Lecture 2 - Overview of power switching devices. The Power Switch: what is a good power switch?
|
|
- Joel Parker
- 6 years ago
- Views:
Transcription
1 Lecture 2 - Overview of power switching devices The Power Switch: what is a good power switch? A K G Attributes of a good power switch are: 1. No power loss when ON 2. No power loss when OFF 3. No power loss during turning ON or OFF 4. Little power required to turn it ON or OFF 5. Bi-directional? 6. Adequate voltage and current ratings 7. Low Turn-on and Turn-off times Lecture 2 - Overview 2-1 F. Rahman
2 Lecture 2 - Overview 2-2 F. Rahman
3 Lecture 2 - Overview 2-3 F. Rahman
4 More on classification of power semiconductors Source: S. Bernet, Recent developments of high power semiconductors for industry and traction applications, IEEE Transactions on, Vol. 15, No. 6, Nov. 2000, pp Lecture 2 - Overview 2-4 F. Rahman
5 Diodes of various sizes (d) Thyristor (e) Thyristor (f) 3-φ IPM with IGBTs 50A, 400V 1200V, 1000A 1200V, 100A Typical power device encapsulations Key Attributes of power semiconductor switches 1. High breakdown voltage (BV) 2. Low On-state resistance 3. Fast switching times There is not much freedom to enhance one without affecting the others two. 4. Low gate drive requirement Lecture 2 - Overview 2-5 F. Rahman
6 Static I-V characteristics of power semiconductor switches BV I R ON V sat For power electronic converters, only the saturation region and blocking regions of the characteristic (shaded part) are used. Majority-carrier devices such as MOSFETS, and Schottky diodes have low breakdown voltage in order to have acceptable On-resistance. These have very fast switching times. Minority-carrier devices such as BJTs, IGBTs, GTOs, SCRs, MCTs have low On-resistance, due to injection of large quantities of minority carries into the depletion layer when switched on. Such devices can have high breakdown voltage. These are however much slower than majority carrier devices. Lecture 2 - Overview 2-6 F. Rahman
7 DEVICE RATINGS SUMMARY (Mohan, 1995) Lecture 2 - Overview 2-7 F. Rahman
8 DEVICE RATINGS SUMMARY (SEMIKRON, 2004) Lecture 2 - Overview 2-8 F. Rahman
9 Power Devices and Applications Power rating VS frequency range of power semiconductor devices (Courtesy of Powerex. Inc) Lecture 2 - Overview 2-9 F. Rahman
10 The Power Diode Chapter 19 of Mohan gives a good introduction to physics of pn junctions. Junction p-n diode: static characteristic 1 R ON Signal PN diode structure Lecture 2 - Overview 2-10 F. Rahman
11 The avalanche breakdown voltage BV BD is inversely proportional to the impurity densities. BV BD d 17 2 BD ε E = V N 2qN d where N d = donor atom densities/m 3 ε = dielectric constant of the depletion layer q = electronic charge in Coulomb E BD = field strength for avalanche breakdown 20 MV/m / cm / cm 10 / cm Power diode structure The n layer gives the high breakdown voltage capability. The lightly doped n layer supports most of the reverse blocking voltage. The breakdown electric field in the n VAK,max layer W giving avalanche breakdown in the n d layer is determined by width W d of the n layer and the impurity density of this layer. These are selected for the required maximum V AK, or BV BD or V RRM. Lecture 2 - Overview 2-11 F. Rahman
12 The wide n layer does not necessarily mean increased conduction voltage drop across the diode. The relative levels of impurity densities ensure that adequate conductivity is achieved when minority carriers are injected across the junctions. Refer to diode data sheets 1-3 in the Lecture Notes webpage for diode parameters. Switching Characteristics di F dt di R dt trr nsec for fast recovery diodes. several 100 μsecs for line-frequency power diodes Q rr = Reverse recovery charge, C Lecture 2 - Overview 2-12 F. Rahman
13 S = snappiness factor = t t 5 4 ( di / dt) di t di 2Q di I t 2 I dt S+ 1 dt S+ 1 dt t R rr R rr R R rr = 4 = = < τ d0 rr ( + ) 2Qrr 1 S ) 2τ Id0 = < di / dt di / dt R 12 2 τ 4 10 BV BD Schottky diodes Power Schottky diodes are formed from metalsemiconductor junctions, with an n -1 layer as shown in figure below. Note: only majority carriers. Anode, A Metal contact SiO 2 SiO 2 R p p Depletion layer w/o p guard rings n 1 Depletion layer with p guard rings n Metal contact Cathode, K Lecture 2 - Overview 2-13 F. Rahman
14 Compared to junction (bipolar) pn diodes Schottky diodes, being a majority carrier device, have 1. much lower forward on-state voltage drop, V 2. much smaller turn-off times; no reverse recovery current 3. low reverse blocking voltage ratings, up to 200V 4. higher junction capacitance; the charging current of this capacitance at turn-off is comparable to the reverse recovery current of junction (bipolar) pn diodes. 5. high efficiency and switching frequency. Lecture 2 - Overview 2-14 F. Rahman
