CERAMIC RESONATORS (CERALOCKr)

Transcription

1 Ceramic Resonators (CERALOCKr) CERAMIC RESONATORS (CERALOCKr) Murata Manufacturing Co., Ltd. Cat.No.P16E-13

2 CONTENTS CERALOCKr and "CERALOCK" in this catalog are the trademarks of Murata Manufacturing Co., Ltd. 1 Part Numbering Chip Type Three-Terminals CSTCC/E/G/R/V/W Series 3 Chip Type Two-Terminals CSACV/W Series 7 2 MHz Chip Type Notice 9 MHz Chip Type CSTC Series Packaging 12 MHz Chip Type CSAC Series Packaging Lead Type Three-Terminals CSTLA/CSTLS Series 15 4 Lead Type Two-Terminals CSALA/CSALS Series 17 MHz Lead Type Notice 19 4 MHz Lead Type CSTLS/CSTLA Series Packaging 2 MHz Lead Type CSALS/CSALA Series Packaging 25 5 Chip Type Two-Terminals CSBFB Series 27 CSBFB_J kHz Notice (Soldering and Mounting) 29 CSBFB_J 7-125kHz Notice (Soldering and Mounting) Lead Type Two-Terminals CSBLA Series 31 khz Type Notice 33 6 khz CSBFB/CSBLA Series Packaging 35 Application Circuits Utilizing 36

3 o Part Numbering CERALOCKr (MHz) The structure of the "Global Part Numbers" that have been adopted since June 21 and the meaning of each code are described herein. ( If you have any questions about details, inquire at your usual Murata sales office or distributor. ) (Global Part Number) CS q T w CV e 16M r X53 t *** y -R u qproduct ID Product ID CS wfrequency/capacitance Code A T estructure/size Code LA LS CC CR/CE/CG CV CW Ceramic Resontors Frequency/Capacitance MHz No capacitance built-in MHz Built-in Capacitance Structure/Size Lead Type Round Lead Type Cap Chip Type Small-cap Chip Type Monolithic Chip Type Small Monolithic Chip Type yindividual Specification Code *** upackaging Code -B -A -A1 -R -R1 Individual Specification Three-digit alphanumerics express "Individual Specification". With standard products, "yindividual Specification" is omitted, and "upackage Specification Code" is carried up. Packaging Bulk Radial Taping H =18mm Radial Taping H =16mm Plastic Taping ø=18mm Plastic Taping ø=33mm Radial taping is applied to lead type and plastic taping to chip type. rnominal Center Frequency Expressed by four-digit alphanumerics. The unit is in hertz (MHz). Decimal point is expressed by capital letter "M". tdesign Code Design Gpp Thickness Shear mode T/Vpp Thickness Expander mode Xpp Thickness Expander mode (3rd overtone) pp indicates initial frequency tolerance and load capacity. CERALOCKr (khz) (Global Part Number) CS q B w FB e 1M r J58 t *** y -R1 u qproduct ID Product ID estructure/size tdesign CS Ceramic Resontors Epp Area Expansion mode Jpp Area Expansion mode (Closed Type) wfrequency/capacitance pp indicates initial frequency tolerance and load capacitance. Code B Code LA FB Frequency/Capacitance khz No capacitance built-in Structure/Size Two-Terminal Lead Type SMD Type Code yindividual Specification Code *** Design Individual Specification Three-digit alphanumerics express "Individual Specification". With standard products, "yindividual Specification" is omitted, and "upackage Specification Code" is carried up. rnominal Center Frequency Expressed by four-digit alphanumerics. The unit is in hertz (Hz). Capital letter "K" following three figures expresses the unit of "khz". upackaging Code -B -R1 Packaging Bulk Plastic Taping ø=33mm 2

4 t Please read CAUTION and Notice in this catalog for safety. This catalog has only typical specifications. Therefore you are requested Ceramic Resonators(CERALOCKr) Chip Type Three-Terminals CSTCC/E/G/R/V/W Series 1 Chip "CERALOCK" with built-in load capacitance in an extremely small package. MURATA's package technology expertise has enabled the development of the Chip "CERALOCK" with built-in load capacitors. High-density mounting can be realized because of the small package and the elimination of the need for an external load capacitor. Features 1. Oscillation circuits do not require external load capacitors. 2. The series is available in a wide frequency range. 3. The resonators are extremely small and have a low profile. 4. No adjustment is necessary for oscillation circuits. Applicatons Clock oscillators for microprocessors. Electronic control circuits for small electronic equipment such as hand held movie. Audio-visual applications (Camcorder, Remote Controller, etc.) Office automation equipments (DVD, CD-ROM, HDD, FDD, etc.) Automotive electronics. (CSTCC_G_A series, CSTCR_G_A series, CSTCE_G_A series, CSTCV_X_Q series) Dual Tone Multi Frequency (DTMF) generator for cordless telephones. CSTCC_G(_A) MHz CSTCR_G(_A) MHz.45±.3.45 (Ref.).3±.3 7.2± max..45 (Ref.).45 (Ref.) (3) (2) (1) 1.2±.2 1.4±.2 1.2±.2 1.1±.1 2.5±.1 2.5±.1.3±.2.4 (ref.) (3).2±.2.8±.1.4 (ref.) 4.5± max..75±.1 1.5±.1 1.5±.1.1±.1.5(ref.) (2) (1).4 (ref.).8±.1.8±.1 3.±.2.4±.1.4±.1.4±.1.1±.1 (3).4±.1 3.2±.15 3.max. 1.3± max..5±.5 t : 1.75±.5 ( MHz) t : 1.55±.5 (3.MHz ) 2.± ±.5.5(ref.).5(ref.) (2) (1).4±.1.4±.1.7±.1 1.1max. : EIAJ code 1.4 max..4±.5 : EIAJ Monthly Code.4±.1 CSTCE_G(_A) MHz.4±.1 1.2±.1 1.2±.1 3.2± ±.2 1.3±.1.1±.1.1±.1 3.max. 1.3± max..4±.1 (.7) (3) M (.9) (2) (.7) (1) 3.1±.2 : EIAJ Monthly Code.62(ref.) (3).9±.1.62(ref.).45(ref.) (2) (1).6±.1.4±.1.6±.1.4±.2.5±.2.4± CSTCE_V MHz.65±.1.95±.1.95±.1 CSTCV_X_Q MHz 1.6±.2 1.6± ±.3 Continued on the following page. 3

