EEL 5245 POWER ELECTRONICS I Lecture #4: Chapter 2 Switching Concepts and Semiconductor Overview
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1 EEL 5245 POWER ELECTRONICS I Lecture #4: Chapter 2 Switching Concepts and Semiconductor Overview
2 Objectives of Lecture Switch realizations Objective is to focus on terminal characteristics Blocking capability Conduction direction Device loss mechanisms Qualitative relationships between On state resistance Breakdown Voltage Switching Time Survey of some commonly available commercial products Comparison of Switching Devices
3 Switch Classifications
4 Switch Realizations-Power Diode Passive means no active means of control Device conducts in forward direction in response to positive forward voltages Devices turns off with negative forward voltage
5 Switch Realizations-BJT/IGBT Active-controlled turn on and turn off BJT conduct in forward direction in response to control current at C IGBT conduct in forward direction in response to control voltage at C (wrt terminal 0) Devices turns off when control signal removed
6 Switch Realizations-MOSFET Active-controlled turn on and turn off MOSFETs conduct in forward direction in response to control voltage at C (wrt terminal 0) Devices turns off when control signal removed
7 Switch Realizations-SPST
8 Switch Realizations-BJT and Diode
9 Switch Realizations- Anti-parallel Diode Usually an active switch, controlled by terminal C Normally operated as twoquadrant switch : Can conduct positive or negative on-state current can block positive off-state voltage provided that the intended onstate and the off-state operating points lie on the composite i-v characteristic, then switch can be realized as shown
10 Switch Realizations- MOSFET Body Diode
11 Switch Realizations- Bidirectional Voltage Blocking-SCR Usually an active switch, controlled by terminal C Normally operated as twoquadrant switch : Can conduct positive or negative on-state current Can block positive off-state voltage Provided that the intended onstate and the off-state operating points lie on the composite i-v characteristic, then switch can be realized as shown Thyristor family also has this i-v characteristic Silicon Controller Rectifier (SCR) Gate Turn Off Thyristor (GTO)
12 Power Diode Overview Diode Minority carrier device Passively controlled device Controlled by external circuitry Forward Bias to turn on Reverse Bias to turn off Relatively low on state conduction losses Turn-on is to charge the depletion capacitor across the pn-junction Turn-off is more complex.
13 Diode Switching Characteristics Conventional
14 Diode Switching Characteristics Conventional
15 Diode Switching Characteristics Fast Recovery Type
16 Types of Power Diodes Standard recovery Reverse time not specified, intended for 50/60 Hz Fast recovery and ultra-fast recovery Reverse recovery time and recovered charge specified Intended for converter applications Schottky diode A majority carrier device Essentially no recovered charge Model with equilibrium I-V characteristic, in parallel with depletion region capacitance Restricted to low voltage (few devices can block 110V or more)
17 Diode Switching Characteristics Simulation-Dbreak 1.0A 0.5A 0A 10.0us 10.4us 10.8us I(D1) Time
18 Diode Switching Characteristics Simulation-1N4002 General Purpose 40A 0A 0A -40A -40A -80A 10.00us 10.25us 10.50us 10.75us I(D1) Time -71A us I(D1) us Time us
19 Diode Switching Characteristics Simulation-D1N4148-Fast Recovery 1.0A 200mA 0.5A 0A 0A 10.0us 10.2us 10.4us 10.6us 10.8us I(D1) Time -200mA us I(D1) us Time us
20 Survey of Commercial Power Diodes
21 General Comments on Power Diodes Inverse Relationship between Blocking voltage/forward current and reverse recovery time/forward voltage drop Generally, Diode turn on fast enough to be considered ideal Device turn off generally considered ideal but can effect circuit operation Diode turn off means negative current needed to remove stored charge This charge removal is required for device turn off In some instances, this negative current and delay can have an effect on circuit operation Can result in inductive ringing (particularly when fast recovery used in an inductive enviornment) When required, series diodes add to blocking capability
22 Thyristors - Overview Thyristors Controlled diode In off state, can block positive forward polarity voltage and thus not conduct Can be trigger into the on state by providing a short pulse of gate current provided that device is in forward blocking state Once device begins to conduct, it is LATCHED on and gate current can be removed
23 Thyristors -SCR i A i g Anode (A) Cathode (K) (a) Circuit symbol Silicon Controlled Rectifier Once device begins to conduct, it is LATCHED on and gate current can be removed Cannot be turned off by active control (activity at gate) When current reduces and tries to go to negative, device turns off External circuit must reverse bias the SCR to achieve turn off After turn off, gate regains control allowing active turn on once the device is in forward blocking state
24 i A Anode (A) Thyristors -SCR Symbol and Terminal Characteristics i A Forward blocking region i g3 >i g2 >i g1 i g Cathode (K) (a) Circuit symbol v AK Reverse avalanche region Max reverse voltage Reverse blocking region i g5 i g4 i g3 i g2 i g1 i g =0 Forward breakover voltage Latching current Holding current v AK i A ON Forward current carrying(on) Reverse voltage blocking Forward voltage blocking(off) v AK