15 The Power MOSFET Very fast, t off 50 nsec nsec. R dson increases with 500V, 15A device. 2.6 V BD ; typically, R ds 40 mω for a Turned-on and -off by V GS. V GS,TH 5-20V. These devices are easily connected in parallel. N-Channel MOSFET (a) symbol, (b) v-i characteristic, (c) idealized characteristic. MOSFET with parasitic reverse diode MOSFET with blocked parasitic blocking and fast recovery diode Lecture 2 - Overview 2-15 F. Rahman
16 Switching of Power Devices (Resistive load) Gate input power: t on p = v i dt f G G G s 0, W Switching power loss = p SW = shaded area f s, W Lecture 2 - Overview 2-16 F. Rahman
17 Switching ON/OFF a resistive-inductive circuit T i T v T L I o V d FW Resistor R FW R LOAD The turn-off problem Suppose the switch T is ON for a while and the inductive Vd load current is Io =. R LOAD Assume that the free-wheeling resistor R FW, is not present. When T is turned OFF, I o falls to zero in time t fi or t rv (whichever is longer). If V d = 5V and R LOAD = 0.1Ω, L = 30 mh, t fi = t rv = 150 nsec, (i) What is voltage V ds across the switch when it is turned off? (ii) What role could the free-wheeling resistor play in limiting this voltage? (iii) What role could R FW play in turning off the load current quickly? Lecture 2 - Overview 2-17 F. Rahman
18 Switching a diode-clamped circuit The load current I o is assumed to remain constant while the switch turns ON and OFF with a duty cycle at the switching frequency f s. T i T v T V d Ideal Diode, D i D I o We assume: ideal devices and no reverse recovery current in the diode. I o = i T + i D at all time. Voltage v T (t) and current i T (t) transients at turn-on and turn-off occur along straight tines. When the switch T is turned on, the diode continues to carry part of I o as i T builds up. Until i T becomes equal to I o, the diode remains in the conducting state (i.e., forward biased). The diode starts to become reverse biased after I o fully commutates to T in time t ri. Thus, while i T rises from zero to I o, v T remains clamped to V d. Once I o fully commutates to T, the voltage v T (or v AK ) across switch falls to zero in time t fv. Lecture 2 - Overview 2-18 F. Rahman
19 When the switch T is turned off, the diode does not conduct until the potential at the cathode of diode D rises to V d. Thus, diode D remains reverse biased until v T rises to V d in time t rv. Thereafter, the diode becomes forward biased and starts to conduct. Thus, the current through T remains clamped to I o until v T rises to V d in time t rv. Until then i T = I o. Once v T rises to V d, current i T falls to zero in time t fi. Note that diode clamping increases the areas of overlap during both transitions. The power loss in the switch is given by the product p = v T * i T, given by the shaded areas. Note also that the reverse recovery current of the diode at turn-on of T increases the peak current loading of switch T. The following analysis assumes ideal diode, i.e., the reverse recovery current of the diode is neglected. The energy dissipated (power lost) in the switch during turn-on and turn-off transients can be found by multiplying the voltage v T (t) and current i T (t) of the switch and integrating the product over the duration of each transient. The calculation is simplified if the origin t = 0 for each case is shifted to time when the respective transitions begin, and if the on-state voltage of the switch is neglected in comparison with the DC supply voltage V d. Lecture 2 - Overview 2-19 F. Rahman
20 T s = 1 f s = T ON + T OFF T OFF T ON v T V d I O V d i T t don t doff t ri t fv t rv t fi I O i D V d I O W 1 = V I t 2 coff d o coff p T W con = 1 V I t 2 d o con W on = V I t on o on t con =t ri + t fv t coff = t rv + t fi Lecture 2 - Overview 2-20 F. Rahman
21 Thus, for turn-on transient, W tri I tfv = o Vd tdt + I ov d 1 0 t 0 ri t t s on fv 1 1 = VIt + VIt 2 2 d o ri d o fv dt 1 1 = VI d o( tri + tfv) = VIt d o con J 2 2 Joules Similarly, it can be shown that for turn-off transient, W trv V tfi = d I o tdt + Vd I o 1 0 t 0 rv t t s off fi dt 1 1 = VI d o( trv + tfi) = VIt d o coff J 2 2 J The total switching power loss is thus given by sw d o ( tcon + tcoff ) fs 1 P = 2 V I W If the turn-on and turn-off transients are not short compared to T s, the average power loss in the switching process, P s, may become large compared to the loss during the ON time. 1 P = V I f t + t 2 ( ) sw d o s con coff The on-state power loss is given by Lecture 2 - Overview 2-21 F. Rahman
22 P V I t f = W on on o on s where t on is the on-time of the switch in a switching period. Note that P sw increases proportionately with f s, while P ON does not, since T on and f s are inversely proportional to each other. Lecture 2 - Overview 2-22 F. Rahman
Power Semiconductor Devices
TRADEMARK OF INNOVATION Power Semiconductor Devices Introduction This technical article is dedicated to the review of the following power electronics devices which act as solid-state switches in the circuits.