5 Continued from the preceding page T.2 * 2.T max..1±.1 2.± ± max..75±.75.4±.1 (.5) (3) (.5) (2) (.5) (1) max..85±.1 CSTCW_X 2.-7.MHz T.2.5T.2.5T.2 1.T.2 1.T T.2 Thickness varies with frequency and built-in capacitors value. *: EIAJ code CSTCG_V MHz (Ultra small).52(ref.).41(ref.).52(ref.) (3) (2) (1).5±.1.3±.1.5±.1.3±.1.7±.1.7±.1 Part Number Oscillating Frequency (MHz) Initial Tolerance (%) Temp.Stability (%) Temperature Range ( C) Aging (1 years) (%) CSTCC_G 2. to 3.99 ±.3-2 to 8 ±.3 - CSTCC_G_A 2. to 3.99 ±.4-4 to 125 ±.3 for automotive electronics CSTCR_G 4. to 7.99 ±.2-2 to 8 ±.1 - CSTCR_G_A 4. to 7.99 ±.3-4 to 125 ±.1 for automotive electronics CSTCE_G 8. to 12.5 ±.2-2 to 8 ±.1 - CSTCE_G_A 8. to 12.5 ±.2-4 to 125 ±.1 for automotive electronics CSTCE_V to ±.3-2 to 8 ±.3 - CSTCV_X_Q 14.7 to 7. ±.3-4 to 125 ±.1 for automotive electronics CSTCG_V 2. to ±.3-2 to 8 ±.3 Ultra small type CSTCW_X 2. to 7. ±.2-2 to 8 ±.1 - Irregular or stop oscillation may occur under unmatched circuit conditions. Please check the actual conditions prior to use. Use Oscillation Frequency Measuring Circuit VDD Rf To Frequency counter Rd (1) (3) C1 C2 (2) 4

6 Standard Land Pattern Dimensions CSTCC_G(_A) CSTCR_G(_A) ~ Land Pattern Land Pattern CSTCE_G(_A) CSTCE_V ~ Land Pattern Land Pattem CSTCV_X_Q CSTCG_V ± Land Pattern Land Pattem CSTCW_X T Land Pattern 5

7 1 Oscillation Frequency Temperature Stability CSTCC_G(_A) CSTCR_G(_A) W Oscillating Frequency Shift (%) W.25 Y.25 Y Temperature ( C) Oscillating Frequency Shift (%) Temperature ( C) Y.5.5 CSTCE_G(_A) CSTCE_V Oscillating Frequency Shift (%) Temperature ( C) Oscillating Frequency Shift (%) Temperature ( C) CSTCV_X_Q CSTCG_V Oscillating Frequency Shift (%) Temperature ( C) Oscillating Frequency Shift (%) Temperature ( C) CSTCW_X W.5 Oscillating Frequency Shift (%) W.25 Y.25 Y Temperature ( C) Y.5 6

8 Ceramic Resonators(CERALOCKr) Chip Type Two-Terminals CSACV/W Series Wide range of chip "CERALOCK" is now available. This diverse series owes its development to MURATA's package technology expertise and original mass production techniques. It enables high-density mounting and further miniaturization of electronic equipment. (.5) (3) 3.7±.2 M (.5) (2) (.5) (1) 3.1±.2.4±.2.5±.2.4± ±.1 Terminal (1) and (3) are interchangeable. Terminal (2) shall be soldered only to fix the resonator on to P.C.B. Terminal (2) shall be electrically floating so it shall not be connected to anywhere. 2 Features 1. The series is available in a wide frequency range. 2. The resonators are extremely small and have a low profile. (CSACW series) 3. No adjustment is necessary for oscillation circuits. CSACV_X_Q MHz 1.6±.2 1.6± ±.3 : EIAJ Monthly Code 2.5T max. Applications Clock oscillators for microprocessors. Electronic control circuits for small electronic equipment. Automotive electronics. (CSACV_X_Q series) (.5) (.5) T.2 * T.2.5T CSACW_X 2.-7.MHz 1.T.2 1.T T.2 Thickness varies with frequency and built-in capacitors value. *: EIAJ code Part Number Oscillating Frequency (MHz) Initial Tolerance (%) Temp.Stability (%) Temperature Range ( C) Aging (1 years) (%) CSACV_X_Q 14.7 to 7. ±.3-4 to 125 ±.1 for automotive electronics CSACW_X_53 2. to ±.2-2 to 8 ±.1 - CSACW_X_ to 7. ±.2-2 to 8 ±.1 - Irregular or stop oscillation may occur under unmatched circuit conditions. Please check the actual conditions prior to use. Use Oscillation Frequency Measuring Circuit VDD Rf To Frequency counter Rd CL1 CL2 7

9 Standard Land Pattern Dimensions CSACV_X_Q CSACW_X ± T Land Pattern Land Pattern Oscillation Frequency Temperature Stability CSACV_X_Q CSACW_X +.5 W.5 Oscillating Frequency Shift (%) Temperature ( C) Oscillating Frequency Shift (%) W.25 Y.25 Y Temperature ( C).5 Y.5 8

10 MHz Chip Type Notice (Soldering and Mounting) 1. Soldering Condition (1) Reflow One heat stress shown in the right profile is applied to resonator, then being place in natural condition for 1 hour, resonator shall be measure. 1. Pre-heating conditions shall be +14 to +16 C for 6 to 12 seconds. Ascending time up to +15 C shall be longer than 3 second. 2. Heating conditions shall be within 2 seconds at +23 C min., but peak temperature shall be Iower than +24 C. Temperature ( C) Pre-Heating (in air) Soldering Peak Temperature 24 C max. Gradual Cooling (in air) 2 (2) Soldering Iron Soldering iron of +27±5 C shall be placed.5mm above from electrode of resonator. Melting solder through soldering iron shall be applied to electrode for 3±1 seconds, then being place in natural condition for 24 hour, resonator shall be measured. 3 sec. min. 6 sec. to 12 sec. 2 sec. max. 12 sec. min. 2. Wash Some series are not withstand washing. Please check the right list before use. (1) Cleaning Solvent HCFC, Isopropanol, Tap water, Demineralized water, Cleanthrough75H, Pine alpha 1S, Techno care FRW (2) Temperature Difference : T *1 T<=6 C ( T=Component-solvent) *1 ex. In case the component at +9 C immerses into cleaning solvent at +6 C, then T=3 C. Series CSTCC (Except MHz) CSTCV CSACV CSTCR CSTCC (Only MHz) CSTCW CSACW CSTCE CSTCG All automotive types are Available. Wash Available Available Available Not Available Not Available Not Available Not Available Not Available Not Available (3) Condition 1. Ultrasonic Wash 1 minute max. in above solvent at +6 C max. (Frequency : 28kHz, Output : 2W/L) 2. Immersion Wash 5 minutes max. in above solvent at +6 C max. 3. Shower or Rinse Wash 5 minutes max. in above solvent at +6 C max. (4) Drying 5 minutes max. by air blow at +8 C max. (5) Others 1. Total washing time should be within 1 minutes. 2. Please insure the component is thoroughly evaluated in your application circuit. 3. The component may be damaged if it is washed with chlorine, petroleum, or alkali cleaning solvent. 9

