HCP0704 High current power inductors
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1 Supersedes February 009 pplications Voltage Regulator Module (VRM) Multi-phase regulators Desktop and servers Base station equipment Notebook and laptop regulators Data networking and storage systems Point-of-load modules (POL) Battery power systems DCR sensing circuits Product features 6.8 x 6.8 x 4. mm surface mount package Iron powder core material Magnetically shielded, low EMI High temperature core material eliminates thermal aging issues High current carrying capacity, low core losses Tight DCR tolerance for sensing circuits Inductance range from 0.40 µh to 4.7 µh Current range from 5.0 to 7 Frequency range up to MHz Halogen free, lead free, RoHS compliant Environmental Data Storage temperature range (Component): -40 C to +55 C Operating temperature range: -40 C to +55 C (ambient plus self-temperature rise) Solder reflow temperature: J-STD-00 (latest revision) compliant Pb HLOGEN HF FREE
2 Product Specifications Part Number 6 OCL ± 5% (μh) FLL Min. (μh) I rms 3 () I sat +5 C () DCR +0 C K-factor 5 -R40-R ±0% R60-R ±0% R0-R ±0% R8-R ±0% 0.8 -R3-R ±0% R3-R ±0% R7-R ±0% 7.7 Open Circuit Inductance (OCL) Test Parameters: 00 khz, 0.0 V rms, 0.0 dc Full Load Inductance (FLL) Test Parameters: 00 khz, 0. V rms,i sat 3 I rms : DC current for an approximate temperature rise of 40 C without core loss. Derating is necessary for C currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed +5 C under worst case operating conditions verified in the end application. 4 I sat : Peak current for approximately 0% rolloff at +5 C. 5 K-factor: Used to determine B p-p for core loss (see graph). B p-p = K * L * ΔI : (Gauss), K: (K-factor from table), L: (inductance in μh), ΔI (peak-to-peak ripple current in amps). 6 Part Number Definition: -xxx-r = Product code and size xxx= Inductance value in μh, R = decimal point. If no R is present, then third character = # of zeros -R suffix = RoHS compliant Dimensions (mm) Top View Side View Bottom View Recommended Pad Layout Schematic 6.80 Max -R40 to R0= 4.0 max -R8 to 4R7= 4.00 max -R40 to R3=.0 +/ R3 to 4R7=.00 +/ ± (x) xxx wwllyy R 6.80 Max 4.00(x) The nominal DCR test point is in the middle of the terminal Part Marking: xxx = Inductance value in μh. (R = Decimal point). If no R is present, then last character is # of zeros wwllyy = Date code R = Revision level Do not route traces or vias underneath the inductor Packaging information (mm) Supplied in tape and reel packaging, 000 parts per 3 diameter reel..5 Dia min Dia. +0./ Section xxx wwllyy R ±0.3 -R40 to R0= 4. -R8 to 4R7= User direction of feed
3 Technical Data 4348 Temperature rise vs. total loss Tempetature Rise( C) Tota l Los s (W) Core loss vs. Bp-p 500 khz 00 khz 0 MHz 50 khz Core Loss (W) Bp- p ( G aus s ) 3
4 Inductance characteristics 00% % of OCL vs % of Isat 80% 5 C % of OCL 60% 40% 0% 0% 0% 0% 40% 60% 80% 00% 0% 40% 60% % of Isat 4
5 Technical Data 4348 Solder reflow profile T P Max. Ramp Up Rate = 3 C/s Max. Ramp Down Rate = 6 C/s t P T C -5 C Table - Standard SnPb Solder (T c ) Package Thickness mm3 <350 mm3 350 T L Temperature T smax T smin Preheat ts t <.5mm) 35 C 0 C.5mm 0 C 0 C Table - Lead (Pb) Free Solder (T c ) Package Thickness < >000 <.6mm 60 C 60 C 60 C.6.5mm 60 C 50 C 45 C >.5mm 50 C 45 C 45 C 5 C Time 5 C to Peak Time Reference JDEC J-STD-00 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak Temperature min. (T smin ) 00 C 50 C Temperature max. (T smax ) 50 C 00 C Time (T smin to T smax ) (t s ) 60-0 Seconds 60-0 Seconds verage ramp up rate T smax to T p 3 C/ Second Max. 3 C/ Second Max. Liquidous temperature (Tl) Time at liquidous (t L ) 83 C Seconds Peak package body temperature (T P )* Table Table 7 C Seconds Time (t p )** within 5 C of the specified classification temperature (T c ) 0 Seconds** 30 Seconds** verage ramp-down rate (T p to T smax ) 6 C/ Second Max. 6 C/ Second Max. Time 5 C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T p ) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 000 Eaton Boulevard Cleveland, OH 44 United States 07 Eaton ll Rights Reserved Printed in US Publication No BU-SB09086 July 07 Eaton is a registered trademark. ll other trademarks are property of their respective owners.