More informationToday s subject MOSFET and IGBT
Today s subject MOSFET and IGBT 2018-05-22 MOSFET metal oxide semiconductor field effect transistor Drain Gate n-channel Source p-channel The MOSFET - Source Gate G D n + p p n + S body body n - drift
More informationEEL 5245 POWER ELECTRONICS I Lecture #4: Chapter 2 Switching Concepts and Semiconductor Overview
EEL 5245 POWER ELECTRONICS I Lecture #4: Chapter 2 Switching Concepts and Semiconductor Overview Objectives of Lecture Switch realizations Objective is to focus on terminal characteristics Blocking capability
More informationLecture 23 Review of Emerging and Traditional Solid State Switches
Lecture 23 Review of Emerging and Traditional Solid State Switches 1 A. Solid State Switches 1. Circuit conditions and circuit controlled switches A. Silicon Diode B. Silicon Carbide Diodes 2. Control
More informationChapter 1 Power Electronic Devices
Chapter 1 Power Electronic Devices Outline 1.1 An introductory overview of power electronic devices 1.2 Uncontrolled device power diode 1.3 Half- controlled device thyristor 1.4 Typical fully- controlled
More informationT C =25 unless otherwise specified. Symbol Parameter Value Units V DSS Drain-Source Voltage 40 V
40V N-Channel Trench MOSFET June 205 BS = 40 V R DS(on) typ = 3.3mΩ = 30 A FEATURES Originative New Design Superior Avalanche Rugged Technology Excellent Switching Characteristics Unrivalled Gate Charge
More informationR. W. Erickson. Department of Electrical, Computer, and Energy Engineering University of Colorado, Boulder
R. W. Erickson Department of Electrical, Computer, and Energy Engineering University of Colorado, Boulder pn junction! Junction diode consisting of! p-doped silicon! n-doped silicon! A p-n junction where
More informationR. W. Erickson. Department of Electrical, Computer, and Energy Engineering University of Colorado, Boulder
R. W. Erickson Department of Electrical, Computer, and Energy Engineering University of Colorado, Boulder Inclusion of Switching Loss in the Averaged Equivalent Circuit Model The methods of Chapter 3 can
More informationLecture Notes. Emerging Devices. William P. Robbins Professor, Dept. of Electrical and Computer Engineering University of Minnesota.
Lecture Notes Emerging Devices William P. Robbins Professor, Dept. of Electrical and Computer Engineering University of Minnesota Outline Power JFET Devices Field-Controlled Thyristor MOS-Controlled Thyristor
More informationPower Electronics. P. T. Krein
Power Electronics Day 10 Power Semiconductor Devices P. T. Krein Department of Electrical and Computer Engineering University of Illinois at Urbana-Champaign 2011 Philip T. Krein. All rights reserved.
More informationElectrical Engineering EE / EEE. Postal Correspondence Course. Power Electronics. GATE, IES & PSUs
Power Electronics-EE GATE, IES, PSU 1 SAMPLE STUDY MATERIAL Electrical Engineering EE / EEE Postal Correspondence Course Power Electronics GATE, IES & PSUs Power Electronics-EE GATE, IES, PSU 2 C O N T
More informationDevice Marking Device Device Package Reel Size Tape width Quantity TO-252-2L. Parameter Symbol Limit Unit
HM80N05K N-Channel Enhancement Mode Power MOSFET Description The uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge. It can be used in a wide variety of applications.
More informationModule 1. Power Semiconductor Devices. Version 2 EE IIT, Kharagpur 1
Module 1 Power Semiconductor evices Version 2 EE IIT, Kharagpur 1 Lesson 6 Metal Oxide Semiconductor Field Effect Transistor (MOSFET) Version 2 EE IIT, Kharagpur 2 Constructional Features, operating principle
More informationEC T34 ELECTRONIC DEVICES AND CIRCUITS
RAJIV GANDHI COLLEGE OF ENGINEERING AND TECHNOLOGY PONDY-CUDDALORE MAIN ROAD, KIRUMAMPAKKAM-PUDUCHERRY DEPARTMENT OF ECE EC T34 ELECTRONIC DEVICES AND CIRCUITS II YEAR Mr.L.ARUNJEEVA., AP/ECE 1 PN JUNCTION
More informationPower Electronics Power semiconductor devices. Dr. Firas Obeidat
Power Electronics Power semiconductor devices Dr. Firas Obeidat 1 Table of contents 1 Introduction 2 Classifications of Power Switches 3 Power Diodes 4 Thyristors (SCRs) 5 The Triac 6 The Gate Turn-Off
More informationHRLD150N10K / HRLU150N10K 100V N-Channel Trench MOSFET
HRLD15N1K / HRLU15N1K 1V N-Channel Trench MOSFET FEATURES Originative New Design Superior Avalanche Rugged Technology Excellent Switching Characteristics Unrivalled Gate Charge : 8 nc (Typ.) Extended Safe
More informationDevice Marking Device Device Package Reel Size Tape width Quantity SIP3210 SIP3210 SOP-8 330mm
SIAI N-Channel Enhancement Mode Power MOSFET DESCRIPTION The SIP3210 uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge. It can be used in a wide variety of applications.