11 MHz Chip Type Notice 2 Notice (Storage and Operating Conditions) CSTCC_G Please do not apply excess mechanical stress to the component and terminals at soldering. The component is recommended with placement machines with employ optical placement capabilities. The component might be resulted in damage by excessivemechanical force. Please make sure that you have evaluated by using placementmachines before going into mass production. Do not use placement machines whichutilize mechanical positioning. Please contact Murata for details beforehand. 1. CSTCC_G(2.MHz-3.49MHz) Conformal coating or washing to the component is not acceptable. Because it is not hermetically sealed. 2. CSTCC_G(3.5MHz-1.MHz) Conformal coating of the component is acceptable. However, the resin material, curing temperature, and other process conditions should be evaluated to confirm stable electrical characteristics are maintained. Notice (Storage and Operating Conditions) CSTCC_G_A/CSTCR_G_A Please do not apply excess mechanical stress to the component and terminals at soldering. Conformal coating of the component is acceptable. However, the resin material, curing temperature, and other process conditions should be evaluated to confirm stable electrical characteristics are maintained. The component is recommended with placement machines with employ optical placement capabilities. The component might be resulted in damage by excessivemechanical force. Please make sure that you have evaluated by using placementmachines before going into mass production. Do not use placement machines whichutilize mechanical positioning. Please contact Murata for details beforehand. Notice (Storage and Operating Conditions) CSTCV_X_Q/CSACV_X_Q Please do not apply excess mechanical stress to the component and terminals at soldering. Conformal coating of the component is acceptable. However, the resin material, curing temperature, and other process conditions should be evaluated to confirm stable electrical characteristics are maintained. The component is recommended with placement machines which employ optical placement capabilities. In some cases, placement machines which utilize mechanical positioning may apply excessive mechanical force which might result in damage to the ceramic resonator. Please contact Murata before mounting this product using placement machines which use mechanical positioning. Notice (Storage and Operating Conditions) CSTCW_X/CSACW_X Please do not apply excess mechanical stress to the component and terminals at soldering. Conformal coating or washing to the component is not acceptable. Because it is not hermetically sealed. 1

12 MHz Chip Type Notice Notice (Storage and Operating Conditions) CSTCR_G/CSTCE_G/CSTCE_V/CSTCG_V Please do not apply excess mechanical stress to the component and terminals at soldering. Conformal coating or washing to the component is not acceptable. Because it is not hermetically sealed. The component is recommended with placement machines with employ optical placement capabilities. The component might be resulted in damage by excessivemechanical force. Please make sure that you have evaluated by using placementmachines before going into mass production. Do not use placement machines whichutilize mechanical positioning. Please contact Murata for details beforehand. 2 Notice (Rating) The component may be damaged if excess mechanical stress is applied. Notice (Handling) "CERALOCK" may stop oscillating or oscillate irregularly under improper circuit conditions. 11

13 MHz Chip Type CSTC Series Packaging 2 Minimum Quantity Part Number Plastic Tape ø18mm Plastic Tape ø33mm Bulk Dimensions CSTCC_G CSTCC_G_A CSTCR_G CSTCR_G_A CSTCE_G CSTCE_G_A CSTCE_V CSTCV_X_Q CSTCW_X CSTCG_V 2, 2, 3, 3, 3, 3, 3, 2, 3, 3, 6, 6, 9, 9, 9, 9, 9, 6, 9, 9, a a a a b b b a b b The order quantity should be an integral multiple of the "Minimum Quantity" shown above. (pcs.) cdimensions of Reel a b Trailer 4-19 Leader Cover Film Trailer 4-19 Leader Cover Film Empty Components Empty 16 min Empty Components Empty 16 min (ø18) ø13.±.2 2. (ø18) ø13.± max max. Dimensions of Taping CSTCC_G(_A) less than 3.MHz CSTCC_G(_A) more than 3.MHz 4.±.1 2.±.5 ø1.55± ±.1 4.±.1 2.±.5 φ1.55±.5 (9.5) (3) (2) (1) 7.6± ±.1 5.5±.5 12.±.2 (9.5) (3) (2) (1) 7.6±.1 5.5±.5 12.±.2 4.±.1 ø ±.1 4.± φ ±.1 The cover film peel strength force.1 to.7n The cover film peel speed 3mm/min. Cover film 1 3 max..3± ±.5 (2.45 max.) The cover film peel strength force.1 to.7n The cover film peel speed 3mm/min. Cover film 1 3 max..3± ±.5 (2.25 max.) Direction of Feed Direction of Feed Continued on the following page. 12

14 MHz Chip Type CSTC Series Packaging Continued from the preceding page. Dimensions of Taping CSTCR_G(_A) CSTCE_G(_A) (9.5) 4.±.1 2.±.5 (3) (2) (1) ø1.5 W.1 Y 4.7±.1 5.5± ±.1 12.±.2 (5.2) 4.±.1 2.±.5 (3) (2) (1) +.1 ø ± ±.1 3.5±.5 8.± ±.1 ø1.5y W.1 2.2±.1 The cover film peel strength force.1 to.7n The cover film peel speed 3mm/min. Cover Film 1 3 max..3± ±.5 (1.85 max.) 1 4.±.1 The cover film peel strength force.1 to.7n The cover film peel speed 3mm/min. Cover Film +.2 ø ±.1 3 max..25±.5.9±.1 (1.3max) Direction of Feed Direction of Feed (9.5) 4.±.1 4.±.1 CSTCE_V Dimensions of Carrier Tape 2.±.5 (3) (2) (1) Ø The cover film peel strength force.1 to.7n 1.5±.1 The cover film peel speed 3mm/min Cover Film 1 Ø max. 3.45±.1.25±.5 3.5± ±.1 1.1±.5 8.±.2 (1.4max.) (9.5) The cover film peel strength force.1 to.7n The cover film peel speed 3mm/min 1 Cover Film CSTCV_X_Q 4.±.1 2.±.1 (3)(2)(1) W.1 ø1.5 Y. 4.±.1 W.3 W.1 ø1.5 Y Y.5 3 Max. Direction of Feed 1, 2 : Dimensions varies with product thickness of CERALOCK 4.1± ±.1.3±.1 5.5±.1 12.±.2 t1 1 t2 2 Direction of Feed Thickness of CERALOCK t1 1 t ± ±.1 1.2±.1 2.max. 1.8max. 1.5max. (5.2) 4.±.1 4.±.1 CSTCG_V Dimensions of Carrier Tape 2.±.5 (3) (2) (1) Ø The cover film peel strength force.1 to.7n 1.45±.1 The cover film peel speed 3mm/min Cover Film 1 Ø max. 2.2±.5.25±.5 3.5± ±.1 1.±.5 8.±.2 (1.3max.) (5.5) CSTCW_X 4.±.1 The cover film peel strength force.1 to.7n The cover film peel speed 3mm/min. Cover Film 1 2.±.1 (1) (3) (2) 4.± Max. Direction of Feed +.1 φ ±.1 3.5± ±.1 1, 2 : Dimensions varies with product thickness of CERALOCK 8.± φ1.-..2±.1 t1 1 t2 2 Direction of Feed Thickness of CERALOCK t1 1 t ±.1 2.1max. 1.3±.1 1.9max. 1.12±.1 1.7max. 13

15 MHz Chip Type CSAC Series Packaging 2 Minimum Quantity Part Number Plastic Tape ø18mm Plastic Tape ø33mm Bulk Dimensions CSACV_X_Q CSACW_X 2, 3, 6, 9, 5 5 a b The order quantity should be an integral multiple of the "Minimum Quantity" shown above. cdimensions of Reel (pcs.) a b Trailer 4-19 Leader Cover Film Trailer 4-19 Leader Cover Film Empty Components Empty 16 min 4-56 Empty Components Empty 16 min (ø18) ø13.±.2 2. (ø18) ø13.± max max. Dimensions of Taping CSACV_X_Q CSACW_X (9.5) The cover film peel strength force.1 to.7n The cover film peel speed 3mm/min 1 Cover Film 4.±.1 2.±.1 (3)(2)(1) W.1 ø1.5 Y. 4.1± ±.1 5.5±.1 12.±.2 4.±.1 W.3 W.1 ø1.5 Y Y.5 3 Max..3±.1 t1 1 t2 2 (5.5) 4.±.1 The cover film peel strength force.1 to.7n The cover film peel speed 3mm/min. Cover Film 1 2.± φ ± Max. 2.8±.1 3.5± ±.1 8.±.2 φ ± t1 t2 Direction of Feed 1, 2 : Dimensions varies with product thickness of CERALOCK Thickness of CERALOCK t1 1 t ± ±.1 1.2±.1 2.max. 1.8max. 1.5max. 1, 2 : Dimensions varies with product thickness of CERALOCK Thickness of CERALOCK t1 1 t2 2 Direction of Feed ±.1 1.3± ±.1 2.1max. 1.9max. 1.7max. 14

