SZ007A Preliminary Specification

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1 Features and Benefits VDD range: 4.75V~5.25V Power consumption: 16mA Size: mmx10.668mmx2.9mm Operating temp range: 40 to 85 High resolution and dynamic range Low zero rate output drift Adjustable full scale range ±75º/s ±150º/s ±300 º/s On chip EEPROM trimming On chip 11 bits ADC Analog and digital output(spi interface) Applications GPS/DR Navigation Vehicle stability Roll over Intelligent traffic system General Description The is an integrated Z Axis angular rate sensor (Gyroscope). A single CLCC package contains a high performance silicon micro machined sensor with signal conditioning circuitry. It provides excellent temperature stability and high resolution over the operating temperature range ( 40 ~ 85 ) It provides on chip temperature sensor, which outputs a voltage proportional to the temperature. It has ±75 º/s, ±150 º/s and ±300 º/s full scale selectable, and the signals of different full scale can be accessed by using different I2C commands conveniently. is capable of detecting rates with 3dB bandwidth up to 75Hz. The delivers output signal proportional to angular rate perpendicular to the assembly surface. includes low pass filters and EEPROM for on chip factory calibration for the sensor. Factory trimmed scale factors eliminates the need for external active components and end user calibration. The is provided in Ceramic package (CLCC32) and the size is mm x mm x 2.9mm Order Information Part Number Package Code Option Code Full Scale C N C(CLCC32) N ±75 º /s C E C(CLCC32) E ±150 º /s C R C(CLCC32) R ±300 º /s SENODIA Technologies(SH) Co., Ltd. Page 1 of 17

2 1. Functional Diagram Fig. 1. Function block diagram SENODIA Technologies(SH) Co., Ltd. Page 2 of 17

3 2. Gyroscope Sensor Specifications DC Operating Parameters T= 40 to 85, Vdd=4.75V to5.25v (unless otherwise specified) All parameters specified Vdd=5.0V and T=25 Parameter Test Condition Min. Typ. Max. Unit Full Scale Range N ±75 º /s E ±150 º /s R ±300 º /s Non Linearity Best fit line ±0.5 % of FS Sensitivity /Scale Factor N E R mv/ º /s 12.8 LSB/ º /s mv/ º /s 6.4 LSB/ º /s 6.67 mv/ º /s 3.2 LSB/ º /s Scale Factor Drift 40 ~85 ±5 %S 0 Zero Rate Output(ZRO) 2.5 V 1008 LSB ADC Time µs Zero Rate Temperature Drift Zero Rate time stability based on (Allan Deviation) Zero output Power Variation drift 40 ~85 ±5 %FS OUT 17 º /h N VDD:4.75~5.25V mv/v LSB/V E VDD:4.75~5.25V mv/v LSB/V R VDD:4.75~5.25V mv/v LSB/V Bandwidth( 3dB) External selectable 6 70 Hz Output Noise Density Within 15Hz bandwidth 0.03 º /s/sqrthz Cross sensitivity ±1 2 % FS OUT Resonant Frequency 8.2 KHz V ref V SENODIA Technologies(SH) Co., Ltd. Page 3 of 17

4 TC of VREF 40 ~85 90 ppm/ K Vibration sensitivity 8.4 g PTP,100Hz,,7000Hz 0.1 º /s/g Temperature Sensor V TC of Temperature Sensor 40 ~85 10 mv/ K ADC Resolution 11 bit Power on Time C FLT =10nF, C 3 =100nF ms 3. Electrical Characteristics Electrical Vdd=5.0V, T=25 unless otherwise noted Symbol Parameter Condition Min. Typ. Max. Unit Vdd Supply voltage V Idd Supply current Vdd=5.0V 16 ma Symbol Parameter Pin Min. Typ. Max. Unit low level input voltage VIL SENB,MOSI 0 30%VDD V high level input voltage VIH SENB,MOSI 70%VDD VDD V low level output voltage VOL MISO, ERROR, V IO<8mA high level output voltage VOH MISO, ERROR, IO<8mA 80%VDD VDD V 4. Absolute Maximum Ratings Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. Parameter Min Max Units Comments SupplyVoltage.VDD V No latch up or damage. Rise time (10 to 90%): tr 0.5µs. Supply Voltage, VDD V Operating within specifications Output pins (OUTAR, OUTTEMP, all digital IO s),current limit, shorted to VDD or VSS pin SENODIA Technologies(SH) Co., Ltd. Page 4 of ma VDD = 0 to 7V guaranteed by characterization