More informationDevice Marking Device Device Package Reel Size Tape width Quantity 6075K FNK6075K TO-252-2L Parameter Symbol Limit Unit
FNK N-Channel Enhancement Mode Power MOSFET Description The FNK6075K uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge. It can be used in a wide variety of applications.
More informationOperating Junction and 55 to +175 C Storage Temperature Range
Feathers: dvanced trench process technology avalanche energy, 100% test Fully characterized avalanche voltage and current ID =60 BV=60V Rdson=14mΩ(max.) Description: The is a new generation of middle voltage
More informationDescription TO-3PN D S. Symbol Parameter FDA18N50 Unit. Maximum Lead Temperature for Soldering Purpose, 300 C 1/8 from Case for 5 Seconds
FDA18N50 N-Channel UniFET TM MOSFET 500 V, 19 A, 265 m Features R DS(on) = 265 m (Max.) @ = 10 V, ID = 9.5 A Low Gate Charge (Typ. 45 nc) Low C rss (Typ. 25 pf) 100% Avalanche Tested Applications PDP TV
More informationTaiwan Goodark Technology Co.,Ltd
TGD N-Channel Enhancement Mode Power MOSFET Description The uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge. It can be used in a wide variety of applications.
More informationYJS12N10A. N-Channel Enhancement Mode Field Effect Transistor
RoHS COMPLIANT N-Channel Enhancement Mode Field Effect Transistor Product Summary V DS I D R DS(ON) ( at V GS =10V) R DS(ON) ( at V GS =6V) 100% UIS Tested 100% VDS Tested 100V 12A
More information1 Basics V GG. V GS(th) V GE(th) , i C. i D I L. v DS. , v CE V DD V CC. V DS(on) VCE(sat) (IGBT) I t MOSFET MOSFET.
Reverse operation During reverse operation (Figure 1.10, III rd quadrant) the IGBT collector pn-junction is poled in reverse direction and there is no inverse conductivity, other than with MOSFETs. Although,
More informationSolid State Devices- Part- II. Module- IV
Solid State Devices- Part- II Module- IV MOS Capacitor Two terminal MOS device MOS = Metal- Oxide- Semiconductor MOS capacitor - the heart of the MOSFET The MOS capacitor is used to induce charge at the
More informationFNK N-Channel Enhancement Mode Power MOSFET
FNK N-Channel Enhancement Mode Power MOSFET Description The FNK 80H11 uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge. It can be used in a wide variety of
More informationV DSS R DS(on) max I D. 20V GS = 10V 8.9A. 71 P A = 25 C Power Dissipation 2.0 P A = 70 C Power Dissipation Linear Derating Factor
Applications Dual SO-8 MOSFET for POL converters in desktop, servers, graphics cards, game consoles and set-top box PD - 95858A IRF895 HEXFET Power MOSFET V DSS R DS(on) max I D 20V 8.3m:@V GS = V 8.9A
More informationMDS9652E Complementary N-P Channel Trench MOSFET
MDS9E Complementary N-P Channel Trench MOSFET MDS9E Complementary N-P Channel Trench MOSFET General Description The MDS9E uses advanced MagnaChip s MOSFET Technology to provide low on-state resistance,
More informationIRFI4212H-117P. Description. Key Parameters g V DS 100 V R DS(ON) 10V 58 m: Q g typ. 12 nc Q sw typ. 6.9 nc R G(int) typ. 3.
DIGITAL AUDIO MOSFET PD - 97249A IRFI422H-7P Features Ÿ Integrated half-bridge package Ÿ Reduces the part count by half Ÿ Facilitates better PCB layout Ÿ Key parameters optimized for Class-D audio amplifier
More informationT C =25 unless otherwise specified
800V N-Channel MOSFET BS = 800 V R DS(on) typ = 3.0 A Dec 2005 FEATURES Originative New Design Superior Avalanche Rugged Technology Robust Gate Oxide Technology Very Low Intrinsic Capacitances Excellent
More informationProduct Summary. BV DSS typ. 84 V R DS(ON) max. 8.0 mω I D 80 A
SIAI N-Channel Enhancement Mode Power MOSFET General Description The S75NF75 uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge. This device is suitable for use
More informationAnalog and Telecommunication Electronics
Politecnico di Torino - ICT School Analog and Telecommunication Electronics F2 Active power devices»mos»bjt» IGBT, TRIAC» Safe Operating Area» Thermal analysis 30/05/2012-1 ATLCE - F2-2011 DDC Lesson F2:
More informationSchematic diagram R DS(ON) < V GS =10V. Marking and pin assignment Uninterruptible power supply
FNK N-Channel Enhancement Mode Power MOSFET Description The FNK 85H21 uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge. It can be used in automotive applications
More informationIRF3709ZCS IRF3709ZCL
PD - 95836 IRF3709ZCS IRF3709ZCL Applications l High Frequency Synchronous Buck Converters for Computer Processor Power HEXFET Power MOSFET V DSS R DSon) max Qg 30V 6.3m: 7nC Benefits l l l Low R DSon)
More informationHCS80R1K4E 800V N-Channel Super Junction MOSFET
HCS80R1K4E 800V N-Channel Super Junction MOSFET Features Very Low FOM (R DS(on) X Q g ) Extremely low switching loss Excellent stability and uniformity 100% Avalanche Tested Application Switch Mode Power
More informationV DSS R DS(on) max Qg (typ.) 60V GS = 10V 24nC
Applications l Synchronous Rectifier MOSFET for Isolated DC-DC Converters l Low Power Motor Drive Systems PD - 97436 IRF735PbF HEXFET Power MOSFET V DSS R DS(on) max Qg (typ.) 60V 7.8mΩ@V GS = 0V 24nC
More informationGrade of climate describes the permissible ambient test conditions (climate) according to DIN IEC 68-1
Total power dissipation P tot Maximum power dissipation per transistor/ diode or within the whole power module P tot = (T jmax -T case )/R thjc, Parameter: case temperature T case = 25 C Operating temperature
More informationTaiwan Goodark Technology Co.,Ltd TGD01P30
TGD P-Channel Enhancement Mode Power MOSFET Description The uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge. It can be used in a wide variety of applications.