16 Ceramic Resonators(CERALOCKr) Lead Type Three-Terminals CSTLA/CSTLS Series 9.±1. 4.±1. "CERALOCK" with built-in load capacitors. MURATA's ceramic resonator, "CERALOCK", has been widely applied as the most suitable component for clock oscillators in a broad range of microprocessors. The CSTLS series (MHz band) and CSTLA series (MHz band) can be used in the design of oscillation circuits not requiring external load capacitors, enabling both highdensity mounting and cost reduction (Ref.) (3) (2) (1).7 (Ref.) ø.48± ±.3 3 Features 1. Oscillation circuits do not require external load capacitors. 2. The series is stable over a wide temperature range. 3. The resonators are compact, light weight and exhibit superior shock resistance performance. 4. They enable the design of oscillator circuits requiring no adjustment. 5. The series is inexpensive and available in stable supply. 6. There are some variation of built-in capacitance value to apply various of IC. CSTLS_G MHz 2.5±.2 2.5±.2 8.±1. 3.± (Ref.) (3) (2) (1).7 (Ref.) ø.48± ±.3 : Weekly Date Code Applications DTMF generators. Clock oscillators for microcomputers. Remote control units. Automated office equipment. CSTLS_G MHz 2.5±.2 1. max. 2.5±.2 : Weekly Date Code 5. max. 8. max. 1.3±.1 5.±1..5±.1.5±.1 CSTLA_T MHz 2.5±.2 (3) (2) (1) 2.5±.2.3±.1 : EIAJ code 1.max. 5.max. 5.5±1. T 1.5±.1 8.max.** 6.5 CSTLA_X MHz 1.3±.1.5±.1 (3) (2) (1) 2.5±.2 2.5±.2.3±.1 5.± to 14.99MHz : 9.max : EIAJ Code CSTLS_X MHz 2.5±.2 2.5±.2 3.5±.3 (3) (2) (1) φ.48±.5 T 1 : 3.5±1. ( MHz) 3.±1. (33. 7.MHz) : EIAJ Monthly Code 15

17 Part Number Oscillating Frequency (MHz) Initial Tolerance (%) Temp.Stability (%) Temperature Range ( C) Aging (1 years) (%) CSTLS_G 2. to 1. ±.2-2 to 8 ±.2 - CSTLA_T 1.1 to 13. ±.4-2 to 8 ±.3 - CSTLA_X 13.1 to ±.3-2 to 8 ±.3 - CSTLS_X 16. to 7. ±.2-2 to 8 ±.2 - Irregular or stop oscillation may occur under unmatched circuit conditions. Please check the actual conditions prior to use. The order quantity should be an integral multiple of the "Minimum Quantity" shown in the packaging page. Use Oscillation Frequency Measuring Circuit 3 VDD Rf To Frequency counter Rd (1) (3) C1 C2 (2) Oscillation Frequency Temperature Stability W.5 CSTLS_G CSTLA_T W.5 Oscillating Frequency Shift (%) W.25 Y.25 Y Temperature ( C) Oscillating Frequency Shift (%) W.25 Y.25 Y Temperature ( C) Y.5 Y.5 CSTLA_X CSTLS_X.3 W.5.2 Oscillating Frequency Shift (%) Y Temperature ( C) Oscillating Frequency Shift (%) Temperature ( C).1.2 Y

18 Ceramic Resonators(CERALOCKr) Lead Type Two-Terminals CSALA/CSALS Series 1. max. 5. max. "CERALOCK" with two leaded terminals. The CSALA and CSALS series ceramic resonator owe their development to MURATA's innovative expert technologies and the application of mass production techniques typically utilized in the manufacture of piezoelectric ceramic components. Because of their high mechanical Q and consistent high quality, both the CSALA and CSALS series are ideally suited to microprocessor and remote control unit applications. In addition, MURATA offers a special "CERALOCK" version suitable for automatic insertion utilizing tape and reel and other packaging forms. For further information, please contact your local MURATA representative office or authorized distributor. CSALA_T MHz 1.5±.15.5±.1 5.±.3 1. max. 1. max. 5.±.1.3±.1 : EIAJ code 5. max. 4 Features 1. The series is stable over a wide temperature range and with respect to long-term aging. 2. The series comprises fixed, tuned, solid-state devices. 3. The resonators are miniature and light weight. 4. They exhibit excellent shock resistance performance. 5. Oscillating circuits requiring no adjustment can be designed by utilizing these resonators in conjunction with transistors or appropriate ICs. CSALA_X MHz 1.5±.15.5±.1 5.±.3 5.±1. 1. max. 5.5±1. T 1.3±.1 : EIAJ code Applications Square-wave and sine-wave oscillator. Clock generator for microprocessors. Remote control systems ±.3 5.±.3 CSALS_X MHz φ.48±.5 1 T : 3.5±1. ( MHz) 3.±1. (33. 7.MHz) : EIAJ Monthly Code Part Number Oscillating Frequency (MHz) Initial Tolerance (%) Temp.Stability (%) Temperature Range ( C) Aging (1 years) (%) CSALA_T 1.1 to to 8 - CSALA_X 13.1 to ±.3-2 to 8 ±.3 - CSALS_X 16. to 7. ±.2-2 to 8 ±.2 - Irregular or stop oscillation may occur under unmatched circuit conditions. Please check the actual conditions prior to use. The order quantity should be an integral multiple of the "Minimum Quantity" shown in the packaging page. Use 17

19 Oscillation Frequency Measuring Circuit VDD Rf To Frequency counter Rd CL1 CL2 Oscillation Frequency Temperature Stability CSALA_T CSALA_X 4 Oscillating Frequency Shift (%) W.5 W.25 Y.25 Y.5 Y Temperature ( C) Oscillating Frequency Shift (%) W.5 Y.5 Y Temperature ( C) CSALS_X.3.2 Oscillating Frequency Shift (%) Temperature ( C)

