Implementation and Design Considerations of High Voltage Gate Drivers Richard Herring, Application Engineer

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1 Implementation and Design Considerations of High Voltage Gate Drivers Richard Herring, Application Engineer 1

2 What will I get out of this session? Purpose: This session presents the high voltage half bridge drivers architecture and operation details, and common applications well suited for these drivers. Guidance for designing with high voltage half bridge drivers including bias considerations, start up,sequencing and other operation considerations are discussed. The cause of some common concerns or issues in high voltage power trains is presented, and recommendations to mitigate these issues. TI high voltage half bridge drivers attributes and features help overcome the challenges of a high noise power train environment. Part numbers mentioned: UCC27710 UCC27712 UCC27714 Relevant End Equipments: Motor Drive Appliance Inductive Heating HVAC

3 AGENDA TI high voltage driver portfolio summary High voltage half bridge gate driver architecture High voltage half bridge gate driver applications High voltage half bridge gate driver design considerations Bias and start up Negative voltage spikes/ringing on HS False triggering of driver output Driver input noise Summary

4 Driver Portfolio Summary Low Side Half-Bridge High Voltage Isolated SiC UCC2732x/42x UCC2752x UCC2751x/53x TPS28225 UCC2720x/A LM510X UCC27712 UCC27714 UCC27710 UCC21520 UCC53XX UCC27531 UCC21521C Higher VDD for more headroom and robustness Low pulse transmission distortion PFC AC/DC Power DC/DC Converter Solar Micro Inverter Flyback : TIDA TIDA TIDA PMP BIDIR TIDA SOLAR PMP10035 Low power dissipation and lower switching loss Low pulse transmission distortion LED Control DC/DC Converter Module Power Auto_LED PMP4320A PMP7246 Higher power density Best in class dynamic characteristics Offers design flexibility & robustness Replace bulky gate drive transformers BLDC Motors Battery Chargers AC/DC Power LLC Resonant Converter TIDA TIDA PMP11282 PMP10949 Universal drive capability Allow best in class efficiency High degree of isolation Best in class reliability and robustness Highest level of flexibility Inverters, UPS Three Phase inverter TIDA TIDA High efficiency Small form factor User-friendly interface Optimized pinout for easy PCB layout SiC Driver EVM UCC21521CE VM 286

5 High Voltage High Side Low Side Driver Architecture V Bias HV(620 to 700V) R Boot D Boot SGND HI PWM1 GND PWM2 LI VDD Level Shift V DD Noise Canceller V DD HB HS LO C Boot Q1 HS Q2 HV (620~700V) Low side driver LO V DD -V F HS High Side Floating Driver GND LI HI GND UCC27714, UCC27712, UCC27710 GND 6

6 Applications: Inductive Heater AC 85~265V EMI Filter PFC (Power Factor Correction) 400V DC DC-AC Inverter V DC-Link 400V C R Heat Coil C B L m High Voltage Half bridge driver

7 Applications: Motor Drive EMI Filter PFC (Power Factor Correction) 400V DC DC-AC VFD V DC-Link 400V High Voltage Half bridge driver M

8 Question #2: During start up of the bridge power train, what would cause the low side to switch before the high side? A) Input signals not present or below threshold? B) Different delays in the driver IC? C) Timing of the bias supplies to the IC? D) Other?