More informationParameter Symbol Limit Unit
N-Channel Enhancement Mode Power MOSFET Description The PE3050K uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge. It can be used in a wide variety of applications.
More informationReading. Lecture 17: MOS transistors digital. Context. Digital techniques:
Reading Lecture 17: MOS transistors digital Today we are going to look at the analog characteristics of simple digital devices, 5. 5.4 And following the midterm, we will cover PN diodes again in forward
More informationTO-247-3L Inner Circuit Product Summary C) RDS(on) Parameter Symbol Test Conditions Value Unit
Silicon Carbide Power MOSFET N-CHANNEL ENHANCEMENT MODE TO-247-3L Inner Circuit Product Summary VDS ID(@25 C) RDS(on) 650V 110A 20mΩ Features Low On-Resistance Low Capacitance Avalanche Ruggedness Halogen
More informationT C =25 unless otherwise specified
500V N-Channel MOSFET BS = 500 V R DS(on) typ = 0.22 = 8A Apr 204 FEATURES TO-220F Originative New Design Superior Avalanche Rugged Technology Robust Gate Oxide Technology Very Low Intrinsic Capacitances
More informationHCS80R380R 800V N-Channel Super Junction MOSFET
HCS8R38R 8V N-Channel Super Junction MOSFET Features Very Low FOM (R DS(on) X Q g ) Extremely low switching loss Excellent stability and uniformity % Avalanche Tested Application Switch Mode Power Supply
More informationElectrical Characteristics (T A =25 unless otherwise noted) Off Characteristics Parameter Symbol Condition Min Typ Max Unit Drain-Source Breakdown Vol
N-Channel Enhancement Mode Power MOSFET Description The HM uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge. It can be used in a wide variety of applications.
More informationHCA80R250T 800V N-Channel Super Junction MOSFET
HCA80R250T 800V N-Channel Super Junction MOSFET Features Very Low FOM (R DS(on) X Q g ) Extremely low switching loss Excellent stability and uniformity 100% Avalanche Tested Application Switch Mode Power
More informationHCA60R080FT (Fast Recovery Diode Type) 600V N-Channel Super Junction MOSFET
HCA60R080FT (Fast Recovery Diode Type) 600V N-Channel Super Junction MOSFET Features Very Low FOM (R DS(on) X Q g ) Extremely low switching loss Excellent stability and uniformity 00% Avalanche Tested
More informationHCI70R500E 700V N-Channel Super Junction MOSFET
HCI70R500E 700V N-Channel Super Junction MOSFET Features Very Low FOM (R DS(on) X Q g ) Extremely low switching loss Excellent stability and uniformity 100% Avalanche Tested Higher dv/dt ruggedness Application
More information(anode) (also: I D, I F, I T )
(anode) V R - V A or V D or VF or V T IA (also: I D, I F, I T ) control terminals (e.g. gate for thyrisr; basis for BJT) - (IR =-I A ) (cathode) I A I F conducting range A p n K (a) V A (V F ) - A anode
More informationPE6018. N-Channel Enhancement Mode Power MOSFET. Description. General Features. Application. Absolute Maximum Ratings (T C =25 unless otherwise noted)
N-Channel Enhancement Mode Power MOSFET Description The PE6018 uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge. It D can be used in a wide variety of applications.
More informationIRL3714Z IRL3714ZS IRL3714ZL
Applications l High Frequency Synchronous Buck Converters for Computer Processor Power PD - 94798 IRL3714Z IRL3714ZS IRL3714ZL HEXFET Power MOSFET V DSS R DS(on) max Qg 20V 16m: 4.8nC Benefits l l l Low
More informationTaiwan Goodark Technology Co.,Ltd
TGD N-Channel Enhancement Mode Power MOSFET Description The uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge. It can be used in a wide variety of applications.
