EMIF03-SIM05F3. EMI filter with SWP protection for SIM interface. Features. Application. Description. Complies with the following standards:

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EMIF0-SIM05F EMI filter with SWP protection for SIM interface Datasheet production data Features Lead-free package Very low PCB space consumption Very thin package: < 0.

1 EMIF0-SIM05F EMI filter with SWP protection for SIM interface Datasheet production data Features Lead-free package Very low PCB space consumption Very thin package: < 0.55 mm after reflow High efficiency in ESD suppression IEC level High reliability offered by monolithic integration High reduction of parasitic elements through integration and WLCSP packaging Complies with the following standards: IEC level ± 5 kv (air discharge) ± 8 kv (contact discharge) Application Mobile phones Description The EMIF0-SIM05F is a highly integrated device designed to protect SIM interface and SWP line against ESD transients and EMI emission. The device is the ideal fit for applications using NFC. Figure. Figure. WLCSP package (9 bumps) Pin configuration (bump side) SWP Functional schematic November 0 Doc ID 08 Rev /9 This is information on a product in full production. 9

2 Characteristics EMIF0-SIM05F Characteristics Table. Absolute maximum ratings (T amb = 5 C) Symbol Parameter Value Unit V PP Internal pins (A, B, C): ESD discharge IEC (), level Air discharge Contact discharge External pins (A, A, B, C, C): ESD discharge IEC , level Air discharge Contact discharge 6 6 kv T j Maximum junction temperature 50 T op Operating temperature range - 0 to + 85 C T stg Storage temperature range - 55 to 50. Measurements done on IEC test bench. For further details see Application note AN5, IEC standard testing. Figure. Electrical characteristics (definitions) I Symbol Parameter V BR = Breakdown voltage I RM = Leakage V V RM = Stand-off voltage V = Clamping voltage I = Peak pulse current PP RM V V BR V RM I RM V I PP Table. Electrical characteristics (T amb = 5 C) Symbol Test conditions Min. Typ. Max. Unit I RM V RM = V 00 na V BR I R = ma 6 V R, R RST, DATA serial resistor 00 R K serial resistor 7 C line C SWP Line capacitance on RST, DATA, K lines V line = 0 V, V osc = 0 mv, F = MHz (measured under zero light conditions) Line capacitance on SWP line V line = 0 V, V osc = 0 mv, F = MHz (measured under zero light conditions) pf pf /9 Doc ID 08 Rev

3 EMIF0-SIM05F Characteristics Figure. Attenuation measurements C-C, A-A, B-B Figure 5. Attenuation measurements A-C S(dB) S(dB) F(Hz) F(Hz) 00.0k.0M 0.0M 00.0M.0G k.0M 0.0M 00.0M.0G Data Rst Clk SWP Vcc Figure 6. Analog Xtalk measurements Figure 7. Digital crosstalk measurements 0.00 XTalk (db) V K = V t R = t F = ns Clk Data F(Hz) k.0M 0.0M 00.0M.0G Clk -SWP Rst -Data Clk -Rst Figure 8. Dynamic characteristic (SWP) Figure 9. Dynamic characteristic (V CC ) I PP (A) V (V) Breakdown Direct Poly. (Breakdown) Poly. (Direct) t P = 00 ns T J initial = 5 C I PP (A) V (V) Breakdown Direct Poly. (Breakdown) Poly. (Direct) t P = 00 ns T J initial = 5 C Doc ID 08 Rev /9

4 Characteristics EMIF0-SIM05F Figure 0. ESD response to IEC (+8 kv contact discharge) K line Figure. ESD response to IEC (-8 kv contact discharge) K line 5.0 V / Div 5.0 V / Div V :clamping 0 ns V :clamping 00 ns 0.0 V 7. V 6.8 V. V -9. V - m V -. V -9 m V 0 ns / Div 0 ns / Div V :clamping 0 ns V :clamping 00 ns Figure. ESD response to IEC Figure. ESD response to IEC (+8 kv contact discharge) DATA line (-8 kv contact discharge) DATA line 5.0 V / Div 5.0 V / Div V :clamping 0 ns V :clamping 00 ns 8.8 V 6.6 V 6. V.9 V -9.7 V -5 m V -.7 V -9 m V 0 ns / Div V :clamping 0 ns V :clamping 00 ns /9 Doc ID 08 Rev

5 EMIF0-SIM05F Characteristics Figure. ESD response to IEC (+8 kv contact discharge) SWP line Figure 5. ESD response to IEC (-8 kv contact discharge) SWP line 0 V / Div 0 V / Div 07.6 V V :clamping 0 ns V :clamping 00 ns -.9 V -.7 V.5 V.5 V 5.6 V -5.0 V V :clamping 0 ns V :clamping 00 ns -5.0 v 0 ns / Div 0 ns / Div Figure 6. ESD response to IEC (+8 kv contact discharge) V CC line Figure 7. ESD response to IEC (-8 kv contact discharge) V CC line 0 V / Div 5 V / Div V :clamping 0 ns V :clamping 00 ns -. V -. V 6. V.V 0V 5.0 V -. V V :clamping 0 ns V :clamping 00 ns -0.0 v 0 ns / Div 0 ns / Div Doc ID 08 Rev 5/9

6 Ordering information scheme EMIF0-SIM05F Ordering information scheme Figure 8. Ordering information scheme EMIF yy - xxx zz Fx EMI filter Number of lines Information x = resistance value (ohms) z = capacitance value / 0 (pf) or letters = application digits = version Package F = Flip Chip x = : lead-free, pitch = 00 µm, bump = 55 µm 6/9 Doc ID 08 Rev

7 EMIF0-SIM05F Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: ECOPACK is an ST trademark. Figure 9. WLCSP package dimensions 55 ± 0 µm 00 µm A B C. mm ± 0.05 µm. mm ± 0.05 µm Figure 0. Footprint recommendations Figure. Marking Copper pad Diameter: 0 µm recommended 60 µm maximum Solder mask opening: 00 µm minimum Solder stencil opening: 0 µm recommended Dot, ST logo ECOPACK grade xx = marking z = manufacturing location yww = datecode (y = year ww = week) x y x w z w Doc ID 08 Rev 7/9

8 Ordering information EMIF0-SIM05F Figure. Tape and reel specification Dot identifying Pin A location 0.0 ± 0.0.0± ± 0. Ø.50 ± ± ± 0..5 ± ± ± ± 0. All dimensions are typical values in mm User direction of unreeling Note: More information is available in the application notes: AN8, IPAD 00 µm Flip Chip: package description and recommendations for use AN75, EMI filters: recommendations and measurements Ordering information Table. Ordering information Order code Marking Package Weight Base qty Delivery mode EMIF0-SIM05F LB WLCSP.9 mg 5000 Tape and reel (7 ) 5 Revision history Table. Document revision history Date Revision Changes -Nov-0 Initial release. 8/9 Doc ID 08 Rev

9 EMIF0-SIM05F Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST S TERMS AND CONDITIONS OF SALE ST DISAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. 0 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America Doc ID 08 Rev 9/9

EMIF02-SPK03F2. 2-channel EMI filter and ESD protection for speaker phone. Features. Application. Description. Complies with the following standards

EMIF02-SPK03F2. 2-channel EMI filter and ESD protection for speaker phone. Features. Application. Description. Complies with the following standards 2-channel EMI filter and ESD protection for speaker phone Datasheet production data Features 2-channel EMI symmetrical (I/O) low-pass filter High efficiency in EMI filtering: S21 attenuation, -40 db at