20 MHz Lead type Notice Notice (Soldering and Mounting) CSTLS_G/CSTLS_X/CSALS_X The component cannot be withstand washing. Notice (Soldering and Mounting) CSTLA_T/CSTLA_X/CSALA_T/CSALA_X (1) Cleaning Solvent HCFC, Isopropanol, Tap water, Demineralized water, Cleanthrough75H, Pine alpha 1S, Techno care FRW (2) Condition 1. Ultrasonic Wash 1 minute max. in above solvent at +6 C. max. (Frequency:28kHz, Output:2W/L) 2. Immersion Wash 5 minutes max. in above solvent at +6 C. max. 3. Shower or Rinse Wash 5 minutes max. in above solvent at +6 C. max. (3) Drying 5 minutes max. by air blow at +8 C. max. (4) Others 1. In case of immersing in cleaning solvent, the temperature of component must be returned to room temperature after soldering 2. Total washing time should be within 1 minutes. 3. Please insure the component is thoroughly evaluated in your application circuit. 4. The component may be damaged if it is washed with chlorine, pertroleum or alkali cleaning solvent. 4 Notice (Storage and Operating Conditions) CSTLS_G/CSTLS_X/CSALS_X Please do not apply excess mechanical stress to the component and lead terminals at soldering. Conformal coating or washing to the component is not acceptable. Because it is not hermetically sealed. Notice (Storage and Operating Conditions) CSTLA_T/CSTLA_X/CSALA_T/CSALA_X Please do not apply excess mechanical stress to the component and lead terminals at soldering. Conformal coating of the component is acceptable. However, the resin material, curing temperature, and other process conditions should be evaluated to confirm stable electrical characteristics are maintained. Notice (Rating) The component may be damaged if excess mechanical stress is applied. Notice (Handling) "CERALOCK" may stop oscillating or oscillate irregularly under improper circuit conditions. 19

21 MHz Lead Type CSTLS/CSTLA Series Packaging CSTLA/CSTLS Series Minimum Quantity Part Number Ammo Pack CSTLS_G (2. to 3.39MHz) 1,5 CSTLS_G (3.4 to 1.MHz) 2, CSTLS_X (16. to 7.MHz) 2, CSTLA_T (1.1 to 13.MHz) 1, CSTLA_X (13.1 to 15.99MHz) 1, The order quantity should be an integral multiple of the "Minimum Quantity" shown above. Bulk (pcs.) Tape Dimensions of CSTLS_G (2. to 3.39MHz) P2 D P S h h M A M 4 d W2 W L1 W H1 W1 H D P1 F1 F2 P Direction of Feed t Item Code Dimensions Tolerance Remarks Width of diameter Height of resonator Dimensions of terminal Lead length under the hold down tape Pitch of component Pitch of sprocket hole Length from sprocket hole center to lead Length from sprocket hole center to component center Lead spacing (I) Lead spacing (II) Slant to the forward or backward Width of carrier tape Width of hold down tape Position of sprocket hole Gap of hold down tape and carrier tape Distance between the center of sprocket hole and lead stopper Total heigth of resonator Diameter of sprocket hole Total tape thickness Body tilt D A d L1 P P P1 P2 F1 F2 h W W W1 W2 H H1 D t S ø min min ø4..6 ±1. ±.5 - ±.2 ±.2 ±.2 ± ±.1 ±.2 ±.2 ±1. Tolerance for Pitches 1xP=127±1 1mm max. Hold down tape doesn't exceed the carrier tape. Continued on the following page. 2

22 Continued from the preceding page. Tape Dimensions of CSTLS_G (3.4 to 1.MHz) MHz Lead Type CSTLS/CSTLA Series Packaging P2 D P S h h M A M d W2 W L1 W H1 W1 H D P1 F1 F2 P Direction of Feed t 4 Item Code Dimensions Tolerance Remarks Width of diameter Height of resonator Dimensions of terminal Lead length under the hold down tape Pitch of component Pitch of sprocket hole Length from sprocket hole center to lead Length from sprocket hole center to component center Lead spacing (I) Lead spacing (II) Slant to the forward or backward Width of carrier tape Width of hold down tape Position of sprocket hole Gap of hold down tape and carrier tape Distance between the center of sprocket hole and lead stopper Total heigth of resonator Diameter of sprocket hole Total tape thickness Body tilt D A d L1 P P P1 P2 F1 F2 h W W W1 W2 H H1 D t S ø min min ø4..6 ±1. ±.5 ±.2 ±.2 ±.2 ±1. W.5 Y ±1. ±.2 ±.2 ±1. Tolerance for Pitches 1xP=127±1 1mm max. Hold down tape does not exceed the carrier tape. Continued on the following page. 21

23 MHz Lead Type CSTLS/CSTLA Series Packaging Continued from the preceding page. Tape Dimensions of CSTLA_T P2 D P S h h W L1 W W1 H A D1xt1 W2 H1 D P1 F1 F2 4 P Direction of Feed t Item Code Dimensions Tolerance Remarks Width of diameter Height of resonator Dimensions of terminal Lead length under the hold down tape Pitch of component Pitch of sprocket hole Length from sprocket hole center to lead Length from sprocket hole center to component center Lead spacing (I) Lead spacing (II) Slant to the forward or backward Width of carrier tape Width of hold down tape Position of sprocket hole Gap of hold down tape and carrier tape Distance between the center of sprocket hole and lead stopper Total heigth of resonator Diameter of sprocket hole Total tape thickness Body tilt D A D1 t1 L1 P P P1 P2 F1 F2 h W W W1 W2 H H1 D t S 1. max. 8. max min min max. ø ±.1 - ±.2 ±.2 ±.2 ± ±.2 ±.2 ±1. Tolerance for pitches 1xP=127±1 1mm max. Hold down tape doesn't exceed the carrier tape. Continued on the following page. 22

24 MHz Lead Type CSTLS/CSTLA Series Packaging Continued from the preceding page. Tape Dimensions of CSTLA_X P2 D P S h h W L1 W W1 H A D1xt1 W2 H1 D P1 F1 F2 P Direction of Feed t 4 Item Code Dimensions Tolerance Remarks Width of diameter Height of resonator Dimensions of terminal Lead length under the hold down tape Pitch of component Pitch of sprocket hole Length from sprocket hole center to lead Length from sprocket hole center to component center Lead spacing (I) Lead spacing (II) Slant to the forward or backward Width of carrier tape Width of hold down tape Position of sprocket hole Gap of hold down tape and carrier tape Distance between the center of sprocket hole and lead stopper Total heigth of resonator Diameter of sprocket hole Total tape thickness Body tilt D A D1 t1 L1 P P P1 P2 F1 F2 h W W W1 W2 H H1 D t S 1. max. 8. max min min max. ø ±.1 - ±.2 ±.2 ±.2 ± ±.2 ±.2 ± to 14.99MHz : 9. max. Tolerance for pitches 1xP=127±1 1mm max. Hold down tape doesn't exceed the carrier tape to 14.99MHz : 27.5 max. Continued on the following page. 23

25 MHz Lead Type CSTLS/CSTLA Series Packaging Continued from the preceding page. Tape Dimensions of CSTLS_X P2 P h h D S d W2 W H1 L1 W W1 H A D 4 P1 F1 F2 P Direction of Feed t Item Code Dimensions Tolerance Remarks Width of diameter Height of resonator Dimensions of terminal Lead length under the hold down tape Pitch of component Pitch of sprocket hole Length from sprocket hole center to lead Length from sprocket hole center to component center Lead spacing (I) Lead spacing (II) Slant to the forward or backward Width of carrier tape Width of hold down tape Position of sprocket hole Gap of hold down tape and carrier tape Distance between the center of sprocket hole and lead stopper Total heigth of resonator Diameter of sprocket hole Total tape thickness Body tilt D A d L1 P P P1 P2 F1 F2 h W W W1 W2 H H1 D t S ø min min ø4..6 ±1. ±.5 ±.2 ±.2 ±.2 ±1. W.5 Y. ±.1 ±.2 ±.2 ±1. Tolerance for Pitches 1xP=127±1 1mm max. Hold down tape doesn't exceed the carrier tape. 24