More informationIRFR3709ZPbF IRFU3709ZPbF
Applications l High Frequency Synchronous Buck Converters for Computer Processor Power l High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Industrial Use l Lead-Free
More information2 Marks - Question Bank. Unit 1- INTRODUCTION
Two marks 1. What is power electronics? EE6503 POWER ELECTRONICS 2 Marks - Question Bank Unit 1- INTRODUCTION Power electronics is a subject that concerns the applications electronics principles into situations
More informationTO-220 G. T C = 25 C unless otherwise noted. Drain-Source Voltage 80 V. Symbol Parameter MSP120N08G Units R θjc
MSP120N08G 80V N-Channel MOSFET General Description Features This Power MOSFET is produced using Maple semi s advanced technology. which provides high performance in on-state resistance, fast switching
More informationDevice Marking Device Device Package Reel Size Tape width Quantity
N-Channel Enhancement Mode Power MOSFET Description The uses advanced trench technology and design to provide excellent DS(ON) with low gate charge. It can be used in a wide variety of applications. General
More informationDOWNLOAD PDF POWER ELECTRONICS DEVICES DRIVERS AND APPLICATIONS
Chapter 1 : Power Electronics Devices, Drivers, Applications, and Passive theinnatdunvilla.com - Google D Download Power Electronics: Devices, Drivers and Applications By B.W. Williams - Provides a wide
More informationUNIT 3: FIELD EFFECT TRANSISTORS
FIELD EFFECT TRANSISTOR: UNIT 3: FIELD EFFECT TRANSISTORS The field effect transistor is a semiconductor device, which depends for its operation on the control of current by an electric field. There are
More informationHFP4N65F / HFS4N65F 650V N-Channel MOSFET
HFP4N65F / HFS4N65F 650V N-Channel MOSFET Features Originative New Design Very Low Intrinsic Capacitances Excellent Switching Characteristics 100% Avalanche Tested RoHS Compliant Key Parameters May 2016
More informationN-Channel Enhancement Mode Field Effect Transistor
PRODUCT SUMMARY V (BR)DSS R DS(ON) I D 75 8mΩ 8A G D S. GATE 2. DRAIN 3. SOURCE ABSOLUTE MAXIMUM RATINGS (T C = 25 C Unless Otherwise Noted) PARAMETERS/TEST CONDITIONS SYMBOL LIMITS UNITS Gate-Source Voltage
More informationTaiwan Goodark Technology Co.,Ltd TGD0103M
TGD N-Channel Enhancement Mode Power MOSFET Description The uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge. It can be used in a wide variety of applications.
More informationT C =25 unless otherwise specified
WFW11N90 900V N-Channel MOSFET BS = 900 V R DS(on) typ = 0.93 Ω = 11 A FEATURES TO-3P Originative New Design Superior Avalanche Rugged Technology Robust Gate Oxide Technology Very Low Intrinsic Capacitances
More informationTaiwan Goodark Technology Co.,Ltd
TGD N-Channel Enhancement Mode Power MOSFET Description The uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge. This device is suitable for use in PWM, load switching
More informationIRF7821PbF. HEXFET Power MOSFET
Applications l High Frequency Point-of-Load Synchronous Buck Converter for Applications in Networking & Computing Systems. l Lead-Free Benefits l Very Low R DS(on) at 4.5V V GS l Low Gate Charge l Fully
More information8 S1, D2. Storage Temperature Range Soldering Temperature, for 10 seconds 300 (1.6mm from case )
Co-Pack Dual N-channel HEXFET Power MOSFET and Schottky Diode Ideal for Synchronous Buck DC-DC Converters Up to A Peak Output Low Conduction Losses Low Switching Losses Low Vf Schottky Rectifier D D 2
More informationTSP13N 50M / TSF13N N50M
TSP13N50M / TSF13N50M 600V N-Channel MOSFET General Description This Power MOSFET is produced using True semi s advanced planar stripe DMOS technology. This advanced technology has been especially tailored
More informationCharacteristics Symbol Rating Unit
General Description MDS1525 Single N-channel Trench MOSFET 3V, 16.9A, 1.1mΩ The MDS1525 uses advanced MagnaChip s MOSFET Technology, which provides high performance in on-state resistance, fast switching
More information8N Amps, 600/650 Volts N-CHANNEL POWER MOSFET 8N60 MOSFET N 600V 7.5A 1,2 OHM. Power MOSFET. DESCRIPTION FEATURES
MOSFET N 6V 7.5A,2 OHM 8N6 7.5 Amps,6/65 Volts N-CHANNEL POWER MOSFET DESCRIPTION The UTC 8N6 is a high voltage and high current power MOSFET, designed to have better characteristics, such as fast switching
More informationIRLR8721PbF IRLU8721PbF
Applications l High Frequency Synchronous Buck Converters for Computer Processor Power l High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Industrial Use l Lead-Free
More informationKS3304DA. Single P-Channel Advanced Power MOSFET. Applications. Absolute Maximum Ratings
Single P-Channel Advanced Power MOSFET Features -3V/-A, R DS (ON) =mω(typ.)@v GS =-V R DS (ON) =7.2mΩ(Typ.)@V GS =-4.V Low R DS (ON) Super High Dense Cell Design Reliable and Rugged G Pin Description D
More informationMOSFET. CoolMOS CP. Data Sheet. Industrial & Multimarket. Metal Oxide Semiconductor Field Effect Transistor
MOSFET Metal Oxide Semiconductor Field Effect Transistor CoolMOS CP 600V CoolMOS CP Power Transistor Data Sheet Rev. 2.1, 2012-01-10 Final Industrial & Multimarket 1 Description The CoolMOS CP series offers