5 Operating Temperature Range, TAMBIENT Operating Temperature Range, TJUNCTION Output not shorted Storage Temperature Range Package Thermal Resistance 100 /W Latch up withstand ma CDF AEC Q ; VDD= 5.75V Acceleration shock survival ± 1500 g Shock 0.5ms, 3 axis 5. Pin Description Fig. 2. PIN Description (Top View) Table PIN Description Pin No Pin Name Pin Function 1,32 TOPCAP Please connect to GND 3 VSS Digital GND 4 VDD Digital Power 6 SCLK SPI Serial clock 7 SENB SPI Serial Enable 8 MISO SPI Data IO port, input as master, output as slave 9 MOSI SPI Data IO port,output as master,input as slave 10,28,29 Res_G Reserve pin,please connect GND 11 ERROR Continue self test Error report 12 SELFTEST Self test request 21 HVIN Charge pump filter(need to connect a 10nF with 25V SENODIA Technologies(SH) Co., Ltd. Page 5 of 17

6 capacitance) 22 TEMP Temperature Sensor analog output 23 FLT Filter capacitance pin 24 ZOUT Analog Sensor output 25 VREF Voltage of sensor reference 26 VSSA Analog GND 27 VDDA Analog Power Supply 30 RES_F Reserve pin, please Open 2,5,13,14,15,16, 17,18,19,20,31, 32 NC Please connect to GND Table 6.1 Pins Description 6. Design Notes 6.1 Senor Analog output voltage Sensor signal is output by the Zout pin, and the relationship between voltage can be calculate: Zout = Bias+ Sensitivity AngularRate Bias is the Zero Rate output 6.2 Communication with the through the SPI The has a serial communication interface compatible with four wires Serial Peripheral Interface (SPI). serial clock (SCLK); master data output, slave data input (MOSI); master data input, slave data output (MISO); slave select (SENB). The can work only as a slave device. SENB Figure 6.1 Data transfer sequence( Full Answer Reading) SENODIA Technologies(SH) Co., Ltd. Page 6 of 17

7 SENB Figure 6.2 data transfer sequence (High Byte Answer) SENB Figure 6.3 SPI Data Transfer Timing Parameter Threshold Unit Test Condition t1 30 ns SENB active to SCLK Raising Edge Setup time t2 80 ns SCLK High Duration t3 80 ns SCLK Low Duration t4 0 ns SENB Low Duration t5 50 ns SCLK High Duration t6 80 ns Data In Setup time t7 50 ns Data In Hold t8 50 ns Output active t9 0 ns Output Setup time t10 40 ns Output Disable time 6.3 ADC Apply Note integrate a 11bits AD Converter, any Temperature and Gyro Rate can be obtain by the formula from ADC code SENODIA Technologies(SH) Co., Ltd. Page 7 of 17

8 V ZOUT (mv) =ADC code *25/12+400; V TEMP (mv)=adc code*25/16+300; Description of the bits mentioned in ADC section: ADEN BUSY CHAN EOC ADC enable bit: ADEN=0:ADC at a sleep mode and refused to be read; ADEN=1:ADC work normally Note: This bit should be set by Command ADCC, and cleared after power up This bit will be set after chip reset and will be cleared after initialization inside chip If busy = 1,then chip send Refuse signal only CHAN bit is used to select input Source of ADC CHAN = 0: input Angular rate channel CHAN = 1: Temperature will be converted Note: This bit Can be Set by Command ADCC and cleared after power up End of AD-conversion bit. EOC bit indicates an ADC state. EOC=0 : ADC in progress and can not be restarted. EOC=1 : AD-conversion has been completed and can be restarted. As a result, any attempt of the ADC starting will be rejected if EOC has a 0 state. OPC X Unknown Operation Code. This bit is set when a received operation code was not recognized. These bits are reserved or have an undefined state ADC Instructions and Answers There are three SPI commands that are used to control embedded ADC of the : STATR, ADCC and ADCR. The Refusal Answer Every instruction sent to the has an answer. If the is not able to accept the instruction a refusal answer will be transmitted out. This answer has a unique format which is shown in the Table 7. The refusal answer is the only one that has a set MSB. The other bits help to understand a possible reason for the instruction rejection. Refuse Answer Bit15 Bit1 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 1 OPC EOC X X BUSY X X X X X X X X X X Command of the Status Reading(STATR) Instruction Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SENODIA Technologies(SH) Co., Ltd. Page 8 of 17

9 Answer Bit15 Bit1 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 0 X EOC X X X X X X X X X CHAN ADEN X X Command of the ADC Control (ADCC) Instruction Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit CHAN ADEN 0 0 Answer Bit15 Bit1 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 0 X EOC X X X X X X X X X CHAN ADEN X X Command of the ADC Reading (ADCR) Instruction Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit Answer Bit15 Bit1 Bit13 Bit12 Bit11 Bit10 Bit9 Bit8 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 0 X EOC X AD10 AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 0 AD10:AD0 as the ADC code,valid only EOC is set Reading the Digital Angular Rate or Temperature (suggested procedure) There is a recommended sequence below to obtain digital data from the ADC. Notes: The bit with leftmost position should be shifted first. Below x means any value: 0 or 1. Step 1 (put ADC to the active mode if it wasn t) Use SPI to send ADCC instruction (MOSI): And check 15th bit of the answer (MISO): If 15th bit is zero, the instruction is accepted. Before to go to the Step 2 provide a delay > 115 μs or wait till the EOC bit is set. Step 2 (conversion start) Use SPI to send ADCC instruction(mosi): And check 15th bit of the answer (MISO): If 15th bit is zero, the instruction is accepted. CHAN bit specifies the input source of the ADC. CHAN=0: The angular rate signal. CHAN=1: The temperature sensor signal. SENODIA Technologies(SH) Co., Ltd. Page 9 of 17