26 MHz Lead Type CSALS/CSALA Series Packaging CSALA/CSALS Series Minimum Quantity Part Number Ammo Pack CSALS_X (16. to 7.MHz) 2, CSALA_T (1.1 to 13.MHz) 1,5 CSALA_X (13.1 to 15.99MHz) 1,5 The order quantity should be an integral multiple of the "Minimum Quantity" shown above. Bulk (pcs.) Tape Dimensions of CSALS P2 P h h D S d W2 H1 L1 W W1 H 4 W A D P1 F P Direction of Feed t Item Code Dimensions Tolerance Remarks Width of diameter Height of resonator Dimensions of terminal Lead length under the hold down tape Pitch of component Pitch of sprocket hole Length from sprocket hole center to lead Length from sprocket hole center to component center Lead spacing Slant to the forward or backward Width of carrier tape Width of hold down tape Position of sprocket hole Gap of hold down tape and carrier tape Distance between the center of sprocket hole and lead stopper Total heigth of resonator Diameter of sprocket hole Total tape thickness Body tilt D A d L1 P P P1 P2 F h W W W1 W2 H H1 D t S ø min min ø4..6 ±1. ±.5 ±.2 ±.3 ± ±1. ±.2 ±.2 ±1. Tolerance for Pitches 1xP=127±1 1mm max. Hold down tape doesn't exceed the carrier tape. Continued on the following page. 25

27 MHz Lead Type CSALS/CSALA Series Packaging Continued from the preceding page. Tape Dimensions of CSALA P2 D P S h h W L1 W W1 H A d1xt1 W2 H1 D 4 P1 F P Direction of Feed t Item Code Dimensions Tolerance Remarks Width of diameter Height of resonator Dimensions of terminal Lead length under the hold down tape Pitch of component Pitch of sprocket Length from hole center to lead Length from hole center to component center Lead spacing Slant to the forward or backward Width of carrier tape Width of hold down tape Position of sprocket hole Gap of hold down tape and carrier tape Distance between the center of sprocket hole and lead stopper Total heigth of resonator Diameter of sprocket hole Total thickness of tape Body tilt D A d1 x t1 L1 P P P1 P2 F h W W W1 W2 H H1 D t S 1. max. 1. max..5 x.3 3. min min max. ø4..6 ±.1 ± ± ±.2 ±.2 ±1. Tolerance for pitches 1 x P=127±1 1mm max. Hold down tape does not exceed the carrier tape 26

28 Ceramic Resonators(CERALOCKr) Chip Type Two-Terminals CSBFB Series 7.5±.3 3.3±.3 Can be reflow soldered and mounted by automatic placers. MURATA's original package technologies have enabled the development of the khz band "CERALOCK". The series is perfect in miniature remote control units and AV modules. 1. max. 8.5± Features 1. The series withstands reflow soldering. 2. The series is mountable by automatic placers. 3. No adjustment is necessary for oscillation circuits. CSBFB_J kHz 5.±.2 1.1±.1.9±.1.15 max. : EIAJ code.15±.5 Applications Clock oscillators for microprocessors. OA equipment. AV modules. 1. max. 5.±.3 6.± ± ±.3.8±.2.7±.2.15±.5 5 CSBFB_J 7-125kHz.15 max..1±.3 : EIAJ code 2.5±.2 Part Number Oscillating Frequency (khz) Initial Tolerance (%) Temp.Stability (%) Temperature Range ( C) Aging (1 years) (%) CSBFB_J 43 to 519, 7 to 125 ±.3-2 to 8 ±.3 - Irregular or stop oscillation may occur under unmatched circuit conditions. Please check the actual conditions prior to use. Use Oscillation Frequency Measuring Circuit Oscillation Frequency Temperature Stability VDD W.5 CL1 Rf Rd CL2 To Frequency counter Oscillating Frequency Shift (%) Y.5 Y Temperature ( C) Continued on the following page. 27

29 Continued from the preceding page. Standard Land Pattern Dimensions CSBFB_J (43-519kHz) CSBFB_J (7-125kHz)

30 CSBFB_J kHz Notice (Soldering and Mounting) 1. Soldering Condition (1) Reflow Right profile of heat stress is applied to resonator, then being place in natural condition for 1 hour, resonator shall be measured. 1. Pre-heating conditions shall be +14 to +16 C for 6 to 12 seconds. Ascending time up to +15 C shall be longer than 3 second. 2. Heating conditions shall be within 2 seconds at +225 C min., but peak temperature shall be Iower than +235 C. Temperature ( C) Pre-Heating (in air) Soldering Peak Temperature 235 C max. Gradual Cooling (in air) (2) Soldering Iron Soldering iron of +27±5 C shall be placed.5mm above from electrode of resonator. Melting solder through soldering iron shall be applied to electrode for 3±1 seconds, then being place in natural condition for 24 hour, resonator shall be measured. 3sec. min. 6sec. to 12sec. 2sec. max. 12sec. min. 2. Wash (1) Cleaning Solvent HCFC, Isopropanol, Tap water, Demineralized water, Cleanthrough75H, Pine alpha 1S, Techno care FRW (2) Temperature Difference : T *1 T<=6 C ( T=Component-solvent) *1 ex. In case the component at +9 C immerses into cleaning solvent at +6 C, then T=3 C. 5 (3) Condition 1. Ultrasonic Wash 1 minute max. in above solvent at +6 C max. (Frequency : 28kHz, Output : 2W/L) 2. Immersion Wash 5 minutes max. in above solvent at +6 C max. 3. Shower or Rinse Wash 5 minutes max. in above solvent at +6 C max. (4) Drying 5 minutes max. by air blow at +8 C max. (5) Others 1. Total washing time should be within 1 minutes. 2. Please insure the component is thoroughly evaluated in your application circuit. 3. The component may be damaged if it is washed with chlorine, petroleum, or alkali cleaning solvent. 29

31 CSBFB_J 7-125kHz Notice (Soldering and Mounting) 1. Soldering Condition (1) Reflow Right profile of heat stress is applied to resonator, then being place in natural condition for 1 hour, resonator shall be measured. 1. Pre-heating conditions shall be +14 to +16 C for 6 to 12 seconds. Ascending time up to +15 C shall be longer than 3 second. 2. Heating conditions shall be within 2 seconds at +215 C min., but peak temperature shall be Iower than +225 C. Temperature ( C) Pre-Heating (in air) Soldering Peak Temperature 225 C max. Gradual Cooling (in air) (2) Soldering Iron Soldering iron of +27±5 C shall be placed.5mm above from electrode of resonator. Melting solder through soldering iron shall be applied to electrode for 3±1 seconds, then being place in natural condition for 24 hour, resonator shall be measured. 3sec. min. 6sec. to 12sec. 2sec. max. 12sec. min Wash (1) Cleaning Solvent HCFC, Isopropanol, Tap water, Demineralized water, Cleanthrough75H, Pine alpha 1S, Techno care FRW (2) Temperature Difference : T *1 T<=6 C ( T=Component-solvent) *1 ex. In case the component at +9 C immerses into cleaning solvent at +6 C, then T=3 C. (3) Condition 1. Ultrasonic Wash 1 minute max. in above solvent at +6 C max. (Frequency : 28kHz, Output : 2W/L) 2. Immersion Wash 5 minutes max. in above solvent at +6 C max. 3. Shower or Rinse Wash 5 minutes max. in above solvent at +6 C max. (4) Drying 5 minutes max. by air blow at +8 C max. (5) Others 1. Total washing time should be within 1 minutes. 2. Please insure the component is thoroughly evaluated in your application circuit. 3. The component may be damaged if it is washed with chlorine, petroleum, or alkali cleaning solvent. 3