More informationIRFB4020PbF. Key Parameters V DS 200 V R DS(ON) 10V 80 m: Q g typ. 18 nc Q sw typ. 6.7 nc R G(int) typ. 3.2 Ω T J max 175 C
PD - 9795 DIGITAL AUDIO MOSFET Features Key parameters optimized for Class-D audio amplifier applications Low R DSON for improved efficiency Low Q G and Q SW for better THD and improved efficiency Low
More informationHCD80R1K4E 800V N-Channel Super Junction MOSFET
HCD80R1K4E 800V N-Channel Super Junction MOSFET Features Very Low FOM (R DS(on) X Q g ) Extremely low switching loss Excellent stability and uniformity 100% Avalanche Tested Application Switch Mode Power
More informationProduct Summary. BV DSS typ. 80 V R DS(ON) max. 4 mω I D 200 A
N-Channel Enhancement Mode Power MOSFET General Description The YMP200N08 uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge. This device is suitable for use
More informationECE520 VLSI Design. Lecture 2: Basic MOS Physics. Payman Zarkesh-Ha
ECE520 VLSI Design Lecture 2: Basic MOS Physics Payman Zarkesh-Ha Office: ECE Bldg. 230B Office hours: Wednesday 2:00-3:00PM or by appointment E-mail: pzarkesh@unm.edu Slide: 1 Review of Last Lecture Semiconductor
More informationFDP8D5N10C / FDPF8D5N10C/D
FDP8D5NC / FDPF8D5NC N-Channel Shielded Gate PowerTrench MOSFET V, 76 A, 8.5 mω Features Max r DS(on) = 8.5 mω at V GS = V, I D = 76 A Extremely Low Reverse Recovery Charge, Qrr % UIL Tested RoHS Compliant
More informationIs Now Part of. To learn more about ON Semiconductor, please visit our website at
Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers
More informationDepartment of Electrical Engineering IIT Madras
Department of Electrical Engineering IIT Madras Sample Questions on Semiconductor Devices EE3 applicants who are interested to pursue their research in microelectronics devices area (fabrication and/or
More informationThree Terminal Devices
Three Terminal Devices - field effect transistor (FET) - bipolar junction transistor (BJT) - foundation on which modern electronics is built - active devices - devices described completely by considering
More informationDevice Marking Device Device Package Reel Size Tape width Quantity NCE3080K NCE3080K TO-252-2L Parameter Symbol Limit Unit
http://www.ncepower.com NCE N-Channel Enhancement Mode Power MOSFET Description The uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge. It can be used in a wide
More informationHCD6N70S / HCU6N70S 700V N-Channel Super Junction MOSFET
HCD6N70S / HCU6N70S 700V N-Channel Super Junction MOSFET FEATURES Originative New Design Superior Avalanche Rugged Technology Robust Gate Oxide Technology Very Low Intrinsic Capacitances Excellent Switching
More informationHCS65R110FE (Fast Recovery Diode Type) 650V N-Channel Super Junction MOSFET
HCS65R110FE (Fast Recovery Diode Type) 650V N-Channel Super Junction MOSFET Features Very Low FOM (R DS(on) X Q g ) Extremely low switching loss Excellent stability and uniformity 100% Avalanche Tested
More informationLecture Note on Switches Marc T. Thompson, 2003 Revised Use with gratefulness for ECE 3503 B term 2018 WPI Tan Zhang
Lecture Note on Switches Marc T. Thompson, 2003 Revised 2007 Use with gratefulness for ECE 3503 B term 2018 WPI Tan Zhang Lecture note on switches_tan_thompsonpage 1 of 21 1. DEVICES OVERVIEW... 4 1.1.
More informationEC 307 Power Electronics & Instrumentation
EC 307 Power Electronics & Instrumentation MODULE I Difference Between Linear Electronics and Power Electronics Electronics has now become the core component in the development of the technology. The fast
More informationChapter 1: Diode circuits
Analog Electronics Circuits Nagamani A N Lecturer, PESIT, Bangalore 85 Email nagamani@pes.edu Chapter 1: Diode circuits Objective To understand the diode operation and its equivalent circuits To understand
More informationPower semiconductors. José M. Cámara V 1.0
Power semiconductors José M. Cámara V 1.0 Introduction Here we are going to study semiconductor devices used in power electronics. They work under medium and high currents and voltages. Some of them only
More informationHFI50N06A / HFW50N06A 60V N-Channel MOSFET
HFI50N06A / HFW50N06A 60V N-Channel MOSFET Features Superior Avalanche Rugged Technology Robust Gate Oxide Technology Very Low Intrinsic Capacitances Excellent Switching Characteristics 100% Avalanche
More informationMDF11N60 N-Channel MOSFET 600V, 11 A, 0.55Ω
General Description MDF11N6 is suitable device for SMPS, high Speed switching and general purpose applications. MDF11N6 N-Channel MOSFET 6V, 11 A,.55Ω Features = 6V = 11A @ V GS = V R DS(ON).55Ω @ V GS
More informationHCS70R350E 700V N-Channel Super Junction MOSFET
HCS70R350E 700V N-Channel Super Junction MOSFET Features Very Low FOM (R DS(on) X Q g ) Extremely low switching loss Excellent stability and uniformity 100% Avalanche Tested Higher dv/dt ruggedness Application
More informationDevice Marking Device Device Package Reel Size Tape width Quantity HM60N08 HM60N08 TO-220-3L - - Parameter Symbol Limit Unit
N-Channel Enhancement Mode Power MOSFET Description The uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge. It can be used in a wide variety of applications.