9 Design Considerations: Half Bridge Driver With Boot Strap Bias High side bias bootstrap from VDD HB capacitor charges when HS goes low Used in many applications, usually no concerns Bias I CHB Up to 600 V V VDD(on) Threshold VDD and VHB both have UVLO delays HS must go low for HB to charge. In most cases LO must switch to charge HB cap UCC27712 VDD PWM Controller PWM1 3 VDD 2 HI HB HS Load LI LO V VDD UVLO Delay V VHB(on) Threshold PWM2 GND 1 LI LO 5 HB-HS COM 4 HI V VHB UVLO Delay

10 Level Shifter Implementation High voltage half bridge drivers have edge triggered level shifter. Low cost high voltage level shifter Reduces power dissipation Level Shifter Pulse Filter VHB UVLO R R S Q 8 7 HB TI provides robust level shifter function HI 2 Min Pulse Delay Pulse Generator 6 HS 70ns pulse and 40ns edge pulse filters for noise Shoot Through Prevention VDD UVLO 3 VDD immunity 6mA pulse trigger current for robust dv/dt induced LI 1 Min Pulse Delay Delay 5 LO 4 COM current immunity

11 Level Shifter Sequence Considerations Edge triggered level shifter. High side HB HS voltage must be above UVLO VDD V VDD(on) Threshold There is a UVLO delay HI rising edge generates turn on pulse LI LO V VDD UVLO Delay HB must be above UVLO and beyond delay on rising edge of HI. HB-HS HI Level Shift V VHB UVLO Delay HB UVLO and delay before HI rising HB UVLO and delay after HI rising

12 Question #3: What could cause high voltage spikes and/or ringing in the power train switch node? A) Power device parasitics? B) Poor board layout? C) Power device switching edges too fast? D) Other?

13 Design Considerations: Negative Voltage on HS Question: Do you see significant negative voltage on the power train switch node? Bias Up to 600 V UCC27712 PWM Controller PWM1 PWM2 GND 3 VDD 2 HI 1 LI HB HS LO Load Why doesn t the low side FET body diode limit the voltage? COM 4

14 Negative voltage on HS: di/dt Effect on Driver Noise Canceller D Boot HB HS C Boot V HV Q1 SW How can I reduce these negative spikes? di/dt V GQ 1 SW /HS Driver IC V CC LO Q2 Negative Voltage on HS V HV COM GND What are possible results of large HS negative spike? Driver malfunction (i.e. faulty input pulse translation) D BOOT over current Overvoltage V HB-HS Negative Voltage Capability (V) UCC27712 NTSOA 15

15 Negative HS spikes: Reduce the parasitic L Most of the parasitic inductance is from the layout, not device leads (typically) Layout of HB FETs can be tight. What about path to HV bulk cap? V GQ1 SW /HS Add HV ceramic caps V GQ1 SW /HS

16 Design Considerations: Driver Input Noise dv/dt coupling through parasitic capacitance Switching transition HF noise on driver inputs Ground bounce from control to power stage Bias Up to 600 V UCC27712 PWM Controller 3 VDD HB 8 PWM1 2 HI 7 HS 6 Load PWM2 1 LI GND LO COM

17 Separate Power Ground noise V Bias R Boot V HV D Boot Controller VSS PWM1 VSS PWM2 HI VCC COM LI V CC High Side Level Shift Noise Canceller HB HS LO C Boot Q1 Q2 VSS COM UCC27712 CTL GND PGND 18

18 IC Features to Mitigate Input Noise Minimum Input Pulse Rejection Turn On, UCC27712 Example UCC27712: 25ns UCC27714: 40ns UCC27710: 40ns Turn Off Input Interlock and Deadtime Outputs to LO LO to Prevents both outputs from being on with overlapping inputs Inputs UCC27712, UCC27710: 150ns deadtime 19

19 Control Power Ground noise PCB R/C filter on LI HI pins HF impedance (small inductance) RTN from FET source and COM Ceramic HF capacitors on VIN to GND. Previous suggestion on for HS negative voltage Add HV ceramic caps

20 SUMMARY High voltage half bridge gate driver architecture is a cost effective solution well suited for many applications Design considerations include startup sequencing, power train ringing and control noise TI drivers incorporate features and offer transient voltage capabilities important in high noise environments Mitigating noise and voltage spikes in the application is easily achieved in many applications

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[High side bias challenges and solutions in half bridge gate drivers] [Ritesh Oza]

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