10 Go to the Step 3. Step 3 (polling and result obtaining) Use SPI to send ADCR instruction and check 15th and 13th bits of the answer: If 15th bit is zero, the instruction is accepted. If 13th bit (EOC) is zero, the conversion is still in progress and the result of the conversion (bits AD10 AD0) is not valid. As soon as the EOC bit is set the conversion is completed and the result is valid. Instead of the polling of the EOC bit one can use a simple delay that should be bigger than a maximal conversion time (>115 μs, see table 4). Go to the Step 2 to do the next conversion or to the Step 4 to put ADC to the sleep mode. Step 4 (put ADC to the sleep mode if it s necessary) Use SPI to send ADCC instruction (MOSI): And check 15th bit of the answer (MISO): If 15th bit is zero, the instruction is accepted. 7. Applications Examples Figure 7.1 with simultaneous analog and digital output The can simultaneously output analog and digital signals. The analog output signal can be fed to a microcontroller (μc) that contains an analog to digital converter. A multiplexer can be used to select between the temperature and the angular rate signals. The generates an internal reference voltage used for supplying the ADC, thereby maintaining accuracy regardless of the supply voltage of the μc. Whilst supplying the analog output signal, the can simultaneously send a digital output signal to the μc through the SPI. SENODIA Technologies(SH) Co., Ltd. Page 10 of 17

11 1. The bandwidth of the can be selected by connecting an appropriate capacitor inthe FLT pin. CFLT implements a first order low pass filter cascaded with an internal 4 th order SC filter. The 3dB bandwidth set by CFLT is: fout =0.16 / (ROUT*CFLT), with ROUT = 200k_ (typ). It is recommended to use CFLT even if the cut off frequency is not specified to reduce switching spikes at the output. 2. It is recommended to use X5R or X7R type capacitors. Min. voltage for C3 should be 25V or more, and 10V or more for the other capacitors. Recommended values of decoupling capacitors C1 and C2 are 1.0μF and 0.1μF for C3. These capacitors should be placed as close as possible to their respective pins. 3. HVIN is a high impedance node. Be sure that an equivalent leakage resistance at this node Figure 7-2. with analog output only If only an analog output signal is required, the doesn t need to communicate through the SPI pins. All other pins continue to be used as described above. Figure 7-3. with digital output only If only a digital output signal is required the uses the SPI to send the temperature and SENODIA Technologies(SH) Co., Ltd. Page 11 of 17

12 the angular rate in a digital format. The operation mode only through the SPI allows a reduction of cost and complexity in the interfacing to system microcontroller or microprocessor. All the pins in the above schematics continue to be used as described above. In order to adapt the for a 3.3V Microcontroller one can use the below schematic: Figure 7-4. Possible interfacing with 3.3V μc SENODIA Technologies(SH) Co., Ltd. Page 12 of 17

13 8.0 Package information 8.1 Package dimensions Figure 8 1. Package dimensions unit: mm (inch) SENODIA Technologies(SH) Co., Ltd. Page 13 of 17

14 Figure 8 2. Bottom Dimensions Figure 8 3. Land Pattern(TOP View) 8.2 Marking Label SENODIA Technologies(SH) Co., Ltd. Page 14 of 17

15 9. Solder Reflow Curve Solder Reflow curve follows IPC/JEDEC J STD 020C Pb free standards. SENODIA Technologies(SH) Co., Ltd. Page 15 of 17

16 Figure 9.1 Solder Reflow curve 10. Environment Compliant pass SGS certification,compliant with RoHS standards. SENODIA Technologies(SH) Co., Ltd. Page 16 of 17

17 11. Revision History Date Revision Changes Preliminary issue Revised Version for digital command information Add order information and Laser label 12. Disclaimer Information furnished by SENODIA is believed to be accurate and reliable. However, SENODIA reserve the right to make changes, modifications or corrections to this document and related products at any time, without notice. No license and intellectual property right is granted under this document. We reserve all rights of disposal such copying or passing on to third parties. No responsibility is assumed by SENODIA for any infringements of patents or other rights of third parties which may result from its use. SENODIA Technologies(SH) Co., Ltd. Page 17 of 17

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