32 Ceramic Resonators(CERALOCKr) Lead Type Two-Terminals CSBLA Series 7.9±.3 3.6±.3 "CERALOCK" with two leaded terminals. The CSBLA series ceramic resonator owe their development to MURATA's innovative expert technologies and the application of mass production techniques typically utilized in the manufacture of piezoelectric ceramic components. Because of their high mechanical Q and consistent high quality, the CSBLA series are ideally suited to microprocessor and remote control unit applications. Features 1. The series is stable over a wide temperature range and with respect to long-term aging. 2. The series comprises fixed, tuned, solid-state devices. 3. The resonators are miniature and light weight. 4. They exhibit excellent shock resistance performance. 5. Oscillating circuits requiring no adjustment can be designed by utilizing these resonators in conjunction with transistors or appropriate ICs. Applications Square-wave and sine-wave oscillator. Clock generator for microprocessors. Remote control systems. CSBLA_E kHz CSBLA_E 43-59kHz.1±.3.25± max. 1.5 max..1±.3.25±.1 5.± ±.3.8±.1 1.1±.1 1.8±.25 : EIAJ code 7.±.3 3.5±.3 5.± ±.3.8±.1 1.1±.1 : EIAJ code 7.±.3 3.5±.3 6 CSBLA_E kHz.1±.3.25± max. 5.± ±.3.8±.1 1.1±.1 : EIAJ code 5.±.3 2.2±.2 3.5± max. 6.±.3.8±.2.6±.2.15±.5.1±.3 CSBLA_J 7-125kHz 2.5±.2 1.1±.2 : EIAJ code in mm 31

33 Part Number Oscillating Frequency (khz) Initial Tolerance Temp.Stability (%) Temperature Range ( C) Aging (1 years) (%) CSBLA_E 375 to 699 ±2kHz ±.3-2 to 8 ±.3 - CSBLA_J 7 to 125 % ±.3-2 to 8 ±.3 - Irregular or stop oscillation may occur under unmatched circuit conditions. Please check the actual conditions prior to use. The order quantity should be an integral multiple of the "Minimum Quantity" shown in the packaging page. Use Oscillation Frequency Measuring Circuit Oscillation Frequency Temperature Stability VDD W.5 Rf Rd To Frequency counter Oscillating Frequency Shift (%) Y Temperature ( C) CL1 CL2 Y

34 CSBLA Series Notice(Soldering and Mounting) Notice (Soldering and Mounting) CSBLA_E The component cannot be withstand washing. Notice (Soldering and Mounting) CSBLA_J (1) Cleaning Solvent HCFC, Isopropanol, Tap water, Demineralized water, Cleanthrough75H, Pine alpha 1S, Techno care FRW. (2) Temperature Difference: T *1 DT<=3 C. ( T=Component-solvent) *1 ex. In case the component at +9 C. immerses into cleaning solvent at +6 C., then T=3 C. (3) Condition 1. Ultrasonic Wash 1 minute max. in above solvent at +6 C. max. (Frequency:28kHz, Output:2W/L) 2. Immersion Wash 5 minutes max. in above solvent at +6 C. max. 3. Shower or Rinse Wash 5 minutes max. in above solvent at +6 C. max. (4) Drying 5 minutes max. by air blow at +8 C. max. (5) Others 1. Total washing time should be within 1 minutes. 2. Please insure the component is thoroughly evaluated in your application circuit. 3. The component may be damaged if it is washed with alkali cleaning solvent. 6 33

35 khz CSBFB/CSBLA Series Notice Notice (Storage and Operating Condition) CSBFB_J Please do not apply excess mechanical stress to the component and lead terminals at soldering. Conformal coating of the component is acceptable. However, the resin material, curing temperature, and other process conditions should be evaluated to confirm stable electrical characteristics are maintained. Ultrasonic cleaning of the component is acceptable. However, the size of bath, size and thickness of PBC should be evaluated to confirm stable electrical characteristics are maintained. In case of the bulk component, dry heating treatment (13 C. for 5 hours min.) is requiredbefore reflow soldering. Then, the component should be soldering within 48 hours after dry heating treatment. Notice (Storage and Operating Condition) CSBLA_E Please do not apply excess mechanical stress to the component and lead terminals at soldering. Conformal coating or washing to the component is not acceptable. Because it is not hermetically sealed. 6 Notice (Storage and Operating Condition) CSBLA_J Please do not apply excess mechanical stress to the component and lead terminals at soldering. Conformal coating of the component is acceptable. However, the resin material, curing temperature, and other process conditions should be evaluated to confirm stable electrical characteristics are maintained. Ultrasonic cleaning of the component is acceptable. However, the size of bath, size and thickness of PBC should be evaluated to confirm stable electrical characteristics are maintained. Notice (Rating) The component may be damaged if excess mechanical stress is applied. Notice (Handling) "CERALOCK" may stop oscillating or oscillate irregularly under improper circuit conditions. 34

36 khz CSBFB/CSBLA Series Packaging CSBFB Series Minimum Quantity Part Number CSBFB_J (43 to 519kHz) CSBFB_J (7 to 125kHz) Plastic Tape ø33mm 1,5 3, Bulk 5 1, The order quantity should be an integral multiple of the "Minimum Quantity" shown above. (pcs.) cdimensions of Reel 2. (ø1) (ø33) ø max. CSBFB_J kHz CSBFB_J 7-125kHz 4.±.1 2.±.1 ø1.5± ±.1 4.±.1 2.±.1 ø1.5± ± ±.1 7.5±.1 16.± ±.1 8.8±.1 7.5± ± ±.15 The cover film peel strength force.1 to.7n The cover film peel speed 3mm/min. 1 Cover Film 12.±.1 8.5±.1 3 max. t.3 3.5±.1 (4.6max.) The cover film peel strength force.1 to.7n The cover film peel speed 3mm/min. 1 Cover Film 8.± ±.1 3 max. t.3 2.7±.1 (3.7max.) 6 Direction of Feed Direction of Feed CSBLA Series Minimum Quantity Part Number Magazine CSBLA_E 5 CSBLA_J 1 The order quantity should be an integral multiple of the "Minimum Quantity" shown above. Bulk 5 1, (pcs.) 35

