DATASHEET ISL Features. Applications. Ordering Information. Typical Application Circuit. MMIC Silicon Bipolar Broadband Amplifier.

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1 ISL55 MMIC Silicon Bipolar Broadband Amplifier NOT RECOMMENDED FOR NEW DESIGNS NO RECOMMENDED REPLACEMENT contact our Technical Support Center at INTERSIL or DATASHEET FN17 Rev. The ISL555, ISL557, ISL558 and ISL559, ISL55, ISL5511 constitute a family of high performance gain blocks featuring a Darlington configuration using high f t transistors and excellent thermal performance. They are an ideal choice for DVB-S LNB cable receiver applications. ISL555, ISL557, ISL558 offer higher OIP performance while the ISL559, ISL55, ISL5511 offer lower operating supply currents. ISL555 and ISL559 match a 75 source to a 5 load. ISL557 and ISL55 match a 75 source to a 75 load. ISL558 and ISL5511 match a 5 source to a 5 load. Ordering Information PART NUMBER (Note) PART MARKING TAPE & REEL PACKAGE (Pb-Free) PKG. DWG. # ISL55IEZ-T7 CBG 7 (k pcs) Ld SC-7 P.9 NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and % matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-. Features Input impedance of 75 Output impedance of 75 Noise figure of.7db OIP of 11dBm Low supply current of 1mA Low input and output return losses Pb-free plus anneal available (RoHS compliant) Applications LNB and LNB-T line amplifiers IF gain blocks for satellite and terrestrial HDTV STBs PA driver amplifier Wireless data, satellite Bluetooth/WiFi Satellite locator and signal strength meters Typical Application Circuit +.V Pinout LD SC-7 GND 1 OUT.1µF pf pf.1µf GND 5 GND nh IN VSP 8pF 1,, 5 8pF FN17 Rev. Page 1 of

2 ISL55 Absolute Maximum Ratings (T A = 5 C) Supply Voltage from VSP to GND V Input Voltage V S + +.V to GND -.V Power Dissipation See Packging Information Section Ambient Operating Temperature C to +85 C Storage Temperature C to +15 C Operating Junction Temperature C ESD Rating Human Body Model (Per MIL-STD-88 Method 15.7)...V Machine Model (Per EIAJ ED-71 Method C-111) V CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: T J = T C = T A Electrical Specifications VSP = +.V, Zrsc = Zload = 5, TA = 5 C, unless otherwise specified. PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT Gt Small Signal Gain GHz db 1.5GHz db.ghz db P1dB Output Power at 1dB Compression GHz dbm.ghz -.7. dbm OIP Output Third Order Intercept Point GHz 11. dbm.ghz.9 dbm BW db Bandwidth db below 5MHz. GHz IRL Input Return Loss GHz Zrsc = 75 Zload = db ORL Output Return Loss GHz Zrsc = 75 Zload = db RISOL Reverse Isolation.GHz db NF Noise Figure.GHz.7 db ID Device Operating Current ma Device Test Setup Agilent _875ES VNA 5 5 CONNECTORLESS PLATFORM PICOSECOND LABS MODEL 55 5 PIN PIN 5 DC BLOCK DUT BIAS TEE PICOSECOND LABS MODEL V I 1 I I DEVICE INPUT REFERENCE OUTPUT REFERENCE.V POWER SUPPLY FN17 Rev. Page of

3 ISL55 Typical Performance Curves Z src = 75, Z load = 75 IRL (db) ORL (db) FIGURE 1. INPUT RETURN LOSS vs FREQUENCY FIGURE. OUTPUT RETURN LOSS vs FREQUENCY Typical Performance Curves 5 environment S1 (db) S11 (db) FIGURE. S1 vs FREQUENCY FIGURE. S11 vs FREQUENCY S1 (db) S (db) FIGURE 5. S1 vs FREQUENCY FIGURE. S vs FREQUENCY FN17 Rev. Page of

4 ..5.7 ISL55 Typical Performance Curves 5 environment (Continued) OIP (dbm) FIGURE 7. OIP vs FREQUENCY dbm FIGURE 8. P1dBm vs FREQUENCY NOISE FIGURE (db) FIGURE 9. NOISE FIGURE vs FREQUENCY GHz S. GHz.5 GHz..5 GHz S11 RF Café FIGURE. S11 AND S vs FREQUENCY FN17 Rev. Page of

5 ISL55 Packaging Information JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD. POWER DISSIPATION (W) 5 17mW SC7- JA =57 C/W AMBIENT TEMPERATURE ( C) FIGURE 11. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE FN17 Rev. Page 5 of

6 ISL55 Small Outline Transistor Plastic Packages (SC7-) A A SEATING b (.8) M 5 e1 D e 1 C X 1 X 1 WITH PLATING c C A1 E. (.) C BASE METAL L L1 b b1 R1 SEATING R -C- c1 VIEW C GAUGE L E1 C P.9 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE INCHES MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A A A b b c..9.8 c D E E e.5 Ref 5 Ref - e1.51 Ref 1. Ref - L..18 L1.17 Ref. Ref. L. BSC.15 BSC N 5 R R o 8 o o 8 o - Rev. 9/ NOTES: 1. Dimensioning and tolerance per ASME Y1.5M Package conforms to EIAJ SC7 and JEDEC MOAB.. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs.. Footlength L measured at reference to gauge plane. 5. N is the number of terminal positions.. These Dimensions apply to the flat section of the lead between.8mm and.15mm from the lead tip. 7. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only VIEW C Copyright Intersil Americas LLC. All Rights Reserved. All trademarks and registered trademarks are the property of their respective owners. For additional products, see Intersil products are manufactured, assembled and tested utilizing ISO91 quality systems as noted in the quality certifications found at Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see FN17 Rev. Page of

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