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More informationFeatures. Ordering and Marking Information. P-Channel Enhancement Mode MOSFET -20V/-12.2A, R DS(ON) =-4.5V =-2.5V. = 14mW(max.
P-Channel Enhancement Mode MOSFET Features Pin Description -2V/-12.2, = 14mW(max.) @ V GS =-4.5V = 2mW(max.) @ V GS =-2.5V = 32mW(max.) @ V GS =-1.8V Reliable and Rugged Lead Free and Green Devices vailable
More informationFeatures. Ordering and Marking Information. N-Channel Enhancement Mode MOSFET 30V/4.7A, R DS(ON) =10V V GS. =40mW(max.
N-Channel Enhancement Mode MOSFET Features Pin Description 3V/4.7, R DS(ON) =4mW(max.) @ V GS =V R DS(ON) =6mW(max.) @ V GS =4.5V Reliable and Rugged Lead Free and Green Devices vailable (RoHS Compliant)
More informationPackage Code S : SOP-8. Date Code YYXXX WW
N-Channel Enhancement Mode MOSFET Features 100 V/8 A R DS(ON) = 20 m Ω (typ.) @ V GS =10V Avalanche Rated Reliable and Rugged Lead Free and Green DevicesAvailable (RoHS Compliant) Pin Description D D D
More informationPackage Code. Handling Code. Assembly Material
P-Channel Enhancement Mode MOSFET Features Pin Description -2V/-4.9A, R DS(ON) =43mΩ (Max.) @ V GS =-4.5V R DS(ON) =58mΩ (Max.) @ V GS =-2.5V R DS(ON) =88mΩ (Max.) @ V GS =-1.8V 1% UIS + R g Tested Reliable
More informationSM1A16PSU/UB. Features. Ordering and Marking Information. P-Channel Enhancement Mode MOSFET -100V/-13A, R DS(ON) =-10V
P-Channel Enhancement Mode MOSFET Features Pin Configuration -0V/-13A, R DS(ON) =205mΩ (max.) @ V GS =-V R DS(ON) =300mΩ (max.) @ V GS =-4V Reliable and Rugged D S G S D G Lead Free and Green Devices Available
More informationFeatures. Ordering and Marking Information. P-Channel Enhancement Mode MOSFET -60V/-15A, R DS(ON) =-10V
P-Channel Enhancement Mode MOSFET Features -6V/-15, R DS(ON) =93mΩ(max.) @ V GS =-1V R DS(ON) =128mΩ(max.) @ V GS =-4.5V Reliable and Rugged Lead Free and Green Devices vailable (RoHS Compliant) 1% UIS
More informationFEATURES. IHLP-3232DZ μh ± 20 % ER e3 MODEL INDUCTANCE VALUE INDUCTANCE TOLERANCE PACKAGE CODE JEDEC LEAD (Pb)-FREE STANDARD
IHP-33DZ- IHP Commercial Inductors, High Temperature ( C) Series DESIGN SUPPORT TOOS click logo to get started Models Available STANDARD EECTRICA SPECIFICATIONS INDUCTANCE ± % AT khz,. V, A (μh) Design
More informationApplications. Pin Configuration. Ordering and Marking Information. Hall Effect Micro Switch IC
Hall Effect Micro Switch IC Features Micro Power Operation for Battery pplications Chopper Stabilized mplifier Independent of North or South Pole Magnet, Easy for Manufacture Small Size Package Lead Free
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