37 Application Circuits Utilizing TMP87CM4AN(TOSHIBA) 8-bit Microcomputer MC68HC98JB8(MOTOROLA) 8-bit Microcomputer VDD(+5V) VDD (+5V) 22,42 IC : TMP87C846N 19 2 L CSTLS8MG53-B C1=15pF C2=15pF C1 C2 L : 17,18,21 5 IC : MC68HC98JB Rf CSTCR6MG55-R C1 C2 C1=39pF C2=39pF upd7818f(nec) 8-bit Microcomputer HD64F3337(HITACHI) 8-bit Microcomputer VDD (+5V) VCC (+5V) 1kΩ.1µF H H 43 IC : µpd7818f IC : HD64F L 5 49 L CSTLS8MG53-B C1 C2 C1=15pF C2=15pF H : 48,59,6,63,64 L : 1-8,17,32,51, 54-58,61,62 C1 C2 CSTLS8MG56-B C1=47pF C2=47pF H : 4,7,8,9,47,55 L : 1,12,38,56,73 6 ML66517(OKI) M3839MF(MITSUBISHI) 8-bit Microcomputer 8-bit Microcomputer VDD (+5V) VCC (+5V) H 1 IC : ML66517 IC : M3839MF L ,26,32 CSTLS8MG56-B CSTLS8MG53-B C1 C2 C1=47pF C2=47pF H : 9,65 L : 1,35,55,75,76 C1 C2 C1=15pF C2=15pF Continued on the following page. 36

38 Application Circuits Utilizing Continued from the preceding page. M3428M1(MITSUBISHI) Remote Control Unit upd65(nec) Speech Synthesizer VDD (+3.V) VDD (+3V) 2 H IC : M3428M1 IC : µpd CSTLS3M64G53-B 8 7 L CERALOCK C1 C2 C1=15pF C2=15pF C1 C2 C1=15pF C2=15pF H : 6,1 L : 3,9,12,13,14 CERALOCK : CSTLS3M64G53-B upd75434(nec) 4-bit Microcomputer LC651154F(SANYO) 4-bit Microcomputer +5V VDD(+5V) 19,2 IC : µpd IC : LC651154F 2 3 1,4 8 9 L CSTLS4MG53-B CSTLS4MG56-B C1=47pF C2=47pF C1 C2 C1=15pF C2=15pF C1 C2 L=1-7,16-2,25,26,29 LC7367JM(SANYO) VDD (+5V) Tone/Pulse Dialer ML75MB(OKI) VDD (+5.V) Tone/Pulse Dialer 6 H IC : LC7367JM IC : ML75MB 9 1 L CSTLS3M58GD6267-B CSTLS3M58GD314 C1 C2 C1=47pF C2=47pF H=11 L=5,6,7,8,12 C1 C2 C1=15pF C2=15pF Continued on the following page. 37

39 Application Circuits Utilizing Continued from the preceding page. upd7f312gj(nec) VDD (+3.3V) 32-bit Microcomputer CXD368Q(SONY) VDD (+5V) Digital Signal Processing IC for CD H H IC : µpd7f312 IC : CXD368Q L L CSTCR6M6G55-R Rd C1 C2 C1=39pF C2=39pF H : 34,45,62,1,126,144 L : 9,35,65,71,83,117,135 C1 C2 CSTCE16M9V53-R C1=15pF C2=15pF Rd=22Ω H : 1,28,47,56,61 L : 18,35,45,51,7 LC895299(SANYO) Error Correction of CD-ROM LSI TMP47C66AN(TOSHIBA) 4-bit Microcomputer VDD1 (+5V) VDD2 (+3.3V) VDD (+5V) H1 H2 64 IC : LC IC : TMP47C66AN 93 Rf 92 L ,31,32 CSTLS4MG53-B C1 C2 CSTCW33M8X53-R H1 : 21,39,52,65,86,88,94,112, H1 : 154,163,176 H2 : 22,44,66,11,116,132,165 L : 1,23,24,4,45,51,58,67,73,89, L : 91,19,111,125,133,139,155,164 C1 C2 C1=15pF C2=15pF 6 TA869AN(TOSHIBA) LA341(SANYO) TV Horizontal/Compatible with Synthesizer Circuit FM Stereo MPX VCC (+9.V) 47µF +.22µF 25, IC : TA869AN CSBLA456KE2ZF11-B 1kΩ 3.3µF 1µF 35kΩ.47µF VCO STOP VCC + 1µF LA341 Vcont. CERALOCK 15Ω 51kΩ 39Ω 43Ω FH (1/32fosc.).47µF VCC (+12V) kΩ kΩ 8 75pF 75pF INPUT L R CERALOCK : CSBLA53KEZZF46-B Continued on the following page. 38

40 Application Circuits Utilizing Continued from the preceding page. TEA213(THOMSON) TV Horizontal/Compatible with Synthesizer Circuit LA7687(SANYO) TV Horizontal/Compatible with Synthesizer Circuit VCC (+12.V) VCC (+7.8V) 1µF.1µF 1kΩ 47nF Flyback In Hout µF + 1µF IC : LA7687 IC : TEA kΩ CERALOCK Rs 3.9kΩ 2.2µF 33nF Vcont. 3.32kΩ 1nF 4 CERALOCK : CSBLA53KEZZF12-B Rs=47Ω CERALOCK.33µF + 22µF + 33kΩ 1.8kΩ 3.3µF Vcont. HVcc 13mA Hout (fosc./32) CERALOCK : CSBLA53KEZZF12-B Oscillation Circuit Incorporationg Transistor 3kΩ -1V CERALOCK.1µF.5µF 1kΩ Output Recommendable Value CERALOCK : CSBLA455KEC8-B 6 39

41 Note: 1. Export Control <For customers outside Japan> Murata products should not be used or sold for use in the development, production, stockpiling or utilization of any conventional weapons or mass-destructive weapons (nuclear weapons, chemical or biological weapons, or missiles), or any other weapons. <For customers in Japan> For products which are controlled items subject to the Foreign Exchange and Foreign Trade Law of Japan, the export license specified by the law is required for export. 2. Please contact our sales representatives or product engineers before using our products listed in this catalog for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property, or when intending to use one of our products for other applications than specified in this catalog. q Aircraft equipment w Aerospace equipment e Undersea equipment r Power plant equipment t Medical equipment y Transportation equipment (vehicles, trains, ships, etc.) u Traffic signal equipment i Disaster prevention / crime prevention equipment o Data-processing equipment! Application of similar complexity and/or reliability requirements to the applications listed in the above 3. Product specifications in this catalog are as of January 22. They are subject to change or our products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before your ordering. If there are any questions, please contact our sales representatives or product engineers. 4. Please read CAUTION and Notice in this catalog for safety. This catalog has only typical specifications. Therefore you are requested to approve our product specification or to transact the approval sheet for product specification, before your ordering. 5. Please note that unless otherwise specified, we shall assume no responsibility whatsoever for any conflict or dispute that may occur in connection with the effect of our and/or third party's intellectual property rights and other related rights in consideration of your using our products and/or information described or contained in our catalogs. In this connection, no representation shall be made to the effect that any third parties are authorized to use the rights mentioned above under licenses without our consent. 6. None of ozone depleting substances (ODS) under the Montreal Protocol is used in manufacturing process of us. Head Office , Tenjin Nagaokakyo-shi, Kyoto , Japan Phone: International Division , Shibuya, Shibuya-ku, Tokyo 15-2, Japan Phone: Fax: intl@murata.co.jp