25 Thyristors -SCR Simulation 1.0A 0.5A 0A 1.0V I(Rload) 0.5V SEL>> -0.1V 0s 5ms 10ms 15ms V(Gate) Time
26 Commercial SCR Survey Product Package Circuit VDRM IT(RMS) ST180C04C0 TO-200AA (A-Puk) DISCRETE ST230C04C0 TO-200AA (A-Puk) DISCRETE ST280C04C0 TO-200AA (A-Puk) DISCRETE ST280C06C0 TO-200AA (A-Puk) DISCRETE ST280CH06C0 TO-200AA (A-Puk) DISCRETE ST230C08C0 TO-200AA (A-Puk) DISCRETE ST180C08C0 TO-200AA (A-Puk) DISCRETE ST180C12C0 TO-200AA (A-Puk) DISCRETE ST230C12C0 TO-200AA (A-Puk) DISCRETE ST230C14C0 TO-200AA (A-Puk) DISCRETE ST230C16C0 TO-200AA (A-Puk) DISCRETE ST180C16C0 TO-200AA (A-Puk) DISCRETE ST180C18C0 TO-200AA (A-Puk) DISCRETE ST180C20C0 TO-200AA (A-Puk) DISCRETE
27 General Comments on SCRs Used to be device of choice for high power applications SCR based Phase Controlled Rectifiers still common in three-phase industrial environment A minority carrier device SCR has highest blocking voltage and current carrying capabilities of all the semiconductor switches Large reverse recovery current Long carrier lifetimes allow low on state resistance but mean long turn off times Switching very slow Newer designs rarely use SCRs unless very high power required Most newer designs use MOSFETs or IGBTs
28 Thyristors -Triac A(Anode) SCR 1 SCR 2 G(Gate) K(Cathode) Triac Back to back SCR Bidirectional current flow, bidirectional voltage blocking Often used: AC waveform chopping: dimmers, soldering stations, controlled heating elements
29 Thyristors -GTO Gate Turn Off Thyristor G i A i G A + v AK _ Like SCR, once device begins to conduct, it is LATCHED on and gate current can be removed Unlike SCR, GTO can be turned off with a negative gate-cathode voltage (i.e. active turn off control) This negative gate current pulse can be short duration but must be large magnitude (~.33 i A ) A controlled switch like BJT/MOSFET but not suitable for inductive turn off Slow switching time (fs max ~10 khz)
30 BJT - Overview i B i C + v CE _ Bipolar Junction Transistor A minority carrier device Current controlled Requires a continuous base current to remain in on (conducting) state Significant delays during turn off transition On-state resistance has negative temperature characteristic so device paralleling not always straightforward
31 BJT Symbol and i-v Characteristics i C + i C Saturation(ON-state) i B v CE _ Active region Increasing base current i C Cut-OFF(OFF-state) ON-state v CE OFF-state v CE Ideal switch characteristics
32 General Comments on BJT BJT has been replaced by MOSFET in low-voltage (<500V) applications BJT is being replaced by IGBT in applications at voltages above 500V Design trade off between on-state losses and switching times A minority-carrier device: compared with MOSFET, the BJT exhibits slower switching, but lower on-resistance at high voltages
33 Gate(G) + + V GD V GS Drain(D) - - i D + V DS - Source(S) MOSFET Overview Metal-Oxide-Semiconductor Field Effect Transistor A majority carrier device Voltage controlled Require continuous application of Gate to Source voltage to maintain on-state (conduction) No gate current flows except during transitions to charge and discharge gate capacitance Very short switching times On-state resistance has positive temperature coefficient so device paralleling simple
34 MOSFET Symbol and i-v Characteristics Drain(D) - i D + i D + V GD V DS - Gate(G) + V GS - Source(S) Slope = 1 r O v GS Increasing i D ON-state OFF-state v DS 0 v DS Ideal switch characteristics
35 Survey of Commercially Available MOSFETs Part Number Rated Max. Voltage Rated Avg. Current Ron Qg(typical) IRFZ48 60V 50A 0.018Ω 110nC IRF V 5.6A 0.54Ω 8.3nC IRF V 28A 0.077Ω 72nC APT10M25BNR 100V 75A 0.025Ω 171nC IRF V 10A 0.55Ω 63nC MTM15N40E 400V 15A 0.3Ω 110nC APT5025BN 500V 23A 0.25Ω 83nC APT1001RBNR 1000V 11A 1.0Ω 150nC
36 General Comments on MOSFET Majority carrier device: fast switching times Typical switching frequencies: tens and hundreds of khz On state losses rise more rapidly with blocking voltage than in a comparable BJT Easy to drive The device of choice for blocking voltages less than 500V 1000V devices are available, but are useful only at low power levels (100W) Generally, on state resistance most significant factor when selecting device
37 IGBT Overview Insulated Gate Bipolar Transistor Combination of BJT and MOSFET Like MOSFET, has high impedance gate which requires small charge to turn on Like BJT, small on state resistance even for devices with large blocking voltage ratings Can be designed to block negative voltages like thysistors
38 IGBT Symbol and i-v Characteristics i D 1 Slope = r O v GS Increasing 0 v DS i D ON-state OFF-state OFF-state v DS Ideal switch characteristics
39 Survey of Commercially Available IGBTs
40 General Comments on IGBT Faster than comparable BJT, Slower than a comparable MOSFET On state losses smaller than MOSFET and are comparable to BJT Turn on time can be effected by rate of change of v gs Most new designs in the industrial power electronics market use IGBTs for medium power applications
41 Device Comparison f s vs. Power P As power rating increases, frequency decreases 10 5 SCR Power (kw) GTO SITH BJT MCT IGBT As frequency increases, power decreases 10 1 MOSFET Frequency (Hz) 10 8 f
42 Future Trends in Device Progress
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