More informationSuper Junction MOSFET
APT77N6BC6 APT77N6SC6 6V 77A.4Ω CO LMOS Power Semiconductors Super Junction MOSFET Ultra Low R DS(ON) TO-247 Low Miller Capacitance D 3 PAK Ultra Low Gate Charge, Q g Avalanche Energy Rated Extreme dv
More informationAppendix: Power Loss Calculation
Appendix: Power Loss Calculation Current flow paths in a synchronous buck converter during on and off phases are illustrated in Fig. 1. It has to be noticed that following parameters are interrelated:
More informationSSF2341E. Main Product Characteristics V DSS -20V. R DS(on) 37mΩ (typ.) I D. Features and Benefit. Description
Main Product Characteristics V DSS -20V R DS(on) 37mΩ (typ.) I D -4A 1 SOT-23 Marking and Pin A s s i gnm e nt Schematic Diagram Features and Benefit Advanced MOSFET process technology Ideal for PWM, load
More informationCharacteristics Symbol Rating Unit. T C=70 o C 36.6 T A=25 o C 20.4 (3) T A=70 o C 16.3 (3) Pulsed Drain Current I DM 100 A 31.2 T C=70 o C 20.0.
General Description The MDD152 uses advanced MagnaChip s MOSFET Technology, which provides high performance in on-state resistance, fast switching performance and excellent quality. MDD152 is suitable
More informationPower Semiconductors. Brian K. Johnson and Herbert L. Hess University of Idaho P.O. Box Moscow, ID USA
Power Semiconductors Brian K. Johnson and Herbert L. Hess University of Idaho P.O. Box 441023 Moscow, ID 83844-1023 USA Transient Simulation Applications Medium to high power applications Converter applications
More informationLecture 19 Real Semiconductor Switches and the Evolution of Power MOSFETS A.. Real Switches: I(D) through the switch and V(D) across the switch
Lecture 19 Real Semiconductor Switches and the Evolution of Power MOSFETS 1 A.. Real Switches: I(D) through the switch and V(D) across the switch 1. Two quadrant switch implementation and device choice
More informationAO4912 Asymmetric Dual N-Channel Enhancement Mode Field Effect Transistor
Asymmetric Dual N-Channel Enhancement Mode Field Effect Transistor General Description The AO49 uses advanced trench technology to provide excellent R DS(ON) and low gate charge. The two MOSFETs make a
More informationN- & P-Channel Enhancement Mode Field Effect Transistor
N- & annel Enhancement Mode P2OAG TSOP- PRODUCT SUMMARY V (BR)DSS R DS(ON) I D annel 2V mω.a annel -2V 5mΩ -2.5A G D G D D S D2 5 2 G : GATE D : DRAIN S : SOURCE S S G S2 G2 ABSOLUTE MAXIMUM RATINGS (T
More informationDevice Marking Device Device Package Reel Size Tape width Quantity NCE60P12K NCE60P12K TO-252-2L - - -
http://www.ncepower.com NCE P-Channel Enhancement Mode Power MOSFET Description The uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge.this device is well suited
More informationCharacteristics Symbol Rating Unit. T C=70 o C 53.0 T A=25 o C 22.8 (3) T A=70 o C 18.2 (3) Pulsed Drain Current I DM 100 A 46.2 T C=70 o C 29.6.
General Description The MDU1514 uses advanced MagnaChip s MOSFET Technology, which provides high performance in on-state resistance, fast switching performance and excellent quality. MDU1514 is suitable
More informationSUPER-SEMI SUPER-MOSFET. Super Junction Metal Oxide Semiconductor Field Effect Transistor. 800V Super Junction Power Transistor SS*80R240S
SUPER-SEMI SUPER-MOSFET Super Junction Metal Oxide Semiconductor Field Effect Transistor 800V Super Junction Power Transistor SS*80R240S Rev. 1.1 Aug. 2017 SSP80R240S/SSF80R240S/SSB80R240S 800V N-Channel
More information(a) average output voltage (b) average output current (c) average and rms values of SCR current and (d) input power factor. [16]
Code No: 07A50204 R07 Set No. 2 1. A single phase fully controlled bridge converter is operated from 230 v, 50 Hz source. The load consists of 10Ω and a large inductance so as to reach the load current
More information