C 8.5 ka I 2 t I 2 t fr fusing V R = 50% V RRM - 1/4 sine 360x 10 3 A 2 s SM Surge (nn-repetitive) frward current 10ms half sine; = 150 C 10.5 ka I 2 t I 2 t fr fusing V R = x 10 3 A 2 s THERMAL AND MECHANICAL DATA Symbl Parameter Cnditins Min. Max. Units Duble side cled dc R th(j-c) Thermal resistance - junctin t case Single side cled Ande dc Cathde dc Duble side Clamping frce 12.0kN R th(c-h) Thermal resistance - case t heatsink with munting cmpund Single side T vj Virtual junctin temperature On-state (cnducting) Reverse (blcking) C C T stg Strage temperature range C - Clamping frce kn 3/7

4 CHARACTERISTICS Symbl Parameter Cnditins Min. Max. Units V FM Frward vltage At 1800A peak, = 25 C V I RM Peak reverse current At V RRM, = 150 C - 75 ma Q S I rr Ttal stred charge Reverse recvery current = 1000A, di RR /dt = 3A/µs = 150 C, V R = 100V µc - 90 A V TO Threshld vltage At T vj = 150 C V r T Slpe resistance At T vj = 150 C mω CURVES 2500 Measured under pulse cnditins 2500 Half wave dc Instantaneus frward current, - (A) T j = 25 C T j = 150 C Mean pwer dissipatin - (W) phase Instantaneus frward vltage, V F - (V) V FM Equatin:- Fig.2 Maximum (limit) frward characteristics V FM = A + Bln ( ) + C. +D Mean frward current, (AV) - (A) Fig.3 Dissipatin curves Where A = B = C = D = these values are valid fr T j = 125 C fr 500A t 2500A 4/7

5 10000 Cnditins: T j = 150 C V R = 100V = 1000A I 2 t = Î 2 x t Stred charge, Q S - (µc) 1000 Peak half sine frward current - (ka) I 2 t I 2 t value - (A 2 s x 10 3 ) Q S d /dt Rate f decay f frward current, d /dt - (A/µs) Fig.4 Ttal stred charge I RM ms Cycles at 50Hz Duratin Fig.5 Surge (nn-repetitive) frward current vs time (with 50% V RRM at 125 C) 0.1 Ande side cled Thermal Impedance - junctin t case, R th(j c) - ( ) Cnductin d.c. Halfwave 3 phase phase 60 Duble side cled Effective thermal resistance Junctin t case Duble side Single side Time - (s) Fig.6 Maximum (limit) transient thermal impedance - junctin t case 5/7

6 PACKAGE DETAILS Fr further package infrmatin, please cntact yur nearest Custmer Service Centre. All dimensins in mm, unless stated therwise. DO NOT SCALE. Hle Ø3.6 x 2.0 deep (in bth electrdes) Cathde Ø58.5 max Ø34 nm Ø34 nm Ande Nminal weight: 250g Clamping frce: 12kN ±10% Package utine type cde: G Nte: 1. Package maybe supplied with pins and/r tags. 6/7

7 POWER ASSEMBLY CAPABILITY The Pwer Assembly grup was set up t prvide a supprt service fr thse custmers requiring mre than the basic semicnductr, and has develped a flexible range f heatsink / clamping systems in line with advances in device types and the vltage and current capability f ur semicnductrs. We ffer an extensive range f air and liquid cled assemblies cvering the full range f circuit designs in general use tday. The Assembly grup cntinues t ffer high quality engineering supprt dedicated t designing new units t satisfy the grwing needs f ur custmers. Using the up t date CAD methds ur team f design and applicatins engineers aim t prvide the Pwer Assembly Cmplete slutin (PACs). DEVICE CLAMPS Disc devices require the crrect clamping frce t ensure their safe peratin. The PACs range ffers a varied selectin f pre-laded clamps t suit all f ur manufactured devices. This include cube clamps fr single side cling f T 22mm Clamps are available fr single r duble side cling, with high insulatin versins fr high vltage assemblies. Please refer t ur applicatin nte n device clamping, AN4839 HEATSINKS Pwer Assembly has its wn prprietary range f extruded aluminium heatsinks. They have been designed t ptimise the perfrmance r ur semicnductrs. Data with respect t air natural, frced air and liquid cling (with flw rates) is available n request. Fr further infrmatin n device clamps, heatsinks and assemblies, please cntact yur nearest Sales Representative r Custmer Services. pwer_slutins@dynexsemi.cm HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Dddingtn Rad, Lincln. Linclnshire. LN6 3LF. United Kingdm. Tel: (0) Fax: (0) DYNEX POWER INC. 99 Bank Street, Suite 410, Ottawa, Ontari, Canada, K1P 6B9 Tel: Fax: Tll Free: DYNEX (39639) CUSTOMER SERVICE CENTRES Mainland Eurpe Tel: +33 (0) Fax: +33 (0) Nrth America Tel: (613) Fax: (613) UK, Scandinavia & Rest Of Wrld Tel: +44 (0) Fax: +44 (0) SALES OFFICES Mainland Eurpe Tel: +33 (0) Fax: +33 (0) Nrth America Tel: (613) Fax: (613) Tll Free: DYNEX (39639) / Tel: (949) Fax: (949) UK, Scandinavia & Rest Of Wrld Tel: +44 (0) Fax: +44 (0) These ffices are supprted by Representatives and Distributrs in many cuntries wrld-wide. Dynex Semicnductr 2001 Publicatin N. DS Issue N. 5.0 August 2001 TECHNICAL DOCUMENTATION NOT FOR RESALE. PRINTED IN UNITED KINGDOM Datasheet Anntatins: Dynex Semicnductr anntate datasheets in the tp right hard crner f the frnt page, t indicate prduct status. The anntatins are as fllws:- Target Infrmatin: This is the mst tentative frm f infrmatin and represents a very preliminary specificatin. N actual design wrk n the prduct has been started. Preliminary Infrmatin: The prduct is in design and develpment. The datasheet represents the prduct as it is understd but details may change. Advance Infrmatin: The prduct design is cmplete and final characterisatin fr vlume prductin is well in hand. N Anntatin: The prduct parameters are fixed and the prduct is available t datasheet specificatin. This publicatin is issued t prvide infrmatin nly which (unless agreed by the Cmpany in writing) may nt be used, applied r reprduced fr any purpse nr frm part f any rder r cntract nr t be regarded as a representatin relating t the prducts r services cncerned. N warranty r guarantee express r implied is made regarding the capability, perfrmance r suitability f any prduct r service. The Cmpany reserves the right t alter withut prir ntice the specificatin, design r price f any prduct r service. Infrmatin cncerning pssible methds f use is prvided as a guide nly and des nt cnstitute any guarantee that such methds f use will be satisfactry in a specific piece f equipment. It is the user's respnsibility t fully determine the perfrmance and suitability f any equipment using such infrmatin and t ensure that any publicatin r data used is up t date and has nt been superseded. These prducts are nt suitable fr use in any medical prducts whse failure t perfrm may result in significant injury r death t the user. All prducts and materials are sld and services prvided subject t the Cmpany's cnditins f sale, which are available n request. All brand names and prduct names used in this publicatin are trademarks, registered trademarks r trade names f their respective wners. 7/7